CN103092227A - Laser module temperature control testing device - Google Patents
Laser module temperature control testing device Download PDFInfo
- Publication number
- CN103092227A CN103092227A CN2012105767735A CN201210576773A CN103092227A CN 103092227 A CN103092227 A CN 103092227A CN 2012105767735 A CN2012105767735 A CN 2012105767735A CN 201210576773 A CN201210576773 A CN 201210576773A CN 103092227 A CN103092227 A CN 103092227A
- Authority
- CN
- China
- Prior art keywords
- temperature control
- laser module
- proving installation
- heating radiator
- module temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Semiconductor Lasers (AREA)
Abstract
The invention relates to the field of laser application, and particularly provides a laser module temperature control testing device with high accuracy. The testing device is capable of providing a wider temperature control range and improves temperature changing speed and testing efficiency by a clamping device being changed, heat dissipation parts being changed to reduce an influence of expansion with heat and contraction with cold on tests, a heat insulation piece being increased and heat dissipation structures being changed. The laser module temperature control testing device comprises a fixed platform. A clamping device, a refrigeration piece and a radiator are arranged above the fixed platform from bottom to up. The laser module temperature control testing device further comprises a temperature control device. The temperature control device comprises a single chip computer and temperature sensors. The temperature sensors are connected with the single chip computer and are controlled by the single chip computer concentratedly. The temperature sensors are fixed on the radiator and the clamping device, the single chip computer adjusts proportional integral derivative (PID) parameter values automatically according to feedback temperature differences of the temperature sensors. In testing, products just need to be inserted to be positioned well, and therefore the laser module temperature control testing device is easy to operate, is good in consistency, and improves testing efficiency largely.
Description
Technical field
The present invention relates to the laser application, specifically refer to a kind of high-precision laser module temperature control proving installation.
Background technology
Development along with present science and technology, the application of laser product is also growing, the demand of the indicator type laser module that volume is little, lightweight, reliability is high is increasing, some high-tech, high-precision instrument, equipment are also improving constantly the requirement of mode of laser organizing, stability, this just makes the laser module very high in the requirement of test accuracy and accuracy, and the measuring error of being introduced by test is very little.
Present common module testing method is: will be placed on the temperature-control structure of V-type groove on a platform, and module will be clamped on the V-type groove detect.This method of testing has a lot of defectives: the one, and this method of testing has been introduced many variablees, and platform, heating radiator, cooling piece, V-type groove all can cause very big deviation to the test result precision because of expanding with heat and contract with cold; Especially the test of laser spots drift; The 2nd, owing to not adopting heat insulating construction, radiating end thermal capacity is larger, has a strong impact on alternating temperature speed and temperature control scope; The 3rd, fixing means generally adopts screw directly to withstand, and screw and product contact portion are irregular, can cause product clip inclined to one side and unstable; The 4th, heating radiator generally adopts fan cooling or water circulation heat radiation, can produce vibration and static, affects measuring accuracy, causes damage of product.
Summary of the invention
For defects, the invention provides a kind of laser module temperature control proving installation, it is by changing gripping element, change radiator portion and reduce the impact of expanding with heat and contract with cold on test, and by increasing heat Insulation film, change radiator structure, make proving installation that wider temperature controlling range can be provided, improve alternating temperature speed and testing efficiency.
The technical scheme of laser module temperature control proving installation of the present invention is such: it comprises stationary platform, the stationary platform top arranges gripping element, cooling piece, heating radiator from the bottom to top, it also comprises temperature regulating device, temperature regulating device comprises single-chip microcomputer, temperature sensor, temperature sensor all is connected with single-chip microcomputer, by the single-chip microcomputer centralized control, temperature sensor is fixed on heating radiator and gripping element, single-chip microcomputer automatic pid regulator parameters value poor according to the feedback temperature of temperature sensor.
Between gripping element and stationary platform, heat-insulating shield is set.
Gripping element is set to the V-shaped groove clamper, and the top arranges the bulb plunger, and the bulb plunger comprises the inversion U-lag, and spring is set in U-lag, and the spring bottom arranges bulb.
Heating radiator is set to grid shape heating radiator, and the heat radiation grid are arranged on the top.
The thermal expansivity of the material of heat-insulating shield is set to (7.5 ± 2.5) * 10
-6/ ℃.
