CN103128879A - LED (Light Emitting Diode) mould - Google Patents
LED (Light Emitting Diode) mould Download PDFInfo
- Publication number
- CN103128879A CN103128879A CN 201310077070 CN201310077070A CN103128879A CN 103128879 A CN103128879 A CN 103128879A CN 201310077070 CN201310077070 CN 201310077070 CN 201310077070 A CN201310077070 A CN 201310077070A CN 103128879 A CN103128879 A CN 103128879A
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- CN
- China
- Prior art keywords
- guide
- mould
- clamping plate
- led
- guide column
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Mounting, Exchange, And Manufacturing Of Dies (AREA)
Abstract
The invention discloses an LED (Light Emitting Diode) mould comprising a mould base. The mould base comprises a clamping plate and a base plate; the mould base is further fixedly provided with a vertical guide column; the guide column penetrates through the clamping plate and the base plate; the clamping plate and the base plate are internally provided with cylindrical guide sleeves which are adapted to the guide column; and the inner side faces of the guide sleeves are provided with a plurality of rolling beads to form rolling bead type guide sleeves for reducing the friction force between the guide column and the guide sleeves. The mould base of the LED mould disclosed by the invention is provided with the rolling bead type guide sleeves to be matched with the guide column, so that the friction force between the guide column and the guide sleeves is reduced, the guide column and the guide sleeves are not easily damaged, and the matching precision between all plates of the mould base is improved.
Description
Technical field
The present invention relates to mould, be specifically related to a kind of LED die.
Background technology
In LED die design, do not take the measure that reduces friction in the guide pin bushing of existing die holder, cause the frictional force between guide pillars and bushes larger, the wearing and tearing between both are very fast, and damage frequency is higher.
Summary of the invention
Technical problem to be solved by this invention is the larger problem of frictional force between the guide pillars and bushes of LED die.
In order to solve the problems of the technologies described above, the technical solution adopted in the present invention is to provide a kind of LED die, comprise die holder, described die holder comprises clamping plate and backing plate, also be fixed with vertical guide pillar on described die holder, described guide pillar passes described clamping plate and backing plate, is provided with the cylindraceous guide pin bushing adaptive with described guide pillar in described clamping plate and backing plate, the medial surface of described guide pin bushing is provided with a plurality of balls, forms the ball-type guide pin bushing that reduces frictional force between described guide pillars and bushes.
Be provided with the ball-type guide pin bushing in the die holder of LED die provided by the invention and coordinate with guide pillar, the frictional force between reducing both be difficult for being worn bad, and the quality of fit between each plate of die holder has improved.
Description of drawings
Fig. 1 is the structural representation of the die holder of LED die provided by the invention.
The specific embodiment
Below in conjunction with accompanying drawing, the present invention is made detailed explanation.
As shown in Figure 1, LED die provided by the invention comprises die holder 1, die holder 1 comprises clamping plate 2 and backing plate 3, also be fixed with vertical guide pillar 4 on die holder 1, guide pillar 4 passes clamping plate 2 and backing plate 3, be provided with the cylindraceous guide pin bushing 5 adaptive with guide pillar 4 in clamping plate 2 and backing plate 3, the medial surface of guide pin bushing 5 is provided with a plurality of balls 6, forms the ball-type guide pin bushing that reduces frictional force between guide pillar 4 and guide pin bushing 5.
Be provided with the ball-type guide pin bushing in the die holder 1 of LED die provided by the invention and coordinate with guide pillar 4, the frictional force between reducing both is difficult for being worn bad, and the quality of fit between each plate of die holder improved, thereby the offset of product and precision have also been improved a lot.
The present invention is not limited to above-mentioned preferred forms, and anyone should learn the structural change of making under enlightenment of the present invention, and every have identical or close technical scheme with the present invention, within all falling into protection scope of the present invention.
Claims (1)
1.LED mould, comprise die holder, described die holder comprises clamping plate and backing plate, also be fixed with vertical guide pillar on described die holder, described guide pillar passes described clamping plate and backing plate, it is characterized in that, is provided with the cylindraceous guide pin bushing adaptive with described guide pillar in described clamping plate and backing plate, the medial surface of described guide pin bushing is provided with a plurality of balls, forms the ball-type guide pin bushing that reduces frictional force between described guide pillars and bushes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201310077070 CN103128879A (en) | 2013-03-12 | 2013-03-12 | LED (Light Emitting Diode) mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201310077070 CN103128879A (en) | 2013-03-12 | 2013-03-12 | LED (Light Emitting Diode) mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103128879A true CN103128879A (en) | 2013-06-05 |
Family
ID=48489649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201310077070 Pending CN103128879A (en) | 2013-03-12 | 2013-03-12 | LED (Light Emitting Diode) mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103128879A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106270113A (en) * | 2016-08-12 | 2017-01-04 | 宁波鸿达电机模具有限公司 | One is waved and is rushed blanking single-stroke mould |
-
2013
- 2013-03-12 CN CN 201310077070 patent/CN103128879A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106270113A (en) * | 2016-08-12 | 2017-01-04 | 宁波鸿达电机模具有限公司 | One is waved and is rushed blanking single-stroke mould |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130605 |