CN103096639B - The method of printing stencil and manufacture method and print solder paste - Google Patents
The method of printing stencil and manufacture method and print solder paste Download PDFInfo
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- CN103096639B CN103096639B CN201110341314.4A CN201110341314A CN103096639B CN 103096639 B CN103096639 B CN 103096639B CN 201110341314 A CN201110341314 A CN 201110341314A CN 103096639 B CN103096639 B CN 103096639B
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Abstract
Embodiments of the invention disclose a kind of method of printing stencil and manufacture method and print solder paste.The surface that the manufacture method of printing stencil is included in substrate forms free from being stained with solder mixture.Free from being stained with solder mixture comprises the chemical analysis such as polytetrafluoroethylene.Heat free from being stained with solder mixture and be not stained with solder layer to be formed.
Description
Technical field
The present invention relates to printing stencil and manufacture method thereof, particularly relate to the method using printing stencil print solder paste.
Background technology
Along with the development of electronic technology, the electronic device quantity that circuit board is assembled increases day by day, and for the ease of assembling and manufacture circuit board, industry adopts surface adhering technical (SurfaceMountTechnology mostly; SMT) electronic device (as integrated circuit (IC) chip) etc. is welded on circuit board.
Its flow process of SMT outlines as follows, is first carried out toasting and cleaning by PCB (printed circuit board (PCB)); Be delivered to printing machine and carry out paste solder printing operation; Inspection tin cream quality and printing process; Utilize part storage machine by part storage on tin cream; Reflow oven heating is adopted to print and put the PCB that part completes; Finally by finished product rewinding shipment.It can thus be appreciated that one of link that paste solder printing is for this reason important in technique, whether the quality of tin cream is enough to affect finished product conduction good, and whether easily causes line short etc.
But the printing stencil that general print solder paste uses can attach tin cream, in the process of continuous printing, necessary high-frequency ground wiped clean printing stencil, causes printed patterns quality too low to avoid attaching at the tin cream of printing stencil, and product yield is declined.And the step of clean printing stencil also can significantly expend extra time, cost.
Summary of the invention
The present invention has the method about printing stencil and manufacture method and print solder paste.Printing stencil has Non-Dewetting cream, uses printing stencil to reduce manufacturing cost, and enhances productivity and product yield.
According to an aspect of the present invention, a kind of manufacture method of printing stencil is provided.The surface that method is included in substrate forms free from being stained with solder mixture.Free from being stained with solder mixture comprises polytetrafluoroethylene.Heat free from being stained with solder mixture and be not stained with solder layer to be formed.
According to a further aspect in the invention, a kind of printing stencil is provided.The surface that the manufacture method of printing stencil is included in substrate forms free from being stained with solder mixture.Free from being stained with solder mixture comprises polytetrafluoroethylene.Heat free from being stained with solder mixture and be not stained with solder layer to be formed.
According to a further aspect in the invention, a kind of method of print solder paste is provided.Method comprises the surface above-mentioned printing stencil being positioned substrate.Insert tin cream by least one nib of printing stencil, make solder paste coating on the surface of substrate.
Preferred embodiment cited below particularly, and coordinate accompanying drawing, be described in detail below.
Accompanying drawing explanation
Fig. 1 is the manufacturing process of printing stencil in embodiment.
Fig. 2 is the vertical view of printing stencil.
Description of reference numerals
1,2,3,4,5: step
10: substrate
12: free from being stained with solder mixture
Embodiment
In embodiment, the substrate surface of printing stencil is not to be stained with solder layer process.Therefore in the process of print solder paste, the degree that tin cream sticks on printing stencil is low, ensure that printed pattern is clear not easily fuzzy, clean time, material (such as cleaning agent, cleansing tissue) use amount, manpower or mechanical action cost can be reduced, and significantly reduce manufacturing cost, and boost productivity and product yield.
Fig. 1 is the manufacturing process of printing stencil in embodiment.The manufacture method of printing stencil can comprise preparation substrate (step 1), and substrate can be web plate, and material comprises metal or pottery, the alloys such as such as copper, zinc, nickel, chromium, aluminium, carbon steel or stainless copper.
Then, by the surface roughening (step 2) of substrate.In embodiment, substrate is not sealed with corrosion-resistant gummed paper for the part of roughening, then, substrate is placed in the electrolytic solution, use electrolysis, utilize the surface roughening that substrate is exposed by pulse current.Carry out the about 1 hour time of electrolysis.The degree of substrate surface roughening can be nano-scale.After having carried out roughening step, corrosion-resistant gummed paper to be removed, then dry up substrate with clean water.
Then, substrate sprays free from being stained with solder mixture (step 3).For example, Fig. 2 is the vertical view of printing stencil, and it shows in substrate 10 and is coated with the free from being stained with solder mixture 12 of one deck.In embodiment, by substrate not for being sealed with gummed paper by the part sprayed, control the region that free from being stained with solder mixture is sprayed into expection thus.The method of spraying can be spray painting method.