The material of heat-insulating shield arranges pottery, zirconia or aluminium oxide.
The thermal expansivity of the material of gripping element, heating radiator is set to (25 ± 10) * 10
-6/ ℃.
The material of gripping element, heating radiator arranges steel, copper or aluminium.
The material of cooling piece is set to semiconductor chilling plate.
the technical program temperature regulating device comprises single-chip microcomputer, temperature sensor, temperature sensor all is connected with single-chip microcomputer, by the single-chip microcomputer centralized control, temperature sensor is fixed on heating radiator and gripping element, single-chip microcomputer automatic pid regulator parameters value poor according to the feedback temperature of temperature sensor, this device can be according to the temperature difference of heating radiator and gripping element, utilize pid algorithm accurately to control cooling piece work, cooling piece constantly passes to heating radiator with the heat of product gripping element, or the heat of heating radiator is passed to gripping element, thereby reach accurate temperature controlling, thereby effectively reduce the impact that temperature variation is brought whole proving installation, good test environment is provided.
Between the technical program gripping element and stationary platform, heat-insulating shield is set, has reduced the overall thermal capacity, change radiator structure, make proving installation that wider temperature controlling range can be provided, and improve alternating temperature speed.
The gripping element of the technical program is set to the V-shaped groove clamper, the top arranges the bulb plunger, the bulb plunger comprises the inversion U-lag, spring is set in U-lag, the spring bottom arranges bulb, and it is the bulb plunger that the technical program has changed gripping element, makes it be the some contact with contacting of product, and can make the strength that holds out against product controlled by the bulb plunger of changing different dynamics, improved the precision of product test.
The technical program heating radiator is set to grid shape heating radiator, the heat radiation grid are arranged on the top, so just can remove the fan of heating radiator, has removed impact that fan vibration causes test and static to the destruction of product, the accuracy of raising product test.
The expansion coefficient of the material of the technical program heat-insulating shield is set to (7.5 ± 2.5) * 10
-6/ ℃.The material of heat-insulating shield arranges pottery, zirconia or aluminium oxide.The expansion coefficient of the material of gripping element, heating radiator is set to (25 ± 10) * 10
-6/ ℃.The material of gripping element, heating radiator arranges steel, copper or aluminium, and gripping element V-type groove vertex distance gripping element ground face thickness can be set to 3-6mm, reduces the product gripping element because expanding with heat and contract with cold on the impact of testing.
The technical program only need to be inserted product when test and get final product good location, and simple to operate, high conformity has improved testing efficiency greatly.
Description of drawings
Fig. 1 is the structural representation of the side of laser module temperature control proving installation of the present invention;
Fig. 2 is the structural representation in the front of laser module temperature control proving installation of the present invention;
Fig. 3 is the structural representation of bulb plunger of the present invention;
Fig. 4 is the structural representation of heating radiator of the present invention.
1-stationary platform, 2-heat-insulating shield, 3-gripping element, 4-cooling piece, 5-heating radiator, 6-the first temperature sensor, 7-the second temperature sensor, 8-bulb plunger, 9-U shape groove, 10-spring, 11-bulb.
Embodiment
Embodiment 1:
It comprises stationary platform 1 laser module temperature control proving installation of the present invention, stationary platform 1 top arranges gripping element 3, cooling piece 4, heating radiator 5 from the bottom to top, it also comprises temperature regulating device, temperature regulating device comprises single-chip microcomputer, temperature sensor, temperature sensor all is connected with single-chip microcomputer, by the single-chip microcomputer centralized control, temperature sensor is fixed on heating radiator and gripping element, what be connected with gripping element is the first temperature sensor 6, what be connected with heating radiator is the second temperature sensor 7, single-chip microcomputer automatic pid regulator parameters value poor according to the feedback temperature of temperature sensor.Between gripping element 3 and stationary platform 1, heat-insulating shield 2 is set.Gripping element 3 is set to the V-shaped groove clamper, and the top arranges bulb plunger 8, and the bulb plunger comprises is inverted U-lag 9, the interior spring 10 that arranges of U-lag 9, and spring 10 bottoms arrange bulb 11.Heating radiator 5 is set to grid shape heating radiator, and the heat radiation grid are arranged on the top.The expansion coefficient of the material of heat-insulating shield 2 is set to (7.5 ± 2.5) * 10
-6/ ℃.The material of heat-insulating shield 2 arranges pottery, zirconia or aluminium oxide.The expansion coefficient of the material of gripping element, heating radiator is set to (25 ± 10) * 10
-6/ ℃.The material of gripping element 3, heating radiator 5 arranges steel, copper or aluminium.The material of cooling piece is set to semiconductor chilling plate.
