CN103148368B - Heat-conductive rubber light-emitting diode (LED) lamp and preparation method thereof - Google Patents
Heat-conductive rubber light-emitting diode (LED) lamp and preparation method thereof Download PDFInfo
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- CN103148368B CN103148368B CN201210583104.0A CN201210583104A CN103148368B CN 103148368 B CN103148368 B CN 103148368B CN 201210583104 A CN201210583104 A CN 201210583104A CN 103148368 B CN103148368 B CN 103148368B
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- 229920001971 elastomer Polymers 0.000 title claims abstract description 73
- 239000005060 rubber Substances 0.000 title claims abstract description 73
- 238000002360 preparation method Methods 0.000 title claims description 8
- 239000000463 material Substances 0.000 claims abstract description 58
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229910052802 copper Inorganic materials 0.000 claims abstract description 32
- 239000010949 copper Substances 0.000 claims abstract description 32
- 239000011324 bead Substances 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 25
- 239000002994 raw material Substances 0.000 claims abstract description 15
- 238000009434 installation Methods 0.000 claims abstract description 8
- 239000004014 plasticizer Substances 0.000 claims description 45
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 claims description 42
- 239000013543 active substance Substances 0.000 claims description 42
- 239000002245 particle Substances 0.000 claims description 40
- 239000000395 magnesium oxide Substances 0.000 claims description 33
- KUAZQDVKQLNFPE-UHFFFAOYSA-N thiram Chemical compound CN(C)C(=S)SSC(=S)N(C)C KUAZQDVKQLNFPE-UHFFFAOYSA-N 0.000 claims description 33
- 239000002585 base Substances 0.000 claims description 32
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical class CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 30
- -1 promoter Substances 0.000 claims description 28
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 24
- 239000005864 Sulphur Substances 0.000 claims description 24
- 239000002270 dispersing agent Substances 0.000 claims description 23
- 229920002943 EPDM rubber Polymers 0.000 claims description 22
- 238000004073 vulcanization Methods 0.000 claims description 21
- 239000006229 carbon black Substances 0.000 claims description 20
- 150000002148 esters Chemical class 0.000 claims description 20
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims description 20
- 239000005662 Paraffin oil Substances 0.000 claims description 19
- 229960002447 thiram Drugs 0.000 claims description 19
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims description 17
- 239000003153 chemical reaction reagent Substances 0.000 claims description 17
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 17
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 15
- 239000000843 powder Substances 0.000 claims description 14
- 229920003051 synthetic elastomer Polymers 0.000 claims description 14
- 239000005061 synthetic rubber Substances 0.000 claims description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 13
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims description 13
- 238000001556 precipitation Methods 0.000 claims description 12
- 238000007493 shaping process Methods 0.000 claims description 12
- OUBMGJOQLXMSNT-UHFFFAOYSA-N N-isopropyl-N'-phenyl-p-phenylenediamine Chemical compound C1=CC(NC(C)C)=CC=C1NC1=CC=CC=C1 OUBMGJOQLXMSNT-UHFFFAOYSA-N 0.000 claims description 11
- 238000005987 sulfurization reaction Methods 0.000 claims description 11
- ZNRLMGFXSPUZNR-UHFFFAOYSA-N 2,2,4-trimethyl-1h-quinoline Chemical compound C1=CC=C2C(C)=CC(C)(C)NC2=C1 ZNRLMGFXSPUZNR-UHFFFAOYSA-N 0.000 claims description 10
- 229920000305 Nylon 6,10 Polymers 0.000 claims description 10
- ZFMQKOWCDKKBIF-UHFFFAOYSA-N bis(3,5-difluorophenyl)phosphane Chemical compound FC1=CC(F)=CC(PC=2C=C(F)C=C(F)C=2)=C1 ZFMQKOWCDKKBIF-UHFFFAOYSA-N 0.000 claims description 10
- 229910052799 carbon Inorganic materials 0.000 claims description 10
- 239000013078 crystal Substances 0.000 claims description 10
- ZRMMVODKVLXCBB-UHFFFAOYSA-N 1-n-cyclohexyl-4-n-phenylbenzene-1,4-diamine Chemical compound C1CCCCC1NC(C=C1)=CC=C1NC1=CC=CC=C1 ZRMMVODKVLXCBB-UHFFFAOYSA-N 0.000 claims description 9
- 239000001913 cellulose Chemical class 0.000 claims description 9
- 229920002678 cellulose Chemical class 0.000 claims description 9
- HHECSPXBQJHZAF-UHFFFAOYSA-N dihexyl hexanedioate Chemical compound CCCCCCOC(=O)CCCCC(=O)OCCCCCC HHECSPXBQJHZAF-UHFFFAOYSA-N 0.000 claims description 9
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 claims description 8
- 239000002202 Polyethylene glycol Substances 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 8
- 239000000194 fatty acid Substances 0.000 claims description 8
- 229930195729 fatty acid Natural products 0.000 claims description 8
- 150000004665 fatty acids Chemical class 0.000 claims description 8
- PHNWGDTYCJFUGZ-UHFFFAOYSA-N hexyl dihydrogen phosphate Chemical compound CCCCCCOP(O)(O)=O PHNWGDTYCJFUGZ-UHFFFAOYSA-N 0.000 claims description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 8
- 229920001223 polyethylene glycol Polymers 0.000 claims description 8
- FJRUWRJAJNEIKD-UHFFFAOYSA-N 2,3-dihydro-1,4-benzodioxine-6,7-diamine Chemical compound O1CCOC2=C1C=C(N)C(N)=C2 FJRUWRJAJNEIKD-UHFFFAOYSA-N 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 229920002401 polyacrylamide Polymers 0.000 claims description 7
- 229920002907 Guar gum Polymers 0.000 claims description 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 6
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 6
- 239000003513 alkali Substances 0.000 claims description 6
- 239000000665 guar gum Substances 0.000 claims description 6
- 229960002154 guar gum Drugs 0.000 claims description 6
- 235000010417 guar gum Nutrition 0.000 claims description 6
- 229910052749 magnesium Inorganic materials 0.000 claims description 6
- 239000011777 magnesium Substances 0.000 claims description 6
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 6
- 235000019422 polyvinyl alcohol Nutrition 0.000 claims description 6
- RCEAADKTGXTDOA-UHFFFAOYSA-N OS(O)(=O)=O.CCCCCCCCCCCC[Na] Chemical compound OS(O)(=O)=O.CCCCCCCCCCCC[Na] RCEAADKTGXTDOA-UHFFFAOYSA-N 0.000 claims description 5
- 239000005843 Thiram Substances 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 5
- AFZSMODLJJCVPP-UHFFFAOYSA-N dibenzothiazol-2-yl disulfide Chemical compound C1=CC=C2SC(SSC=3SC4=CC=CC=C4N=3)=NC2=C1 AFZSMODLJJCVPP-UHFFFAOYSA-N 0.000 claims description 5
- 239000005543 nano-size silicon particle Substances 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 238000003786 synthesis reaction Methods 0.000 claims description 5
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 claims description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 4
- 229910052796 boron Inorganic materials 0.000 claims description 4
- 229940068984 polyvinyl alcohol Drugs 0.000 claims description 4
- 125000002813 thiocarbonyl group Chemical group *C(*)=S 0.000 claims description 4
- 230000003213 activating effect Effects 0.000 claims description 3
- 238000001354 calcination Methods 0.000 claims description 3
- 239000003607 modifier Substances 0.000 claims description 3
- 239000011734 sodium Substances 0.000 claims description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims 12
- 229920001030 Polyethylene Glycol 4000 Polymers 0.000 claims 4
- 230000001681 protective effect Effects 0.000 abstract description 35
- 238000004519 manufacturing process Methods 0.000 abstract description 15
- 238000009987 spinning Methods 0.000 abstract description 8
- 239000000758 substrate Substances 0.000 abstract description 3
- 230000008569 process Effects 0.000 abstract description 2
- 230000002035 prolonged effect Effects 0.000 abstract 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 42
- 239000000945 filler Substances 0.000 description 33
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 31
- 229910017083 AlN Inorganic materials 0.000 description 28
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 28
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 24
- 239000003963 antioxidant agent Substances 0.000 description 20
- 230000003078 antioxidant effect Effects 0.000 description 20
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 17
- 239000011787 zinc oxide Substances 0.000 description 16
- 239000000523 sample Substances 0.000 description 15
- 238000010586 diagram Methods 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 12
- 230000000694 effects Effects 0.000 description 12
- 244000043261 Hevea brasiliensis Species 0.000 description 9
- 239000002131 composite material Substances 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 9
- 239000007788 liquid Substances 0.000 description 9
- 229920003052 natural elastomer Polymers 0.000 description 9
- 229920001194 natural rubber Polymers 0.000 description 9
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 8
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 8
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 8
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 7
- 230000003679 aging effect Effects 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 7
- 239000002105 nanoparticle Substances 0.000 description 7
- 239000004800 polyvinyl chloride Substances 0.000 description 7
- 229920000915 polyvinyl chloride Polymers 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 6
- 230000032683 aging Effects 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 230000008901 benefit Effects 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 229910044991 metal oxide Inorganic materials 0.000 description 6
- 150000004706 metal oxides Chemical class 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 5
- 238000005286 illumination Methods 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- NWSGBTCJMJADLE-UHFFFAOYSA-N 6-o-decyl 1-o-octyl hexanedioate Chemical compound CCCCCCCCCCOC(=O)CCCCC(=O)OCCCCCCCC NWSGBTCJMJADLE-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000001856 Ethyl cellulose Substances 0.000 description 4
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 4
- UTGQNNCQYDRXCH-UHFFFAOYSA-N N,N'-diphenyl-1,4-phenylenediamine Chemical group C=1C=C(NC=2C=CC=CC=2)C=CC=1NC1=CC=CC=C1 UTGQNNCQYDRXCH-UHFFFAOYSA-N 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 238000005336 cracking Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 229920001249 ethyl cellulose Polymers 0.000 description 4
- 235000019325 ethyl cellulose Nutrition 0.000 description 4
- 238000011049 filling Methods 0.000 description 4
- 239000003063 flame retardant Substances 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 238000011160 research Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- QGJOPFRUJISHPQ-UHFFFAOYSA-N Carbon disulfide Chemical compound S=C=S QGJOPFRUJISHPQ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
