CN103148368A - Heat-conductive rubber light-emitting diode (LED) lamp and preparation method thereof - Google Patents
Heat-conductive rubber light-emitting diode (LED) lamp and preparation method thereof Download PDFInfo
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- CN103148368A CN103148368A CN2012105831040A CN201210583104A CN103148368A CN 103148368 A CN103148368 A CN 103148368A CN 2012105831040 A CN2012105831040 A CN 2012105831040A CN 201210583104 A CN201210583104 A CN 201210583104A CN 103148368 A CN103148368 A CN 103148368A
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- Prior art keywords
- rubber
- radiator
- led lamp
- parts
- socket
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- 239000010974 bronze Substances 0.000 description 1
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- 239000004917 carbon fiber Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 150000008280 chlorinated hydrocarbons Chemical class 0.000 description 1
- NEHMKBQYUWJMIP-UHFFFAOYSA-N chloromethane Chemical class ClC NEHMKBQYUWJMIP-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002322 conducting polymer Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
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- 230000010339 dilation Effects 0.000 description 1
- MIMDHDXOBDPUQW-UHFFFAOYSA-N dioctyl decanedioate Chemical compound CCCCCCCCOC(=O)CCCCCCCCC(=O)OCCCCCCCC MIMDHDXOBDPUQW-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
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- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- QGEOKXWFGANCJL-UHFFFAOYSA-N ethenyl acetate;hydrochloride Chemical compound Cl.CC(=O)OC=C QGEOKXWFGANCJL-UHFFFAOYSA-N 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229920001821 foam rubber Polymers 0.000 description 1
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- 150000002334 glycols Chemical class 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- CNFQJGLKUZBUBD-TXHUMJEOSA-N hexa-1,5-diene;(3e)-hexa-1,3-diene;(4e)-hexa-1,4-diene Chemical class CC\C=C\C=C.C\C=C\CC=C.C=CCCC=C CNFQJGLKUZBUBD-TXHUMJEOSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
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- 229910003475 inorganic filler Inorganic materials 0.000 description 1
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- 150000002500 ions Chemical class 0.000 description 1
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- 229920000126 latex Polymers 0.000 description 1
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
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- QPHJACNABSHDHC-UHFFFAOYSA-N octyl nitrite Chemical class CCCCCCCCON=O QPHJACNABSHDHC-UHFFFAOYSA-N 0.000 description 1
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- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
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Images
Abstract
The invention discloses a heat-conductive rubber light-emitting diode (LED) lamp; and a spinning socket is fixedly connected with a spinning groove which is arranged on a lamp holder through a spinning device on the spinning socket. A radiator comprises radiating fins. The radiating fins are of arc-shaped structures and are distributed uniformly. A protective hood is of a structure which is made of a light-transmitting material. The protective hood is in a semi-spherical shape. An installation method of an LED bulb comprises the following steps that an LED lamp bead is arranged on a copper substrate through an automatic installation method; the copper substrate which is provided with the LED lamp bead is respectively connected with the protective hood and the radiator through the automatic installation method; and the lamp holder is connected and installed with the radiator by manual assembly through the spinning socket. The product assembly method is more simplified, the production efficiency and the production cost are greatly improved, the service life is greatly prolonged, the raw material mixing is reasonable and the process is simple.
Description
Technical field
The present invention relates to throw light on mechanical device technique field particularly relates to a kind of Novel heat-conducting rubber LED lamp and method for making.
Background technology
the mode that present LED illuminating lamp adopts filament to connect more, it exists production stage loaded down with trivial details, produce the accessory long processing time, and the high problem of production cost, in addition, it also exists the material thermal conductivity energy relatively poor, stability is not ideal enough, and moulding, fire-retardant and the relatively poor problem of insulating properties, for this reason, need a kind of LED illuminating lamp that can address the above problem, its material can have heat conductivility and stability preferably, and can well solve moulding, the problem of fire-retardant and insulating properties, simplify simultaneously assemble method, enhance productivity, improve production cost and service life, thereby satisfy the needs of actual conditions.
Now, because electronic product more and more is tending towards miniaturization, therefore those easily integrated and miniaturization and the good compounded rubber substrate of pliability are widely used, but because the multiple stratification of the highly integrated and laminate of integrated circuit certainly leads to the heat release problem, so the requirement of the heat conductivility of these materials has just been become the task of top priority.
Ethylene propylene diene rubber (EPDM) is the terpolymer of ethene, propylene and dienes monomer, and the introducing of diene is to vulcanize in order to realize, the type of diene has: dicyclopentadiene (DCPD), l, 4 one hexadienes.EPDM is better than common EP rubbers toughness.
People with dielectric metal oxide and other compound filled polymers, have tentatively solved this problem in recent years.The filler of insulated type heat conductive rubber mainly comprises: metal oxide such as BeO, MgO, A1
2O
3, CaO, NIO; Metal nitride such as AlN, BN etc.; Carbide such as SiC, B
4C
3Deng.They have higher thermal conductivity factor, and what is more important compares with metal powder excellent electrical insulating property is arranged, so they can guarantee that end article has good electrical insulating property, and this is vital in electronic apparatus industry.
For the research of heat conductive rubber with use a lot, can be divided into by the kind of particle filled composite: metal filled type, metal oxide filled-type, metal nitride filled-type, inorganic non-metallic filled-type, fiber-filled type heat conductive rubber; Also can divide according to a certain character of heat conductive rubber, such as can be divided into insulated type heat conductive rubber and nonisulated type heat conductive rubber according to its electrical insulation capability.
Because rubber itself has insulating properties, the therefore electrical insulation capability of most heat conductive rubbers is finally that the insulating properties by particle filled composite determine.The filler that is used for nonisulated type heat conductive rubber is usually metal powder, graphite, carbon black, carbon fiber etc., the characteristics of this class filler are to have good thermal conductivity, can easily make material obtain high heat conductivility, but also make the decreasing insulating of material even become conductive material simultaneously.Therefore in less demanding situation, can use above-mentioned filler for electrical insulating property at the working environment of material.And also necessarily require under certain conditions heat conductive rubber to have low electrical insulating property to meet specific requirement, as anti-static material, electromagnetic shielding material etc.
Flourish information industry in the last few years, performance to macromolecular material has proposed Secretary, especially the development for heat conductive rubber provides development space, the application of heat conductive rubber on computer fittings will improve the heat dissipation problem of computer and improve its speed of service and stability, as CPU, notebook computer shell and various surface-mounted integrated circuit, these materials all require heat conductive insulating.Macromolecular material insulate, but as Heat Conduction Material, pure macromolecular material is generally inefficient, because macromolecular material is the non-conductor of heat mostly, the macromolecular material thermal conductivity factor is about the 1/500-1/600 of metal.The thermal conductivity factor of foam rubber only has 0.02-0.046W/m.K, is about 1/1500 of metal, 1/40 of cement concrete, and 1/20 of common brick is desirable heat-insulating material. expand it in the application in heat conduction field, must carry out modification to macromolecular material.The thermal conductivity factor of macromolecular material, metal and metal oxide sees Table 1-1, table 1-2, table 1-3.
The high molecular thermal conductivity factor of table 1-1
Can substantially have following several as metal and the inorganic filler of heat conduction particle:
(l) metal powder filler: copper powder, aluminium powder, bronze, silver powder.
(2) metal oxide: aluminium oxide, oxidation is secret, barium monoxide, magnesia, zinc oxide.
(3) metal nitride: aluminium nitride, boron nitride.
(4) inorganic non-metallic: graphite, carborundum.
Inorganic Non-metallic Materials is during as heat filling filled high polymer material matrix, and the quality of filling effect depends primarily on following factor: (l) kind of polymeric matrix, characteristic; (2) shape of filler, particle diameter, distribution of sizes; (3) interaction of the interface binding characteristic of filler and matrix and two-phase.
