CN103085474A - Inkjet print head assembly - Google Patents
Inkjet print head assembly Download PDFInfo
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- CN103085474A CN103085474A CN2012100250116A CN201210025011A CN103085474A CN 103085474 A CN103085474 A CN 103085474A CN 2012100250116 A CN2012100250116 A CN 2012100250116A CN 201210025011 A CN201210025011 A CN 201210025011A CN 103085474 A CN103085474 A CN 103085474A
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- China
- Prior art keywords
- head assembly
- ink jet
- jet printing
- printing head
- protective layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17526—Electrical contacts to the cartridge
- B41J2/1753—Details of contacts on the cartridge, e.g. protection of contacts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/04525—Control methods or devices therefor, e.g. driver circuits, control circuits reducing occurrence of cross talk
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/165—Preventing or detecting of nozzle clogging, e.g. cleaning, capping or moistening for nozzles
- B41J2/16517—Cleaning of print head nozzles
- B41J2/1652—Cleaning of print head nozzles by driving a fluid through the nozzles to the outside thereof, e.g. by applying pressure to the inside or vacuum at the outside of the print head
- B41J2/16526—Cleaning of print head nozzles by driving a fluid through the nozzles to the outside thereof, e.g. by applying pressure to the inside or vacuum at the outside of the print head by applying pressure only
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17533—Storage or packaging of ink cartridges
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17536—Protection of cartridges or parts thereof, e.g. tape
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17536—Protection of cartridges or parts thereof, e.g. tape
- B41J2/1754—Protection of cartridges or parts thereof, e.g. tape with means attached to the cartridge, e.g. protective cap
Abstract
The present invention provides an inkjet print head assembly which comprises the following components: a substrate component which comprises an ink channel; a piezoelectric actuator which is formed on the substrate component; and a first protecting layer which is formed on the piezoelectric actuator and the substrate component and is made of the material with chemical resistance.
Description
The application requires to be submitted on October 28th, 2011 priority of the 10-2011-0111270 korean patent application of Korea S Department of Intellectual Property, and the open of this application is contained in this by reference.
Technical field
The present invention relates to a kind of ink jet printing head assembly, more particularly, relate to the ink jet printing head assembly that a kind of electrical connections that can prevent the ink jet printing head assembly is corroded or damages because of the chemical constituent that is present in China ink.
Background technology
The ink jet printing head assembly is to convert electric energy to physical force and the equipment of the China ink that stores with drop form discharging.
The ink jet printing head assembly can be produced in a large number, therefore has been used for office's printing machine and industrial printing machine.For example, usually use in office China ink is discharged into the ink jet printing head assembly that prints the object that will export on paper on paper, liquid metal material is discharged into printed circuit board (PCB) (PCB) comes up directly to form the ink jet printing head assembly of circuit pattern and use in manufacturing equipment.
Simultaneously, the piezo-activator that is arranged in the ink jet printing head assembly is connected to the main substrate of printing machine by flexible substrates (FPCB), and comes work according to the signal of telecommunication by main substrate transmission.
Yet the industrial China ink that is used in the ink jet printing head assembly generally includes concentrated acidity or basic solvent.Therefore, because of the vaporization of solvent, can or connect in the corrosion of the electrode of piezoelectric element and have problems aspect the corrosion of piezoelectric element and the flexible substrates of main substrate.
Summary of the invention
An aspect of of the present present invention provides a kind of electrode that can protect piezoelectric element or the flexible substrates that piezoelectric element is connected to main substrate has been avoided being included in the ink jet printing head assembly of the Solvent effect in industrial China ink.
According to an aspect of the present invention, provide a kind of ink jet printing head assembly, the ink jet printing head assembly comprises: basal component comprises ink passage; Piezo-activator is formed on basal component; The first protective layer is formed on piezo-activator and basal component, and is formed by the material with chemically-resistant characteristic.
The first protective layer can comprise the Parylene component.
The first protective layer can be formed by a kind of component in N-type Parylene (two pairs of xylylenes), C type Parylene (dichloro xylylene), D type Parylene (tetrafluoro xylylene), F type Parylene (octafluoro-[2,2] are to cyclophane).
The first protective layer can be formed by the blending ingredients that comprises at least a and insulating materials in N-type Parylene (two pairs of xylylenes), C type Parylene (dichloro xylylene), D type Parylene (tetrafluoro xylylene) and F type Parylene (octafluoro-[2,2] are to cyclophane).
The ink jet printing head assembly can also comprise the enhancement Layer that is formed on the first protective layer.
The ink jet printing head assembly can also comprise the second protective layer that is formed on enhancement Layer.
The second protective layer can comprise the Parylene component.
According to a further aspect in the invention, provide a kind of ink jet printing head assembly, the ink jet printing head assembly comprises: basal component comprises ink passage; Piezo-activator is formed on basal component; Flexible substrates is connected to the external circuit board with the electrode of piezo-activator; The first protective layer is formed on piezo-activator and basal component, and is formed by the material with chemically-resistant characteristic.
The first protective layer can comprise the Parylene component.
The ink jet printing head assembly can also comprise the 3rd protective layer that is coated on flexible substrates.
The electrode of piezo-activator and flexible substrates can be bonded to each other by anisotropic conductive film.
The first protective layer can be formed by a kind of component in N-type Parylene (two pairs of xylylenes), C type Parylene (dichloro xylylene), D type Parylene (tetrafluoro xylylene), F type Parylene (octafluoro-[2,2] are to cyclophane).
The first protective layer can be formed by the blending ingredients that comprises at least a and insulating materials in N-type Parylene (two pairs of xylylenes), C type Parylene (dichloro xylylene), D type Parylene (tetrafluoro xylylene) and F type Parylene (octafluoro-[2,2] are to cyclophane).
The ink jet printing head assembly can also comprise enhancement Layer, and enhancement Layer forms on the first protective layer and the electrode of piezo-activator is firmly bonded to flexible substrates.
Enhancement Layer can comprise silicon components.
The ink jet printing head assembly can also comprise the second protective layer that is formed on enhancement Layer.
The second protective layer can comprise the Parylene component.
Description of drawings
By the detailed description of carrying out below in conjunction with accompanying drawing, above and other aspect of the present invention, feature and other advantages will more clearly be understood, in the accompanying drawings:
Fig. 1 is the cutaway view according to the ink jet printing head assembly of first embodiment of the invention;
Fig. 2 is the cutaway view according to the ink jet printing head assembly of second embodiment of the invention;
Fig. 3 is the cutaway view according to the ink jet printing head assembly of third embodiment of the invention;
Fig. 4 is the cutaway view according to the ink jet printing head assembly of fourth embodiment of the invention;
Fig. 5 is the cutaway view according to the ink jet printing head assembly of fifth embodiment of the invention;
Fig. 6 is the cutaway view according to the ink jet printing head assembly of sixth embodiment of the invention.
The specific embodiment
Hereinafter, describe with reference to the accompanying drawings embodiments of the invention in detail.
In the description of this invention, the term of expression assembly of the present invention is considered its function and is named below.Therefore, term should not be understood to limit technology component of the present invention.
Fig. 1 is the cutaway view according to the ink jet printing head assembly of first embodiment of the invention, Fig. 2 is the cutaway view according to the ink jet printing head assembly of second embodiment of the invention, Fig. 3 is the cutaway view according to the ink jet printing head assembly of third embodiment of the invention, Fig. 4 is the cutaway view according to the ink jet printing head assembly of fourth embodiment of the invention, Fig. 5 is the cutaway view according to the ink jet printing head assembly of fifth embodiment of the invention, and Fig. 6 is the cutaway view according to the ink jet printing head assembly of sixth embodiment of the invention.
Contrast industrial ink jet printers can will comprise that the ink print of concentrated acidity or basic solvent is on substrate or LCD panel.In this case, can make by the heat that is produced by printing machine the solvent vaporization that is included in China ink.
Yet solvent vapour can corrode the electrical pattern (for example, the flexible substrates (that is, membranous type substrate) of the substrate of connection piezo-activator and printing machine or the electrode of piezo-activator) of the ink jet printing head assembly that consists of ink-jet printer.
As mentioned above, the corrosion of the electrode of piezo-activator or membranous type substrate can hinder signal is accurately transferred to piezo-activator, can hinder like this high resolution output of accurate printing work and ink-jet printer.