Free from being stained with solder mixture can comprise polytetrafluoroethylene (PTFE), polyimides (PI) (being solvent-borne type in embodiment), epoxide modified bimaleimide resin (bismaleimide; BMI) (being solvent-borne type in embodiment), 4,4-diamino-diphenyl sulfone (diaminodiphenylsulfone; DDS), auxiliary agent or above-mentioned combination, it, according to after the mixing of suitable ratio, obtains with stirring at low speed for about 6 hours.Polytetrafluoroethylene causes the main component of not being stained with solder characteristic, and Main Function remains for preventing tin cream, and ensure that nib is unimpeded, printing stencil (such as PCB) plate face is cleaned, and increases service time.Polyimides (PI) solvent-borne type, its toughness, high temperature resistant, rub resistance, creep resistant can be increased after free from being stained with solder mixture solidified formation is not stained with solder layer, make not to be stained with solder layer can and substrate keep identical elasticity, not easily chapping comes off, increases ageing resistance.Epoxide modified bimaleimide resin (BMI) (being solvent-borne type in embodiment) is made priming paint and is used, there is bonding force of well adhering, high temperature resistant, antifatigue, what obtain after making solidification is not stained with solder layer well together with substrate gluing, and helps high temperature resistant anti-aging.4,4-diamino-diphenyl sulfone (DDS), makes high temperature resistant curing agent and uses, the heat-resistant, wear-resistant not being stained with solder layer obtained after increasing solidification, it helps liquid free from being stained with solder mixture to become solid-state not to be stained with solder layer, and increases its high temperature resistant rub resistance.Auxiliary agent comprises coupling agent, dispersant, promoter, solvent etc., and can improve adherence, uniformity, the resistance to wear of not being stained with solder layer, the performance of solder layer each side is not stained with in reinforcement, the compatibility between auxiliary each material.
Then carry out heating steps (step 4), dry free from being stained with solder mixture is not stained with solder layer to be formed, and forms printing stencil thus.In embodiment, the method for heating is the substrate by being coated with free from being stained with solder mixture, is placed on the oven for baking more than 40 minutes of more than 380 DEG C.
Due to before the free from being stained with solder mixture of spraying; the surface roughening of substrate; when therefore forming the substrate surface of nano-scale structure by micronize; its micronize molecule; strengthen itself and the contact area of not being stained with solder layer; allow in conjunction with effect more tight, therefore effectively can improve the intensity of printing stencil.
Then solder layer (step 5) is not stained with in planarization or polishing.In embodiment, be utilize 600 order belt-sanding printing stencils be not stained with solder layer.Then repeat with fine and soft hairbrush the mesh sidewall of printing stencil of rubbing, with by burr removing.
Then grinding calibrator is utilized to measure the thickness of printing stencil.In embodiment, the thickness of the printing stencil completed is the thickness equaling in fact initial substrate.
In some embodiments, printing stencil is applied to print solder paste, such as SMT typography.So this disclosure is not limited to this, and in other embodiments, the concept of printing stencil also can be applicable to wave-soldering (wavesoldering) technique.For example, substrate is sprayed to the mixture of not weldbonding material, can be used for DIP carrier and solve easily dirt and connect tin problem etc.
Table 1 and table 2 list the result using the printing stencil of embodiment and comparative example to carry out print solder paste respectively.The printing stencil of comparative example does not use is not stained with solder layer process substrate.The die throat diameter of the printing stencil of embodiment and comparative example is all 0.45mm.Experimental technique uses printing stencil continuously to 200 plate base print solder paste, and measure the tin cream size of corresponding printing stencil 3 specific mesh 1,2,3 position on substrate.Relatively the percentage difference (diffusion ratio) of die throat diameter and tin cream size is understood tin cream and is attached situation at printing stencil.The value wherein spreading ratio is less, represents that the size of tin cream size is more close to die throat diameter, also represents that tin cream does not more attach on printing stencil.Relatively, when the value of diffusion ratio is larger, represent that the situation that tin cream attaches on printing stencil is more serious.
From the result of table 1 and table 2, compared to the printing stencil using comparative example, the degree that its tin cream of the printing stencil of embodiment attaches is than low, and the stay in grade of print solder paste.
Table 1 uses the result of the printing stencil print solder paste of embodiment
Table 2 uses the result of the printing stencil print solder paste of comparative example
Table 3 lists the result using the printing stencil of embodiment and comparative example to carry out print solder paste respectively.As can be known from the results of Table 3, no matter be use machine automatization wiping, or with wiping manually, compared to the printing stencil using comparative example, use the tin cream that the frequency wiping that the printing stencil of embodiment can be lower attaches, and the total time-consuming of wiping, average single wipe are consuming time low, significantly reduce the cleaning time of technique.