The thermal conductivity factor of some packing materials of table 1-3
Due to adding of filler, the mechanical performance of material is descended.Therefore, the conductibility that not only will consider in the design of composite, and require that stability of material is good, nontoxic, satisfactory mechanical property and inexpensive.Another selection with respect to filled polymer is the polymer that use itself has the good heat conductive performance, but materials is expensive and performance on deficient in stability, become their major defect in the use.Rubber is the material of output maximum in macromolecular material.
The market demand of conductibility macromolecular material is all increasing every year, and wherein the market demand of heat conductive rubber increases faster.Therefore the research of rubber heat conductivility is caused various countries researcher's interest, and done good work.The research of fillibility heat conductive rubber at present, most of method that adopts physics to fill, heat conductivility is poor, and mechanical performance descends serious, and production cost is high.But along with the market of expanding day and going deep into of research, heat conductive rubber will have a large development, especially the research and development of nano heat-conductive material, high heat conduction bulk polymer material preparation, the discussion of polymer thermal conduction mechanism should become the developing direction of heat-conducting polymer material.
Summary of the invention
Technical problem to be solved by this invention is to be, a kind of high heat conductive rubber and preparation method and LED lamp and preparation method have been proposed, it is by improving raw material components and formula, its heat conductivility and stability have further been improved, and moulding, fire-retardant and insulating properties have been improved largely, simultaneously, the assemble method of its product is more simplified, and the production efficiency of its product, production cost and service life all are improved largely, and it has reasonable raw material proportioning, the simple characteristics of technique.
The technical solution used in the present invention is: a kind of heat conductive rubber LED lamp is provided, has comprised: lamp socket, radiator, copper base and LED lamp pearl.
Described heat conductive rubber LED lamp can further have the type of spinning socket;
Described lamp socket can be connected with described radiator by the type socket that spins;
Described LED lamp pearl can be arranged on described copper base;
Described copper base can be provided with described LED lamp pearl;
The one side of described copper base can be connected with radiator;
The described type socket that spins can be attached thereto by the groove that spins that arranges on the rotary joint device that arranges on it and lamp socket connect fixing.
Described radiator can be comprised of fin.
Described fin can adopt arcuate structure and be evenly distributed.
The material that described radiator preferably adopts is the described high heat conducting nano compounded rubber of any one in following content.
For solving the problems of the technologies described above, the present invention also provides a kind of installation method of described heat conductive rubber LED lamp, comprises the following steps: adopt the Auto-mounting mode to be arranged on copper base LED lamp pearl; Adopt the Auto-mounting mode to be connected with described protective cover and described radiator respectively the copper base that LED lamp pearl is housed; With lamp socket by the type socket that the spins installation that is connected with radiator by manual assembly.
For solving the problems of the technologies described above, the present invention provides again the radiator that uses in a kind of LED bulb, and the material that described radiator adopts is the described high heat conducting nano compounded rubber of any one in following content.
For solving the problems of the technologies described above, the present invention provides a kind of high heat conducting nano compounded rubber again, and its raw material comprises one or more in following component: ethylene propylene diene rubber, age resistor, carbon black, sulphur, promoter, plasticizer, paraffin oil, organic active agent PEG4000, inorganic active agent, dispersant.
Described material content proportioning is preferably by weight:
Ethylene propylene diene rubber 150-200 part,
Age resistor 1-4 part,
Carbon black 40-80 part,
Sulphur 1-3 part,
Promoter 1-3 part,
Plasticizer 6-10 part,
Paraffin oil 40-80 part,
Organic active agent PEG4000,3-8 part
Inorganic active agent 6-12 part,
Dispersant 1-4 part.
Described age resistor is preferably one or more in following reagent: 6-ethyoxyl-2,2,4-trimethyl-1,2-dihyaroquinoline; 2,2,4-trimethyl 1,2-dihydro quinoline condensate; N-phenyl-α-aniline; The N-PBNA; N-phenyl-N`-cyclohexyl p-phenylenediamine (PPD); N-phenyl-N`-isopropyl-p-phenylenediamine (PPD).N-N`-diphenyl-p-phenylenediamine (PPD).
Described promoter is preferably one or more in following reagent: promoter T; N, the two thiamides of N-tetramethyl two sulphur; Tetramethylthiuram disulfide; Thiram; Vulcanization accelerator TMTD; Tetramethyl two sulfo-thiurams; Vulcanization accelerator TMTD; Vulcanization accelerator TMTD-II; Promoter TT; Curing two (thiocarbonyl group dimethylamine); Curing tetramethyl TMTD; Tetramethyl sulfo-peroxy dicarbonate diamides; Tetramethyl thiuram disulfide; TMTD; Altax; Accelerant B Z.
Described plasticizer is preferably one or more in following reagent:: o-phthalic acid dibutyl ester; DEDB; Dioctyl adipate; Di-n-hexyl adipate; BBP(Butyl Benzyl Phthalate; Decanedioic acid two (2-ethyl hexyl) ester.
Described activating agent is preferably PEG4000; Described dispersant is preferably one or more in following reagent: triethyl group hexyl phosphoric acid, lauryl sodium sulfate, methyl anyl alcohol, cellulose derivative, polyacrylamide, guar gum, fatty acid polyethylene glycol ester.
Described inorganic active agent is preferably one or more in following reagent: MgO, Al
2O
3, Si
3N
4, BN, AlN, ZnO, KAl (SO
4)
212H
2O, Al
2O
3-2SiO
2-2H
2O。
Described AlN is preferably: AlN whisker and AlN particle.
Described Si
3N
4Be preferably highly heat-conductive silicon nitride; Described BN is the nano silicon nitride boron particles, satisfies following index:
Described high heat conducting nano compounded rubber preferably prepares by following steps:
The first step, synthetic rubber: by banbury with described raw material synthetic rubber;
Second step, moulding: by mill with the synthetic rubber moulding;
In the 3rd step, sulfuration: moulding rubber is put into the mould of vulcanizer, the pressurization scope is 150-210kgf/ ㎝
2, being warmed up to 220-230 ℃, the time is 80-100 second, vulcanizes.
The technique effect that the present invention has a mind to is: proposed a kind of high heat conductive rubber and preparation method and LED bulb and installation method, it is by improving raw material components and formula, its heat conductivility and stability have further been improved, and moulding, fire-retardant and insulating properties have been improved largely, it has reasonable raw material proportioning, the simple characteristics of technique; Its product of while, the LED bulb of namely being made by described high heat conductive rubber is by the employing type structure that spins, can solve the existing existing problem of LED illuminating lamp, the production and assembly mode that can adopt Auto-mounting and assembly line manually to be used in conjunction with, have production and assembly succinct, production efficiency is high, production cost is low, be connected firmly attractive in appearance, good illumination effect is used safety, the advantage that the life-span is long, the public places such as market, factory, office family can be widely used in, the needs of actual conditions can be satisfied.The present invention mixes by the filler to various difformities and size the capacity of heat transmission that uses the raising Polymers and has carried out the experiment contrast, and filler comprises MgO, Al
2O
3, Si
3N
4, BN, AlN, ZnO, KAl (SO
4)
212H
2O(alum) and/or Al
2O
3-2SiO
2-2H
2O(kaolin) etc.The present invention significantly improves the thermal conductivity of composite with mixed fillers.Utilization of the present invention has particle, the whisker of certain draw ratio to form continuous heat conduction network chain; Select the filler combination of different particle diameters, reach higher filling density: the interface that utilizes coupling agent to improve filler and matrix, to reduce thermal resistance at the interface; Improve thermal conductivity factor with nanomaterial-filled rubber.High heat conducting nano compounded rubber of the present invention is that thermal conductivity is up to the thermoplastic composite resin of 22.45 ~ 33.75w/mK.The technology of the present invention is utilized unique MOLECULE DESIGN, has improved the interaction force of molecule between thermoplastic elastomer and filler, and filler high efficiency contact has each other formed the heat passage, has increased substantially thermal conductivity.
