CN103135338B - Nanoscale soft mold manufacturing method and device - Google Patents
Nanoscale soft mold manufacturing method and device Download PDFInfo
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- CN103135338B CN103135338B CN201210387170.0A CN201210387170A CN103135338B CN 103135338 B CN103135338 B CN 103135338B CN 201210387170 A CN201210387170 A CN 201210387170A CN 103135338 B CN103135338 B CN 103135338B
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Abstract
The invention discloses a nanoscale soft mold manufacturing method and a device. The method includes that: (1) a female mold is provided, and the surface of the female mold is provided with nanoscale concave and/or convex patterns; (2) photosensitive curing material is added to the surface of the female mold, then base material is covered on the female mold, the photosensitive curing material is enabled to be filled inside the patterns, and the base material is enabled to be tightly attached to the surface of the female mold; (3) the photosensitive curing material is lighted by light rays with set wavelengths to enable the photosensitive curing material to be molded in a curing mode; and (4) the molded photosensitive curing material in the curing mode and the base material are separated from the female mold to obtain target products. The device comprises a feeding device, a rolling mechanism, a de-molding mechanism and a light source. The nanoscale female mold is chosen to perform nanoscale pattern transferring until the soft base material is combined to soft molds, a large number of nanoscale soft molds can be manufactured in atmospheric environment, structure transfer rate is 95%, female mold damage risk and mold cost can be reduced, and the produced soft molds can be applied to any micro-nano structure component belonging to a coining mode.
Description
Technical field
The present invention be more particularly directed to a kind of method for making and device of nanoscale soft mold.
Background technology
Mould is the mother of industry, and it realizes the processing of article profile mainly through the change of institute's moulding material physical state.In stamping-out, shaping and punching, die forging, cold-heading, extruding, metallic sintered products compacting, pressure casting, and in the compression moulding of goods such as engineering plastics, rubber, pottery or the formed machining of injection moulding, possesses the role of key.When the structure of mould even arrives micron, nanoscale from large to small, its Production Time is often very consuming time, and cost is also very expensive, accidentally damages, will cause very great loss if use in the process of mould.But the application of micro nano structure widely, throughout display (such as: brightness enhancement film, anti-reflective film, micro-structure light guide plate etc.), solar element (such as: light harvesting and anti-reflection structure) and LED (such as micron order and nanoscale sapphire substrate substrate and photonic crystal).In the Mold Making technology of micro-nano-scale, micro-shadow (Photolithigraphy) process technique is the most common, below just an introduction is done with this known techniques: with light shield (mask) a1 for figure, with ultraviolet a2 Exposure mode, figure is developed on photoresistance, through etch process by graphic making in a base version (such as: Silicon Wafer a4, it has oxide layer a3), finally remove the silicon mould (consulting shown in Figure 1A) that photoresistance obtains a tool pattern.This exposure imaging processing procedure is limited to the analytic ability of light source and photoresistance, for i-line light source, generally minimumly only can accomplish 500nm yardstick, to obtain more minor structure, can the micro-shadow of electron beam (E-beam, as shown in Figure 1B, wherein, b1 is Silicon Wafer, and b2 is template layer, and b3 is photoresist layer) carry out.Learnt by above-mentioned, the mould producing a micro-structure needs complicated fabrication steps and time, if having damage during follow-up use, is all one bear greatly and lose to cost and time.
In sum, along with micro nano structure is widely applied in photovalve, if cannot overcome mould production cost (expense and time), product will not possess competitive edge.
Summary of the invention
The object of the invention is to for deficiency of the prior art, a kind of method for making and device of nanoscale soft mold are provided, it can realize a large amount of manufactures of nanoscale soft mold, and structure transcription rate >95%, and significantly can lower master mold damage probability and reduce mould use cost, reach the product competition advantage of low cost high production.