- 239000001361 adipic acid Substances 0.000 description 3
- 235000011037 adipic acid Nutrition 0.000 description 3
- QGJOPFRUJISHPQ-NJFSPNSNSA-N carbon disulfide-14c Chemical compound S=[14C]=S QGJOPFRUJISHPQ-NJFSPNSNSA-N 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 150000001993 dienes Chemical class 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 230000003993 interaction Effects 0.000 description 3
- 239000002649 leather substitute Substances 0.000 description 3
- 238000013508 migration Methods 0.000 description 3
- 230000005012 migration Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 231100000252 nontoxic Toxicity 0.000 description 3
- 230000003000 nontoxic effect Effects 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- RUFPHBVGCFYCNW-UHFFFAOYSA-N 1-naphthylamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1 RUFPHBVGCFYCNW-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- YCSMVPSDJIOXGN-UHFFFAOYSA-N CCCCCCCCCCCC[Na] Chemical compound CCCCCCCCCCCC[Na] YCSMVPSDJIOXGN-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 229940037003 alum Drugs 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- 230000003712 anti-aging effect Effects 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000000805 composite resin Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000004567 concrete Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 238000007710 freezing Methods 0.000 description 2
- 230000008014 freezing Effects 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 230000037361 pathway Effects 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 2
- 231100000614 poison Toxicity 0.000 description 2
- 230000007096 poisonous effect Effects 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 238000004513 sizing Methods 0.000 description 2
- 229910052938 sodium sulfate Inorganic materials 0.000 description 2
- 235000011152 sodium sulphate Nutrition 0.000 description 2
- 238000003746 solid phase reaction Methods 0.000 description 2
- 238000010532 solid phase synthesis reaction Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 229920002725 thermoplastic elastomer Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- PKJBRKTYYNRVSN-UHFFFAOYSA-N 10-(aminomethyl)-9,10-dihydroanthracene-1,2-diol Chemical compound OC1=CC=C2C(CN)C3=CC=CC=C3CC2=C1O PKJBRKTYYNRVSN-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- JKTNUPMEJUHPBY-UHFFFAOYSA-N C(CCC)C=1C(=C(C(C(=O)O)=CC1)C(=O)O)CC1=CC=CC=C1.C(C=1C(C(=O)OCC2=CC=CC=C2)=CC=CC1)(=O)OCCCC Chemical compound C(CCC)C=1C(=C(C(C(=O)O)=CC1)C(=O)O)CC1=CC=CC=C1.C(C=1C(C(=O)OCC2=CC=CC=C2)=CC=CC1)(=O)OCCCC JKTNUPMEJUHPBY-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229920002160 Celluloid Polymers 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JVTAAEKCZFNVCJ-UHFFFAOYSA-M Lactate Chemical compound CC(O)C([O-])=O JVTAAEKCZFNVCJ-UHFFFAOYSA-M 0.000 description 1
- 229920005479 Lucite® Polymers 0.000 description 1
- WAEMQWOKJMHJLA-UHFFFAOYSA-N Manganese(2+) Chemical compound [Mn+2] WAEMQWOKJMHJLA-UHFFFAOYSA-N 0.000 description 1
- 229920002319 Poly(methyl acrylate) Polymers 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- LZBCVRCTAYKYHR-UHFFFAOYSA-N acetic acid;chloroethene Chemical compound ClC=C.CC(O)=O LZBCVRCTAYKYHR-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 230000000172 allergic effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 208000010668 atopic eczema Diseases 0.000 description 1
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Inorganic materials [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 1
- CSSYLTMKCUORDA-UHFFFAOYSA-N barium(2+);oxygen(2-) Chemical compound [O-2].[Ba+2] CSSYLTMKCUORDA-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011449 brick Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 150000008280 chlorinated hydrocarbons Chemical class 0.000 description 1
- NEHMKBQYUWJMIP-UHFFFAOYSA-N chloromethane Chemical class ClC NEHMKBQYUWJMIP-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002322 conducting polymer Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000010339 dilation Effects 0.000 description 1
- MIMDHDXOBDPUQW-UHFFFAOYSA-N dioctyl decanedioate Chemical compound CCCCCCCCOC(=O)CCCCCCCCC(=O)OCCCCCCCC MIMDHDXOBDPUQW-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- QGEOKXWFGANCJL-UHFFFAOYSA-N ethenyl acetate;hydrochloride Chemical compound Cl.CC(=O)OC=C QGEOKXWFGANCJL-UHFFFAOYSA-N 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229920001821 foam rubber Polymers 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 235000013611 frozen food Nutrition 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- CNFQJGLKUZBUBD-TXHUMJEOSA-N hexa-1,5-diene;(3e)-hexa-1,3-diene;(4e)-hexa-1,4-diene Chemical class CC\C=C\C=C.C\C=C\CC=C.C=CCCC=C CNFQJGLKUZBUBD-TXHUMJEOSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000002085 irritant Substances 0.000 description 1
- 231100000021 irritant Toxicity 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 229910001437 manganese ion Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000011858 nanopowder Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000009965 odorless effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000012785 packaging film Substances 0.000 description 1
- 229920006280 packaging film Polymers 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000003209 petroleum derivative Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000002574 poison Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000011814 protection agent Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000013074 reference sample Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000007614 solvation Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229920006174 synthetic rubber latex Polymers 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000003809 water extraction Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Abstract
The invention discloses a heat-conductive rubber light-emitting diode (LED) lamp; and a spinning socket is fixedly connected with a spinning groove which is arranged on a lamp holder through a spinning device on the spinning socket. A radiator comprises radiating fins. The radiating fins are of arc-shaped structures and are distributed uniformly. A protective hood is of a structure which is made of a light-transmitting material. The protective hood is in a semi-spherical shape. An installation method of an LED bulb comprises the following steps that an LED lamp bead is arranged on a copper substrate through an automatic installation method; the copper substrate which is provided with the LED lamp bead is respectively connected with the protective hood and the radiator through the automatic installation method; and the lamp holder is connected and installed with the radiator by manual assembly through the spinning socket. The product assembly method is more simplified, the production efficiency and the production cost are greatly improved, the service life is greatly prolonged, the raw material mixing is reasonable and the process is simple.
Description
Technical field
The present invention relates to the mechanical device technique field of illumination, particularly relate to a kind of Novel heat-conducting rubber LED and method for making.
Background technology
The mode that current LED illumination lamp many employings filament connects, it is loaded down with trivial details to there is production stage in it, produce accessory long processing time, and the problem that production cost is high, in addition, it is poor also to there is material conducts heat performance in it, stability is not ideal enough, and it is shaping, the problem that fire-retardant and insulating properties are poor, for this reason, need a kind of LED illumination lamp that can solve the problem, its material can have good heat conductivility and stability, and can well solve shaping, the problem of fire-retardant and insulating properties, simplify assemble method simultaneously, enhance productivity, improve production cost and service life, thus meet the needs of actual conditions.
Now, because electronic product is more and more tending towards miniaturized, therefore those easily integrated and miniaturized and that pliability is good compounded rubber substrate be widely used, but because the multiple stratification of the highly integrated and laminate of integrated circuit certainly leads to heat release problem, therefore the task of top priority is just become to the requirement of the heat conductivility of these materials.
Ethylene propylene diene rubber (EPDM) is the terpolymer of ethene, propylene and diene-based monomer, and the introducing of diene is to realize sulfuration, and the type of diene has: dicyclopentadiene (DCPD), l, 4 one hexadienes.EPDM is better than common EP rubbers toughness.
People are with dielectric metal oxide and other compound filled polymers in recent years, tentatively solve this problem.The filler of insulated type heat conductive rubber mainly comprises: metal oxide is as BeO, MgO, A1
2o
3, CaO, NIO; Metal nitride is as AlN, BN etc.; Carbide is as SiC, B
4c
3deng.They have higher thermal conductivity factor, and what is more important compares the electrical insulating property having excellence with metal powder, and therefore they can ensure that end article has good electrical insulating property, and this is vital in electronic apparatus industry.
Investigation and application for heat conductive rubber is a lot, can be divided into: metal filled type, metal oxide filled-type, metal nitride filled-type, inorganic non-metallic filled-type, fiber-filled type heat conductive rubber by the kind of particle filled composite; Also can divide according to a certain character of heat conductive rubber, such as can be divided into insulated type heat conductive rubber and nonisulated type heat conductive rubber according to its electrical insulation capability.
Because rubber itself has insulating properties, the therefore electrical insulation capability of most heat conductive rubber is finally determined by the insulating properties of particle filled composite.Filler for nonisulated type heat conductive rubber is usually metal powder, graphite, carbon black, carbon fiber etc., the feature of this kind of filler has good thermal conductivity, material easily can be made to obtain high heat conductivility, but also make the decreasing insulating of material even become conductive material simultaneously.Therefore at the working environment of material in the less demanding situation of electrical insulating property, above-mentioned filler can be applied.And also necessarily require heat conductive rubber to have low electrical insulating property to meet specific requirement, as anti-static material, electromagnetic shielding material etc. under certain conditions.
Information industry flourish in the last few years, new requirement is proposed to the performance of macromolecular material, especially for the development of heat conductive rubber provides development space, the application of heat conductive rubber on computer fittings will improve the heat dissipation problem of computer and improve its speed of service and stability, as CPU, notebook computer shell and various surface-mounted integrated circuit, these materials all require heat conductive insulating.Macromolecular material insulate, but as Heat Conduction Material, pure macromolecular material is generally inefficient, because macromolecular material is the non-conductor of heat mostly, macromolecular material thermal conductivity factor is about the 1/500-1/600 of metal.The thermal conductivity factor of foam rubber only has 0.02-0.046W/m.K, is about 1/1500 of metal, 1/40 of cement concrete, 1/20 of common brick, is desirable heat-insulating material. and expand its application in heat conduction field, modification must be carried out to macromolecular material.The thermal conductivity factor of macromolecular material, metal and metal oxide is in Table 1-1, table 1-2, table 1-3.
The high molecular thermal conductivity factor of table 1-1
The thermal conductivity factor of table 1-2 metal and metal oxide
Metal and the inorganic filler that can be used as conductive particle have following several substantially:
(l) metal powder filler: copper powder, aluminium powder, bronze, silver powder.
(2) metal oxide: aluminium oxide, is oxidized secret, barium monoxide, magnesia, zinc oxide.
(3) metal nitride: aluminium nitride, boron nitride.
(4) inorganic non-metallic: graphite, carborundum.
When Inorganic Non-metallic Materials is as heat filling filled high polymer material matrix, the quality of filling effect depends primarily on following factor: the kind of (l) polymeric matrix, characteristic; (2) shape, particle diameter, the Size Distribution of filler; (3) interface binding characteristic of filler and matrix and the interaction of two-phase.
The thermal conductivity factor of some packing materials of table 1-3
Due to adding of filler, the mechanical performance of material is declined.Therefore, the conductibility not only will considered in the design of composite, and require that stability of material is good, nontoxic, satisfactory mechanical property and inexpensive.The polymer that use itself has good heat conductive performance relative to another selection of filled polymer, but the expensive and deficient in stability in performance of this type of material price, become their major defect on using.Rubber is the material that in macromolecular material, output is maximum.
The market demand of conductibility macromolecular material is annual all in growth, and wherein the market demand of heat conductive rubber increases faster.Therefore the research of rubber heat conductivility has been caused to the interest of various countries researcher, and done good work.The research of current fillibility heat conductive rubber, the method that major part adopts physics to fill, heat conductivility is poor, and mechanical performance declines serious, and production cost is high.But along with the market of expanding day and going deep into of research, heat conductive rubber will have a large development, especially the research and development of nano heat-conductive material, the preparation of high heat-conductive body polymeric material, the discussion of polymer bond mechanism should become the developing direction of heat-conducting polymer material.
Summary of the invention
Technical problem to be solved by this invention is, propose a kind of high heat conductive rubber and preparation method and LED thereof and preparation method, it is by improving raw material components and formula, further improve its heat conductivility and stability, and improve shaping, fire-retardant and insulating properties largely, simultaneously, the assemble method of its product more simplifies, and the production efficiency of its product, production cost and service life are improved all largely, and it has reasonable raw material proportioning, the simple feature of technique.
The technical solution used in the present invention is: provide a kind of heat conductive rubber LED, comprising: lamp socket, radiator, copper base and LED lamp bead.
Described heat conductive rubber LED can have the type socket that spins further;
Described lamp socket can be connected with described radiator by the type socket that spins;
Described LED lamp bead can be arranged on described copper base;
Described copper base can be provided with described LED lamp bead;
The one side of described copper base can be connected with radiator;
Described spin type socket can by the groove that spins that arranges on rotary joint device that it is arranged and lamp socket be attached thereto connect fixing.
Described radiator can be made up of fin.
Described fin can adopt arcuate structure and be evenly distributed.
The material that described radiator preferably adopts is high heat conducting nano compounded rubber according to any one of following content.
For solving the problems of the technologies described above, present invention also offers a kind of installation method of described heat conductive rubber LED, comprising the following steps: LED lamp bead adopted Auto-mounting mode to be arranged on copper base; Auto-mounting mode is adopted to be connected with described protective cover and described radiator respectively the copper base that LED lamp bead is housed; Lamp socket to be connected with radiator by manual assembly by the type socket that spins and to install.
For solving the problems of the technologies described above, invention further provides the radiator used in a kind of LED bulb, material high heat conducting nano compounded rubber according to any one of following content that described radiator adopts.
For solving the problems of the technologies described above, the present invention has reoffered a kind of high heat conducting nano compounded rubber, its raw material comprise in following component one or more: ethylene propylene diene rubber, age resistor, carbon black, sulphur, promoter, plasticizer, paraffin oil, organic active agent PEG4000, inorganic active agent, dispersant.
Described material content proportioning is preferably by weight:
Ethylene propylene diene rubber 150-200 part,
Age resistor 1-4 part,
Carbon black 40-80 part,
Sulphur 1-3 part,
Promoter 1-3 part,
Plasticizer 6-10 part,
Paraffin oil 40-80 part,
Organic active agent PEG4000,3-8 part
Inorganic active agent 6-12 part,
Dispersant 1-4 part.
Described age resistor be preferably in following reagent one or more: 6-ethyoxyl-2,2,4-trimethyl-1,2-dihyaroquinoline; 2,2,4-trimethyl 1,2-dihydro quinoline condensate; N-phenyl-α-aniline; N-PBNA; N-phenyl-N`-cyclohexyl p-phenylenediamine (PPD); N-phenyl-N`-isopropyl-p-phenylenediamine (PPD).; N-N`-diphenyl-p-phenylenediamine.
Described promoter be preferably in following reagent one or more: promoter T; The two thiamides of N, N-tetramethyl two sulphur; Tetramethylthiuram disulfide; Thiram; Vulcanization accelerator TMTD; Tetramethyl two sulfo-thiuram; Vulcanization accelerator TMTD; Vulcanization accelerator TMTD-II; Promoter TT; Curing two (thiocarbonyl group dimethylamine); Tetramethyl TMTD; Tetramethyl sulfo-peroxy dicarbonate diamides; Tetramethyl thiuram disulfide; TMTD; Altax; Accelerant B Z.
Described plasticizer be preferably in following reagent one or more:: o-phthalic acid dibutyl ester; DEDB; Dioctyl adipate; Di-n-hexyl adipate; BBP(Butyl Benzyl Phthalate; Decanedioic acid two (2-ethyl hexyl) ester.
Described activating agent is preferably PEG4000; Described dispersant be preferably in following reagent one or more: triethyl group hexyl phosphoric acid, lauryl sodium sulfate, methyl anyl alcohol, cellulose derivative, polyacrylamide, guar gum, fatty acid polyethylene glycol ester.
Described inorganic active agent be preferably in following reagent one or more: MgO, Al
2o
3, Si
3n
4, BN, AlN, ZnO, KAl (SO
4)
212H
2o, Al
2o
3-2SiO
2-2H
2o.
Described AlN is preferably: AlN whisker and AlN particle.
Described Si
3n
4be preferably highly heat-conductive silicon nitride; Described BN is nano silicon nitride boron particles, meets following index:
Described high heat conducting nano compounded rubber, prepare preferably by following steps:
The first step, synthetic rubber: by banbury by described Material synthesis rubber;
Second step, shaping: by mill, synthetic rubber is shaping;
3rd step, sulfuration: mould molded rubber being put into vulcanizer, pressurization scope is 150-210kgf/ ㎝
2, be warmed up to 220-230 DEG C, the time is 80-100 second, carries out sulfuration.
The technique effect that the present invention has a mind to is: propose a kind of high heat conductive rubber and preparation method and LED bulb thereof and installation method, it is by improving raw material components and formula, further improve its heat conductivility and stability, and improve shaping, fire-retardant and insulating properties largely, it has reasonable raw material proportioning, the simple feature of technique; Its product simultaneously, namely the LED bulb be made up of described high heat conductive rubber to be spun type structure by employing, the problem existing for existing LED illumination lamp can be solved, the production and assembly mode that Auto-mounting and assembly line hand fit use can be adopted, there are production and assembly succinct, production efficiency is high, production cost is low, be connected firmly attractive in appearance, good illumination effect, use safety, the advantage that the life-span is long, the public places such as market, factory, office family can be widely used in, the needs of actual conditions can be met.The present invention is by having carried out Experimental comparison to the capacity of heat transmission of the filler of various difformity and size raising Polymers used in combination, and filler comprises MgO, Al
2o
3, Si
3n
4, BN, AlN, ZnO, KAl (SO
4)
212H
2o (alum) and/or Al
2o
3-2SiO
2-2H
2o (kaolin) etc.The present invention's mixed fillers makes the thermal conductivity of composite significantly improve.The present invention utilizes the particle, the whisker formation continuous print heat conduction network chain that there are certain draw ratio; Select the filler combination of different particle diameters, reach higher filling density: utilize coupling agent to improve the interface of filler and matrix, to reduce the thermal resistance of interface; Thermal conductivity factor is improved with nanomaterial-filled rubber.High heat conducting nano compounded rubber of the present invention is the thermoplastic composite resin of thermal conductivity up to 22.45 ~ 33.75w/mK.The technology of the present invention utilizes unique MOLECULE DESIGN, improves the interaction force of molecule between thermoplastic elastomer and filler, and filler high efficiency contact each other defines thermal pathways, has increased substantially thermal conductivity.
Accompanying drawing explanation
Below in conjunction with drawings and embodiments, the invention will be further described:
Fig. 1 is its assembled state structural representation of LED bulb of one embodiment of the invention;
Fig. 2 is its split status architecture schematic diagram of LED bulb of one embodiment of the invention;
Fig. 3 is its lamp socket surface structure schematic diagram of LED bulb of one embodiment of the invention;
Fig. 4 is its lamp socket front view of LED bulb of one embodiment of the invention;
Fig. 5 is its lamp base part view of LED bulb of one embodiment of the invention;
Fig. 6 is its radiator surface structure schematic diagram of LED bulb of one embodiment of the invention;
Fig. 7 is its radiator view of LED bulb of one embodiment of the invention;
Fig. 8 is its heat sink side view of LED bulb of one embodiment of the invention;
Fig. 9 is its copper base front view of LED bulb of one embodiment of the invention;
Figure 10 is its rate copper base side view of LED bulb of one embodiment of the invention;
Figure 11 is its LED lamp bead structural representation of LED bulb of one embodiment of the invention;
Figure 12 is its protective cover surface structure schematic diagram of LED bulb of one embodiment of the invention;
Figure 13 is its protective cover front view of LED bulb of one embodiment of the invention;
Figure 14 is its protective cover side view of LED bulb of one embodiment of the invention.
Detailed description of the invention
Describe embodiments of the present invention in detail below with reference to drawings and Examples, to the present invention, how application technology means solve technical problem whereby, and the implementation procedure reaching technique effect can fully understand and implement according to this.
Embodiment 1: the present embodiment high heat conducting nano short vulcanization complex ternary EP rubbers, each material component content proportioning is by weight:
Ethylene propylene diene rubber 150-200 part,
Age resistor 1-4 part,
Carbon black 40-80 part,
Sulphur 1-3 part,
Promoter 1-3 part,
Plasticizer 6-10 part,
Paraffin oil 40-80 part,
Organic active agent PEG4000,3-8 part
Inorganic active agent 6-12 part,
Dispersant 1-4 part,
And it is prepared by following steps:
The first step, synthetic rubber: by banbury by above-mentioned raw materials synthetic rubber;
Second step, shaping: by mill, synthetic rubber is shaping;
3rd step, sulfuration: mould molded rubber being put into vulcanizer, pressurization scope is 150-210kgf/ ㎝
2, be warmed up to 220-230 DEG C, the time is 80-100 second, carries out sulfuration.
Embodiment 2: rubber disperse agent impels material particles to be dispersed in Rubber Media, forms the reagent of stable suspension.The rubber disperse agent used in the embodiment of the present invention is one or more in following reagent: triethyl group hexyl phosphoric acid, lauryl sodium sulfate, methyl anyl alcohol, cellulose derivative, polyacrylamide, guar gum, fatty acid polyethylene glycol ester.
Embodiment 3:
The age resistor that one embodiment of the invention uses is: 6-ethyoxyl-2,2,4-trimethyl-1,2-dihyaroquinoline.Its trade name is antioxidant A W.Antioxidant A W is brown viscous liquid, and sterling is light brown sticky cylinder liquid.Nontoxic, proportion is 1.029 ~ 1.030 (25 DEG C), and boiling point is 169 DEG C.Benzene, acetone, dichloroethane, carbon tetrachloride, industrial naptha and ethanol can be dissolved in; Water insoluble.Stable storage.Be the anti-ozone age resistor of special efficacy, also have protective action to flex crack and thermo-oxidative ageing.The goods used under being specially adapted to dynamic condition.No blooming, has contaminative, is unsuitable for light color article.Little on sulfuration impact during consumption 1 ~ 2 part, increase to 3 parts and then significantly promote sulfuration, during use, promote that consumption should suitably reduce.
The age resistor that another embodiment of the present invention uses is: 2,2,4-trimethyl 1,2-dihydro quinoline condensate.Trade name is anti-aging agent RD.Anti-aging agent RD be amber to canescence resin-like powder, nontoxic.Softening point is not less than 74 DEG C.Acetone, benzene, chloroform, carbon disulfide can be dissolved in, be slightly soluble in petroleum hydrocarbon; Water insoluble.The oxidation that energy rejection condition is harsher, heat ageing and Weather effect, but poor to flex crack protection effect.No blooming, there is light contamination.General amount ranges is 0.5 ~ 2 part, reaches as high as 3 compositions.
The age resistor that yet another embodiment of the invention uses is: N-phenyl-α-aniline.Trade name is antioxidant A.Antioxidant A be yellowish-brown to purple crystal shape material, sterling is colorless plate crystal, because of containing a small amount of alpha naphthylamine and aniline, poisonous, can not with skin contact.Proportion is 1.16 ~ 1.17, and fusing point is not less than 52.0 DEG C.Be soluble in acetone, ethyl acetate, benzene, ethanol, chloroform, carbon tetrachloride; Dissolve in gasoline; Water insoluble.Gradual change purple in daylight and air.Inflammable.Antioxidant A to heat, oxygen, to subdue and the aging action such as weather all has good protection effect, be the general age resistor of natural rubber, synthetic rubber and reclaimed rubber.The performance that ozone-resistant is aging is had concurrently in neoprene; Also there is certain inhibition easily to disperse in dry glue to the aging action of variable valency metal ions and reclaimed rubber, be also easily scattered in water; Solubility in rubber is up to 5%, larger than antioxidant D, and consumption is no blooming 3 ~ 4 parts time, therefore can increase consumption to improve protective benefits.Antioxidant A has contaminative and animal migration.General amount ranges is 1 ~ 2 part, reaches as high as 5 parts.
The age resistor that further embodiment of this invention uses is: N-PBNA.Trade name is antioxidant D.Antioxidant D is light grey to light brown powder, and sterling is white powder.Proportion is 1.18, and fusing point is not less than 104 DEG C.Easy solvent is in acetone, ethyl acetate, carbon disulfide, chloroform; Dissolve in ethanol, carbon tetrachloride; Be insoluble to gasoline and water.Under air and daylight, gradually become grey black, but do not affect protection effect.Inflammable.Antioxidant D is the universal age resistor of natural rubber, synthetic rubber and latex.All there is good protective action to heat, oxygen, flex crack and general aging action, and be slightly better than antioxidant A.Also have protective action to the ion of poisonous metal, but comparatively antioxidant A is poor.If with age resistor 4040 or 4010NA and use, heat resistanceheat resistant, oxygen, flex crack and ozone-resistant ageing properties all have remarkable increase.Easily be scattered in water in dry glue.Solubility in rubber is lower than antioxidant A, is about 1.5%.The meeting bloom when consumption is more than 2 parts, with antioxidant A and with then avoiding.Tool contaminative, is unsuitable for light color article.Amount ranges is generally 0.5 ~ 2 part.This kind of age resistor is easy to get because of raw material, manufactures simple, cheap, therefore also occupies certain status at home at present.
The age resistor that further embodiment of this invention uses is: N-phenyl-N`-cyclohexyl p-phenylenediamine (PPD).Trade name is antioxidant 4010 (or age resistor CPPD).Antioxidant 4010 is pale powder, and sterling is white powder.Irritant to skin.Proportion is 1.29, and fusing point is lower than 110 DEG C, is very easily dissolved in chloromethanes, is soluble in benzene, ethyl acetate, acetone, is insoluble in industrial naptha, water insoluble.In atmosphere or daylight end deepen look, but protection effect do not subtract.Antioxidant 4010 is one of excellent universal age resistor of natural rubber and synthetic rubber, is particularly useful for natural rubber and butadiene-styrene rubber.Excellent to aging action protective benefitses such as heat, oxygen, ozone, light, be also the excellent lasting be full of cracks of mechanical stress formation and the inhibitor of flex crack.Also have the aging action of high-energy radiation and copper ion and necessarily have protective action.All better than the protection effect of antioxidant A T and antioxidant D, have goodish protective benefits time alone, but with its age resistor as AW, crystallinity and with to ozone-induced cracking and natural aging protective benefits higher.Also can use with antioxidant A, D or other universal age resistor.Antioxidant 4010 easily disperses, and can produce bloom when consumption is more than 1 part, and it is serious that goods meet phototropic.Also can migration stain other sizing material contacted with it or material.General amount ranges 0.15 ~ 1 part.
The age resistor that further embodiment of this invention uses is: N-phenyl-N`-isopropyl-p-phenylenediamine (PPD).Trade name is antioxidant 4010NA (or age resistor IPPD).Antioxidant 4010NA is purple flaky crystal.Micro-toxic, allergic anti-hydraulic pressure can be caused.Fusing point is not less than 70 DEG C.Dissolve in oils, benzene, ethyl acetate, carbon tetrachloride, carrene, chloroform, carbon disulfide, acetone, ethanol, be insoluble in gasoline, water insoluble.Stable storage.Meeting variable color under daylight, but do not affect usefulness.Antioxidant 4010NA is the universal age resistor of natural rubber, synthetic rubber latex glue.Good to ozone-induced cracking, flex crack barrier propterty spy; Also be heat, oxygen, light and generally aging superior protection agent.Also can suppress the aging action of variable valency metal ions, protection natural rubber performance compared with 4010 more comprehensively.Antioxidant 4010NA can be alone, produces with not only reducing consumption but also can improve protective benefits with antioxidant A W or wax.Especially with wax and with staying the anti-static ozone-induced cracking performance of improving the standard.Fusing point is lower, easily disperses, and the solubility in rubber is larger than 4010, and bloom is less, therefore can improve consumption.Contaminative is large.The goods used under being usually used in the higher condition of dynamic and static state stress.General amount ranges is 1 ~ 4 part.
The age resistor that further embodiment of this invention uses is: N-N`-diphenyl-p-phenylenediamine.Trade name is antioxidant H.(having another name called antioxidant DPPD or age resistor PPD).Antioxidant H is that taupe powder is lumped together, and sterling is silvery white flaky crystal.Proportion is 1.18 ~ 1.22.Fusing point is not less than 140 DEG C.Dissolve in benzene, toluene, acetone, ether, dichloroethanes, carbon disulfide, be slightly soluble in ethanol and gasoline; Water insoluble.Storage-stable.In atmosphere and easy to change under daylight.Inflammable.Antioxidant H is natural rubber, elastomeric universal age resistor, has excellent flex cracking resistance performance, excellent to the aging protective action of heat, oxygen, ozone, light, particularly copper, manganese ion.Especially natural rubber and elastomeric paralled system is applicable to.But variable color and seriously polluted.Solubility in rubber is low; In butadiene-styrene rubber, be up to 0.7%, be 0.35% in natural rubber, in polybutadiene rubber, solubility is lower.There is bloom phenomenon when exceeding its solubility in consumption, when with other age resistor as antioxidant A and the used time, its consumption can be reduced and can improve protection effect again.Time alone, amount ranges is generalized to 0.2 ~ 0.3 part.
Embodiment 4: the promoter that the embodiment of the present invention uses is one or more in following product: promoter T, N, the two thiamides of N-tetramethyl two sulphur, tetramethylthiuram disulfide, thiram, vulcanization accelerator TMTD, tetramethyl two sulfo-thiuram, Vulcanization accelerator TMTD, Vulcanization accelerator TMTD-II, promoter TT, curing two (thiocarbonyl group dimethylamine), tetramethyl TMTD, tetramethyl sulfo-peroxy dicarbonate diamides, tetramethyl thiuram disulfide, TMTD, rubber accelerator DM, accelerant B Z.
Embodiment 5:
The plasticizer that one embodiment of the invention uses is: o-phthalic acid dibutyl ester (DOP).Plasticizer DOP is colourless oil liquid, proportion 0.9861 (20/20), fusing point-55, and boiling point 370 (normal pressure) is water insoluble, is dissolved in ethanol, ether, the most of organic solvent of mineral wet goods.General purpose grade DOP, is widely used in the industry such as plastics, rubber, paint and emulsifying agent.DOP is universal plasticizer, be mainly used in the processing of the processing of polyvinyl chloride fat, also the can be used for ground high polymers such as resin, acetate resin, ABS resin and rubber, also can be used for making paint, dyestuff, dispersant etc., the PVC of DOP plasticising can be used for manufacturer's fabricate-leather, agricultural film, packaging material, cable etc.
The plasticizer that another embodiment of the present invention uses is: DEDB.DEDB and polyvinyl chloride and the rare copolymer of vinyl chloride acetic acid second, the poly-rare good intermiscibility of acetic acid second, also and polyvinyl chloride, polymethyl acrylate, polyvinyl alcohol butyral, NC Nitroncellulose, butyl acetate cellulose and ethyl cellulose etc. mix.DEDB lighter color, plasticizing efficiency are high, intermiscibility good, volatility is low, exudative low, thermally-stabilised index is high, cold-resistant water-fast extraction, not oxidizable and volatilization, excellent electrical properties, filler capacity greatly, goods brightness high.Be widely used in PVC plastic particle, non-filling calendered film, artificial leather, CABLE MATERIALS, sheet material, sheet material, soft or hard tubing, sole material, rubber-plastic strip, foamed material, film, paint, rubber, lucite, printing-ink, plasticized paste, acetate emulsion adhesive etc.Be the one that plasticizer industry price is minimum, can significantly reduce rubber product cost.
The plasticizer that yet another embodiment of the invention uses is: dioctyl adipate.Its chemistry is by name: adipic acid 2121 Octyl Nitrite, molecular formula is C
22h
42o
4, dioctyl adipate is colorless and odorless transparent oily liquid, can be dissolved in most of organic solvents such as ethanol, ether, acetone, acetic acid, be slightly soluble in ethylene glycol, water insoluble.But the volatility of dioctyl adipate is large, and there is certain deficiency the aspects such as resistance to water, animal migration, insulating properties.Dioctyl adipate is normal and phthalate is composite, is applied to cold-resistant agricultural film, cable clad, artificial leather, sheet material, outdoor water pipe and Frozen Food Packaging film etc.Dioctyl adipate can also as the cold resistant plasticizer of the resins such as the low temperature plasticizer of various synthetic rubber and NC Nitroncellulose, ethyl cellulose, polystyrene, vinyl chloride one acetic acid butylene copolymer.At present, di-n-hexyl adipate is also widely used in polyvinyl butyral resin film.In addition, in many countries, legal its can be used as the plasticizer of food, medical packaging plastics.
The plasticizer that further embodiment of this invention uses is: di-n-hexyl adipate.Di-n-hexyl adipate is the cold resisting type plasticizer that consumption is maximum in the world.N-octyl n-decyl adipate (NODA), colourless transparent liquid is by adipic acid and the n-octyl alcohol of straight chain, the straight chain type binary acid mixed ester of Decanol lactate synthesis; N-octyl n-decyl adipate (NODA) is dissolved in mineral oil, gasoline and most of organic solvent, insoluble or be slightly soluble in glycerine, glycols and some amine, is the straight chain type cold-resistant plasticizer of function admirable.Compared with adipic acid branched-chain alcoho, there is better resistance to low temperature, and volatilization loss, heat resistance and light resistance, water-extraction resistance etc. are also excellent compared with side chain alcohol ester.When it and phthalic acid ester shares time, polyvinyl chloride Vinyl Acetate Copolymer Emulsion performance can be improved, be widely used for the cold resistant plasticizer of polyvinyl acetate, polystyrene, polymethyl methacrylate, celluloid, ethyl cellulose and rubber.
The plasticizer that further embodiment of this invention uses is: BBP(Butyl Benzyl Phthalate (Butyl benzyl phthalate) molecular weight 312.40.Character: colourless transparent oil liquid.Relative density (25 DEG C/4 DEG C) 1.116 ,-35 DEG C, freezing point, boiling point 370 DEG C. flash-point (opening) 199 DEG C. refractive index 1.535. viscosity (25 DEG C) 41.5mPas, is dissolved in organic solvent and hydro carbons.Water insoluble.Flammable.Micro-poison.With most of rubber and resin compatible good. solvation is strong, the plasticizer of, oil resistant extractable heat-resisting as resistance to water.
The plasticizer that further embodiment of this invention uses is: cold resistant plasticizer DOS.Di-n-octyl sebacate (DOS), formal name used at school: decanedioic acid two (2-ethyl hexyl) ester molecule formula: C
26h
50o
4.Cold resistant plasticizer DOS is colourless or pale yellow transparent oily liquids,-48 DEG C, freezing point, boiling point: 256 DEG C (0.67Kpa), ignition point 257-263 DEG C, viscosity 25mPa.s (20 DEG C), index of refraction 1.449-1.451 (25 DEG C), can be dissolved in the organic solvents such as hydro carbons, alcohols, ketone, ester class, chlorinated hydrocarbon, be insoluble to di-alcohols and water.Cold resistant plasticizer DOS is the excellent cold resistant plasticizer of a kind of polyvinyl chloride, and plasticizing efficiency is high, and volatility is low, therefore except having excellent low temperature cold tolerance, has again good heat resistance, can use at a higher temperature.The weatherability of this product is better, and electrical insulation properties is also more excellent, normal and phthalate use, is specially adapted to the goods such as cold-resistant electric wire and CABLE MATERIALS, artificial leather, film, sheet material, sheet material.Cold resistant plasticizer DOS can as the cold resistant plasticizer of the resins such as the low temperature plasticizer of various synthetic rubber and NC Nitroncellulose, ethyl cellulose, polymethyl methacrylate, polystyrene, vinyl chloride copolymer.
Embodiment 6: the inorganic active agent that raw materials comprises is one or more in following compounds (or mixture): MgO, Al
2o
3, Si
3n
4, BN, high-purity carbon dust, AlN, ZnO, KAl (SO
4)
212H
2o (alum), Al
2o
3-2SiO
2-2H
2o (kaolin).
Embodiment 7: the MgO that the embodiment of the present invention uses is nano-MgO particle.
Nano-powder material industrialized producing technology requires that preparation method is simple, and production cost is suitable for, and reproducible, powder granularity is even, product purity is high, reunion degree is low.Method about nano magnesia synthesis in prior art is a lot, but in fact can be applied to industrial less.One is because problems such as equipment, cost, raw material, scale, investments; Two is that some technique is still in the laboratory research stage, and realize suitability for industrialized production and have any problem, even some may not realize suitability for industrialized production.
The present embodiment adopts indoor temperature solid phase method to prepare MgO particle.
Solid-phase reaction of the present invention overcomes conventional wet and prepares the agglomeration traits that magnesium oxide nanoparticle exists, and has reaction without the need to solvent, the advantage such as productive rate is high, reaction condition is easy; And overcome that the efficiency existed in original solid-phase reaction is low, the shortcoming of the oxidizable distortion of particle.
The concrete grammar that the present embodiment indoor temperature solid phase method prepares MgO particle is: by MgCL
2solution and Na
2cO
3(raw material mass mixture ratio 1:1.2) solution, with PVA solution (poly-vinyl alcohol solution) for modifier, reaction produces precipitation MgCO
3precipitation, then under 75 ~ 85 DEG C of constant temperature, the mode transformed by precipitation obtains alkali formula carbon formula magnesium presoma.50 ~ 60 DEG C of standing alkali formula carbon formula magnesium presoma precipitation 24-30 hour.Finally pass at Ar air-flow, temperature is calcination under the condition of 600 ~ 650 DEG C, obtains nano-MgO particle.Adopt PVA as high molecular surfactant, control the reunion of particle, obtained nano-MgO particle dispersion is better, and be cubic structure, substantially spherical in shape, its particle diameter is 25-35nm.
Embodiment 8-1: the Si3N4 that the embodiment of the present invention uses is nano silicon nitride silicon grain, meets following index:
Embodiment 8-2: the Si that the embodiment of the present invention uses
3n
4it can also be highly heat-conductive silicon nitride.Common silicon nitride has randomly-oriented sintering structure.Highly heat-conductive silicon nitride adds kind of crystal grain (diameter 1um, long 3-4um) at material powder (below particle diameter 1um), makes the sub-orientations of this all crystal grain, forms the fibrous silicon nitride structure reaching 100um with orientation.Due to the formation of filamentary structure, thermal conductivity factor presents each diversity, and on orientation texture direction, thermal conductivity factor is 120w/ (mK), is 3 times of common silicon nitride, is equivalent to the thermal conductivity factor of steel.
Embodiment 9: the BN that the embodiment of the present invention uses is nano silicon nitride boron particles, meets following index:
Embodiment 10: the embodiment of the present invention use high-purity carbon dust be: Dongguan pull together produce 10000 high-purity carbon dusts.Performance indications are:
| Fixed carbon: | 99.99％ | Specification: | 10000 orders |
| The trade mark: | 18925457433 | Moisture: | 0.015％ |
| Dilation: | 1-2 doubly | Oversize granularity: | 0.0006％ |
| Ash content: | 0.85 | Volatile matter: | 0.01％ |
| Screenings granularity: | 0.0005％ |
Embodiment 11: the AlN filler that the embodiment of the present invention uses is: AlN whisker and AlN particle do filler.In the embodiment of the present invention, using ABS as matrix, AlN whisker and AlN particle (below 6um) are filled, and obtain the composite of the highest thermal conductivity 28.2W/ (m.K), AlN whisker and AlN particle ratio (mass ratio) are l:40 ~ 60.Invention further contemplates the confounding effect of filler and coupling agent to the impact of composite heat conductivility.By AlN whisker and the AlN mix particles of adequate rate, give composite higher heat-conductivity and lower thermal coefficient of expansion than independent whisker and particle.By using coupling agent silane treatment, the thermal conductivity of the ABS composite material of AlN particulate reinforcement improves 98%, and thermal conductivity raising is due to the interface by improving matrix and particle, and the contact resistance of filler-matrix reduces.
Embodiment 12: the ZnO that the embodiment of the present invention uses is: nano granular of zinc oxide.Its performance indications are:
The embodiment of the present invention use nano zine oxide, for above-mentioned: 1 class nano-ZnO, 2 class nano-ZnOs, 3 class nano-ZnOs, in one.
Embodiment 13: performance test and characterization experiments contrast.
Experimental provision
This experiment adopts flash of light heat transfer analysis instrument LFA 447N ano flashTM to measure thermal diffusion coefficient.This conductometer uses xenon lamp as heating source heated sample surface, uses Infrared Detectors to read sample temperature rise, decreases potential surface resistance of heat transfer.
Experimental principle
Under certain design temperature T (constant temperature), light beam pulse is being launched instantaneously by lasing light emitter (or flash lamp), uniform irradiation is at sample lower surface, use the corresponding temperature rise process in infrared detector measurement sample upper surface centre, obtain the relation curve of temperature rising to the time.By half heating-up time (sample upper surface temperature is elevated to the time needed for the half of maximum after receiving optical pulse irradiation) t50 (or claiming t1/2), by following formula:
α＝()1388×d
2/t
50 (1)
The thermal diffusion coefficient α of sample under temperature T can be obtained.In formula, d is the thickness of sample.Thermal conductivity factor λ is tried to achieve by following formula:
λ＝α×C
p×ρ (2)
In formula, Cp is the specific heat of rubber; ρ is the density of rubber.Specific heat to be compared with reference sample by sample tries to achieve.Density is recorded by micro computer specific gravity material balance.
Prepared by sample
Sizing material is cut into the thin rounded flakes that diameter is 12.5 ~ 12.7mm during test, and ensures that sample upper and lower surface is smooth, smooth.
Experimental procedure
(1) half an hour before experiment, in instrument, pour appropriate liquid nitrogen into, regulate external recirculated water controller, set temperature makes it higher than room temperature 2 ~ 3 degrees Celsius, preheater apparatus.
(2) by precision be 0.02mm slide measure to the thickness of test specimen carry out three times measure, get the thickness of its mean value as sample.
(3) with alcohol by sample wiped clean, dry.Uniform graphite coating is carried out in the upper and lower surface of sample.
(4) sample is put into sample well, open Survey Software, parameters, start test.
A liquid nitrogen is filled with every 3.5h in experimentation.Experiment terminates all power supplys of rear closedown.
Various formula heat conductivility and mechanical property
Filler 1: ethylene propylene diene rubber 150 parts, age resistor [6-ethyoxyl-2,2,4-trimethyl-1,2-dihyaroquinoline] 2 parts, carbon black 40 parts, 1 part, sulphur, promoter [N, the two thiamides of N-tetramethyl two sulphur] 1 part, 6 parts, plasticizer [o-phthalic acid dibutyl ester], paraffin oil 40 parts, organic active agent [PEG4000] 3-8 part, inorganic active agent [MgO, Al
2o
3, (high-termal conductivity) Si
3n
4, BN, AlN, (1 class nanometer) ZnO] each 1 part, dispersant [triethyl group hexyl phosphoric acid] 1 part.
Filler 2: ethylene propylene diene rubber 160 parts, 2 parts, age resistor [2-dihyaroquinoline], carbon black 50 parts, 2 parts, sulphur, promoter [tetramethylthiuram disulfide] 2 parts, 7 parts, plasticizer [DEDB], paraffin oil 50 parts, organic active agent [PEG4000] 4 parts, inorganic active agent [MgO2 part, Al
2o
31 part, (nano particle) Si
3n
41 part, BN1 part, AlN1 part, (2 class nanometer) ZnO1 part, KAl (SO
4)
212H
2o1 part], dispersant [lauryl sodium sulfate] 2 parts.
Filler 3: ethylene propylene diene rubber 170 parts, 3 parts, age resistor [2,2,4-trimethyl 1], carbon black 60 parts, 3 parts, sulphur, promoter [thiram] 3 parts, 8 parts, plasticizer [decanedioic acid two (2-ethyl hexyl) ester], paraffin oil 60 parts, organic active agent [PEG4000], 5 parts, inorganic active agent [MgO, Al
2o
3, BN, AlN, Al
2o
3-2SiO
2-2H
2o] each 2 parts, dispersant [methyl anyl alcohol] 3 parts.
Filler 4: ethylene propylene diene rubber 180 parts, 4 parts, age resistor [N-phenyl-N`-cyclohexyl p-phenylenediamine (PPD)], carbon black 70 parts, 3 parts, sulphur, promoter [vulcanization accelerator TMTD] 3 parts, 9 parts, plasticizer [BBP(Butyl Benzyl Phthalate], paraffin oil 70 parts, organic active agent [PEG4000], 6 parts, inorganic active agent [MgO, Al
2o
3, (nano particle) Si
3n
4, KAl (SO
4)
212H
2o, Al
2o
3-2SiO
2-2H
2o] each 2 parts, dispersant [cellulose derivative] 4 parts.
Filler 5: ethylene propylene diene rubber 190 parts, 4 parts, age resistor [N-phenyl-N`-cyclohexyl p-phenylenediamine (PPD)], carbon black 80 parts, 3 parts, sulphur, promoter [vulcanization accelerator TMTD] 3 parts, 10 parts, plasticizer [BBP(Butyl Benzyl Phthalate], paraffin oil 80 parts, organic active agent [PEG4000] 7 parts, inorganic active agent [Al
2o
3, (high-termal conductivity) Si
3n
4, BN, AlN, (2 class nanometer) ZnO, KAl (SO
4)
212H
2o, Al
2o
3-2SiO
2-2H
2o] each 1 part, dispersant [polyacrylamide] 4 parts.
Filler 6: ethylene propylene diene rubber 200 parts, 4 parts, age resistor [N-phenyl-N`-isopropyl-p-phenylenediamine (PPD)], carbon black 80 parts, 3 parts, sulphur, promoter [Vulcanization accelerator TMTD] 3 parts, 10 parts, plasticizer [decanedioic acid two (2-ethyl hexyl) ester], paraffin oil 80 parts, organic active agent [PEG4000] 8 parts, inorganic active agent [MgO, Si
3n
4(nano particle), BN, AlN, (1 class nanometer) ZnO, KAl (SO
4)
212H
2o, Al
2o
3-2SiO
2-2H
2o] each 1.5 parts, dispersant [fatty acid polyethylene glycol ester] 4 parts.
Filler 7: ethylene propylene diene rubber 200 parts, age resistor [6-ethyoxyl-2,2,4-trimethyl-1,2-dihyaroquinoline; N-N`-diphenyl-p-phenylenediamine] each 2 parts, carbon black 60 parts, 2 parts, sulphur, promoter [Vulcanization accelerator TMTD-II; Altax; Accelerant B Z] each 1 part, plasticizer [dioctyl adipate; Di-n-hexyl adipate; BBP(Butyl Benzyl Phthalate; Decanedioic acid two (2-ethyl hexyl) ester] each 1 part, paraffin oil 40 parts, organic active agent [PEG4000] 3 parts, inorganic active agent [MgO, Al
2o
3, Si
3n
4(nano particle), BN, AlN, (1 class nanometer) ZnO ,] each 2 parts, each 1 part of dispersant [triethyl group hexyl phosphoric acid, lauryl sodium sulfate, methyl anyl alcohol].
Filler 8: ethylene propylene diene rubber 180 parts, age resistor [2,2,4-trimethyl 1,2-dihydro quinoline condensate; N-phenyl-N`-isopropyl-p-phenylenediamine (PPD)] each 1 part, carbon black 50 parts, 2 parts, sulphur, promoter [promoter T tetramethyl two sulfo-thiuram; Vulcanization accelerator TMTD; ] each 1 part, plasticizer [di-n-hexyl adipate; BBP(Butyl Benzyl Phthalate; Decanedioic acid two (2-ethyl hexyl) ester] each 3 parts, paraffin oil 50 parts, organic active agent [PEG4000] 6 parts, inorganic active agent [MgO, Al
2o
3, Si
3n
4(nano particle), BN, AlN, (2 class nanometer) ZnO, KAl (SO
4)
212H
2o, Al
2o
3-2SiO
2-2H
2o] each 1 part, each 1 part of dispersant [cellulose derivative, polyacrylamide, guar gum, fatty acid polyethylene glycol ester].
Filler 9: ethylene propylene diene rubber 170 parts, age resistor [6-ethyoxyl-2,2,4-trimethyl-1,2-dihyaroquinoline; N-N`-diphenyl-p-phenylenediamine] each 1 part, carbon black 70 parts, 3 parts, sulphur, promoter [promoter T; Vulcanization accelerator TMTD; Vulcanization accelerator TMTD-II; ] each 1 part, plasticizer [di-n-hexyl adipate; BBP(Butyl Benzyl Phthalate] each 4 parts, paraffin oil 70 parts, organic active agent [PEG4000] 4 parts, inorganic active agent [MgO, Al
2o
3, Si
3n4 (high-termal conductivity), BN, AlN, (1 class nanometer) ZnO, KAl (SO
4)
212H
2o, Al
2o
3-2SiO
2-2H
2o] each 1 part, each 1 part of dispersant [triethyl group hexyl phosphoric acid, methyl anyl alcohol, polyacrylamide].
Filler 10: ethylene propylene diene rubber 160 parts, age resistor [N-phenyl-N`-cyclohexyl p-phenylenediamine (PPD); N-phenyl-N`-isopropyl-p-phenylenediamine (PPD).; N-N`-diphenyl-p-phenylenediamine] each 1 part, carbon black 40 parts, 3 parts, sulphur, promoter [TMTD; Altax] each 1 part, plasticizer [o-phthalic acid dibutyl ester; Dioctyl adipate; BBP(Butyl Benzyl Phthalate] each 3 parts, paraffin oil 80 parts, organic active agent [PEG4000] 3 parts, inorganic active agent [MgO, Al
2o
3, Si
3n
4(nano particle), BN, AlN, ZnO ,] each 2 parts, each 1 part of dispersant [triethyl group hexyl phosphoric acid, methyl anyl alcohol, cellulose derivative, guar gum].
Filler 11: ethylene propylene diene rubber 200 parts, age resistor [N-phenyl-α-aniline; N-PBNA; N-phenyl-N`-isopropyl-p-phenylenediamine (PPD)] each 1 part, carbon black 40 parts, 1 part, sulphur, promoter [Vulcanization accelerator TMTD; Promoter TT; Tetramethyl TMTD] each 1 part, plasticizer [BBP(Butyl Benzyl Phthalate; Decanedioic acid two (2-ethyl hexyl) ester] each 5 parts, paraffin oil 80 parts, organic active agent [PEG4000] 4 parts, inorganic active agent [MgO, Al
2o
3, Si
3n
4(high-termal conductivity), BN, AlN, (2 class nanometer) ZnO, KAl (SO
4)
212H
2o, Al
2o
3-2SiO
2-2H
2o] each 1 part, dispersant [fatty acid polyethylene glycol ester] 2 parts.
Filler 12: ethylene propylene diene rubber 150 parts, age resistor [N-phenyl-N`-isopropyl-p-phenylenediamine (PPD); N-N`-diphenyl-p-phenylenediamine] each 1 part, carbon black 50 parts, 2 parts, sulphur, promoter [promoter T; ] 2 parts, 9 parts, plasticizer [decanedioic acid two (2-ethyl hexyl) ester], paraffin oil 70 parts, organic active agent [PEG4000] 6 parts, inorganic active agent [MgO, Si
3n
4(high-termal conductivity), AlN, (1 class nanometer) ZnO, Al
2o
3-2SiO
2-2H
2o] each 2 parts, each 1 part of dispersant [lauryl sodium sulfate, cellulose derivative, fatty acid polyethylene glycol ester].
High heat conducting nano compounded rubber of the present invention is that thermal conductivity can up to the thermoplastic composite resin of 22.25 ~ 35.56w/mK.The technology of the present invention utilizes unique MOLECULE DESIGN, improves the interaction force of molecule between thermoplastic elastomer and filler, and filler high efficiency contact each other defines thermal pathways, has increased substantially thermal conductivity.
Embodiment 14: as shown in Fig. 1 ~ 14, is respectively: its assembled state structural representation of the LED bulb of one embodiment of the invention; Its split status architecture schematic diagram of LED bulb; Its lamp socket surface structure schematic diagram of LED bulb; Its lamp socket front view of LED bulb; Its lamp base part view of LED bulb; Its type socket surface structure schematic diagram that spins of bulb; Its type socket front view that spins of LED bulb; Its type socket side view that spins of LED bulb; Its radiator surface structure schematic diagram of LED bulb; Its radiator view of LED bulb; Its heat sink side view of LED bulb; Its copper base front view of LED bulb; Its rate copper base side view of LED bulb; Its LED lamp bead structural representation of LED bulb; Its protective cover surface structure schematic diagram of LED bulb; Its protective cover front view of LED bulb; Its protective cover side view of LED bulb.
In Fig. 1 ~ 14, each Reference numeral is respectively: 1 is lamp socket, and 2 for spinning type socket, and 3 is radiator, and 4 is copper base, and 5 is LED lamp bead, and 6 is protective cover.
The LED bulb that described high heat conductive rubber is made, comprises lamp socket 1, radiator 3, copper base 4, LED lamp bead 5 and protective cover 6, also comprises the type socket 2 that spins; Described lamp socket 1 is connected with radiator 3 by the type socket 2 that spins; Described LED lamp bead 1 is arranged on copper base 4; The one side that described copper base 4 is provided with LED lamp bead 5 is connected with protective cover 6, and its another side is connected with radiator 3; Described spin type socket 2 by spinning that it is arranged to be attached thereto with the groove that spins that arranges on lamp socket connect fixing; Described radiator 3 is made up of fin; Described fin adopts arcuate structure and is evenly distributed; Described protective cover 6 adopts light-transmitting materials structure; Described protective cover 6 is set to semi-spherical shape.
The installation method of described LED bulb, comprises the following steps: LED lamp bead 5 adopted Auto-mounting mode to be arranged on copper base 4; Auto-mounting mode is adopted to be connected with protective cover 6 and radiator 3 respectively the copper base 4 that LED lamp bead 5 is housed; Lamp socket 1 to be connected with radiator 3 by manual assembly by the type socket 2 that spins and to install.
Embodiment 15: as shown in Fig. 1 ~ 14, is respectively: its assembled state structural representation of the LED bulb of one embodiment of the invention; Its split status architecture schematic diagram of LED bulb; Its lamp socket surface structure schematic diagram of LED bulb; Its lamp socket front view of LED bulb; Its lamp base part view of LED bulb; Its type socket surface structure schematic diagram that spins of bulb; Its type socket front view that spins of LED bulb; Its type socket side view that spins of LED bulb; Its radiator surface structure schematic diagram of LED bulb; Its radiator view of LED bulb; Its heat sink side view of LED bulb; Its copper base front view of LED bulb; Its rate copper base side view of LED bulb; Its LED lamp bead structural representation of LED bulb; Its protective cover surface structure schematic diagram of LED bulb; Its protective cover front view of LED bulb; Its protective cover side view of LED bulb.
In Fig. 1 ~ 14, each Reference numeral is respectively: 1 is lamp socket, and 2 for spinning type socket, and 3 is radiator, and 4 is copper base, and 5 is LED lamp bead, and 6 is protective cover.
Its LED bulb made of high heat conductive rubber described in the present embodiment, comprises lamp socket 1, radiator 3, copper base 4, LED lamp bead 5 and protective cover 6, in addition, also comprises the type socket 2 that spins; Described lamp socket 1 is connected with radiator 3 by the type socket 2 that spins; Described LED lamp bead 5 is arranged on copper base 4; The one side that described copper base 4 is provided with LED lamp bead 5 is connected with protective cover 6, and its another side is connected with radiator 3.
Described spin type socket 2 by the groove that spins that arranges on rotary joint device that it is arranged and lamp socket 1 be attached thereto connect fixing.
Described radiator 3 is made up of fin.
Described fin adopts arcuate structure and is evenly distributed.
Described protective cover 6 adopts light-transmitting materials structure.
Described protective cover 6 is set to semi-spherical shape.
Its installation method of described LED bulb, comprises the following steps: LED lamp bead 5 adopted Auto-mounting mode to be arranged on copper base 4; Auto-mounting mode is adopted to be connected with protective cover 6 and radiator 3 respectively the copper base 4 that LED lamp bead 5 is housed; Lamp socket 1 to be connected with radiator 3 by manual assembly by the type socket 2 that spins and to install.
All above-mentioned this intellectual properties of primary enforcement, not setting restriction this new product of other forms of enforcement and/or new method.Those skilled in the art will utilize this important information, and foregoing is revised, to realize similar implementation status.But all modifications or transformation belong to the right of reservation based on new product of the present invention.
The above is only preferred embodiment of the present invention, and be not restriction invention being made to other form, any those skilled in the art may utilize the technology contents of above-mentioned announcement to be changed or be modified as the Equivalent embodiments of equivalent variations.But everyly do not depart from technical solution of the present invention content, any simple modification, equivalent variations and the remodeling done above embodiment according to technical spirit of the present invention, still belong to the protection domain of technical solution of the present invention.
Claims (3)
1. a heat conductive rubber LED, is characterized in that,
Comprise: lamp socket, radiator, copper base and LED lamp bead;
Described LED bulb has the type socket that spins further; Described lamp socket is connected with described radiator by the type socket that spins; Described copper base one side is provided with described LED lamp bead, and the another side of described copper base is connected with radiator; Described spin type socket by the groove that spins that arranges on rotary joint device that it is arranged and lamp socket be attached thereto connect fixing;
The material that described radiator adopts is high heat conducting nano compounded rubber;
Described high heat conducting nano compounded rubber, its raw material comprise in following component one or more: ethylene propylene diene rubber, age resistor, carbon black, sulphur, promoter, plasticizer, paraffin oil, organic active agent PEG4000, inorganic active agent, dispersant;
Described material content proportioning is by weight:
Ethylene propylene diene rubber 150-200 part,
Age resistor 1-4 part,
Carbon black 40-80 part,
Sulphur 1-3 part,
Promoter 1-3 part,
Plasticizer 6-10 part,
Paraffin oil 40-80 part,
Organic active agent PEG4000,3-8 part
Inorganic active agent 6-12 part,
Dispersant 1-4 part;
Described age resistor is one or more in following reagent: 6-ethyoxyl-2,2,4-trimethyl-1,2-dihyaroquinoline; 2,2,4-trimethyl 1,2-dihydro quinoline condensate; N-phenyl-α-aniline; N-PBNA; N-phenyl-N`-cyclohexyl p-phenylenediamine (PPD); N-phenyl-N`-isopropyl-p-phenylenediamine (PPD); N-N`-diphenyl-p-phenylenediamine;
Described promoter is one or more in following reagent: promoter T; The two thiamides of N, N-tetramethyl two sulphur; Tetramethylthiuram disulfide; Thiram; Vulcanization accelerator TMTD; Tetramethyl two sulfo-thiuram; Vulcanization accelerator TMTD; Vulcanization accelerator TMTD-II; Promoter TT; Curing two (thiocarbonyl group dimethylamine); Tetramethyl TMTD; Tetramethyl sulfo-peroxy dicarbonate diamides; Tetramethyl thiuram disulfide; TMTD; Altax; Accelerant B Z;
Described plasticizer is one or more in following reagent: o-phthalic acid dibutyl ester; DEDB; Dioctyl adipate; Di-n-hexyl adipate; BBP(Butyl Benzyl Phthalate; Decanedioic acid two (2-ethyl hexyl) ester;
Described activating agent is PEG4000; Described dispersant is one or more in following reagent: triethyl group hexyl phosphoric acid, lauryl sodium sulfate, methyl anyl alcohol, cellulose derivative, polyacrylamide, guar gum, fatty acid polyethylene glycol ester;
Described inorganic active agent is one or more in following reagent: MgO, Al
2o
3, Si
3n
4, BN, AlN, ZnO, KAl (SO
4)
212H
2o, Al
2o
3-2SiO
2-2H
2o;
Described MgO is nano-MgO particle, and its preparation method is: be the MgCL of 1:1.2 by raw material mass mixture ratio
2solution and Na
2cO
3solution take poly-vinyl alcohol solution as modifier, and reaction produces precipitation MgCO
3precipitation, then under 75 ~ 85 DEG C of constant temperature, the mode transformed by precipitation obtains alkali formula carbon formula magnesium presoma; 50 ~ 60 DEG C of standing alkali formula carbon formula magnesium presoma precipitation 24-30 hour; Finally pass at Ar air-flow, temperature is calcination under the condition of 600 ~ 650 DEG C, obtains nano-MgO particle;
Nano-MgO particle is cubic structure, substantially spherical in shape, and its particle diameter is 25-35nm;
Described AlN is: AlN whisker and AlN particle;
Described Si
3n
4for highly heat-conductive silicon nitride; Described highly heat-conductive silicon nitride adds diameter 1um at the following material powder of particle diameter 1um, and long 3-4um kind crystal grain, makes the sub-orientations of this all crystal grain, form the fibrous silicon nitride structure reaching 100um with orientation;
Described BN is nano silicon nitride boron particles, meets following index:
Described high heat conducting nano compounded rubber, it is prepared by following steps:
The first step, synthetic rubber: by banbury by described Material synthesis rubber;
Second step, shaping: by mill, synthetic rubber is shaping;
3rd step, sulfuration: mould molded rubber being put into vulcanizer, pressurization scope is 150-210kgf/ ㎝
2, be warmed up to 220-230 DEG C, the time is 80-100 second, carries out sulfuration.
2. an installation method for heat conductive rubber LED as claimed in claim 1, is characterized in that, comprise the following steps: LED lamp bead adopted Auto-mounting mode to be arranged on copper base; Auto-mounting mode is adopted to be connected with described radiator the copper base that LED lamp bead is housed; Lamp socket to be connected with radiator by manual assembly by the type socket that spins and to install.
3. the radiator used in heat conductive rubber LED, is characterized in that, the material that described radiator adopts is high heat conducting nano compounded rubber;
Described high heat conducting nano compounded rubber, its raw material comprise in following component one or more: ethylene propylene diene rubber, age resistor, carbon black, sulphur, promoter, plasticizer, paraffin oil, organic active agent PEG4000, inorganic active agent, dispersant;
Described material content proportioning is by weight:
Ethylene propylene diene rubber 150-200 part,
Age resistor 1-4 part,
Carbon black 40-80 part,
Sulphur 1-3 part,
Promoter 1-3 part,
Plasticizer 6-10 part,
Paraffin oil 40-80 part,
Organic active agent PEG4000,3-8 part
Inorganic active agent 6-12 part,
Dispersant 1-4 part;
Described age resistor is one or more in following reagent: 6-ethyoxyl-2,2,4-trimethyl-1,2-dihyaroquinoline; 2,2,4-trimethyl 1,2-dihydro quinoline condensate; N-phenyl-α-aniline; N-PBNA; N-phenyl-N`-cyclohexyl p-phenylenediamine (PPD); N-phenyl-N`-isopropyl-p-phenylenediamine (PPD); N-N`-diphenyl-p-phenylenediamine;
Described promoter is one or more in following reagent: promoter T; The two thiamides of N, N-tetramethyl two sulphur; Tetramethylthiuram disulfide; Thiram; Vulcanization accelerator TMTD; Tetramethyl two sulfo-thiuram; Vulcanization accelerator TMTD; Vulcanization accelerator TMTD-II; Promoter TT; Curing two (thiocarbonyl group dimethylamine); Tetramethyl TMTD; Tetramethyl sulfo-peroxy dicarbonate diamides; Tetramethyl thiuram disulfide; TMTD; Altax; Accelerant B Z;
Described plasticizer is one or more in following reagent: o-phthalic acid dibutyl ester; DEDB; Dioctyl adipate; Di-n-hexyl adipate; BBP(Butyl Benzyl Phthalate; Decanedioic acid two (2-ethyl hexyl) ester;
Described activating agent is PEG4000; Described dispersant is one or more in following reagent: triethyl group hexyl phosphoric acid, lauryl sodium sulfate, methyl anyl alcohol, cellulose derivative, polyacrylamide, guar gum, fatty acid polyethylene glycol ester;
Described inorganic active agent is one or more in following reagent: MgO, Al
2o
3, Si
3n
4, BN, AlN, ZnO, KAl (SO
4)
212H
2o, Al
2o
3-2SiO
2-2H
2o;
Described MgO is nano-MgO particle, and its preparation method is: be the MgCL of 1:1.2 by raw material mass mixture ratio
2solution and Na
2cO
3solution take poly-vinyl alcohol solution as modifier, and reaction produces precipitation MgCO
3precipitation, then under 75 ~ 85 DEG C of constant temperature, the mode transformed by precipitation obtains alkali formula carbon formula magnesium presoma; 50 ~ 60 DEG C of standing alkali formula carbon formula magnesium presoma precipitation 24-30 hour; Finally pass at Ar air-flow, temperature is calcination under the condition of 600 ~ 650 DEG C, obtains nano-MgO particle;
Nano-MgO particle is cubic structure, substantially spherical in shape, and its particle diameter is 25-35nm;
Described AlN is: AlN whisker and AlN particle;
Described Si
3n
4for highly heat-conductive silicon nitride; Described highly heat-conductive silicon nitride adds diameter 1um at the following material powder of particle diameter 1um, and long 3-4um kind crystal grain, makes the sub-orientations of this all crystal grain, form the fibrous silicon nitride structure reaching 100um with orientation;
Described BN is nano silicon nitride boron particles, meets following index:
Described high heat conducting nano compounded rubber, it is prepared by following steps:
The first step, synthetic rubber: by banbury by described Material synthesis rubber;
Second step, shaping: by mill, synthetic rubber is shaping;
3rd step, sulfuration: mould molded rubber being put into vulcanizer, pressurization scope is 150-210kgf/ ㎝
2, be warmed up to 220-230 DEG C, the time is 80-100 second, carries out sulfuration.
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| CN201210583104.0A CN103148368B (en) | 2012-12-26 | 2012-12-26 | Heat-conductive rubber light-emitting diode (LED) lamp and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210583104.0A CN103148368B (en) | 2012-12-26 | 2012-12-26 | Heat-conductive rubber light-emitting diode (LED) lamp and preparation method thereof |
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| CN103148368B true CN103148368B (en) | 2014-12-17 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103527962A (en) * | 2013-10-30 | 2014-01-22 | 杨进 | LED bulb lamp |
| CN104592567A (en) * | 2014-02-20 | 2015-05-06 | 泌阳恒茂服饰制品有限公司 | Heat generation body construction method |
| CN104558729A (en) * | 2014-02-21 | 2015-04-29 | 泌阳恒茂服饰制品有限公司 | Production process of heating unit |
| CN104893247A (en) * | 2015-05-27 | 2015-09-09 | 合肥卓元科技服务有限公司 | Heat conduction transparent modification process of epoxy resin for LED packaging |
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|---|---|---|---|---|
| CN201827722U (en) * | 2010-09-30 | 2011-05-11 | 厦门雷的光电科技有限公司 | LED (light emitting diode) lamp bulb |
| CN102504358A (en) * | 2011-11-22 | 2012-06-20 | 广东石油化工学院 | High-heat-conductivity rubber composite material and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201827722U (en) * | 2010-09-30 | 2011-05-11 | 厦门雷的光电科技有限公司 | LED (light emitting diode) lamp bulb |
| CN102504358A (en) * | 2011-11-22 | 2012-06-20 | 广东石油化工学院 | High-heat-conductivity rubber composite material and preparation method thereof |
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