Description of drawings
The invention will be further described below in conjunction with drawings and embodiments:
Fig. 1 is its assembled state structural representation of LED bulb of one embodiment of the invention;
Fig. 2 is its split status architecture schematic diagram of LED bulb of one embodiment of the invention;
Fig. 3 is its lamp socket surface structure schematic diagram of LED bulb of one embodiment of the invention;
Fig. 4 is its lamp socket front view of LED bulb of one embodiment of the invention;
Fig. 5 is its lamp base part view of LED bulb of one embodiment of the invention;
Fig. 6 is its radiator surface structure schematic diagram of LED bulb of one embodiment of the invention;
Fig. 7 is its radiator view of LED bulb of one embodiment of the invention;
Fig. 8 is its heat sink side view of LED bulb of one embodiment of the invention;
Fig. 9 is its copper base front view of LED bulb of one embodiment of the invention;
Figure 10 is its rate copper base side view of LED bulb of one embodiment of the invention;
Figure 11 is its LED lamp pearl structural representation of LED bulb of one embodiment of the invention;
Figure 12 is its protective cover surface structure schematic diagram of LED bulb of one embodiment of the invention;
Figure 13 is its protective cover front view of LED bulb of one embodiment of the invention;
Figure 14 is its protective cover side view of LED bulb of one embodiment of the invention.
The specific embodiment
Describe embodiments of the present invention in detail below with reference to drawings and Examples, how the application technology means solve technical problem to the present invention whereby, and the implementation procedure of reaching technique effect can fully understand and implement according to this.
Embodiment 1: the compound ethylene propylene diene rubber of the present embodiment high heat conducting nano short vulcanization, and each material component content proportioning is by weight:
Ethylene propylene diene rubber 150-200 part,
Age resistor 1-4 part,
Carbon black 40-80 part,
Sulphur 1-3 part,
Promoter 1-3 part,
Plasticizer 6-10 part,
Paraffin oil 40-80 part,
Organic active agent PEG4000,3-8 part
Inorganic active agent 6-12 part,
Dispersant 1-4 part,
And it prepares by following steps:
The first step, synthetic rubber: by banbury with the above-mentioned raw materials synthetic rubber;
Second step, moulding: by mill with the synthetic rubber moulding;
In the 3rd step, sulfuration: moulding rubber is put into the mould of vulcanizer, the pressurization scope is 150-210kgf/ ㎝
2, being warmed up to 220-230 ℃, the time is 80-100 second, vulcanizes.
Embodiment 2: the rubber dispersant is to impel material particles to be dispersed in Rubber Media, forms the reagent of stable suspension.The rubber dispersant that uses in the embodiment of the present invention is one or more in following reagent: triethyl group hexyl phosphoric acid, lauryl sodium sulfate, methyl anyl alcohol, cellulose derivative, polyacrylamide, guar gum, fatty acid polyethylene glycol ester.
Embodiment 3:
The age resistor that one embodiment of the invention is used is: 6-ethyoxyl-2,2,4-trimethyl-1,2-dihyaroquinoline.Its trade name is antioxidant A W.Antioxidant A W is the brown thick liquid, and sterling is light brown sticking cylinder liquid.Nontoxic, proportion is 1.029 ~ 1.030(25 ℃), boiling point is 169 ℃.Can be dissolved in benzene, acetone, two oxidative ethanes, carbon tetrachloride, industrial naptha and ethanol; Water insoluble.Stable storage.Be special efficacy anti-ozone age resistor, flex crack and thermo-oxidative ageing are also had protective action.The goods that are specially adapted to use under dynamic condition.No blooming has contaminative, is unsuitable for light goods.Little on the sulfuration impact during 1 ~ 2 part of consumption, increase to 3 parts and significantly promote sulfuration, promote during use that consumption should suitably reduce.
The age resistor that another embodiment of the present invention is used is: 2,2,4-trimethyl 1,2-dihydro quinoline condensate.Trade name is anti-aging agent RD.Anti-aging agent RD be amber to canescence resin-like powder, nontoxic.Softening point is not less than 74 ℃.Can be dissolved in acetone, benzene, chloroform, carbon disulfide, be slightly soluble in petroleum hydrocarbon; Water insoluble.The harsher oxidation of energy rejection condition, heat ageing and Weather effect, but relatively poor to the flex crack protection effect.No blooming, light contamination is arranged.General amount ranges is 0.5 ~ 2 part, reaches as high as 3 compositions.
The age resistor that yet another embodiment of the invention is used is: N-phenyl-α-aniline.Trade name is antioxidant A.Antioxidant A be yellowish-brown to purple crystal shape material, sterling is colourless flaky crystal, and is poisonous because containing a small amount of alpha naphthylamine and aniline, can not with skin contact.Proportion is 1.16 ~ 1.17, and fusing point is not less than 52.0 ℃.Be soluble in acetone, ethyl acetate, benzene, ethanol, chloroform, carbon tetrachloride; Dissolve in gasoline; Water insoluble.Gradual change purple in daylight and air.Inflammable.Antioxidant A to heat, oxygen, subdue and the aging action such as weather all has good protection effect, be the general age resistor of natural rubber, synthetic rubber and reclaimed rubber.Have the performance of anti-ozone aging concurrently in neoprene; Aging action and reclaimed rubber to variable valency metal ions also have certain inhibition easily to disperse in dried glue, also easily are scattered in water; Solubility in rubber is up to 5%, and is larger than antioxidant D, and consumption is no blooming in the time of 3 ~ 4 parts, therefore can increase consumption to improve protective benefits.Antioxidant A has contaminative and animal migration.General amount ranges is 1 ~ 2 part, reaches as high as 5 parts.
The age resistor that further embodiment of this invention is used is: the N-PBNA.Trade name is antioxidant D.Antioxidant D is light grey to light brown powder, and sterling is white powder.Proportion is 1.18, and fusing point is not less than 104 ℃.Easily solvent is in acetone, ethyl acetate, carbon disulfide, chloroform; Dissolve in ethanol, carbon tetrachloride; Be insoluble to gasoline and water.Gradually become grey black under air and daylight, but do not affect protection effect.Inflammable.Antioxidant D is the universal age resistor of natural rubber, synthetic rubber and latex.Heat, oxygen, flex crack and general aging action all there are good protective action, and slightly are better than antioxidant A.Ion to poisonous metal also has protective action, but poor than antioxidant A.If with age resistor 4040 or 4010NA and use, heat resistanceheat resistant, oxygen, flex crack and anti-ozone aging performance all have remarkable increase.Easily be scattered in water in dried glue in.Solubility in rubber is lower than antioxidant A, is about 1.5%.Meeting bloom when consumption surpasses 2 parts is with antioxidant A and with avoiding.The tool contaminative is unsuitable for light goods.Amount ranges is generally 0.5 ~ 2 part.This class age resistor is simple, cheap because raw material is easy to get, makes, therefore also occupy at home certain status at present.
The age resistor that further embodiment of this invention is used is: N-phenyl-N`-cyclohexyl p-phenylenediamine (PPD).Trade name is antioxidant 4010 (or age resistor CPPD).Antioxidant 4010 is pale powder, and sterling is white powder.Irritant to skin.Proportion is 1.29, and fusing point is lower than 110 ℃, very easily is dissolved in chloromethanes, is soluble in benzene, ethyl acetate, acetone, is insoluble in industrial naptha, and is water insoluble.In air or the daylight end deepen look, but the protection effect do not subtract.Antioxidant 4010 is one of good universal age resistor of natural rubber and synthetic rubber, is particularly useful for natural rubber and butadiene-styrene rubber.Good to aging action protective benefitses such as heat, oxygen, ozone, light, be also the be full of cracks of good lasting mechanical stress formation and the inhibitor of flex crack.The aging action of high-energy radiation and copper ion is also had protective action is necessarily arranged.Protection effect than antioxidant A T and antioxidant D is all good, existing goodish protective benefits when alone, but with its age resistor such as AW, crystallinity and use ozone-induced cracking and natural aging protective benefits higher.Also can and use with antioxidant A, D or other universal age resistor.Antioxidant 4010 easily disperses, and consumption can produce bloom when surpassing 1 part, and it is serious that goods are met phototropic.Also can migration stain other sizing material that contacts with it or material.0.15 ~ 1 part of general amount ranges.