The result of the printing stencil print solder paste of table 3 embodiment and comparative example
Although the present invention discloses as above with preferred embodiment; so itself and be not used to limit the present invention; any persons skilled in the art; without departing from the spirit and scope of the present invention; when doing a little change and retouching, therefore protection scope of the present invention is when being as the criterion depending on the accompanying claim person of defining.
Claims (8)
1. a manufacture method for printing stencil, comprising:
On the surface of substrate, form free from being stained with solder mixture, this free from being stained with solder mixture comprises polytetrafluoroethylene;
Heat this free from being stained with solder mixture and be not stained with solder layer to be formed; And
Before this is not stained with solder layer in formation, use electrolysis by this surface roughening of this substrate,
Wherein, this free from being stained with solder mixture also comprises epoxide modified bimaleimide resin, 4,4-diamino-diphenyl sulfone, auxiliary agent or above-mentioned combination.
2. the manufacture method of printing stencil as claimed in claim 1, is also included in and is formed after this is not stained with solder layer, planarization or polishing this be not stained with solder layer.
3. the manufacture method of printing stencil as claimed in claim 1, wherein, uses pulse current in the process of this roughening.
4. a printing stencil, the wherein manufacture method of this printing stencil, comprising:
On the surface of substrate, form free from being stained with solder mixture, this free from being stained with solder mixture comprises polytetrafluoroethylene;
Heat this free from being stained with solder mixture and be not stained with solder layer to be formed; And
Before in formation, this is not stained with solder layer, use electrolysis by this surface roughening of this substrate, wherein this free from being stained with solder mixture also comprises polyimides, epoxide modified bimaleimide resin, 4,4-diamino-diphenyl sulfone, auxiliary agent or above-mentioned combination.
5. printing stencil as claimed in claim 4, wherein the manufacture method of this printing stencil is also included in and is formed after this is not stained with solder layer, planarization or polishing this be not stained with solder layer.
6. printing stencil as claimed in claim 4, uses pulse current in the process of wherein this roughening.
7. a method for print solder paste, comprising:
Printing stencil as claimed in claim 4 is positioned the surface of substrate; And
Insert tin cream by least one nib of this printing stencil, make this solder paste coating on the surface of this substrate.
8. the method for print solder paste as claimed in claim 7, wherein this substrate comprises circuit board.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110341314.4A CN103096639B (en) | 2011-11-02 | 2011-11-02 | The method of printing stencil and manufacture method and print solder paste |
| TW100145419A TWI547220B (en) | 2011-11-02 | 2011-12-08 | Print stencil and manufacturing method for the same and method for printing solder paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110341314.4A CN103096639B (en) | 2011-11-02 | 2011-11-02 | The method of printing stencil and manufacture method and print solder paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103096639A CN103096639A (en) | 2013-05-08 |
| CN103096639B true CN103096639B (en) | 2016-04-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110341314.4A Active CN103096639B (en) | 2011-11-02 | 2011-11-02 | The method of printing stencil and manufacture method and print solder paste |
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| CN (1) | CN103096639B (en) |
| TW (1) | TWI547220B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102773749A (en) * | 2012-08-28 | 2012-11-14 | 昆山北钜机械有限公司 | Chain type tool magazine |
| CN104999601A (en) * | 2015-06-17 | 2015-10-28 | 东莞市佳丹润滑油有限公司 | Mould release agent special for PCB and preparing method thereof |
| CN106505047B (en) * | 2015-09-07 | 2019-02-22 | 中芯国际集成电路制造（天津）有限公司 | Chip-packaging structure and preparation method thereof, electrostatic powder spraying device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10231698A1 (en) * | 2002-03-26 | 2003-10-23 | Fraunhofer Ges Forschung | Process for improving the transfer of additive material to support used in the production of printed circuit boards comprises using template having openings with coating for the structured transfer of the additive material to the support |
| CN101268724A (en) * | 2005-09-22 | 2008-09-17 | 西门子公司 | Printing template of an smt process and method of coating it |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8480772B2 (en) * | 2009-12-22 | 2013-07-09 | 3M Innovative Properties Company | Transfer assisted screen printing method of making shaped abrasive particles and the resulting shaped abrasive particles |
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2011
- 2011-11-02 CN CN201110341314.4A patent/CN103096639B/en active Active
- 2011-12-08 TW TW100145419A patent/TWI547220B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10231698A1 (en) * | 2002-03-26 | 2003-10-23 | Fraunhofer Ges Forschung | Process for improving the transfer of additive material to support used in the production of printed circuit boards comprises using template having openings with coating for the structured transfer of the additive material to the support |
| CN101268724A (en) * | 2005-09-22 | 2008-09-17 | 西门子公司 | Printing template of an smt process and method of coating it |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI547220B (en) | 2016-08-21 |
| TW201320844A (en) | 2013-05-16 |
| CN103096639A (en) | 2013-05-08 |
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