CN103118484A - Micro-strip interdigital circuit board for microwave non-thermal effect research - Google Patents
Micro-strip interdigital circuit board for microwave non-thermal effect research Download PDFInfo
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- CN103118484A CN103118484A CN2013100223024A CN201310022302A CN103118484A CN 103118484 A CN103118484 A CN 103118484A CN 2013100223024 A CN2013100223024 A CN 2013100223024A CN 201310022302 A CN201310022302 A CN 201310022302A CN 103118484 A CN103118484 A CN 103118484A
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Abstract
The invention provides a micro-strip interdigital circuit board for microwave non-thermal effect research, and belongs to the crossing field of microwave technology and chemical technology. The micro-strip interdigital circuit board is composed of a micro-strip interdigital circuit layer (I), a dielectric layer (II) and a metal ground layer (III), wherein the micro-strip interdigital circuit layer (I) is composed of a left feed part, a right feed part, a left impedance conversion branchknot, a right impedance conversion branchknot, left micro-strip fingers and right micro-strip fingers, the dielectric layer (II) is made of polytetrafluoroethylene, and a metal layer is coated on the metal ground layer (III). The micro-strip interdigital circuit board for the microwave non-thermal effect research is characterized in that two ends of the left feed part and the right feed part are similar in forms of wrists, the left impedance conversion branchknot and the right impedance conversion branchknot are similar in forms of palms, the middle portion of the left micro-strip fingers and the right micro-strip fingers are similar in forms of fingers, the left feed part is connected with the left impedance conversion branchknot, and the right feed part is connected with the right impedance conversion branchknot. The micro-strip fingers are the same in length and width, gaps between every two fingers are the same, gaps between left finger roots and right finger tips and gaps between left finger tips and right finger roots are the same, and corners of micro-strip transmission lines are all made into circular arc structures. The micro-strip interdigital circuit board for the microwave non-thermal effect research has the advantages of being simple and convenient to manufacture, low in cost, larger in generated electric field intensity compared with electric field intensity obtained through other methods in the same power.
Description
Technical field
The invention belongs to the crossing domain of microwave technology and chemical technology, be specifically related to a kind of microstrip interdigital circuit board for the research of microwave non-thermal effect.
Background technology
Microwave technology has become the subject of a comparative maturity through the development of decades, is used widely at aspects such as radar, communication, electronic countermeasures, industrial production and scientific researches.Successfully utilize first the SN of microwave 4-cyano group phenonium ion and cyanobenzene since Richard Gedye seminar in 1986 and Raymond J.Giguere
2Nucleophilic substitution makes reaction rate improve 1240 times, and productive rate also has raising beginning in various degree, microwave energy is demonstrating huge development prospect aspect chemistry and chemical industry, the more and more scholar's application of microwave aspect chemical synthesis, extraction and catalysis that begin one's study.Yet for microwave and matter interaction mechanism, why and how microwave accelerates the definite reason of chemical reaction course, and academia there is much controversy always.Some scientists think that when microwave action during in chemical reaction system, microwave heating effect is unique factor of accelerating chemical reaction.Although other scientists believe firmly that up to the present non-thermal effect is not explained fully, really there is the microwave non-thermal effect.Whether the microwave non-thermal effect exists never final conclusion of this problem on earth.The checking work of present most of non-thermal effect is that to test be the basis, and many scholars think that experimental verification is a kind of effective method that proof microwave non-thermal effect exists.And at present the general experimental provision that is used for non-thermal effect research is household microwave oven or is formed by the household microwave oven transformation, but due to the restriction of himself various condition, brings significant limitation for the research of microwave non-thermal effect.
Summary of the invention
The objective of the invention is not enough for prior art and a kind of microstrip interdigital circuit board for the research of microwave non-thermal effect that provide can be the research of microwave non-thermal effect great convenience is provided.