The heat-insulating shield of the present embodiment be set to zirconia, the material of gripping element, heating radiator is set to aluminium.
Embodiment 2:
The difference of the present embodiment and embodiment 1 is, the heat-insulating shield of the present embodiment is set to aluminium oxide, and the material of gripping element, heating radiator is set to steel.
Embodiment 3:
The difference of the present embodiment and embodiment 1 is, the heat-insulating shield of the present embodiment is set to pottery, and the material of gripping element, heating radiator is set to copper.
Claims (9)
1. laser module temperature control proving installation, it comprises stationary platform, the stationary platform top arranges retained part, cooling piece, heating radiator from the bottom to top, it is characterized in that: it also comprises temperature regulating device, temperature regulating device comprises single-chip microcomputer, temperature sensor, and temperature sensor all is connected with single-chip microcomputer, by the single-chip microcomputer centralized control, temperature sensor is fixed on heating radiator and retained part, single-chip microcomputer automatic pid regulator parameters value poor according to the feedback temperature of temperature sensor.
2. laser module temperature control proving installation according to claim 1, is characterized in that: between retained part and stationary platform, heat-insulating shield is set.
3. laser module temperature control proving installation according to claim 2, it is characterized in that: retained part is set to the V-shaped groove clamper, and the top arranges the bulb plunger, and the bulb plunger comprises the inversion U-lag, and spring is set in U-lag, and the spring bottom arranges bulb.
4. laser module temperature control proving installation according to claim 1, it is characterized in that: heating radiator is set to grid shape heating radiator, and the heat radiation grid are arranged on the top.
5. laser module temperature control proving installation according to claim 1, it is characterized in that: the expansion coefficient of the material of heat-insulating shield is set to (7.5 ± 2.5) * 10
-6/ ℃.
6. laser module temperature control proving installation according to claim 5, it is characterized in that: the material of heat-insulating shield arranges pottery, zirconia or aluminium oxide.
7. laser module temperature control proving installation according to claim 1, it is characterized in that: the expansion coefficient of the material of retained part, heating radiator is set to (25 ± 10) * 10
-6/ ℃.
8. laser module temperature control proving installation according to claim 7, it is characterized in that: the material of retained part, heating radiator arranges steel, copper or aluminium.
9. laser module temperature control proving installation according to claim 1, it is characterized in that: the material of cooling piece is set to semiconductor chilling plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210576773.5A CN103092227B (en) | 2012-12-27 | 2012-12-27 | Laser module temperature control test device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210576773.5A CN103092227B (en) | 2012-12-27 | 2012-12-27 | Laser module temperature control test device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103092227A true CN103092227A (en) | 2013-05-08 |
| CN103092227B CN103092227B (en) | 2017-08-25 |
Family
ID=48204925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210576773.5A Active CN103092227B (en) | 2012-12-27 | 2012-12-27 | Laser module temperature control test device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103092227B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110873636A (en) * | 2020-01-19 | 2020-03-10 | 常州纵慧芯光半导体科技有限公司 | Temperature control test fixture of laser emission module |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2760547Y (en) * | 2004-12-24 | 2006-02-22 | 上海雷硕医疗器械有限公司 | Radiating device for weak light rapid spectral analysis assembly in improved laser diagnostic device |
| CN1983747A (en) * | 2006-06-12 | 2007-06-20 | 哈尔滨工业大学 | Method and device for stabilizing double-longitudinal mold laser frequency based on thermoelectric cryostat |
| CN201186474Y (en) * | 2008-03-06 | 2009-01-28 | 黄贤德 | Mould optical orientator |
