CN103094172A - Semiconductor and high-temperature-resisting antiskid clamp in microelectronic industry - Google Patents
Semiconductor and high-temperature-resisting antiskid clamp in microelectronic industry Download PDFInfo
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- CN103094172A CN103094172A CN2012105593786A CN201210559378A CN103094172A CN 103094172 A CN103094172 A CN 103094172A CN 2012105593786 A CN2012105593786 A CN 2012105593786A CN 201210559378 A CN201210559378 A CN 201210559378A CN 103094172 A CN103094172 A CN 103094172A
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Abstract
The invention discloses a semiconductor and a high-temperature-resisting antiskid clamp in microelectronic industry. Clamp heads and clamp arms are installed in a combined mode. When the clamp is used, the clamp arms are stressed, a to-be-clamped wafer is clamped by clamp grooves, and the wafer is effectively prevented from falling in a clamping process. The antiskid clamp comprises a first clamp arm and a second clamp arm, wherein a first clamp head is installed at the other end of the first clamp arm, a second clamp head is positioned at the other end of the second clamp arm, a clamp groove clamp portion is formed between the first clamp head and the second clamp head, and the first clamp arm and the second clamp arm can control the first clamp head and the second clamp head to act on a sample. The clamp arms and the clamp heads can be made of appropriate high-temperature-resisting materials according to using temperature so as to achieve the purpose of taking and placing the water at high temperature.
Description
Technical field
The present invention relates to a kind of high temperature anti-slip cramping apparatus, the fixture that particularly in a kind of semiconductor and microelectronic industry production procedure, holding chip uses, the fixture that the present invention is designed utilizes the ingehious design of chuck to prevent the landing of wafer in the gripping wafer process.
Background technology
The 21 century mankind have entered informationized society comprehensively, microelectric technique is still at high speed development, to constantly propose higher demand for development to microelectronics information technology and microelectronics ULSI basic technology, it is of paramount importance in several years 21 century generations and one of the most great-hearted high-tech area that microelectric technique will continue.
Fixture is the frequent and indispensable instrument that uses in microelectronics and semiconductor production process.
Working long hours makes operating personnel's rhembasmus unavoidably at uninteresting production line, or firmly lack of standardization during the gripping wafer, causes wafer landing, cracked etc. in the intermediate plate process of being everlasting, and can increase production cost, seriously affects manufacturing schedule.So seek a kind of have certain defencive function and the higher fixture of fail safe, with the loss that landing in minimizing wafer gripping process, cracked etc. is brought, be a very important job.
Present fixture has two kinds usually: a kind of is the tweezers class, and it comprises two long and narrow jig arm, and two jig arm one ends are fixed together, and other end space formation chuck makes chuck close up to come the gripping wafer by pushing the both sides jig arm; Another kind is: the vacuum hold mode, utilize negative pressure of vacuum, and the absorption wafer surface is with the wafer gripping.Its chuck of tweezers class fixture and jig arm are on same straight line, and wafer easily rocks in the clamping transfer process, well holding chip.If in the process that wafer shakes, increase the folder power of tweezers, might scratch the surface of wafer, destroy the wafer top layer, wafer surface rubberised layer or wafer surface easily produce pit, and be as easily impaired in the top layer gallium nitride of LED epitaxial wafer.The second vacuum suction mode, it is very high to sealing requirements, and sucker will be in case gas leakage will cause wafer to come off.And because the sucker material is rubber, serious deformation at high temperature occurs and easily gas leakage also pollute the environment.
Prior art problem defective: chuck is without antiskid function, and fail safe is relatively poor, easily landing; Be difficult to applicable high temperature.Therefore above-mentioned two kinds of tweezers all can not satisfied temperature up to the demand of using safely under the environment of 800 ℃.
Summary of the invention
Content of the present invention is for existing tweezers deficiency in use, it is the fixture of specific cards groove shape that a kind of chuck is provided, and the installation compound mode by chuck and jig arm forces in jig arm during use, block the clamping wafer with draw-in groove, effectively prevent dropping of wafer in clamping process.