Purpose of the present invention is realized by following technical measures:
A kind of microstrip interdigital circuit board for microwave non-thermal effect research as Figure 1-3, it is the dielectric layer II that makes by the little microstrip interdigital circuit layer I that consists of with finger 1,1' in left and right feed section 3,3', left and right impedance transformation minor matters 2,2' and left and right with by polytetrafluoroethylene and the microstrip interdigital circuit board of metal stratum III by adopting printing technology to make of plating layer; Be provided with dielectric layer II between microstrip interdigital circuit layer I and metal stratum III, dielectric layer II is the lower polytetrafluoroethylene of dielectric coefficient or any in epoxy resin; III whole plating layers in metal stratum are for the feed section provides metal ground; The microstrip interdigital circuit board is characterised in that the structure of described microstrip interdigital circuit layer I is that left and right impedance transformation minor matters 2,2' and middle part by left and right feed section 3,3' and the likeness in form palm that is connected with this feed section of two ends likeness in form wrist is similar to the little band finger 1 in left and right, the 1' that finger intersects and consists of, all little band finger length are identical, width is identical, Interdigital Space is identical, the left and right refers to that root is identical with right left finger tip gap, and arc-shaped structure is all made by the corner of all microstrip transmission lines.
The present invention has following advantage:
1. the microstrip interdigital circuit board is two-dimension plane structure, is convenient to reaction system, measured matter or other auxiliary equipment directly placed on itly, simultaneously also is convenient to be connected with other microwave electron equipment.
2. the microstrip interdigital circuit board is when port microwave incident power less (100W), and the electric field strength of its generation is larger with the electric field strength that additive method under power obtains, and more is conducive to the experimental study of microwave non-thermal effect.
Description of drawings
Fig. 1 is the end view of microstrip interdigital board structure of circuit
Fig. 2 is microstrip interdigital circuit board microstrip interdigital circuit layer front view
Fig. 3 is embodiment of the present invention schematic diagram
Fig. 4 is the experimental results of microstrip interdigital circuit board scattering parameter
In figure: I-microstrip interdigital circuit layer;
The II-dielectric layer;
III-metal stratum;
1, the little band finger in 1'-left and right;
2,2'-left and right impedance transformation minor matters;
3,3'-left and right feed section;
A-left and right feed segment length;
B-left and right feed section width;
C-left and right impedance transformation minor matters length;
The left impedance transformation minor matters of d-width;
D '-right impedance transformation minor matters width;
E-left and right little band finger length;
F-left and right little band finger width;
G-left and right little band finger Interdigital Space;
About h-refers to root and right left finger tip gap;
Embodiment
The overall structure of microstrip interdigital circuit board as Figure 1-3, the microstrip interdigital circuit board is printed on a printed circuit board.The microstrip interdigital circuit layer I that this printed circuit board (PCB) is made of left and right feed section 3,3', left and right impedance transformation minor matters 2,2' and left and right interdigital unit 1,1' and the dielectric layer II that is made by polytetrafluoroethylene and the metal stratum III of plating layer consist of, the dielectric layer II of printed circuit board (PCB) is polytetrafluoroethylmaterial material, dielectric coefficient is 2.65 relatively, and thickness is 2mm.
As shown in Figure 3, the structural parameters of microstrip interdigital circuit layer I obtain through numerical simulation optimization, and each several part is of a size of:
The length of left and right feed section 3,3' is a=15mm, width is b=5.5mm, characteristic impedance is 50 ohm, the length of left and right impedance transformation minor matters 2,2' is c=2.75mm, width is respectively d=6mm and d'=7.2mm, the little number with finger 1,1' in left and right is respectively n=5 root and n '=6 piece, all little length with finger are e=30mm, width is f=0.4mm, Interdigital Space is g=0.3mm, the left and right refers to that root and right left finger tip gap are h=1mm, and arc-shaped structure is all made by the corner of all microstrip transmission lines.This microstrip interdigital circuit board can make microwave energy concentrate in Interdigital Space, forms intensive Electric Field Distribution, thereby improves electric field strength so that the experimental study of microwave non-thermal effect.
III whole plating layers in metal stratum are for the microstrip interdigital circuit provides metal ground.
According to the said structure parameter, processing and fabricating microstrip interdigital circuit board model and it has been carried out performance test.Test result sees for details shown in Figure 4, and when the microwave source operating frequency was 2.45GHz, scattering Can was Shuoed ∣ S
11∣=-11.3614dB ， ∣ S
21∣=-0.29605 dB, result shows that this microstrip interdigital circuit board has good transmission characteristic.
Calculate the microstrip interdigital circuit board when the port incident power is 100W through numerical simulation, the electric field strength maximum that produces in its Interdigital Space can reach 4.18 * 10
4V/m, the electric field strength that this electric field ratio adopts additive method to produce under same incident power is larger, is more suitable in the experimental study of microwave non-thermal effect.