The age resistor that further embodiment of this invention is used is: N-phenyl-N`-isopropyl-p-phenylenediamine (PPD).Trade name is antioxidant 4010NA (or age resistor IPPD).Antioxidant 4010NA is the purple flaky crystal.Little toxic, can cause allergic anti-hydraulic pressure.Fusing point is not less than 70 ℃.Dissolve in oils, benzene, ethyl acetate, carbon tetrachloride, carrene, chloroform, carbon disulfide, acetone, ethanol, be insoluble in gasoline, water insoluble.Stable storage.Meeting variable color under daylight, but do not affect usefulness.Antioxidant 4010NA is the universal age resistor of natural rubber, synthetic rubber latex glue.Good to ozone-induced cracking, flex crack barrier propterty spy; Be also heat, oxygen, light and general aging good protective agent.Also can suppress the aging action of variable valency metal ions, protection natural rubber performance than 4010 more comprehensively.Antioxidant 4010NA can be alone, produces with not only reducing consumption but also can improving protective benefits with antioxidant A W or wax.Especially with wax and with staying the anti-static ozone-induced cracking performance of improving the standard.Fusing point is lower, easily disperses, and the solubility in rubber is larger than 4010, and bloom is less, therefore can improve consumption.Contaminative is large.Be usually used in dynamically and condition that static stress is higher under the goods that use.General amount ranges is 1 ~ 4 part.
The age resistor that further embodiment of this invention is used is: N-N`-diphenyl-p-phenylenediamine (PPD).Trade name is antioxidant H.(having another name called antioxidant DPPD or age resistor PPD).Antioxidant H is that the taupe powder is lumped together, and sterling is the silvery white flaky crystal.Proportion is 1.18 ~ 1.22.Fusing point is not less than 140 ℃.Dissolve in benzene, toluene, acetone, ether, dichloroethanes, carbon disulfide, be slightly soluble in ethanol and gasoline; Water insoluble.Storage-stable.Reach under daylight easy to change in air.Inflammable.Antioxidant H is natural rubber, elastomeric universal age resistor, has good flex cracking resistance performance, and is excellent to the aging protective action of heat, oxygen, ozone, light, particularly copper, manganese ion.Especially be applicable to natural rubber and elastomeric paralled system.But variable color and seriously polluted.Solubility in rubber is low; Being up to 0.7% in butadiene-styrene rubber, is 0.35% in natural rubber, and solubility is lower in polybutadiene rubber.The bloom phenomenon appears in consumption when surpassing its solubility, when with other age resistor such as antioxidant A and used time, can reduce its consumption and can improve protection effect again.When alone, amount ranges is generalized to 0.2 ~ 0.3 part.
Embodiment 4: the promoter that the embodiment of the present invention is used is one or more in following product: promoter T, N, the two thiamides of N-tetramethyl two sulphur, tetramethylthiuram disulfide, thiram, vulcanization accelerator TMTD, tetramethyl two sulfo-thiurams, Vulcanization accelerator TMTD, Vulcanization accelerator TMTD-II, promoter TT, curing two (thiocarbonyl group dimethylamine), curing tetramethyl TMTDs, tetramethyl sulfo-peroxy dicarbonate diamides, tetramethyl thiuram disulfide, TMTD, rubber accelerator DM, accelerant B Z.
Embodiment 5:
The plasticizer that one embodiment of the invention is used is: o-phthalic acid dibutyl ester (DOP).Plasticizer DOP is colourless oil liquid, proportion 0.9861 (20/20), fusing point-55, boiling point 370(normal pressure), water insoluble, be dissolved in ethanol, ether, the most of organic solvents of mineral wet goods.General purpose grade DOP is widely used in the industry such as plastics, rubber, paint and emulsifying agent.DOP is universal plasticizer, be mainly used in the processing of polyvinyl chloride fat, the also processing of the high polymers such as can be used for ground resin, acetate resin, ABS resin and rubber, the PVC that also can be used for making paint, dyestuff, dispersant etc., DOP plasticising can be used for manufacturer's fabricate-leather, agricultural film, packaging material, cable etc.
The plasticizer that another embodiment of the present invention is used is: DEDB.DEDB and polyvinyl chloride and the rare copolymer of vinyl chloride acetic acid second, the poly-rare good intermiscibility of acetic acid second, also and polyvinyl chloride, polymethyl acrylate, polyvinyl alcohol butyral, NC Nitroncellulose, butyl acetate cellulose and ethyl cellulose etc. mix.The DEDB lighter color, plasticizing efficiency is high, intermiscibility good, volatility is low, exudative low, thermally-stabilised index is high, cold-resistant water-fast extraction, be difficult for oxidation and volatilization, excellent electrical properties, the filler capacity is large, goods brightness high.Be widely used in PVC plastic grain, non-filling calendered film, artificial leather, CABLE MATERIALS, sheet material, sheet material, soft or hard tubing, sole material, rubber-plastic strip, foamed material, film, paint, rubber, lucite, printing-ink, plasticized paste, acetate emulsion adhesive etc.Be minimum a kind of of plasticizer industry price, can significantly reduce the rubber product cost.
The plasticizer that yet another embodiment of the invention is used is: dioctyl adipate.Its chemistry is by name: adipic acid 2121 Octyl Nitrites, molecular formula are C
22H
42O
4, dioctyl adipate is the colorless and odorless transparent oily liquid, can be dissolved in most of organic solvents such as ethanol, ether, acetone, acetic acid, is slightly soluble in ethylene glycol, and is water insoluble.But the volatility of dioctyl adipate is large, and there is certain deficiency the aspects such as resistance to water, animal migration, insulating properties.Dioctyl adipate is normal and phthalate is composite, is applied to cold-resistant agricultural film, cable clad, artificial leather, sheet material, outdoor water pipe and Frozen Food Packaging film etc.Dioctyl adipate can also be as the low temperature of the various synthetic rubber cold resistant plasticizer with resins such as plasticizer and NC Nitroncellulose, ethyl cellulose, polystyrene, vinyl chloride one acetic acid butylene copolymers.At present, di-n-hexyl adipate also is widely used in the polyvinyl butyral resin film.In addition, in many countries, legal its can be used as the plasticizer of food, medical packaging plastics.
The plasticizer that further embodiment of this invention is used is: di-n-hexyl adipate.Di-n-hexyl adipate is the cold resisting type plasticizer of consumption maximum in the world.N-octyl n-decyl adipate (NODA), colourless transparent liquid is n-octyl alcohol, the synthetic straight chain type binary acid mixed ester of Decanol esterification by adipic acid and straight chain; N-octyl n-decyl adipate (NODA) is dissolved in mineral oil, gasoline and most of organic solvent, and is insoluble or be slightly soluble in glycerine, glycols and some amine, is the straight chain type cold-resistant plasticizer of function admirable.Compare with the adipic acid branched-chain alcoho and have better resistance to low temperature, and volatilization loss, heat resistance and light resistance, water-fast extractable etc. are also good than the side chain alcohol ester.When itself and phthalic acid ester share, can improve polyvinyl chloride Vinyl Acetate Copolymer Emulsion performance, be widely used for the cold resistant plasticizer of polyvinyl acetate, polystyrene, polymethyl methacrylate, celluloid, ethyl cellulose and rubber.
