CN104999601A - Mould release agent special for PCB and preparing method thereof - Google Patents
Mould release agent special for PCB and preparing method thereof Download PDFInfo
- Publication number
- CN104999601A CN104999601A CN201510336183.9A CN201510336183A CN104999601A CN 104999601 A CN104999601 A CN 104999601A CN 201510336183 A CN201510336183 A CN 201510336183A CN 104999601 A CN104999601 A CN 104999601A
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- release agent
- added
- mould release
- modified siloxane
- siloxane resin
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Abstract
The invention discloses a mould release agent special for a PCB and a preparing method thereof. The mould release agent special for the PCB is prepared from, by weight, 1-5% of modified siloxane resin, 1-5% of polytetrafluoroethylene micro-powder, 90-97% of solvent oil number 6 and 0.1-0.3% of oxidized polyethlene wax. In the preparing process, the method comprises the following steps that 1, the modified siloxane resin and the polytetrafluoroethylene micro-powder are added into a container, and then a high-speed dispersion machine is used for blending the mixture uniformly; 2, the solvent oil number 6 and the oxidized polyethlene wax are added, and the dispersion machine continues stirring the mixture for 30-60 minutes for reservation; 3, the mixed material and a propellant are filled and formed through an automatic filling machine, and put in storage after the assay is approved. By spraying the mould release agent, resin adhesive flowing to a lining plate and the periphery of a small hole due to high temperature can be cleared away only by gently shaking the lining plate with hands, and therefore the production efficiency is greatly improved; in addition, damage to the stainless steel lining plate is avoided after the mould release agent is sprayed on the lining plate, adverse effects on the following continuous production is avoided, and the product yield is greatly increased.
Description
Technical field
The present invention relates to metal die releasing agent and preparation method thereof art, refer in particular to a kind of pcb board parting agent special and preparation method thereof, it is in multilayer circuit board pressing process.
Background technology
Multilayer circuit board need be placed on stainless steel liner plate be fixed by four of liner plate surrounding aperture metal bolt when making, then takes in hot press and carry out high-temperature baking, compacting final molding.At present, a problem all can be encountered when producing pcb board by factory, that is exactly that pcb board is when hot press high-temperature baking, Resin adhesive (phenolic resins, epoxy resin, mylar etc.) at high temperature can be softened and flow on liner plate and four apertures, and when causing formed product, separation difficulty, latch and aperture stick together.Artificial scraper and file can only be utilized to be disposed by the resin of liner plate and aperture, in scale removal process, manual labor's intensity is large, efficiency is low, also can scratch stainless steel liner plate, because liner plate reusablely will certainly bring adverse influence to ensuing production, cause product yield to decline.Pcb board production industry all urgently wish to find a kind of not only can quick separating product simultaneously but also do not damage stainless steel liner plate and then can greatly enhance productivity and the method for product yield.
Summary of the invention
In view of this, the present invention is directed to the disappearance of prior art existence, its main purpose is to provide a kind of pcb board parting agent special and preparation method thereof, and it effectively can solve separation difficulty when existing Resin adhesive causes formed product and the low problem of product yield.
For achieving the above object, the present invention adopts following technical scheme:
A kind of pcb board parting agent special, is made up of the raw material of following weight portion: modified siloxane resin 1% ~ 5%, ptfe micropowder 1% ~ 5%, No. 6 solvent naphthas 90% ~ 97% and OPE 0.1% ~ 0.3%.
A preparation method for pcb board parting agent special, includes following steps:
(1) modified siloxane resin and ptfe micropowder are added in container, be then in harmonious proportion evenly with high speed dispersor;
(2) No. 6 solvent naphthas and OPE continuation stirring 30 ~ 60min is added, for subsequent use;
(3) by the above-mentioned material that mixes up and propellant by automatic filling machine filling formation, put in storage after the assay was approved.
The present invention compared with prior art has obvious advantage and beneficial effect, specifically, as shown from the above technical solution:
The present invention has selected modified siloxane resin, has good film forming and adsorptivity, and low price, ample supply and prompt delivery.In addition, ptfe micropowder is that in solid material, surface tension is minimum, can play good demoulding effect.The present invention is because being diffused into substrate surface uniformly in use containing 6# solvent naphtha and levelling agent OPE, the uniform film of one deck is formed around liner plate and hole, thus play and avoid Resin adhesive to contact with the direct of metal, reach the object of the demoulding.When pcb board product is compressing from hot press, after spraying the present invention, as long as the Resin adhesive have gentle hands light one flow to around liner plate and aperture because of high temperature is trembled and can be disposed, improve production efficiency greatly, in addition due to stainless steel liner plate can not be damaged after spraying the present invention, can not bring harmful effect to ensuing continuous seepage, product yield is also greatly improved.
Detailed description of the invention
The present invention discloses a kind of pcb board parting agent special, is made up of the raw material of following weight portion: modified siloxane resin 1% ~ 5%, ptfe micropowder 1% ~ 5%, No. 6 solvent naphthas 90% ~ 97% and OPE 0.1% ~ 0.3%.
During preparation, include following steps:
(1) modified siloxane resin and ptfe micropowder are added in container, be then in harmonious proportion evenly with high speed dispersor;
(2) No. 6 solvent naphthas and OPE continuation stirring 30 ~ 60min is added, for subsequent use;
(3) by the above-mentioned material that mixes up and propellant by automatic filling machine filling formation, put in storage after the assay was approved.
The present invention will be described to use specific embodiment below.
Embodiment 1
A kind of pcb board parting agent special, is made up of the raw material of following weight portion: modified siloxane resin 2%, ptfe micropowder 1%, No. 6 solvent naphthas 96.8% and OPE 0.2%.
During preparation, include following steps:
(1) modified siloxane resin and ptfe micropowder are added in container, be then in harmonious proportion evenly with high speed dispersor;
(2) No. 6 solvent naphthas and OPE continuation stirring 30min is added, for subsequent use;
(3) by the above-mentioned material that mixes up and propellant by automatic filling machine filling formation, put in storage after the assay was approved.Specifically, in volume 500ml aerosol can, load embodiment of the present invention 200g, reinstall propellant 150g, aerosol can lid is carried out encapsulating.
Embodiment 2
A kind of pcb board parting agent special, is made up of the raw material of following weight portion: modified siloxane resin 1%, ptfe micropowder 2%, No. 6 solvent naphthas 96.75% and OPE 0.25%.
During preparation, include following steps:
(1) modified siloxane resin and ptfe micropowder are added in container, be then in harmonious proportion evenly with high speed dispersor;
(2) No. 6 solvent naphthas and OPE continuation stirring 60min is added, for subsequent use;
(3) by the above-mentioned material that mixes up and propellant by automatic filling machine filling formation, put in storage after the assay was approved.Specifically, in volume 500ml aerosol can, load embodiment of the present invention 210g, reinstall propellant 145g, aerosol can lid is carried out encapsulating.
Embodiment 3
A kind of pcb board parting agent special, is made up of the raw material of following weight portion: modified siloxane resin 5%, ptfe micropowder 1%, No. 6 solvent naphthas 93.9% and OPE 0.1%.
During preparation, include following steps:
(1) modified siloxane resin and ptfe micropowder are added in container, be then in harmonious proportion evenly with high speed dispersor;
(2) No. 6 solvent naphthas and OPE continuation stirring 42min is added, for subsequent use;
(3) by the above-mentioned material that mixes up and propellant by automatic filling machine filling formation, put in storage after the assay was approved.Specifically, in volume 500ml aerosol can, load embodiment of the present invention 190g, reinstall propellant 155g, aerosol can lid is carried out encapsulating.
Embodiment 4
A kind of pcb board parting agent special, is made up of the raw material of following weight portion: modified siloxane resin 4.8%, ptfe micropowder 5%, No. 6 solvent naphthas 90% and OPE 0.2%.
During preparation, include following steps:
(1) modified siloxane resin and ptfe micropowder are added in container, be then in harmonious proportion evenly with high speed dispersor;
(2) No. 6 solvent naphthas and OPE continuation stirring 50min is added, for subsequent use;
(3) by the above-mentioned material that mixes up and propellant by automatic filling machine filling formation, put in storage after the assay was approved.Specifically, in volume 500ml aerosol can, load embodiment of the present invention 205g, reinstall propellant 145g, aerosol can lid is carried out encapsulating.
Embodiment 5
A kind of pcb board parting agent special, is made up of the raw material of following weight portion: modified siloxane resin 4%, ptfe micropowder 1.7%, No. 6 solvent naphthas 94% and OPE 0.3%.
During preparation, include following steps:
(1) modified siloxane resin and ptfe micropowder are added in container, be then in harmonious proportion evenly with high speed dispersor;
(2) No. 6 solvent naphthas and OPE continuation stirring 45min is added, for subsequent use;
(3) by the above-mentioned material that mixes up and propellant by automatic filling machine filling formation, put in storage after the assay was approved.Specifically, in volume 500ml aerosol can, load embodiment of the present invention 195g, reinstall propellant 148g, aerosol can lid is carried out encapsulating.
Embodiment 6
A kind of pcb board parting agent special, is made up of the raw material of following weight portion: modified siloxane resin 3%, ptfe micropowder 4.9%, No. 6 solvent naphthas 92% and OPE 0.1%.
During preparation, include following steps:
(1) modified siloxane resin and ptfe micropowder are added in container, be then in harmonious proportion evenly with high speed dispersor;
(2) No. 6 solvent naphthas and OPE continuation stirring 35min is added, for subsequent use;
(3) by the above-mentioned material that mixes up and propellant by automatic filling machine filling formation, put in storage after the assay was approved.Specifically, in volume 500ml aerosol can, load embodiment of the present invention 200g, reinstall propellant 145g, aerosol can lid is carried out encapsulating.
Embodiment 7
A kind of pcb board parting agent special, is made up of the raw material of following weight portion: modified siloxane resin 1%, ptfe micropowder 1.85%, No. 6 solvent naphthas 97% and OPE 0.15%.
During preparation, include following steps:
(1) modified siloxane resin and ptfe micropowder are added in container, be then in harmonious proportion evenly with high speed dispersor;
(2) No. 6 solvent naphthas and OPE continuation stirring 55min is added, for subsequent use;
(3) by the above-mentioned material that mixes up and propellant by automatic filling machine filling formation, put in storage after the assay was approved.Specifically, in volume 500ml aerosol can, load embodiment of the present invention 195g, reinstall propellant 153g, aerosol can lid is carried out encapsulating.
Embodiment 8
A kind of pcb board parting agent special, is made up of the raw material of following weight portion: modified siloxane resin 4%, ptfe micropowder 4.8%, No. 6 solvent naphthas 91% and OPE 0.2%.
During preparation, include following steps:
(1) modified siloxane resin and ptfe micropowder are added in container, be then in harmonious proportion evenly with high speed dispersor;
(2) No. 6 solvent naphthas and OPE continuation stirring 58min is added, for subsequent use;
(3) by the above-mentioned material that mixes up and propellant by automatic filling machine filling formation, put in storage after the assay was approved.Specifically, in volume 500ml aerosol can, load embodiment of the present invention 190g, reinstall propellant 145g, aerosol can lid is carried out encapsulating.
By above-mentioned obtained product by finding after the practical application of pcb board manufacturer:
A, present invention saves a large amount of labour, reduce labor cost; Be pressed into last Scavenger resin adhesive from assembling multilayer circuit board to hot press high-temperature baking with last bar production line and altogether want 3-4 people.1-2 people is only needed, about supposing a medium-sized producer have five production lines that just can saving 10 people, if the present invention is generalized to whole pcb board production industry will save immeasurable labour after utilizing the present invention.
B, the present invention substantially increase production efficiency; Factory finds after using, and after using the present invention, production efficiency improves 1 times fully than in the past.
C, the present invention have increased substantially product yield.Practice is the sole criterion for testing truth, and after using the present invention, product yield rises to 98% from 80%, and product yield has increased significantly.
The above, it is only preferred embodiment of the present invention, not technical scope of the present invention is imposed any restrictions, thus every above embodiment is done according to technical spirit of the present invention any trickle amendment, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (2)
1. a pcb board parting agent special, is characterized in that: be made up of the raw material of following weight portion: modified siloxane resin 1% ~ 5%, ptfe micropowder 1% ~ 5%, No. 6 solvent naphthas 90% ~ 97% and OPE 0.1% ~ 0.3%.