Claims (2)
1. one kind is used for the microstrip interdigital circuit board that the microwave non-thermal effect is studied, it is by left and right feed section, the little microstrip interdigital circuit layer (I) that consists of with finger in left and right impedance transformation minor matters and left and right and the dielectric layer (II) of being made by polytetrafluoroethylene and the microstrip interdigital circuit board of metal stratum (III) by adopting printing technology to make that is coated with metal level, the structure that it is characterized in that microstrip interdigital circuit layer (I) is the left and right feed section (3 by two ends likeness in form wrist, 3 ') with the left and right impedance transformation minor matters (2 of the likeness in form palm that is connected with this feed section, 2 ') and the little band finger (1 in left and right that intersects of middle part likeness in form finger, 1 ') consist of, all little band finger length are identical, width is identical, Interdigital Space is identical, the left and right refers to that root is identical with right left finger tip gap, and arc-shaped structure is all made by the corner of all microstrip transmission lines.
2. microstrip interdigital circuit board as claimed in claim 1, the physical dimension that it is characterized in that described microstrip interdigital circuit layer (I) is: left and right feed section (3, 3') length is a=15mm, width is b=5.5mm, with left and right feed section (3, the left and right impedance transformation minor matters (2 that 3') are connected, 2') length is c=2.75mm, width is respectively d=6mm and d'=7.2mm, with left and right impedance transformation minor matters (2, the little band finger (1 in the left and right that 2') is connected, 1') number is respectively n=5 root and n '=6 piece, all little band finger length are e=30mm, width is f=0.4mm, Interdigital Space is g=0.3mm, the left and right refers to that root and right left finger tip gap are h=1mm, the thickness of dielectric layer (II) is 2mm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310022302.4A CN103118484B (en) | 2013-01-21 | 2013-01-21 | Micro-strip interdigital circuit board for microwave non-thermal effect research |
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| CN201310022302.4A CN103118484B (en) | 2013-01-21 | 2013-01-21 | Micro-strip interdigital circuit board for microwave non-thermal effect research |
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| CN103118484A true CN103118484A (en) | 2013-05-22 |
| CN103118484B CN103118484B (en) | 2015-05-20 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108169249A (en) * | 2017-12-21 | 2018-06-15 | 四川大学 | A kind of microwave interdigital structure non-destructive control probe |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1874056A (en) * | 2006-06-17 | 2006-12-06 | 中国科学技术大学 | Left hand microstrip transmission line, and time delay line structured based on the transmission line |
| CN101197460A (en) * | 2007-11-28 | 2008-06-11 | 中国科学技术大学 | Microwave phase shifter based on plane type left hand microstrip transmission line |
| US20090009193A1 (en) * | 2007-07-06 | 2009-01-08 | Chung Yuan Christian University | Moisture-Sensitive Element with an Interdigital Capacitor and Fabrication thereof |
| CN101345337A (en) * | 2007-07-11 | 2009-01-14 | 西北工业大学 | Novel X waveband double-frequency microstrip antenna |
| CN203104945U (en) * | 2013-01-21 | 2013-07-31 | 太原科技大学 | Microstrip interdigital circuit board used for microwave non-thermal effect research |
-
2013
- 2013-01-21 CN CN201310022302.4A patent/CN103118484B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1874056A (en) * | 2006-06-17 | 2006-12-06 | 中国科学技术大学 | Left hand microstrip transmission line, and time delay line structured based on the transmission line |
| US20090009193A1 (en) * | 2007-07-06 | 2009-01-08 | Chung Yuan Christian University | Moisture-Sensitive Element with an Interdigital Capacitor and Fabrication thereof |
| CN101345337A (en) * | 2007-07-11 | 2009-01-14 | 西北工业大学 | Novel X waveband double-frequency microstrip antenna |
| CN101197460A (en) * | 2007-11-28 | 2008-06-11 | 中国科学技术大学 | Microwave phase shifter based on plane type left hand microstrip transmission line |
| CN203104945U (en) * | 2013-01-21 | 2013-07-31 | 太原科技大学 | Microstrip interdigital circuit board used for microwave non-thermal effect research |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108169249A (en) * | 2017-12-21 | 2018-06-15 | 四川大学 | A kind of microwave interdigital structure non-destructive control probe |
| CN108169249B (en) * | 2017-12-21 | 2020-11-27 | 四川大学 | Microwave interdigital structure nondestructive test probe |
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| CN103118484B (en) | 2015-05-20 |
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