The plasticizer that further embodiment of this invention is used is: BBP(Butyl Benzyl Phthalate (Butyl benzyl phthalate) molecular weight 312.40.Character: colourless transparent oil liquid.Relative density (25 ℃/4 ℃) 1.116, freezing point-35 ℃, 370 ℃ of boiling points. 199 ℃ of flash-points (opening). refractive index 1.535. viscosity (25 ℃) 41.5mPas is dissolved in organic solvent and hydro carbons.Water insoluble.Flammable.Little poison.Good with most of rubber and resin compatible. solvation is strong, as the plasticizer of heat-resisting, the oil resistant extractable of resistance to water.
The plasticizer that further embodiment of this invention is used is: cold resistant plasticizer DOS.Di-n-octyl sebacate (DOS), formal name used at school: decanedioic acid two (2-ethyl hexyl) ester molecule formula: C
26H
50O
4Cold resistant plasticizer DOS is colourless or faint yellow transparent oily liquid, freezing point-48 ° C, boiling point: 256 ° of C (0.67Kpa), ignition point 257-263 ° C, viscosity 25mPa.s (20 ° of C), index of refraction 1.449-1.451 (25 ° of C) can be dissolved in the organic solvents such as hydro carbons, alcohols, ketone, ester class, chlorinated hydrocarbon, is insoluble to di-alcohols and water.Cold resistant plasticizer DOS is the good cold resistant plasticizer of a kind of polyvinyl chloride, and plasticizing efficiency is high, and volatility is low, therefore except having good low temperature cold tolerance, heat resistance is preferably arranged again, can use at higher temperature.The weatherability of this product is better, and electrical insulation properties is also more excellent, and normal and phthalate and use are specially adapted to the goods such as cold-resistant electric wire and CABLE MATERIALS, artificial leather, film, sheet material, sheet material.Cold resistant plasticizer DOS can be as the low temperature of the various synthetic rubber cold resistant plasticizer with resins such as plasticizer and NC Nitroncellulose, ethyl cellulose, polymethyl methacrylate, polystyrene, vinyl chloride copolymers.
Embodiment 6: the inorganic active agent that raw materials comprises is one or more in following compounds (or mixture): MgO, Al
2O
3, Si
3N
4, BN, high-purity carbon dust, AlN, ZnO, KAl (SO
4)
212H
2O(alum), Al
2O
3-2SiO
2-2H
2O(kaolin).
Embodiment 7: the MgO that the embodiment of the present invention is used is the nano-MgO particle.
The nano-powder material industrialized producing technology requires the preparation method simple, and production cost is suitable, good reproducibility, and powder granularity is even, product purity is high, the reunion degree is low.A lot of about the synthetic method of nano magnesia in prior art, but in fact can be applied to industrial less.The one, because problems such as equipment, cost, raw material, scale, investments; The 2nd, some technique still is in the laboratory research stage, realizes that suitability for industrialized production has any problem, and even some may not realize suitability for industrialized production.
The present embodiment adopts indoor temperature solid phase method to prepare the MgO particle.
Solid-phase reaction of the present invention has overcome conventional wet and has prepared the agglomeration traits that the bitter earth nano particle exists, and has reaction and need not the advantages such as solvent, productive rate is high, reaction condition is easy; And overcome that the efficient that exists in original solid-phase reaction is low, the shortcoming of the easy oxidation distortion of particle.
The concrete grammar that the present embodiment indoor temperature solid phase method prepares the MgO particle is: with MgCI solution and Na
2CO
3(raw material mass mixture ratio 1:1.2) solution, take PVA solution (poly-vinyl alcohol solution) as modifier, reaction produces precipitation MgCO
3Precipitation, then under 75 ~ 85 ℃ of constant temperature, the mode that transforms by precipitation has obtained alkali formula carbon formula magnesium presoma.50 ~ 60 ℃ of standing alkali formula carbon formula magnesium presomas precipitate 24-30 hour.Pass at the Ar air-flow at last, temperature is calcination under the condition of 600 ~ 650 ℃, has obtained the nano-MgO particle.Adopt PVA as high molecular surfactant, controlled the reunion of particle, prepared nano-MgO particle dispersion is better, is cubic structure, and is substantially spherical in shape, and its particle diameter is 25-35nm.
Embodiment 8-1: the Si that the embodiment of the present invention is used
3N
4Be the nano silicon nitride silicon grain, satisfy following index:
Embodiment 8-2: the Si that the embodiment of the present invention is used
3N
4Can also be highly heat-conductive silicon nitride.Common silicon nitride has randomly-oriented sintering structure.Highly heat-conductive silicon nitride is to add kind of crystal grain (diameter 1um, long 3-4um) at material powder (below particle diameter 1um), makes the sub-orientations of this all crystal grain, forms the fibrous silicon nitride structure that reaches 100um with orientation.Due to the formation of filamentary structure, thermal conductivity factor presents each diversity, and thermal conductivity factor is 120w/ (mK) on the orientation texture direction, is 3 times of common silicon nitride, is equivalent to the thermal conductivity factor of steel.
Embodiment 9: the BN that the embodiment of the present invention is used is the nano silicon nitride boron particles, satisfies following index:
Embodiment 10: the high-purity carbon dust that the embodiment of the present invention is used is: the 10000 high pure carbon powder of pulling together to produce in the Dongguan.Performance indications are:
| Fixed carbon: | 99.99% | Specification: | 10000 orders |
| The trade mark: | 18925457433 | Moisture: | 0.015% |
| Dilation: | 1-2 doubly | The oversize granularity: | 0.0006% |
| Ash content: | 0.85 | Volatile matter: | 0.01％ |
| The screenings granularity: | 0.0005% |
Embodiment 11: the AlN filler that the embodiment of the present invention is used is: AlN whisker and AlN particle are done filler.In the embodiment of the present invention, as matrix, AlN whisker and AlN particle (6um is following) are filled, and obtain the composite of the highest thermal conductivity 28.2W/ (m.K) with ABS, and AlN whisker and AlN particle ratio (mass ratio) are l:40 ~ 60.What the present invention had further studied filler mixes effect and coupling agent to the impact of composite heat conductivility.With AlN whisker and the AlN mix particles of adequate rate, give composite higher heat-conductivity and lower thermal coefficient of expansion than independent with whisker and particle.By using the coupling agent silane treatment, the thermal conductivity of the ABS composite of AlN particulate reinforcement improves 98%, and the thermal conductivity raising is that the contact resistance of filler-matrix reduces due to the interface by improvement matrix and particle.
Embodiment 12: the ZnO that the embodiment of the present invention is used is: nano granular of zinc oxide.Its performance indications are:
The nano zine oxide that the embodiment of the present invention is used, for above-mentioned: 1 class nano-ZnO, 2 class nano-ZnOs, 3 class nano-ZnOs, in a kind of.
Embodiment 13: performance test and sign experiment contrast.
Experimental provision
This experiment adopts flash of light heat transfer analysis instrument LFA447N ano flashTM that thermal diffusion coefficient is measured.This conductometer uses xenon lamp as heating source heated sample surface, uses Infrared Detectors to read the sample temperature rise, has reduced potential surface resistance of heat transfer.
Experimental principle
Under certain design temperature T (constant temperature), launch the light beam pulse by lasing light emitter (or flash lamp) in moment, uniform irradiation is at the sample lower surface, use the corresponding temperature rise process in infrared detector measurement sample upper surface centre, obtain temperature and raise to the relation curve of time.By half heating-up time (sample upper surface temperature is elevated to peaked half required time after receiving optical pulse irradiation) t50 (or claiming t1/2), by following formula:
α＝01388×d
2/t
50 (1)
Can obtain the thermal diffusion coefficient α of sample under temperature T.In formula, d is the thickness of sample.Thermal conductivity factor λ is tried to achieve by following formula:
λ＝α×C
p×ρ (2)
In formula, Cp is the specific heat of rubber; ρ is the density of rubber.Specific heat is relatively tried to achieve by sample and reference sample.Density is recorded than heavy material balance by micro computer.
The sample preparation
During test, sizing material is cut into the thin rounded flakes that diameter is 12.5 ~ 12.7mm, and guarantees that the sample upper and lower surface is smooth, smooth.
Experimental procedure
(1) half an hour before the experiment, pour appropriate liquid nitrogen in instrument, regulate external recirculated water controller, set temperature makes it higher than 2 ~ 3 degrees centigrade of room temperatures, pre-thermal instrument.
(2) slide measure that is 0.02mm with precision carries out three times to the thickness of test specimen to be measured, and gets its mean value as the thickness of sample.
(3) with alcohol with the sample wiped clean, dry.Upper and lower surface at sample is carried out uniform graphite coating.
(4) sample is put into sample well, open Survey Software, parameters begins test.
Fill with a liquid nitrogen every 3.5h in experimentation.Experiment is closed all power supplys after finishing.
Various formula heat conductivilitys and mechanical property
Filler 1: 150 parts of ethylene propylene diene rubbers, age resistor [6-ethyoxyl-2,2,4-trimethyl-1, the 2-dihyaroquinoline] 2 parts, 40 parts of carbon blacks, 1 part, sulphur, promoter [N, the two thiamides of N-tetramethyl two sulphur] 1 part, 6 parts, plasticizer [o-phthalic acid dibutyl ester], 40 parts of paraffin oils, organic active agent [PEG4000] 3-8 part, inorganic active agent [MgO, Al
2O
3, (high-termal conductivity) Si
3N
4, BN, AlN, (1 class nanometer) ZnO] each 1 part, 1 part of dispersant [triethyl group hexyl phosphoric acid].
Filler 2: 160 parts of ethylene propylene diene rubbers, 2 parts, age resistor [2-dihyaroquinoline], 50 parts of carbon blacks, 2 parts, sulphur, 2 parts of promoter [tetramethylthiuram disulfide], 7 parts, plasticizer [DEDB], 50 parts of paraffin oils, 4 parts of organic active agent [PEG4000], inorganic active agent [MgO2 part, Al
2O
31 part, (nano particle) Si
3N
41 part, BN1 part, AlN1 part, (2 class nanometer) ZnO1 part, KAl (SO
4)
212H
2O1 part], 2 parts of dispersants [lauryl sodium sulfate].
Filler 3: 170 parts of ethylene propylene diene rubbers, 3 parts, age resistor [2,2,4-trimethyl 1], 60 parts of carbon blacks, 3 parts, sulphur, 3 parts of promoter [thiram], 8 parts, plasticizer [decanedioic acid two (2-ethyl hexyl) ester], 60 parts of paraffin oils, organic active agent [PEG4000], 5 parts, inorganic active agent [MgO, Al
2O
3, BN, AlN, Al
2O
3-2SiO
2-2H
2O] each 2 parts, 3 parts of dispersants [methyl anyl alcohol].
Filler 4: 180 parts of ethylene propylene diene rubbers, 4 parts, age resistor [N-phenyl-N`-cyclohexyl p-phenylenediamine (PPD)], 70 parts of carbon blacks, 3 parts, sulphur, 3 parts of promoter [vulcanization accelerator TMTD], 9 parts, plasticizer [BBP(Butyl Benzyl Phthalate], 70 parts of paraffin oils, organic active agent [PEG4000], 6 parts, inorganic active agent [MgO, Al
2O
3, (nano particle) Si
3N
4, KAl (SO
4)
212H
2O, Al
2O
3-2SiO
2-2H
2O] each 2 parts, 4 parts of dispersants [cellulose derivative].
Filler 5: 190 parts of ethylene propylene diene rubbers, 4 parts, age resistor [N-phenyl-N`-cyclohexyl p-phenylenediamine (PPD)], 80 parts of carbon blacks, 3 parts, sulphur, 3 parts of promoter [vulcanization accelerator TMTD], 10 parts, plasticizer [BBP(Butyl Benzyl Phthalate], 80 parts of paraffin oils, 7 parts of organic active agent [PEG4000], inorganic active agent [Al
2O
3, (high-termal conductivity) Si
3N
4, BN, AlN, (2 class nanometer) ZnO, KAl (SO
4)
212H
2O, Al
2O
3-2SiO
2-2H
2O] each 1 part, 4 parts of dispersants [polyacrylamide].
Filler 6: 200 parts of ethylene propylene diene rubbers, 4 parts, age resistor [N-phenyl-N`-isopropyl-p-phenylenediamine (PPD)], 80 parts of carbon blacks, 3 parts, sulphur, 3 parts of promoter [Vulcanization accelerator TMTD], 10 parts, plasticizer [decanedioic acid two (2-ethyl hexyl) ester], 80 parts of paraffin oils, 8 parts of organic active agent [PEG4000], inorganic active agent [MgO, Si
3N
4(nano particle), BN, AlN, (1 class nanometer) ZnO, KAl (SO
4)
212H
2O, Al
2O
3-2SiO
2-2H
2O] each 1.5 parts, 4 parts of dispersants [fatty acid polyethylene glycol ester].
Filler 7: 200 parts of ethylene propylene diene rubbers, age resistor [6-ethyoxyl-2,2,4-trimethyl-1,2-dihyaroquinoline; N-N`-diphenyl-p-phenylenediamine (PPD)] each 2 parts, 60 parts of carbon blacks, 2 parts, sulphur, promoter [Vulcanization accelerator TMTD-II; Altax; Accelerant B Z] each 1 part, plasticizer [dioctyl adipate; Di-n-hexyl adipate; BBP(Butyl Benzyl Phthalate; Decanedioic acid two (2-ethyl hexyl) ester] each 1 part, 40 parts of paraffin oils, 3 parts of organic active agent [PEG4000], inorganic active agent [MgO, Al
2O
3, Si
3N
4(nano particle), BN, AlN, (1 class nanometer) ZnO ,] each 2 parts, each 1 part of dispersant [triethyl group hexyl phosphoric acid, lauryl sodium sulfate, methyl anyl alcohol].
Filler 8: 180 parts of ethylene propylene diene rubbers, age resistor [2,2,4-trimethyl 1,2-dihydro quinoline condensate; N-phenyl-N`-isopropyl-p-phenylenediamine (PPD)] each 1 part, 50 parts of carbon blacks, 2 parts, sulphur, promoter [promoter T tetramethyl two sulfo-thiurams; Vulcanization accelerator TMTD; ] each 1 part, plasticizer [di-n-hexyl adipate; BBP(Butyl Benzyl Phthalate; Decanedioic acid two (2-ethyl hexyl) ester] each 3 parts, 50 parts of paraffin oils, 6 parts of organic active agent [PEG4000], inorganic active agent [MgO, Al
2O
3, Si
3N
4(nano particle), BN, AlN, (2 class nanometer) ZnO, KAl (SO
4)
212H
2O, Al
2O
3-2SiO
2-2H
2O] each 1 part, each 1 part of dispersant [cellulose derivative, polyacrylamide, guar gum, fatty acid polyethylene glycol ester].
Filler 9: 170 parts of ethylene propylene diene rubbers, age resistor [6-ethyoxyl-2,2,4-trimethyl-1,2-dihyaroquinoline; N-N`-diphenyl-p-phenylenediamine (PPD)] each 1 part, 70 parts of carbon blacks, 3 parts, sulphur, promoter [promoter T; Vulcanization accelerator TMTD; Vulcanization accelerator TMTD-II; ] each 1 part, plasticizer [di-n-hexyl adipate; BBP(Butyl Benzyl Phthalate] each 4 parts, 70 parts of paraffin oils, 4 parts of organic active agent [PEG4000], inorganic active agent [MgO, Al
2O
3, Si
3N
4(high-termal conductivity), BN, AlN, (1 class nanometer) ZnO, KAl (SO
4)
212H
2O, Al
2O
3-2SiO
2-2H
2O] each 1 part, each 1 part of dispersant [triethyl group hexyl phosphoric acid, methyl anyl alcohol, polyacrylamide].