| CN101872933A (en) * | 2010-05-31 | 2010-10-27 | 清华大学 | Semiconductor pumped full-cavity microchip laser device with stable output wavelength |
| CN102306893A (en) * | 2011-08-17 | 2012-01-04 | 上海致凯捷激光科技有限公司 | Totally-air-cooled constant temperature cavity |
| CN202134790U (en) * | 2011-07-15 | 2012-02-01 | 江苏敏佳电子科技股份公司 | Infrared laser device having comparatively good heat dissipating performance |
-
2012
- 2012-12-27 CN CN201210576773.5A patent/CN103092227B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2760547Y (en) * | 2004-12-24 | 2006-02-22 | 上海雷硕医疗器械有限公司 | Radiating device for weak light rapid spectral analysis assembly in improved laser diagnostic device |
| CN1983747A (en) * | 2006-06-12 | 2007-06-20 | 哈尔滨工业大学 | Method and device for stabilizing double-longitudinal mold laser frequency based on thermoelectric cryostat |
| CN201186474Y (en) * | 2008-03-06 | 2009-01-28 | 黄贤德 | Mould optical orientator |
| CN101872933A (en) * | 2010-05-31 | 2010-10-27 | 清华大学 | Semiconductor pumped full-cavity microchip laser device with stable output wavelength |
| CN202134790U (en) * | 2011-07-15 | 2012-02-01 | 江苏敏佳电子科技股份公司 | Infrared laser device having comparatively good heat dissipating performance |
| CN102306893A (en) * | 2011-08-17 | 2012-01-04 | 上海致凯捷激光科技有限公司 | Totally-air-cooled constant temperature cavity |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110873636A (en) * | 2020-01-19 | 2020-03-10 | 常州纵慧芯光半导体科技有限公司 | Temperature control test fixture of laser emission module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103092227B (en) | 2017-08-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101601363B1 (en) | Apparatus and method for power cycle test | |
| KR101648082B1 (en) | Apparatus and method for controlling heating of base within chemical vapour deposition chamber | |
| CN108226216B (en) | Method and apparatus for measuring linear expansion coefficient | |
| CN101974421B (en) | Variable-temperature metal module with precise temperature compensation and temperature compensating method | |
| CN202948346U (en) | Thermotank used for fiber-optic gyroscope | |
| CN206741339U (en) | A kind of quick accuracy-control system of Miniature biochemical analysis instrument sample detection room temperature | |
| US20080272795A1 (en) | Prober Apparatus and Operating Method Therefor | |
| CN203798759U (en) | Glass thermophysical property tester | |
| CN104897717A (en) | Indoor measuring device for axial and radial thermal expansion coefficients of rock sample | |
| CN103558881A (en) | Method and device for heating blood in detection pipeline | |
| CN103092227A (en) | Laser module temperature control testing device | |
| CN110118894A (en) | The method and system of measurement of power loss | |
| CN107643777A (en) | Environment temperature method of adjustment and device for circuit board experiment | |
| CN102799168A (en) | Non-contact heating temperature controller performance testing device | |
| JP2009278007A (en) | Prober | |
| CN205449641U (en) | Metal bath optics temperature measuring device | |
| CN106996994B (en) | Temperature cycle test bench | |
| CN105136102A (en) | Metal material deformation amount test box and detection method thereof | |
| CN210604475U (en) | Heat conductivity coefficient testing device | |
| CN203758634U (en) | Cold face temperature uniformity testing apparatus for thermoelectric refrigeration components | |
| CN107271476B (en) | Motor iron core axial heat conductivity coefficient testing device and testing method | |
| CN203455299U (en) | Heat-flux-type differential scanning calorimeter | |
| JP2013020471A (en) | Temperature controller and temperature control method | |
| CN208505485U (en) | A kind of surface temperature measurement instrument | |
| CN207231670U (en) | A kind of detection device for sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Laser module temperature control testing device Effective date of registration: 20190108 Granted publication date: 20170825 Pledgee: Qingdao High-tech Zone High-tech Microfinance Co., Ltd. Pledgor: Qingdao Leichuang Photoelectric Technology Co.,Ltd. Registration number: 2019370010004 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20190401 Granted publication date: 20170825 Pledgee: Qingdao High-tech Zone High-tech Microfinance Co., Ltd. Pledgor: Qingdao Leichuang Photoelectric Technology Co.,Ltd. Registration number: 2019370010004 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |