CN103151408B - The packaging technology of a kind of full glass assembly and a kind of full glass assembly - Google Patents
The packaging technology of a kind of full glass assembly and a kind of full glass assembly Download PDFInfo
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- CN103151408B CN103151408B CN201310050943.0A CN201310050943A CN103151408B CN 103151408 B CN103151408 B CN 103151408B CN 201310050943 A CN201310050943 A CN 201310050943A CN 103151408 B CN103151408 B CN 103151408B
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- glass
- lower floor
- upper strata
- connection part
- groove
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a kind of full glass assembly, comprise upper strata glass and lower floor's glass, and the multiple cell pieces between upper strata glass and lower floor's glass, upper strata glass is respectively arranged with multiple conductive connection part for being connected successively by the electrode of multiple cell piece with on lower floor glass, and conductive connection part is electrically connected by conducting resinl with electrode.The invention also discloses a kind of packaging technology of full glass assembly.In above-mentioned full glass assembly, on the electrode of cell piece, and the part that conductive connection part is answered with this electrode pair smears conducting resinl, thus is connected successively by the electrode of multiple cell piece.Compared with prior art, the full glass assembly that the embodiment of the present invention provides eliminates the welding procedure in encapsulation process, thus avoid the corrosion of scaling powder to battery grid line, it also avoid cell piece by thermogenetic bow action simultaneously, therefore, when battery sheet packaging being helped glass assembly, the fragment rate in lamination process is greatly less, ensure that the reliability of product quality.
Description
Technical field
The present invention relates to solar energy generation technology field, particularly the packaging technology of a kind of full glass assembly and a kind of full glass assembly.
Background technology
In the technical field of solar cell, independent crystal silicon solar batteries sheet energy output is little, and very frangible, solar battery sheet will be packaged into assembly in practical application.
Connected mode traditional between solar battery sheet is soldering copper conduction band between the positive and negative electrode (main gate line of two cell pieces namely connected) of two cell pieces connected.At present, the welding procedure of the full glass assembly of solar cell is hot air welding, can to cell piece localized heating in welding process, cause the bow action of cell piece, thus, when battery sheet packaging being become assembly, fragment rate is increased in lamination process, because full glass assembly cannot be reprocessed, therefore, greatly have impact on the reliability of product quality and add manufacturing cost.Although each assembly producer is by various method optimization technological process, and welding temperature is optimized in research, and to reduce the cell piece degree of crook produced because welding is heated in encapsulation process, the fact shows, the bow action of cell piece can not be avoided.Because aluminium paste coating is different with the thermal coefficient of expansion of silicon layer, therefore, if cell piece be heated will produce bending, that is, as long as still adopt welding method, just the bow action of inevitable cell piece, will cause local stress skewness and cause hidden splitting.In addition, welding procedure on the impact of solar cell chip module moreover, to on the positive and negative electrode of cell piece during soldering copper conduction band, be actually and the grid line on copper conduction band and cell piece is welded to connect, because the localized heating in welding process can produce the destruction of uniformity to grid line, and the scaling powder used in welding process also can corrode battery grid line, greatly reduces the working life of solar cell.In addition, if there is rosin joint or sealing-off, then the electrical property of battery component will directly be affected.
Therefore, how avoiding cell piece by thermogenetic bow action in welding process, to reduce the fragment rate of full glass assembly in encapsulation process, is those skilled in the art's technical problems urgently to be resolved hurrily.
Summary of the invention
In view of this, the invention provides the packaging technology of a kind of full glass assembly and a kind of full glass assembly, significantly reduce the fragment rate of full glass assembly in encapsulation process.
For achieving the above object, the invention provides following technical scheme:
A kind of full glass assembly, comprise upper strata glass and lower floor's glass, and the multiple cell pieces between described upper strata glass and described lower floor glass, described upper strata glass is respectively arranged with multiple conductive connection part for being connected successively by the electrode of multiple described cell piece with on described lower floor glass, and described conductive connection part is electrically connected by conducting resinl with described electrode.
Preferably, in above-mentioned full glass assembly, described conductive connection part is the conductive copper films be attached to by the method for vacuum evaporation on described upper strata glass and described lower floor glass.
Preferably, in above-mentioned full glass assembly, described conductive copper films is provided with for the connection bump with described electrode contact, described conductive connection part is electrically connected by conducting resinl with described electrode.
Preferably, in above-mentioned full glass assembly, the top of described connection bump is greater than the degree of depth of described first groove to the distance of described first groove bottom land.
Preferably, in above-mentioned full glass assembly, described upper strata glass and described lower floor glass are respectively arranged with the first groove, in described first groove, are provided with described conductive copper films.
Preferably, in above-mentioned full glass assembly, described conductive connection part is the copper conduction band be bonded in by glue on described upper strata glass and described lower floor glass.
Preferably, in above-mentioned full glass assembly, described upper strata glass and described lower floor glass are respectively arranged with the first groove, in described first groove, are bonded with described copper conduction band.
Preferably, in above-mentioned full glass assembly, described copper conduction band is bonded on described upper strata glass and described lower floor glass by transparent silica gel.
Preferably, in above-mentioned full glass assembly, described upper strata glass and/or described lower floor glass are provided with the second groove for encapsulating described cell piece.
A packaging technology for full glass assembly, comprises the following steps:
Step one: manufactured respectively on the surface of upper strata glass and lower floor's glass by etching technics and be used for the second groove of packaged battery sheet and the first groove for arranging conductive connection part, described conductive connection part is used for the electrode of multiple described cell piece to connect successively;
Step 2: arrange described conductive connection part in described first groove;
Step 3: described lower floor glass and lower floor's glass clamp tunic of being provided with the first elongated hole are laid, wherein, described first elongated hole is corresponding with the described conductive connection part on described lower floor glass to be placed;
Step 4: on the electrodes for smearing conducting resinl with the position that described conductive connection part carries out being electrically connected;
Step 5: described second groove described cell piece being put into described lower floor glass, makes that described electrode is corresponding with the described conductive connection part on described lower floor glass to be placed;
Step 6: described upper strata glass and the upper strata glass clamp tunic being provided with the second elongated hole are laid, wherein, described second elongated hole on described conductive connection part on the glass of described upper strata and described upper strata glass clamp tunic should be placed with the described electrode pair of described cell piece respectively, in addition, the justified margin of described lower floor glass and described upper strata glass;
Step 7: carry out laminating technology, makes and helps glass assembly.
As can be seen from above-mentioned technical scheme, embodiments provide the packaging technology of a kind of full glass assembly and a kind of full glass assembly.At the full glass assembly that the embodiment of the present invention provides, and in the full glass assembly to be made by this packaging technology, upper strata glass and lower floor's glass are respectively arranged with multiple conductive connection part, and, on the electrode (i.e. main gate line) of cell piece, and the part that the electrode pair of conductive connection part and cell piece is answered smears conducting resinl, thus the electrode of multiple cell piece is connected successively.With in prior art between the electrode of the cell piece connected soldering copper conduction band connected mode compared with, the full glass assembly that the embodiment of the present invention provides eliminates the welding procedure in encapsulation process, thus avoid the corrosion of scaling powder to battery grid line, it also avoid cell piece by thermogenetic bow action simultaneously, therefore, when battery sheet packaging being helped glass assembly, the fragment rate in lamination process is greatly less, ensure that the reliability of product quality.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The cross-sectional view of the full glass assembly that Fig. 1 provides for the embodiment of the present invention.
Embodiment
The invention discloses the packaging technology of a kind of full glass assembly and a kind of full glass assembly, significantly reduce the fragment rate of full glass assembly in encapsulation process.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 1, the cross-sectional view of the full glass assembly that Fig. 1 provides for the embodiment of the present invention.
The full glass assembly that the embodiment of the present invention provides, comprise upper strata glass 1 and lower floor's glass 3, and the multiple cell pieces 2 between upper strata glass 1 and lower floor's glass 3, upper strata glass 1 is respectively arranged with multiple conductive connection part for being connected successively by the electrode (i.e. main gate line) of multiple cell piece 2 with on lower floor glass 3, and conductive connection part is electrically connected by conducting resinl with electrode.
Visible, in the full glass assembly that the embodiment of the present invention provides, upper strata glass 1 and lower floor's glass 3 are respectively arranged with multiple conductive connection part, and, on the electrode (i.e. main gate line) of cell piece 2, and the part that conductive connection part is answered with the electrode pair of cell piece 2 smears conducting resinl, thus the electrode of multiple cell piece 2 is put connection successively.With in prior art between the electrode of the cell piece connected soldering copper conduction band connected mode compared with, the full glass assembly that the embodiment of the present invention provides eliminates the welding procedure in encapsulation process, thus avoid the corrosion of scaling powder to battery grid line, it also avoid cell piece by thermogenetic bow action simultaneously, therefore, when battery sheet packaging being helped glass assembly, the fragment rate in lamination process is greatly less, ensure that the reliability of product quality.
Wherein, conducting resinl is that one can glued joint various material effectively, there is again the adhesive of electric conductivity, usually be main constituent with matrix resin and conductive filler and conducting particles, by the bonding effect of matrix resin, conducting particles is combined, forming conductive path, connecting with the conduction realized by gluing material.The kind of conducting resinl is a lot, and those skilled in the art are easy to select suitable conducting resinl as the case may be, and therefore, the kind of the present invention to conducting resinl does not limit.
In the first specific embodiment provided by the invention, the conductive connection part that upper strata glass 1 and lower floor's glass 3 are arranged respectively is the conductive copper films be attached to by the method for vacuum evaporation on upper strata glass 1 and lower floor's glass 3.The resistivity of conductive copper films is suitable with conventional welding, can replace the copper conduction band of welding between the cell piece 2 connected in prior art.Further, conductive copper films being provided with the connection bump for contacting with the electrode (i.e. main gate line) of cell piece 2, smearing conducting resinl between this connection bump with electrode and being electrically connected.
In order to optimize technique scheme further, upper strata glass 1 and lower floor's glass 3 are respectively arranged with the first groove 4, and conductive copper films is arranged in the first groove 4, thus plays certain protective effect to conductive copper films.Simultaneously, the top of the connection bump in conductive copper films is greater than the degree of depth of the first groove 4 to the distance of the first groove bottom land, namely the connection bump place for the electrode contact with cell piece in conductive copper films is relatively thick, and exceed outside the first groove 4, thus be convenient to realize contacting connection well with the main gate line on cell piece 2.
In order to optimize technique scheme further, as shown in fig. 1, upper strata glass 1 and lower floor's glass 3 are respectively arranged with the second groove 5 for packaged battery sheet 2.Yi Zhi, now, the shape of the second groove 5 and the shape adaptation of cell piece 2, and the first groove 4 and conductive copper films are all positioned at this second groove 5, and namely the first groove 4 is positioned at this second groove 5, and conductive copper films is arranged in the first groove 4.Cell piece 2 is arranged on the effect not only serving location in the second groove 5, prevents cell piece 2 from offseting, and effectively prevent steam and enter the service behaviour that full glass component internal affects cell piece 2, extends the useful life of full glass assembly.In addition, the setting of the second groove 5 also can make the structure of full glass assembly more attractive in appearance.But those skilled in the art it is contemplated that only on upper strata glass 1, or only can also arrange the second groove 5 on lower floor's glass 3, and therefore, the present invention does not limit this.
In the present embodiment, the second groove 5 and the first groove 4 are the groove be made by etching technics.But those skilled in the art are easily known, the processing mode of the second groove 5 and the first groove 4 has plurality of optional scheme, and be not limited to etching technics, therefore, the present invention does not limit this.
The packaging technology of the above-mentioned full glass assembly that the present invention first specific embodiment provides is substantially as follows: first, the surface of upper strata glass 1 and lower floor's glass 3 is produced for the second groove 5 of packaged battery sheet 2 and the first groove 4 for arranging conductive copper films respectively by etching technics, and this conductive copper films is used for the electrode of multiple cell piece 2 to connect successively; Afterwards, vacuum evaporation conductive copper films in the first groove 4, to replace the conducting function of copper conduction band in prior art; Then, the electrode (i.e. main gate line) of cell piece 2 smears conducting resinl, for main gate line and conductive copper films being electrically connected; Carry out lamination after being carried out by upper strata glass 1, lower floor's glass 3 and cell piece 2 having laid, make and help glass assembly.
Wherein, before laying, glass clamp tunic makes elongated hole, this elongated hole is corresponding with the position of conductive copper films; Place corresponding with the conductive copper films on lower floor glass 3 for the elongated hole of lower floor's glass clamp tunic when laying; The main gate line of cell piece 2 smears conducting resinl, and conducting resinl is used for both positive and negative polarity and the conductive copper films of bonding cell piece 2; Cell piece 2 is corresponding with conductive copper films to be placed; Place corresponding with the front main grid line of cell piece 2 for the elongated hole of upper strata glass clamp tunic; Lay upper strata glass 1, the second elongated hole correspondence on the conductive copper films on the glass of upper strata and upper strata glass clamp tunic is placed, and makes the justified margin of upper strata glass 1 and lower floor's glass 3; Finally carry out lamination, make and help glass assembly.
Present invention also offers the second specific embodiment, full glass assembly in second specific embodiment is substantially identical with above-mentioned first specific embodiment, and its unique difference is: conductive connection part is the copper conduction band be bonded in by glue on upper strata glass 1 and lower floor's glass 3.Same, each copper conduction band is bonded in the first groove 4 of setting on upper strata glass 1 and lower floor's glass 3 respectively.At this, for the glue for bonding copper conduction band, the present invention does not limit, as long as it is interior copper conduction band to be realized to be bonded in the first groove 4 that upper strata glass 1 or lower floor's glass 3 are arranged, such as, copper conduction band is bonded in the first groove 4 of upper strata glass 1 and lower floor's glass 3 by transparent silica gel.
To sum up easily know, the packaging technology of the above-mentioned full glass assembly that the present invention second specific embodiment provides is substantially as follows: first, and the second groove 5 and the first groove 4 is produced respectively by etching technics in the surface of upper strata glass 1 and lower floor's glass 3; Afterwards, bonding copper conduction band in the first groove 4; The electrode (i.e. main gate line) of cell piece 2 smears conducting resinl, for main gate line being electrically connected with copper conduction band; Carry out lamination after being carried out by upper strata glass 1, lower floor's glass 3 and cell piece 2 having laid, make and help glass assembly.
Wherein, before laying, glass clamp tunic makes elongated hole, this elongated hole is corresponding with the position of copper conduction band; Place corresponding with the copper conduction band on lower floor glass 3 for the elongated hole of lower floor's glass clamp tunic when laying; The main gate line of cell piece 2 smears conducting resinl, and conducting resinl is used for both positive and negative polarity and the copper conduction band of bonding cell piece; Cell piece 2 is put into the second groove 5 of lower floor's glass 3, make that electrode is corresponding with the copper conduction band on lower floor glass 3 to be placed; Place corresponding with the front main grid line of cell piece 2 for the elongated hole of upper strata glass clamp tunic; Lay upper strata glass 1, the second elongated hole correspondence on the copper conduction band on the glass of upper strata and upper strata glass clamp tunic is placed, and the justified margin of upper strata glass 1 and lower floor's glass 3; Finally carry out lamination, make and help glass assembly.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (9)
1. a full glass assembly, comprise upper strata glass (1) and lower floor's glass (3), and the multiple cell pieces (2) be positioned between described upper strata glass (1) and described lower floor glass (3), it is characterized in that, described upper strata glass (1) with described lower floor glass (3) is respectively arranged with multiple conductive connection part for being connected successively by the electrode of multiple described cell piece (2), described conductive connection part is electrically connected by conducting resinl with described electrode, and the second groove (5) described upper strata glass (1) and/or described lower floor glass (3) are provided with for encapsulating described cell piece (2).
2. full glass assembly according to claim 1, is characterized in that, described conductive connection part is the conductive copper films be attached to by the method for vacuum evaporation in described upper strata glass (1) and described lower floor glass (3).
3. full glass assembly according to claim 2, is characterized in that, described conductive copper films is provided with for the connection bump with described electrode contact, described conductive connection part is electrically connected by conducting resinl with described electrode.
4. full glass assembly according to claim 2, it is characterized in that, described upper strata glass (1) and described lower floor glass (3) are respectively arranged with the first groove (4), in described first groove (4), are provided with described conductive copper films.
5. full glass assembly according to claim 4, is characterized in that, the top of described connection bump is greater than the degree of depth of described first groove (4) to the distance of described first groove bottom land.
6. full glass assembly according to claim 1, is characterized in that, described conductive connection part is the copper conduction band be bonded in by glue in described upper strata glass (1) and described lower floor glass (3).
7. full glass assembly according to claim 6, it is characterized in that, described upper strata glass (1) and described lower floor glass (3) are respectively arranged with the first groove (4), in described first groove (4), are bonded with described copper conduction band.
8. full glass assembly according to claim 6, is characterized in that, described copper conduction band is bonded in described upper strata glass (1) and described lower floor glass (3) by transparent silica gel.
9. a packaging technology for full glass assembly, is characterized in that, comprise the following steps:
Step one: manufactured respectively on the surface of upper strata glass (1) and lower floor's glass (3) by etching technics and be used for second groove (5) of packaged battery sheet (2) and the first groove (4) for arranging conductive connection part, described conductive connection part is used for the electrode of multiple described cell piece (2) to connect successively;
Step 2: arrange described conductive connection part in described first groove (4);
Step 3: described lower floor glass (3) and lower floor's glass clamp tunic of being provided with the first elongated hole are laid, wherein, described first elongated hole is corresponding with the described conductive connection part in described lower floor glass (3) to be placed;
Step 4: on the electrodes for smearing conducting resinl with the position that described conductive connection part carries out being electrically connected;
Step 5: described second groove (5) of described cell piece (2) being put into described lower floor glass (3), makes that described electrode is corresponding with the described conductive connection part in described lower floor glass (3) to be placed;
Step 6: described upper strata glass (1) and the upper strata glass clamp tunic that is provided with the second elongated hole are laid, wherein, described second elongated hole on described conductive connection part on described upper strata glass (1) and described upper strata glass clamp tunic should be placed with the described electrode pair of described cell piece (2) respectively, in addition, the justified margin on described lower floor glass (3) and described upper strata glass (1);
Step 7: carry out laminating technology, makes and helps glass assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310050943.0A CN103151408B (en) | 2013-02-17 | 2013-02-17 | The packaging technology of a kind of full glass assembly and a kind of full glass assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310050943.0A CN103151408B (en) | 2013-02-17 | 2013-02-17 | The packaging technology of a kind of full glass assembly and a kind of full glass assembly |
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| Publication Number | Publication Date |
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| CN103151408A CN103151408A (en) | 2013-06-12 |
| CN103151408B true CN103151408B (en) | 2015-08-26 |
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| CN201310050943.0A Active CN103151408B (en) | 2013-02-17 | 2013-02-17 | The packaging technology of a kind of full glass assembly and a kind of full glass assembly |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107706255B (en) * | 2017-09-25 | 2021-03-19 | 宁夏银星能源光伏发电设备制造有限公司 | Transparent photovoltaic module structure |
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| US4978812A (en) * | 1987-12-25 | 1990-12-18 | Asahi Glass Company, Ltd. | Electromagnetic wave shielding transparent body |
| US5059458A (en) * | 1987-08-14 | 1991-10-22 | Pilkington Plc | Glazing units |
| CN101562211A (en) * | 2008-04-17 | 2009-10-21 | 中电电气(上海)太阳能科技有限公司 | Method for packaging solar module |
| CN102217095A (en) * | 2008-09-05 | 2011-10-12 | 索兰太阳能控股有限公司 | Method of monolithic photo-voltaic module assembly |
| CN202042501U (en) * | 2011-04-06 | 2011-11-16 | 中节能太阳能科技（镇江）有限公司 | Solar battery component connected by conductive tape |
| CN102364693A (en) * | 2011-06-30 | 2012-02-29 | 常州天合光能有限公司 | Double glazing glass solar cell module and lamination technology thereof |
| CN203085607U (en) * | 2013-02-17 | 2013-07-24 | 英利集团有限公司 | All-glass assembly |
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2013
- 2013-02-17 CN CN201310050943.0A patent/CN103151408B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5059458A (en) * | 1987-08-14 | 1991-10-22 | Pilkington Plc | Glazing units |
| US4978812A (en) * | 1987-12-25 | 1990-12-18 | Asahi Glass Company, Ltd. | Electromagnetic wave shielding transparent body |
| CN101562211A (en) * | 2008-04-17 | 2009-10-21 | 中电电气(上海)太阳能科技有限公司 | Method for packaging solar module |
| CN102217095A (en) * | 2008-09-05 | 2011-10-12 | 索兰太阳能控股有限公司 | Method of monolithic photo-voltaic module assembly |
| CN202042501U (en) * | 2011-04-06 | 2011-11-16 | 中节能太阳能科技（镇江）有限公司 | Solar battery component connected by conductive tape |
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| CN203085607U (en) * | 2013-02-17 | 2013-07-24 | 英利集团有限公司 | All-glass assembly |
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Inventor after: Bian Chao Inventor after: Liang Yujie Inventor after: Zhang Lei Inventor after: Wu Cuigu Inventor after: Chen Zhijun Inventor after: Dou Weijun Inventor after: Bai Xuetian Inventor before: Bian Chao Inventor before: Liang Yujie |
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Effective date of registration: 20220622 Address after: 071023 No. 88, Hengyuan West Road, Baoding City, Hebei Province Patentee after: YINGLI Group Ltd. Patentee after: BAODING JIASHENG PHOTOVOLTAIC TECHNOLOGY Co.,Ltd. Address before: 071051 No.722 Cuiyuan street, Baoding City, Hebei Province Patentee before: YINGLI Group Ltd. |
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