For achieving the above object, the present invention adopts following scheme:
The high temperature resistant anti-slip cramping apparatus of a kind of semiconductor and microelectronic industry, include the first jig arm, the second jig arm, be interconnected to form link between the first jig arm, the second jig arm, be mutually angle between the first jig arm, the second jig arm, the first jig arm, the second jig arm all have certain elastic deformation performance; The free end of the first jig arm other end is installed to be connected the first chuck, the free end of the second jig arm other end is installed to be connected the second chuck, form the draw-in groove clamping part between the first chuck and the second chuck, act on sample by the motion that acts on the first jig arm, second jig arm control the first chuck, the second chuck;
The shape of the first chuck, the second chuck can be spade, an inboard inside acute angle, the acute angle to the inside of the inboard formation of the second jig arm and the second chuck of forming of the first chuck and the first jig arm;
Or the shape of first chuck, the second chuck can be for hook-shaped, the first chuck and the first jig arm be inboard forms inside 95～150 degree obtuse angles, be preferably: 100,130,135 degree, the second jig arm and the second chuck be inboard forms 95～150 degree obtuse angles to the inside, is preferably: 100,130,135 degree;
or the end of first jig arm and the second jig arm is the Eight characters and opens, the outside end of the first jig arm makes Eight characters outside formation spend the obtuse angle for one 100～170, be preferably: 110, 130, 155 degree, the outside end of the second jig arm makes Eight characters outside formation spend the obtuse angle for one 100～170, be preferably: 110, 130, 155 degree, the terminal part of the first jig arm and the second jig arm respectively with the first chuck be connected chuck and be connected, the first chuck, the second chuck end spacing is greater than wafer diameter, the first jig arm terminal part and the first chuck form interior to 50～130 hook-shaped draw-in grooves of spending bad angle, be preferably: 70, 90, 100 degree, the second jig arm terminal part and the second chuck form interior to 50～130 hook-shaped draw-in grooves of spending bad angle, be preferably: 70, 90, 100 degree, the first chuck, the draw-in groove of the second chuck is inside, utilize draw-in groove to block wafer, prevent that effectively wafer from coming off.
Therein in some embodiment, the mounting means between described the first jig arm end and the first chuck, the second jig arm end and the second chuck, comprise one-body molded, roll, screw combination, bonding, welding, clamp and other mounting meanss.
Therein in some embodiment, interconnect the position between described the first jig arm, the second jig arm, may be selected in jig arm middle part or jig arm head end, the first jig arm end is installed to be connected the first chuck, the second jig arm end is installed to be connected the second chuck, forms clamping part between the first chuck, the second chuck.
Therein in some embodiment, described the first jig arm, the second jig arm can demands different from use application of force situation and serviceability temperature etc. be selected: iron, stainless steel, carbon element, pottery, titanium, molybdenum, tungsten, aluminium alloy, plastics and other compound materials, connected mode between the first jig arm, the second jig arm, comprise one-body molded, roll, screw combination, bonding, welding, clamp and other connected modes.
In some embodiment, described the first chuck, the second resistant to elevated temperatures material of chuck can adopt: stainless steel, graphite, quartz, carbon element, pottery, titanium, molybdenum, tungsten, aluminium alloy and other resistant to elevated temperatures compound materials therein.
Therein in some embodiment, the shape of described the first jig arm, the second jig arm can be: flat, cylindrical and taper etc., can reach under above-mentioned gripping purpose prerequisite, the arm shape size of above-mentioned tweezers has following two kinds of situations: the first jig arm, the second jig arm size are identical; The first jig arm, the second jig arm size are all not identical.
In some embodiment, the top of described the first jig arm, the second jig arm links together by mutual spreading therein, and above-mentioned the first jig arm, the second jig arm have certain elastic deformation ability.