2. a preparation method for pcb board parting agent special, is characterized in that: include following steps:
(1) modified siloxane resin and ptfe micropowder are added in container, be then in harmonious proportion evenly with high speed dispersor;
(2) No. 6 solvent naphthas and OPE continuation stirring 30 ~ 60min is added, for subsequent use;
(3) by the above-mentioned material that mixes up and propellant by automatic filling machine filling formation, put in storage after the assay was approved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510336183.9A CN104999601A (en) | 2015-06-17 | 2015-06-17 | Mould release agent special for PCB and preparing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510336183.9A CN104999601A (en) | 2015-06-17 | 2015-06-17 | Mould release agent special for PCB and preparing method thereof |
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| Publication Number | Publication Date |
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| CN104999601A true CN104999601A (en) | 2015-10-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510336183.9A Pending CN104999601A (en) | 2015-06-17 | 2015-06-17 | Mould release agent special for PCB and preparing method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106346653A (en) * | 2016-09-07 | 2017-01-25 | 广东工业大学 | Solvent type wax release agent and preparation method thereof |
| CN111627698A (en) * | 2020-06-08 | 2020-09-04 | 江苏国瓷泓源光电科技有限公司 | Nickel inner electrode slurry for MLCC |
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| US4897170A (en) * | 1986-04-07 | 1990-01-30 | Borden, Inc. | Manufacture of a Soderberg electrode incorporating a high carbon-contributing phenolic sacrificial binder |
| JP2000313021A (en) * | 1999-04-28 | 2000-11-14 | Achilles Corp | Compression molded member |
| CN101205439A (en) * | 2006-12-22 | 2008-06-25 | 中国科学院兰州化学物理研究所 | Super-hydrophobic self-cleaning paint |
| CN101323724A (en) * | 2007-06-13 | 2008-12-17 | 慧智科技（中国）有限公司 | Heat resisting ink composition, preparation and use thereof |
| CN101643622A (en) * | 2008-08-08 | 2010-02-10 | 中国科学院兰州化学物理研究所 | Furfuryl-alcohol-resin-based super hydrophobic coating |
| JP2011252041A (en) * | 2010-05-31 | 2011-12-15 | Kyocera Chemical Corp | Method for producing epoxy resin molding material for sealing semiconductor, and resin-sealed semiconductor device |
| CN102585513A (en) * | 2011-12-31 | 2012-07-18 | 全超 | Silicone rubber insulation material applied to high voltage cable accessories in European series and preparation method for material |
| CN103096639A (en) * | 2011-11-02 | 2013-05-08 | 恩斯迈电子(深圳)有限公司 | Printing stencil and manufacturing method of printing stencil and method for printing solder paste |
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2015
- 2015-06-17 CN CN201510336183.9A patent/CN104999601A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4897170A (en) * | 1986-04-07 | 1990-01-30 | Borden, Inc. | Manufacture of a Soderberg electrode incorporating a high carbon-contributing phenolic sacrificial binder |
| JP2000313021A (en) * | 1999-04-28 | 2000-11-14 | Achilles Corp | Compression molded member |
| CN101205439A (en) * | 2006-12-22 | 2008-06-25 | 中国科学院兰州化学物理研究所 | Super-hydrophobic self-cleaning paint |
| CN101323724A (en) * | 2007-06-13 | 2008-12-17 | 慧智科技（中国）有限公司 | Heat resisting ink composition, preparation and use thereof |
| CN101643622A (en) * | 2008-08-08 | 2010-02-10 | 中国科学院兰州化学物理研究所 | Furfuryl-alcohol-resin-based super hydrophobic coating |
| JP2011252041A (en) * | 2010-05-31 | 2011-12-15 | Kyocera Chemical Corp | Method for producing epoxy resin molding material for sealing semiconductor, and resin-sealed semiconductor device |
| CN103096639A (en) * | 2011-11-02 | 2013-05-08 | 恩斯迈电子(深圳)有限公司 | Printing stencil and manufacturing method of printing stencil and method for printing solder paste |
| CN102585513A (en) * | 2011-12-31 | 2012-07-18 | 全超 | Silicone rubber insulation material applied to high voltage cable accessories in European series and preparation method for material |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106346653A (en) * | 2016-09-07 | 2017-01-25 | 广东工业大学 | Solvent type wax release agent and preparation method thereof |
| CN111627698A (en) * | 2020-06-08 | 2020-09-04 | 江苏国瓷泓源光电科技有限公司 | Nickel inner electrode slurry for MLCC |
| CN111627698B (en) * | 2020-06-08 | 2022-05-17 | 江苏国瓷泓源光电科技有限公司 | Nickel inner electrode slurry for MLCC |
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Application publication date: 20151028 |
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