Filler 10: 160 parts of ethylene propylene diene rubbers, age resistor [N-phenyl-N`-cyclohexyl p-phenylenediamine (PPD); N-phenyl-N`-isopropyl-p-phenylenediamine (PPD).N-N`-diphenyl-p-phenylenediamine (PPD)] each 1 part, 40 parts of carbon blacks, 3 parts, sulphur, promoter [TMTD; Altax] each 1 part, plasticizer [o-phthalic acid dibutyl ester; Dioctyl adipate; BBP(Butyl Benzyl Phthalate] each 3 parts, 80 parts of paraffin oils, 3 parts of organic active agent [PEG4000], inorganic active agent [MgO, Al
2O
3, Si
3N
4(nano particle), BN, AlN, ZnO ,] each 2 parts, each 1 part of dispersant [triethyl group hexyl phosphoric acid, methyl anyl alcohol, cellulose derivative, guar gum].
Filler 11: 200 parts of ethylene propylene diene rubbers, age resistor [N-phenyl-α-aniline; The N-PBNA; N-phenyl-N`-isopropyl-p-phenylenediamine (PPD)] each 1 part, 40 parts of carbon blacks, 1 part, sulphur, promoter [Vulcanization accelerator TMTD; Promoter TT; Curing tetramethyl TMTD] each 1 part, plasticizer [BBP(Butyl Benzyl Phthalate; Decanedioic acid two (2-ethyl hexyl) ester] each 5 parts, 80 parts of paraffin oils, 4 parts of organic active agent [PEG4000], inorganic active agent [MgO, Al
2O
3, Si
3N
4(high-termal conductivity), BN, AlN, (2 class nanometer) ZnO, KAl (SO
4)
212H
2O, Al
2O
3-2SiO
2-2H
2O] each 1 part, 2 parts of dispersants [fatty acid polyethylene glycol ester].
Filler 12: 150 parts of ethylene propylene diene rubbers, age resistor [N-phenyl-N`-isopropyl-p-phenylenediamine (PPD); N-N`-diphenyl-p-phenylenediamine (PPD)] each 1 part, 50 parts of carbon blacks, 2 parts, sulphur, promoter [promoter T; ] 2 parts, 9 parts, plasticizer [decanedioic acid two (2-ethyl hexyl) ester], 70 parts of paraffin oils, 6 parts of organic active agent [PEG4000], inorganic active agent [MgO, Si
3N
4(high-termal conductivity), AlN, (1 class nanometer) ZnO, Al
2O
3-2SiO
2-2H
2O] each 2 parts, each 1 part of dispersant [lauryl sodium sulfate, cellulose derivative, fatty acid polyethylene glycol ester].
High heat conducting nano compounded rubber of the present invention is that thermal conductivity can be up to the thermoplastic composite resin of 22.25 ~ 35.56w/mK.The technology of the present invention is utilized unique MOLECULE DESIGN, has improved the interaction force of molecule between thermoplastic elastomer and filler, and filler high efficiency contact has each other formed the heat passage, has increased substantially thermal conductivity.
Embodiment 14: as shown in Fig. 1～14, be respectively: its assembled state structural representation of the LED bulb of one embodiment of the invention; Its split status architecture schematic diagram of LED bulb; Its lamp socket surface structure schematic diagram of LED bulb; Its lamp socket front view of LED bulb; Its lamp base part view of LED bulb; Its type socket surface structure schematic diagram that spins of bulb; Its type socket front view that spins of LED bulb; Its type socket side view that spins of LED bulb; Its radiator surface structure schematic diagram of LED bulb; Its radiator view of LED bulb; Its heat sink side view of LED bulb; Its copper base front view of LED bulb; Its rate copper base side view of LED bulb; Its LED lamp pearl structural representation of LED bulb; Its protective cover surface structure schematic diagram of LED bulb; Its protective cover front view of LED bulb; Its protective cover side view of LED bulb.
In Fig. 1 ~ 14, each Reference numeral is respectively: 1 is lamp socket, and 2 for spinning the type socket, and 3 is radiator, and 4 is copper base, and 5 is LED lamp pearl, and 6 is protective cover.
The LED bulb that described high heat conductive rubber is made comprises lamp socket 1, radiator 3, copper base 4, LED lamp pearl 5 and protective cover 6, also comprises the type socket 2 that spins; Described lamp socket 1 is connected with radiator 3 by the type socket 2 that spins; Described LED lamp pearl 1 is arranged on copper base 4; The one side that described copper base 4 is provided with LED lamp pearl 5 is connected with protective cover 6, and its another side is connected with radiator 3; Described spin type socket 2 by the groove that spins that arranges on spinning of arranging on it and lamp socket be attached thereto connect fixing; Described radiator 3 is comprised of fin; Described fin adopts arcuate structure and is evenly distributed; Described protective cover 6 adopts the light-transmitting materials structure; Described protective cover 6 is made as the hemisphere face shape.
The installation method of described LED bulb comprises the following steps: adopt the Auto-mounting mode to be arranged on copper base 4 LED lamp pearl 5; Adopt the Auto-mounting mode to be connected with protective cover 6 and radiator 3 respectively the copper base 4 that LED lamp pearl 5 is housed; With lamp socket 1 by the type socket 2 that the spins installation that is connected with radiator 3 by manual assembly.
Embodiment 15: as shown in Fig. 1～14, be respectively: its assembled state structural representation of the LED bulb of one embodiment of the invention; Its split status architecture schematic diagram of LED bulb; Its lamp socket surface structure schematic diagram of LED bulb; Its lamp socket front view of LED bulb; Its lamp base part view of LED bulb; Its type socket surface structure schematic diagram that spins of bulb; Its type socket front view that spins of LED bulb; Its type socket side view that spins of LED bulb; Its radiator surface structure schematic diagram of LED bulb; Its radiator view of LED bulb; Its heat sink side view of LED bulb; Its copper base front view of LED bulb; Its rate copper base side view of LED bulb; Its LED lamp pearl structural representation of LED bulb; Its protective cover surface structure schematic diagram of LED bulb; Its protective cover front view of LED bulb; Its protective cover side view of LED bulb.
In Fig. 1～14, each Reference numeral is respectively: 1 is lamp socket, and 2 for spinning the type socket, and 3 is radiator, and 4 is copper base, and 5 is LED lamp pearl, and 6 is protective cover.
Its LED bulb of making of the described high heat conductive rubber of the present embodiment comprises lamp socket 1, radiator 3, copper base 4, LED lamp pearl 5 and protective cover 6, in addition, also comprises the type socket 2 that spins; Described lamp socket 1 is connected with radiator 3 by the type socket 2 that spins; Described LED lamp pearl 5 is arranged on copper base 4; The one side that described copper base 4 is provided with LED lamp pearl 5 is connected with protective cover 6, and its another side is connected with radiator 3.
The spin groove of the described type socket 2 that spins by setting on the rotary joint device that arranges on it and lamp socket 1 be attached thereto connect fixing.
Described radiator 3 is comprised of fin.
Described fin adopts arcuate structure and is evenly distributed.
Described protective cover 6 adopts the light-transmitting materials structure.
Described protective cover 6 is made as the hemisphere face shape.
Described its installation method of LED bulb comprises the following steps: adopt the Auto-mounting mode to be arranged on copper base 4 LED lamp pearl 5; Adopt the Auto-mounting mode to be connected with protective cover 6 and radiator 3 respectively the copper base 4 that LED lamp pearl 5 is housed; With lamp socket 1 by the type socket 2 that the spins installation that is connected with radiator 3 by manual assembly.
This intellectual property of primary enforcement that all are above-mentioned is not set restriction this new product of other forms of enforcement and/or new method.Those skilled in the art will utilize this important information, and foregoing is revised, to realize similar implementation status.But all modifications or transformation belong to the right of reservation based on new product of the present invention.
The above is only preferred embodiment of the present invention, is not to be invention to be done the restriction of other form, and any those skilled in the art may utilize the technology contents of above-mentioned announcement to be changed or be modified as the equivalent embodiment of equivalent variations.But every technical solution of the present invention content that do not break away to any simple modification, equivalent variations and remodeling that above embodiment does, still belongs to the protection domain of technical solution of the present invention according to technical spirit of the present invention.
Claims (10)
1. a heat conductive rubber LED lamp, is characterized in that, comprising: lamp socket, radiator, copper base and LED lamp pearl.
2. heat conductive rubber LED lamp according to claim 1, is characterized in that, described LED bulb further has the type of spinning socket; Described lamp socket is connected with described radiator by the type socket that spins; Described LED lamp pearl is arranged on described copper base; Described copper base is provided with described LED lamp pearl, and the another side of described copper base is connected with radiator; Described spin the type socket by the groove that spins that arranges on the rotary joint device that arranges on it and lamp socket be attached thereto connect fixing.
3. described heat conductive rubber LED lamp according to claim 1 and 2, is characterized in that, the material that described radiator adopts is the described high heat conducting nano compounded rubber of any one in claim 6 ~ 10.
4. the installation method of a heat conductive rubber LED lamp as described in any one in claim 1 ~ 3, is characterized in that, comprises the following steps: adopt the Auto-mounting mode to be arranged on copper base LED lamp pearl; Adopt the Auto-mounting mode to be connected with described radiator the copper base that LED lamp pearl is housed; With lamp socket by the type socket that the spins installation that is connected with radiator by manual assembly.
5. the radiator that uses in a heat conductive rubber LED lamp is characterized in that, the material that described radiator adopts is the described high heat conducting nano compounded rubber of any one in claim 6 ~ 10.
6. a high heat conducting nano compounded rubber, is characterized in that, its raw material comprises one or more in following component: ethylene propylene diene rubber, age resistor, carbon black, sulphur, promoter, plasticizer, paraffin oil, organic active agent PEG4000, inorganic active agent, dispersant.
7. high heat conducting nano compounded rubber according to claim 6, is characterized in that, described material content proportioning is by weight:
Ethylene propylene diene rubber 150-200 part,
Age resistor 1-4 part,
Carbon black 40-80 part,
Sulphur 1-3 part,
Promoter 1-3 part,
Plasticizer 6-10 part,
Paraffin oil 40-80 part,
Organic active agent PEG4000,3-8 part
Inorganic active agent 6-12 part,
Dispersant 1-4 part.
8. high heat conducting nano compounded rubber according to claim 6, is characterized in that, described age resistor is one or more in following reagent: 6-ethyoxyl-2,2,4-trimethyl-1,2-dihyaroquinoline; 2,2,4-trimethyl 1,2-dihydro quinoline condensate; N-phenyl-α-aniline; The N-PBNA; N-phenyl-N`-cyclohexyl p-phenylenediamine (PPD); N-phenyl-N`-isopropyl-p-phenylenediamine (PPD).N-N`-diphenyl-p-phenylenediamine (PPD);
Described promoter is one or more in following reagent: promoter T; N, the two thiamides of N-tetramethyl two sulphur; Tetramethylthiuram disulfide; Thiram; Vulcanization accelerator TMTD; Tetramethyl two sulfo-thiurams; Vulcanization accelerator TMTD; Vulcanization accelerator TMTD-II; Promoter TT; Curing two (thiocarbonyl group dimethylamine); Curing tetramethyl TMTD; Tetramethyl sulfo-peroxy dicarbonate diamides; Tetramethyl thiuram disulfide; TMTD; Altax; Accelerant B Z;
Described plasticizer is one or more in following reagent:: o-phthalic acid dibutyl ester; DEDB; Dioctyl adipate; Di-n-hexyl adipate; BBP(Butyl Benzyl Phthalate; Decanedioic acid two (2-ethyl hexyl) ester;
Described activating agent is PEG4000; Described dispersant is one or more in following reagent: triethyl group hexyl phosphoric acid, lauryl sodium sulfate, methyl anyl alcohol, cellulose derivative, polyacrylamide, guar gum, fatty acid polyethylene glycol ester;
Described inorganic active agent is one or more in following reagent: MgO, Al
2O
3, Si
3N
4, BN, AlN, ZnO, KAl (SO
4)
212H
2O, Al
2O
3-2SiO
2-2H
2O；
Described AlN is: AlN whisker and AlN particle.
9. high heat conducting nano compounded rubber according to claim 8, is characterized in that described Si
3N
4Be highly heat-conductive silicon nitride; Described BN is the nano silicon nitride boron particles, satisfies following index:
10. the described high heat conducting nano compounded rubber of any one according to claim 6-9, is characterized in that, described high heat conducting nano compounded rubber, and it prepares by following steps:
The first step, synthetic rubber: by banbury with described raw material synthetic rubber;
Second step, moulding: by mill with the synthetic rubber moulding;
In the 3rd step, sulfuration: moulding rubber is put into the mould of vulcanizer, the pressurization scope is 150-210kgf/ ㎝
2, being warmed up to 220-230 ℃, the time is 80-100 second, vulcanizes.
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| CN201210583104.0A CN103148368B (en) | 2012-12-26 | 2012-12-26 | Heat-conductive rubber light-emitting diode (LED) lamp and preparation method thereof |
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| CN201210583104.0A CN103148368B (en) | 2012-12-26 | 2012-12-26 | Heat-conductive rubber light-emitting diode (LED) lamp and preparation method thereof |
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| CN103148368B CN103148368B (en) | 2014-12-17 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103527962A (en) * | 2013-10-30 | 2014-01-22 | 杨进 | LED bulb lamp |
| CN104558729A (en) * | 2014-02-21 | 2015-04-29 | 泌阳恒茂服饰制品有限公司 | Production process of heating unit |
| CN104592567A (en) * | 2014-02-20 | 2015-05-06 | 泌阳恒茂服饰制品有限公司 | Heat generation body construction method |
| CN104893247A (en) * | 2015-05-27 | 2015-09-09 | 合肥卓元科技服务有限公司 | Heat conduction transparent modification process of epoxy resin for LED packaging |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004349575A (en) * | 2003-05-23 | 2004-12-09 | Matsushita Electric Ind Co Ltd | Heat dissipation structure |
| CN201827722U (en) * | 2010-09-30 | 2011-05-11 | 厦门雷的光电科技有限公司 | LED (light emitting diode) lamp bulb |
| CN102504358A (en) * | 2011-11-22 | 2012-06-20 | 广东石油化工学院 | High-heat-conductivity rubber composite material and preparation method thereof |
-
2012
- 2012-12-26 CN CN201210583104.0A patent/CN103148368B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004349575A (en) * | 2003-05-23 | 2004-12-09 | Matsushita Electric Ind Co Ltd | Heat dissipation structure |
| CN201827722U (en) * | 2010-09-30 | 2011-05-11 | 厦门雷的光电科技有限公司 | LED (light emitting diode) lamp bulb |
| CN102504358A (en) * | 2011-11-22 | 2012-06-20 | 广东石油化工学院 | High-heat-conductivity rubber composite material and preparation method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103527962A (en) * | 2013-10-30 | 2014-01-22 | 杨进 | LED bulb lamp |
| CN104592567A (en) * | 2014-02-20 | 2015-05-06 | 泌阳恒茂服饰制品有限公司 | Heat generation body construction method |
| CN104558729A (en) * | 2014-02-21 | 2015-04-29 | 泌阳恒茂服饰制品有限公司 | Production process of heating unit |
| CN104893247A (en) * | 2015-05-27 | 2015-09-09 | 合肥卓元科技服务有限公司 | Heat conduction transparent modification process of epoxy resin for LED packaging |
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| Publication number | Publication date |
|---|---|
| CN103148368B (en) | 2014-12-17 |
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