Therein in some embodiment, described the first chuck, the second chuck size are identical; Or first chuck, the second chuck vary in size.
Therein in some embodiment, the end of described the first jig arm and the second jig arm is the Eight characters and opens, the first jig arm end and the first chuck form interior hook-shaped draw-in groove to 90 ° of angles, the second jig arm end and the second chuck form interior hook-shaped draw-in groove to 90 ° of angles, and the draw-in groove of the first chuck, the second chuck is inside.
The present invention need not according to serviceability temperature, jig arm and chuck can select suitable exotic material to make, pick and place the purpose of wafer under the condition that reaches a high temperature, its chuck of fixture can adopt according to resistant to elevated temperatures characteristics: stainless steel, carbon element, pottery, titanium, molybdenum, tungsten, aluminium alloy and other resistant to elevated temperatures compound materials; Its jig arm can demands different from use application of force situation and serviceability temperature etc. be selected: iron, stainless steel, carbon element, pottery, titanium, molybdenum, tungsten, aluminium alloy and other compound materials reach resistant to elevated temperatures purpose.
Description of drawings
The schematic diagram of the embodiment of the present invention shown in Fig. 1 one.
The schematic diagram of the embodiment of the present invention two shown in Figure 2.
Description of reference numerals is as follows:
The first jig arm 1, the second jig arm 2, the first chuck 3, the second chuck 4, wafer 5.
Embodiment
Be concrete order ground, the function that further to understand feature of the present invention, technological means and reach, resolve the advantages and spirit of the present invention, by the present invention is further elaborated by the following examples.
The design sketch of the embodiment of the present invention is referring to accompanying drawing 1, accompanying drawing 2, fixture provided by the present invention utilizes the structure of the first chuck 3, the second chuck 4 and the first chuck 3, the second chuck 4 and tweezer arm that anti-skidding purpose in the special draw-in groove arrival wafer 5 gripping processes that form is installed, the first chuck 3, the second chuck 4 selection type selectings different from according to the demand in use procedure jig arm are installed and are connected, and control the motion complete operation of the first chuck 3, the second chuck 4 by effect the first jig arm 1, the second jig arm 2.Fixture of the present invention comprises the first chuck 3, the second chuck 4 and the first jig arm 1,2 two critical pieces of the second jig arm.The first chuck 3, second chuck 4 of fixture have anti-skidding function, and the shape of its first chuck 3, the second chuck 4 can be spade, hook-shaped etc.; The first jig arm 1, the second jig arm 2 are controlled the first chuck 3, the second chuck 4 acts on sample.
The first jig arm 1,2 of the second jig arm interconnect the position, may be selected in the first jig arm 1, the second jig arm 2 middle parts or jig arm head end; The first jig arm 1,2 angles of the second jig arm under the prerequisite that can implement the gripping function, can be selected arbitrarily.The first chuck 3, the second chuck 4 are arranged on the first jig arm 1, the second jig arm 2 ends, form clamping part.
Its first chuck 3 of fixture of the present invention, the second chuck 4 can adopt according to resistant to elevated temperatures characteristics: stainless steel, carbon element, pottery, titanium, molybdenum, tungsten, aluminium alloy and other resistant to elevated temperatures compound materials; Its first jig arm 1, the second jig arm 2 can demands different from use application of force situation and serviceability temperature etc. be selected: iron, stainless steel, carbon element, pottery, titanium, molybdenum, tungsten, aluminium alloy and other compound materials reach resistant to elevated temperatures purpose.
Fixture provided by the present invention utilizes the structure of the first chuck 3, the second chuck 4 and chuck and the first jig arm 1, the second jig arm 2 that the special draw-in groove that forms is installed to reach purpose anti-skidding in wafer 5 gripping processes, and the first chuck 3, the second chuck 4 carry out selection, type selecting and installation linking with the first jig arm 1, the second jig arm 2 according to the different demands in use procedure.In use, control the first chuck 3, the second chuck 4 by the first jig arm 1, the second jig arm 2 and complete gripping, film releasing operation.
The first chuck 3, the second chuck 4 have anti-skidding function, and the shape of its first chuck 3, the second chuck 4 can be spade, hook-shaped etc.Can realize under holding chip 5 and anti-skidding prerequisite, the shape of the first chuck 3, the second chuck 4, size, installation combination can choose at random.The first chuck 3, the second chuck 4 characteristics resistant to elevated temperatures according to chuck can adopt: stainless steel, graphite, quartz, pottery, titanium, molybdenum, tungsten, aluminium alloy and other resistant to elevated temperatures compound materials.Act on sample (wafer 5) by the first jig arm 1, the second jig arm 2 two control the first chucks 3, the second chucks 4, the shape of the first jig arm 1, the second jig arm 2 can be: flat, cylindrical and taper etc., can reach under above-mentioned gripping purpose prerequisite, the first jig arm 1 of tweezers, the second jig arm 2 shape sizes have following two kinds of situations: the first jig arm 1,2 two sizes of the second jig arm are identical, or the first jig arm 1,2 two sizes of the second jig arm are not identical.The first jig arm 1, the second jig arm 2 can demands different from use application of force situation and serviceability temperature etc. be selected: iron, stainless steel, titanium, molybdenum, tungsten, aluminium alloy, plastics and other compound materials.
The first jig arm 1,2 of the second jig arm interconnect the position, may be selected in jig arm middle part or jig arm top.The connected mode of the first jig arm 1, the second jig arm 2, comprise one-body molded, roll, screw combination, bonding, welding, clamp and other connected modes.Angle between the first jig arm 1, the second jig arm 2 is at energy
Satisfy folderGet under the prerequisite of function, can select arbitrarily.The first chuck 3, the second chuck 4 are arranged on the first jig arm 1, the second jig arm 2 ends, form the draw-in groove clamping part.The first chuck 3, the second chuck 4 and the first jig arm 1, the second jig arm 2 can be selected any setting angle according to demand, and that chuck and the mounting means of jig arm end comprise is one-body molded, roll, screw is combined, bonding, welding, clamp and other mounting meanss.
Embodiment one:
As shown in Figure 1, fixture that the present embodiment adopts has two symmetrical, that shape size is identical the first jig arm 1, the second jig arm 2, above-mentioned jig arm top connects by mutual spreading, above-mentioned the first jig arm 1, the second jig arm 2 all have certain elastic deformation performance, the first jig arm 1, the second jig arm 2 ends connect respectively the first chuck 3, the second chuck 4, the first chucks 3 and the second chuck 4 end-to-end distances from should be greater than wafer 5 diameters.The first chuck 3 and the first jig arm 1 form an acute angle, 4 one-tenth angles to the inside of the second jig arm 2 and the second chuck in like manner, inside acute angle of the first chuck 3 and the second chuck 4 formation, landing in the time of can preventing wafer 5 gripping like this.Force in the first jig arm 1, the second jig arm 2, the distance of dwindling between the first chuck 3, the second chuck 4 is blocked wafer 5, and by the angle between jig arm and chuck, wafer 5 is blocked, prevent that effectively wafer 5 from dropping, tweezers provided by the invention metal molybdenum material, can can use safely under up to the environment of 800 ℃ in temperature, reach high temperature resistant anti-skidding purpose.
Embodiment two:
A kind of fixture of the second execution mode design of the present invention's design, as shown in Figure 2, it comprises two symmetrical, that shape size is identical the first jig arm 1, the second jig arm 2, the top of above-mentioned the first jig arm 1, the second jig arm 2 links together by mutual spreading, above-mentioned the first jig arm 1, the second jig arm 2 have certain elastic deformation ability, the end of the first jig arm 1 and the second jig arm 2 is the Eight characters and opens, the end of the first jig arm 1 and the second jig arm 2 respectively with the first chuck 3 be connected chuck 4 and be connected, the first chuck 3, the second chuck 4 end spacings are greater than wafer 5 diameters.The present embodiment 2 is with the fixture difference of the first execution mode, and the first chuck 3 of the fixture that provides in the present invention, the second chuck 4 are the hook-shaped draw-in groove at 90 ° of angles.The draw-in groove of two chucks is inside, utilizes draw-in groove to block wafer 5, prevents that effectively wafer 5 from coming off.
The plain clamp of semiconductor and microelectronic industry use at present generally includes two kinds, a kind ofly be: comprise two long and narrow jig arm, jig arm one end at these two ends is fixed together, and other end space formation chuck and chuck make chuck close up to come gripping wafer 5 by pushing the both sides jig arm straight down; Another kind is: vacuum holds mode, by emptying, produces negative pressure,, with the contact wafer surface wafer is picked up with sucker.The first forceps jaws is for straight down, and fail safe is relatively poor, and easily landing has at present by put rubber on chuck to prevent slippage, but just can not at high temperature use.The second tweezers vacuum suction requires very high to cleanliness factor, sucker will be in case gas leakage will cause wafer to come off, and sucker is quality of rubber materials.Rubber pollutes the environment when at high temperature serious deformation occuring.Therefore above-mentioned two kinds of tweezers all can not satisfied temperature up to the demand of using safely in the hot environment of 800 ℃.
In enforcement, 4 two chucks of one chuck 3 of fixture, the second chuck can holding chips 5 and are had anti-skidding function, fixture can holding chip 5, can reach under gripping purpose prerequisite size to the first chuck 3, the second chuck 4 do not limit as: two chuck sizes are identical; Two chucks vary in size.The first chuck 3, the second chuck 4 have resistant to elevated temperatures characteristics, and its material can adopt: stainless steel, graphite, quartz, pottery, titanium, molybdenum, tungsten, aluminium alloy and other resistant to elevated temperatures compound materials.The first jig arm 1, the second jig arm 2 are controlled the first chucks 3, the second chuck 4 effect wafers 5, and the shape of its first jig arm 1, the second jig arm 2 can be: flat, cylindrical and taper etc.; Fixture is controlled chuck effect wafer 5 by jig arm, can realize under the above-mentioned purpose prerequisite, and tweezer arm shape size has following two kinds of situations: the first jig arm 1, the second jig arm 2 sizes are identical, and the first jig arm 1, the second jig arm 2 sizes are all not identical.
The first jig arm 1, second jig arm 2 control the first chucks 3, the second chuck 4 effect wafer 5, the first jig arm 1, the second jig arm 2 can demands different from use application of force situation and serviceability temperature etc. be selected: iron, stainless steel, titanium, molybdenum, tungsten, aluminium alloy, plastics and other compound materials.The first jig arm 1,2 of the second jig arm interconnect the place, may be selected in the first jig arm 1, the second jig arm 2 middle parts or jig arm head end.The first jig arm 1, the second jig arm 2 interconnect formula comprise one-body molded, roll, screw combination, bonding, welding, clamp and other connected modes
The first jig arm 1, the second jig arm 2 interconnect, and the first jig arm 1,2 of the second jig arm are mutually angle, and its angle each other can be completed selection arbitrarily under above-mentioned gripping purpose prerequisite.The first chuck 3, the second chuck 4 are arranged on the first jig arm 1, the second jig arm 2 ends, form the draw-in groove clamping part.The first chuck 3, the second chuck 4 and the first jig arm 1, the second jig arm 2 can be selected any setting angle according to demand.The mounting means of the first chuck 3, the second chuck 4 and the first jig arm 1, the second jig arm 2 ends, comprise one-body molded, roll, screw combination, bonding, welding, clamp and other mounting meanss.
Be understandable that, the present invention also has other execution modes, as the change of asymmetric, the angular dimension of jig arm, chuck structure, adopts respectively the combination of above-mentioned execution mode etc., and any design of being out of shape on basis of the present invention all belongs to protection range of the present invention.
The above embodiment has only expressed the specific embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.Should be pointed out that the technology for this area, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (9)
1. a semiconductor and the high temperature resistant anti-slip cramping apparatus of microelectronic industry, it is characterized in that, include: the first jig arm (1), the second jig arm (2), described the first jig arm (1), the second jig arm is interconnected to form link between (2), described the first jig arm (1), the second jig arm is mutually angle between (2), described the first jig arm (1), the second jig arm (2) has certain elastic deformation performance, the free end of described the first jig arm (1) other end is installed to be connected the first chuck (3), the free end of described the second jig arm (2) other end is installed to be connected the second chuck (4), form the draw-in groove clamping part between described the first chuck (3) and described the second chuck (4), by acting on described the first jig arm (1), the second jig arm (2) is controlled described the first chuck (3), the motion of the second chuck (4) acts on sample,
Described the first chuck (3), the second chuck (4) be shaped as spade, an inboard inside acute angle, the acute angle to the inside of described the second jig arm (2) and the inboard formation of described the second chuck (4) of forming of described the first chuck (3) and described the first jig arm (1);
Or described the first chuck (3), the second chuck (4) be shaped as hook-shaped, described the first chuck (3) and described the first jig arm (1) be inboard forms inside 95～150 degree obtuse angles, and described the second jig arm (2) and described the second chuck (4) be inboard forms 95～150 degree obtuse angles to the inside;
or the end of described the first jig arm (1) and described the second jig arm (2) is the Eight characters and opens, the outside end of described the first jig arm (1) makes Eight characters outside formation spend the obtuse angle for one 100～170, the outside end of described the second jig arm (2) makes Eight characters outside formation spend the obtuse angle for one 100～170, the terminal part of described the first jig arm (1) and described the second jig arm (2) respectively with described the first chuck (3) be connected the second chuck (4) and be connected, described the first chuck (3), the second chuck (4) end spacing is greater than wafer (5) diameter, described the first jig arm (1) terminal part and described the first chuck (3) form interior to 50～130 hook-shaped draw-in grooves of spending bad angle, described the second jig arm (2) terminal part and described the second chuck (4) form interior to 50～130 hook-shaped draw-in grooves of spending bad angle, described the first chuck (3), the draw-in groove of the second chuck (4) is inside, utilize draw-in groove to block wafer (5).
2. the high temperature resistant anti-slip cramping apparatus of semiconductor according to claim 1 and microelectronic industry, it is characterized in that, described the first jig arm (1) end is formed in one with the first chuck (3), the mounting means of described the second jig arm (2) end between the second chuck (4), rolls, screw is combined, bonding, welding, clamp.
3. the high temperature resistant anti-slip cramping apparatus of semiconductor according to claim 1 and microelectronic industry, it is characterized in that, interconnect the position between described the first jig arm (1), the second jig arm (2) at jig arm middle part or jig arm head end, described the first jig arm (1) end is installed to be connected described the first chuck (3), described the second jig arm (2) end is installed to be connected described the second chuck (4), and described the first chuck (3), the second chuck form clamping part between (4).
4. the high temperature resistant anti-slip cramping apparatus of semiconductor according to claim 1 and microelectronic industry, it is characterized in that, described the first jig arm (1), the second jig arm (2) material adopt: iron, stainless steel, carbon element, pottery, titanium, molybdenum, tungsten, aluminium alloy, plastics, compound material, between described the first jig arm (1), the second jig arm (2) connected mode be formed in one, roll, screw combination, bonding, welding, clamp.
5. the high temperature resistant anti-slip cramping apparatus of semiconductor according to claim 1 and microelectronic industry, it is characterized in that, described the first chuck (3), the resistant to elevated temperatures material of the second chuck (4) adopt: stainless steel, graphite, quartz, carbon element, pottery, titanium, molybdenum, tungsten, aluminium alloy and compound material.
6. the high temperature resistant anti-slip cramping apparatus of semiconductor according to claim 1 and microelectronic industry, it is characterized in that, being shaped as of described the first jig arm (1), the second jig arm (2): flat, cylindrical and taper, described the first jig arm (1), the second jig arm (2) size is identical, or described the first jig arm (1), the second jig arm (2) size are not identical.
7. the high temperature resistant anti-slip cramping apparatus of semiconductor according to claim 1 and microelectronic industry, is characterized in that, the top of described the first jig arm (1), the second jig arm (2) links together by mutual spreading.
8. the high temperature resistant anti-slip cramping apparatus of semiconductor according to claim 1 and microelectronic industry, is characterized in that, described the first chuck (3), the second chuck (4) size is identical, or described the first chuck (3), the second chuck (4) vary in size.
9. the high temperature resistant anti-slip cramping apparatus of semiconductor according to claim 1 and microelectronic industry, it is characterized in that, the end of described the first jig arm (1) and described the second jig arm (2) is the Eight characters and opens, described the first jig arm (1) end and described the first chuck (3) form interior hook-shaped draw-in groove to 90 ° of angles, in described the second jig arm (2) end and described the second chuck (4) form, to the hook-shaped draw-in groove at 90 ° of angles, the draw-in groove of described the first chuck (3), the second chuck (4) is inside.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210559378.6A CN103094172B (en) | 2012-12-21 | 2012-12-21 | Semiconductor and high-temperature-resantiskid antiskid clamp in microelectronic industry |
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| CN201210559378.6A CN103094172B (en) | 2012-12-21 | 2012-12-21 | Semiconductor and high-temperature-resantiskid antiskid clamp in microelectronic industry |
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| CN103094172B CN103094172B (en) | 2016-02-10 |
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| WO2015051637A1 (en) * | 2013-10-11 | 2015-04-16 | 京东方科技集团股份有限公司 | Mask plate transportation jig |
| CN106206388A (en) * | 2016-07-20 | 2016-12-07 | 无锡宏纳科技有限公司 | A kind of flukeless chip movable clamp |
| CN106252270A (en) * | 2016-07-20 | 2016-12-21 | 无锡宏纳科技有限公司 | A kind of can the fixture of automatic Picking chip |
| WO2018054382A1 (en) * | 2016-09-26 | 2018-03-29 | 清华大学 | Wafer clamping device |
| CN113745144A (en) * | 2021-11-03 | 2021-12-03 | 武汉飞恩微电子有限公司 | A pick up equipment that is used for chip processing to have an anti-drop function |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2015051637A1 (en) * | 2013-10-11 | 2015-04-16 | 京东方科技集团股份有限公司 | Mask plate transportation jig |
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| CN106206388A (en) * | 2016-07-20 | 2016-12-07 | 无锡宏纳科技有限公司 | A kind of flukeless chip movable clamp |
| CN106252270A (en) * | 2016-07-20 | 2016-12-21 | 无锡宏纳科技有限公司 | A kind of can the fixture of automatic Picking chip |
| CN106206388B (en) * | 2016-07-20 | 2018-08-28 | 无锡宏纳科技有限公司 | A kind of flukeless chip movable fixture |
| CN106252270B (en) * | 2016-07-20 | 2018-09-07 | 无锡宏纳科技有限公司 | It is a kind of can automatic Picking chip fixture |
| WO2018054382A1 (en) * | 2016-09-26 | 2018-03-29 | 清华大学 | Wafer clamping device |
| CN113745144A (en) * | 2021-11-03 | 2021-12-03 | 武汉飞恩微电子有限公司 | A pick up equipment that is used for chip processing to have an anti-drop function |
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| Publication number | Publication date |
|---|---|
| CN103094172B (en) | 2016-02-10 |
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