For reaching aforementioned invention object, the technical solution used in the present invention is as follows:
A method for making for nanoscale soft mold, comprising:
(1) surface is provided to have the master mold of the recessed and/or convex pattern of nanoscale;
(2) apply photosensitive curing compounds on described master mold surface, then on described master mold covering substrates, then make photosensitive curing compounds insert in described pattern, and described base material and master mold surface be close to;
(3) irradiate photosensitive curing compounds with the light with setting wavelength and make it curing molding;
(4) photosensitive curing compounds of curing molding and base material are separated with master mold, obtain target product.
Further, step (2) comprising: dripped by photosensitive curing compounds in master mold surface, and base material is covered master mold surface, then be covered in the base material on master mold surface with upper roller roll extrusion by one group, thus to push away the mode of sweeping, photosensitive curing compounds extruding is shakeout and inserted in described pattern, and base material and master mold surface are adjacent to.
Further, in described pattern, the size of each recessed unit and/or protrusion element is between 100-1000 nanometer, its depth-to-width ratio <2.
Further, described base material thickness between 100-200 micron, and preferably in the structure of its surface programming for increasing photosensitive curing compounds and base material then ability.
As one of better embodiment, described photosensitive curing compounds light comprises the ultraviolet photosensitive curing compounds of solidification energy <500 MJ.
Aforementioned master mold can be transparent (such as PET, quartz glass) or opaque (such as Silicon Wafer) material, but is not limited thereto.
The material of aforementioned substrates can select all kinds of inorganic or organic material commonly used, such as polyethylene terephthalate (polyethylene terephthalate, PET) etc., but is not limited thereto.
The photosensitive curing compounds that aforementioned light-sensitive curing materials can select UV type resin etc. to commonly use, such as, polymethylmethacrylate (Polymethylmethacrylate can be selected, Acrylic) be or polyurethane (Polyurethane, PU) be, the characteristic of its tool low-surface-energy, its photocuring energy <500 MJ.
A producing device for nanoscale soft mold, comprising:
Feeding device, for providing photosensitive curing compounds, and is applied to surface and has on the master mold of the recessed and/or convex pattern of setting by photosensitive curing compounds;
Rolling mechanism, for the photosensitive curing compounds be applied on master mold extruding is shakeout and inserted in described pattern, and closely develops base material and master mold,
Mould emptier, for the photosensitive curing compounds of curing molding and base material are separated with master mold, and,
Light source, irradiates photosensitive curing compounds for providing the light of setting wavelength and makes it curing molding.
Further, described rolling mechanism comprises the soft vapour-pressure type pinch roller of the plural groups set gradually by the processing procedure of described nanoscale soft mold, the skin hardness of this plural groups pinch roller by soft to hard sequential.
As preferably one of embodiment, described rolling mechanism comprises:
First group of pinch roller, for the photosensitive curing compounds being applied to master mold surface is shakeout,
Second group of pinch roller, for photosensitive curing compounds being inserted in described pattern,
3rd group of pinch roller, for adjusting the thickness of photosensitive curing compounds, and eliminates the bubble that may occur in photosensitive curing compounds,
Wherein, first group of pinch roller sequentially increases progressively in the scope of 4-9 kilogram to the pressure of the 3rd group of pinch roller.
Preferably, described first group of pinch roller sequentially increases progressively in the scope of 40-80 shore hardness A to the skin hardness of the 3rd group of pinch roller.
Further, described mould emptier comprises assisted demoulding roller, and described assisted demoulding roller is metal material, and diameter is at more than 15cm.
As one of preferred version, described light source comprises UV light source module, and described UV light source module comprises:
LED type UV light source, for irradiating the photosensitive curing compounds be filled in described pattern, and at least makes described photosensitive curing compounds top layer solidify;
And face type mercury lamp UV light source, for irradiating isolated from master mold, the photosensitive curing compounds be connected on base material, and makes it to harden completely.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technological means of the present invention, and can be implemented according to the content of instructions, coordinates accompanying drawing to be described in detail as follows below with preferred embodiment of the present invention.The specific embodiment of the present invention is provided in detail by following examples and accompanying drawing thereof.
Accompanying drawing explanation
Figure 1A is the schematic diagram of micro-shadow (Photolithigraphy) processing procedure in prior art;
Figure 1B is the schematic diagram of electron beam micro-photographing process in prior art;
Fig. 1 a is the element schematic in a preferred embodiment of the present invention involved by nanoscale soft mold processing procedure, comprises master mold (recessed) 101, PET base material 102 and UV type resin 103;
Fig. 1 b is the schematic diagram of the master mold (convex) 104 in a preferred embodiment of the present invention involved by nanoscale soft mold processing procedure;
Fig. 2 is one of schematic diagram of nanoscale soft mold producing device and related process involved by a preferred embodiment of the present invention;
Fig. 3 is the schematic diagram two of nanoscale soft mold producing device and related process involved by a preferred embodiment of the present invention.
Embodiment
Below in conjunction with accompanying drawing, preferred embodiment of the present invention is described in detail.
Please refer to shown in Fig. 1 a-1b, the processing procedure of nanoscale soft mold of the present invention can relate to following element: master mold (recessed) 101, master mold (convex) 104, base material 102 and photosensitive curing compounds 103.
Wherein, described master mold can be transparent (such as PET, quartz glass) or opaque (such as: Silicon Wafer) material, recessed and/or the convex pattern of nanoscale that its surface is arranged can be arbitrary rule and/or irregular pattern, wherein the size of arbitrary recessed and/or protrusion element is between 100-1000nm, and depth-to-width ratio (h/d) <2.
Aforementioned substrates preferably adopts polyethylene terephthalate (polyethylene terephthalate, PET), its thickness is between 100-200 micron, and its surface can through pre-service (primer process) in order to increase the then ability of base material and photosensitive curing compounds.
Aforementioned light-sensitive curing materials preferably adopts UV type resin, as polymethylmethacrylate (Polymethylmethacrylate, Acrylic) be or polyurethane (Polyurethane, PU) is, and the characteristic of tool low-surface-energy, photocuring energy <500 MJ.
Nanoscale soft mold producing device of the present invention can comprise light source, feeding device, rolling mechanism and mould emptier; its principle of work is roughly: through feeding device by photosensitive curing compounds titration on master mold; by rolling mechanism, the photosensitive curing compounds extruding on master mold is shakeout and inserted in the pattern on master mold surface to push away the mode of sweeping by photosensitive curing compounds; formed after closely developing state between base material and master mold, with light source irradiation and photosensitive curing compounds is transferred to solid-state after namely complete Graphic transitions.
Refer to shown in Fig. 2, aforementioned rolling mechanism can adopt many rollers rolling mechanism 202, and it forms primarily of three groups of vapour-pressure type pinch rollers A, B, C, and be used for control photosensitive curing compounds (or being called UV type resin) thickness and homogeneity.
Further say, wherein, first group of pinch roller A is responsible for UV type to shakeout, and second group of pinch roller B is responsible for UV type resin to insert in the pattern on master mold (recessed) 201 surface, and the 3rd group of pinch roller C is responsible for the thickness of adjustment UV type resin and eliminates the bubble that wherein may occur.
Further, first group sequentially increases progressively to the pressure of the 3rd group of pinch roller the scope of 4-9 kilogram.
And, this group to the 3rd group pinch roller has different shore hardness A according to the difference of function, its material can be rubber, silica gel or PU, first group of pinch roller A hardness is lower than second group of pinch roller B, second group of pinch roller B hardness is lower than the 3rd group of pinch roller C, and durometer level is between 40-80 shore hardness A.
Said light source comprises UV light source module, and described UV light source module comprises:
One LED type UV light source UV
1203, the more weak radiant illumination of its tool, and be single wave band;
And, a type mercury lamp UV light source UV
2205, its wave band is distributed between 320-420nm.
Aforementioned mould emptier preferably adopts a withdrawing pattern auxiliary wheel D204, and it is metal material, and diameter is greater than 6 inches, can maintain a fixed angle and carries out the demoulding and avoid structural break.
Continue to consult Fig. 2, the action specification of this nanoscale soft mold producing device is as follows: UV type resin to shakeout to push away the mode of sweeping and to be squeezed in the patterning of master mold 201, through UV by many rollers rolling mechanism 202
1203 carry out one-phase irradiation, and UV type resin is by assisted demoulding roller 204 withdrawing pattern after first stage irradiation solidification, and now structure graph is transferred to PET base material by master mold, then with UV
2205 carry out subordinate phase irradiation makes UV structure solidify completely and the PET soft mold 206 forming a tool UV microstructure.
UV resin, with many pressure rollers roll extrusion UV resin, is filled to mould structure by this nanoscale soft mold producing device uniformly, reaches THICKNESS CONTROL shift with the microstructure graph getting rid of bubble through different clamping pressure and roller hardness.Two benches UV irradiation method makes UV structure in UV
1stage solidifies in surface, carries out UV again by after the auxiliary wheel demoulding
2stage irradiation is also completely by Structured cured for UV shaping.By preceding method and device, nanoscale soft mold can be replicated in a large number and replace original master mold, be applied in imprinting process be major way microstructure make.
Consulting shown in Fig. 3 is another schematic diagram of nanoscale soft mold producing device of the present invention, structure except master mold (convex) 301 in this example is contrary with master mold shown in Fig. 2 (recessed) 201 structures, all the other are the same, wherein, UV light source 302 can from top to bottom according to, also can from lower to upper according to or 2 directions irradiations simultaneously.
In sum, compared with prior art, nanoscale soft mold method for making of the present invention and device at least have the following advantages:
(1) fast and tool cost competitiveness: only needed a master mold to get final product massive duplication, structure transcription rate >95%, micro-photographing process must do not carried out again and make new mould;
(2) environmental protection: 100%UV processing procedure, the environmental issues such as solvent-free volatilization;
(3) can operate under atmospheric environment, must not vacuumize and can carry out nano level design transfer.
(4) can reduce master mold damage risk and reduce die cost, the soft mold of output can be applicable to any one micro nano structure element belonging to impression mode.
The nanoscale soft mold production method provided the embodiment of the present invention above and device are described in detail; for one of ordinary skill in the art; according to the thought of the embodiment of the present invention; all will change in specific embodiments and applications, therefore all any changes made according to design philosophy of the present invention are all within protection scope of the present invention.
Claims (7)
1. a method for making for nanoscale soft mold, is characterized in that, it comprises:
(1) surface is provided to have the master mold of the recessed and/or convex pattern of nanoscale;
(2) photosensitive curing compounds is dripped on described master mold surface, covering substrates on described master mold again, the base material on master mold surface is then covered in by three groups of pinch roller roll extrusion, first group of pinch roller, for the photosensitive curing compounds being applied to master mold surface is shakeout, second group of pinch roller, for photosensitive curing compounds being inserted in described pattern, 3rd group of pinch roller, for adjusting the thickness of photosensitive curing compounds, and the bubble that may occur in elimination photosensitive curing compounds, wherein, first group of pinch roller sequentially increases progressively in the scope of 4-9 kilogram to the pressure of the 3rd group of pinch roller, thus to push away the mode of sweeping, photosensitive curing compounds extruding is shakeout and inserted in described pattern, and described base material and master mold surface are close to,
(3) irradiate photosensitive curing compounds with the light with setting wavelength and make it curing molding;
(4) photosensitive curing compounds of curing molding and base material are separated with master mold, obtain target product.
2. the method for making of nanoscale soft mold according to claim 1, is characterized in that, in described pattern, the size of each recessed unit and/or protrusion element is between 100-1000 nanometer, its depth-to-width ratio < 2.
3. the method for making of nanoscale soft mold according to claim 1, is characterized in that, described base material thickness is between 100-200 micron, and its surface programming has the structure for increasing photosensitive curing compounds and base material then ability.
4. the method for making of nanoscale soft mold according to claim 1, is characterized in that, described photosensitive curing compounds comprises the ultraviolet photosensitive curing compounds of photocuring energy < 500 MJs.
5. the producing device of-kind of nanoscale soft mold, it is characterized in that, it comprises:
Feeding device, for providing photosensitive curing compounds, and is applied to surface and has on the master mold of the recessed and/or convex pattern of setting by photosensitive curing compounds;
Rolling mechanism, for the photosensitive curing compounds be applied on master mold extruding is shakeout and is inserted in described pattern, and base material and master mold are closely developed, described rolling mechanism comprises the three groups of soft vapour-pressure type pinch rollers set gradually by the processing procedure of described nanoscale soft mold, the skin hardness of these three groups soft vapour-pressure type pinch rollers sequentially increases progressively in the scope of 40-80 shore hardness A, and described rolling mechanism comprises:
First group of pinch roller, for the photosensitive curing compounds being applied to master mold surface is shakeout,
Second group of pinch roller, for photosensitive curing compounds being inserted in described pattern,
3rd group of pinch roller, for adjusting the thickness of photosensitive curing compounds, and eliminates the bubble that may occur in photosensitive curing compounds,
Wherein, first group of pinch roller sequentially increases progressively in the scope of 4-9 kilogram to the pressure of the 3rd group of pinch roller;
Mould emptier, for the photosensitive curing compounds of curing molding and base material are separated with master mold, and,
Light source, irradiates photosensitive curing compounds for providing the light of setting wavelength and makes it curing molding.
6. the producing device of nanoscale soft mold according to claim 5, is characterized in that, described mould emptier comprises assisted demoulding roller, and described assisted demoulding roller is metal material, and diameter is at more than 15cm.
7. the producing device of nanoscale soft mold according to claim 5, is characterized in that, described light source comprises UV light source module, and described UV light source module comprises:
LED type UV light source, for irradiating the photosensitive curing compounds be filled in described pattern, and at least makes described photosensitive curing compounds top layer solidify;
And face type mercury lamp UV light source, for irradiating isolated from master mold, the photosensitive curing compounds be connected on base material, and makes it to harden completely.
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| CN201210387170.0A CN103135338B (en) | 2012-10-12 | 2012-10-12 | Nanoscale soft mold manufacturing method and device |
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| CN103400534B (en) * | 2013-08-16 | 2016-01-20 | 青岛博纳光电装备有限公司 | A kind of roller die for contour roll forming nano impression |
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| JP4317375B2 (en) * | 2003-03-20 | 2009-08-19 | 株式会社日立製作所 | Nanoprint apparatus and fine structure transfer method |
| JP4789039B2 (en) * | 2005-06-10 | 2011-10-05 | 独立行政法人産業技術総合研究所 | Nanoimprint equipment |
| KR101137845B1 (en) * | 2005-06-24 | 2012-04-20 | 엘지디스플레이 주식회사 | method for fabricating soft mold |
| US20100052216A1 (en) * | 2008-08-29 | 2010-03-04 | Yong Hyup Kim | Nano imprint lithography using an elastic roller |
| KR20100068830A (en) * | 2008-12-15 | 2010-06-24 | 삼성전자주식회사 | Imprint mold, imprint apparatus and method of manucacturing pattern |
| RU2471626C2 (en) * | 2008-12-17 | 2013-01-10 | Шарп Кабусики Кайся | Roller imprinter and method of making imprint-sheet |
| JP5843784B2 (en) * | 2009-12-22 | 2016-01-13 | スリーエム イノベイティブ プロパティズ カンパニー | Apparatus and method for microcontact printing using a pressure roller |
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