Consider the problems referred to above, proposed embodiments of the invention.In an embodiment of the present invention, provide a kind of and can effectively protect the electrode of piezo-activator or the ink jet printing head assembly of the impact that flexible substrates is avoided solvent vapour.
With reference to the ink jet printing head assembly of Fig. 1 description according to first embodiment of the invention.
Can comprise basal component 10, piezo-activator 40 and the first protective layer 50 according to the ink jet printing head assembly 100 of the embodiment of the present invention.
The first substrate 20 can be monocrystal silicon substrate.Yet if necessary, the first substrate 20 can be silicon-on-insulator (SOI) substrate.The first substrate 20 can comprise nozzle 22 and current limiter 24.
Simultaneously, although shown in Fig. 1 be that nozzle 22 and current limiter 24 are formed in the first substrate 20, if necessary, the part of the part of balancing gate pit or manifold can be formed in the first substrate 20.In addition, can prevent that the damper (damper) that China ink discharges rapidly by nozzle 22 can be additionally formed in the first substrate 20.
The second substrate 30 can be monocrystal silicon substrate.Yet if necessary, the second substrate 30 can be silicon-on-insulator (SOI) substrate.The second substrate 30 can comprise balancing gate pit 32 and manifold 34.Simultaneously, in the accompanying drawings, the thickness t 1 of the first substrate 20 is identical with the thickness t 2 of the second substrate 30, but the thickness t 1 of the first substrate 20 can be larger than the thickness t 2 of the second substrate 30, and vice versa.
Manifold 34 can be formed in the basal surface of the second substrate 30 (with reference to Fig. 1).Manifold 34 can form apart from balancing gate pit 32 has predetermined interval, and can be connected in the first substrate 20 and the second substrate 30 current limiter 24 of the first substrate 20 when stacking.In addition, the height h3 of manifold 34 can be identical with the height h2 of balancing gate pit 34.In this case, can be in the second substrate 30 easily mineralization pressure chamber 32 and manifold 34.That is, when balancing gate pit 32 and manifold 34 had identical height, single etch technique that can be by the second substrate 30 is mineralization pressure chamber 32 and manifold 34 simultaneously.Yet if necessary, balancing gate pit 32 and manifold 34 can have different height.For example, the height h3 of manifold 34 can be identical with the thickness t 2 of the second substrate 30.In this case, China ink is provided to the black entrance of manifold 34 and can be additionally formed in the second substrate 30.
Piezo-activator 40 can be formed in the second substrate 30.Piezo-activator 40 can be formed on the top surface of the second substrate 30 (with reference to Fig. 1), and the balancing gate pit 32 that the pressure of predeterminated level can be applied to the second substrate 30 makes the China ink that is stored in balancing gate pit 32 can be by nozzle 22 dischargings.For this reason, piezo-activator 40 can be formed in the position corresponding with the balancing gate pit 32 of the second substrate 30.In addition, the length L 2 of piezo-activator 40 can be identical with the length L 1 of balancing gate pit 32.
Piezo-activator 40 can comprise piezoelectric element 42, the first electrode 44 and the second electrode 46.
The first electrode 44 can be formed in the second substrate 30.The first electrode 44 can be formed in the second substrate 30 by using the adhesive such as epoxy resin, and can form the measure-alike size that has with piezoelectric element 42.The first electrode 44 can be formed by conductive material, and the first polarity electric current can be offered piezoelectric element 42.For this reason, the first electrode 44 can be electrically connected to external power source or circuit board.In addition, the first electrode can be formed by the double layer of metal thin layer of making by titanium (Ti) and platinum (Pt).The first electrode 44 that is formed as described above can be used as common electrode.
The second electrode 46 can be formed on the top surface of piezoelectric element 42.The second electrode 46 can be by forming such as any material in the material of Pt, Au, Ag, Ni, Ti, Cu etc., and the electric current that has with the opposite polarity polarity of the first electrode 44 can be offered piezoelectric element 42.
Simultaneously, embodiments of the invention have been described on the basal surface that the first electrode 44 is formed on piezoelectric element 42 and the second electrode 46 is formed on the top surface of piezoelectric element 42, but can change the position of the first electrode 44 and the second electrode 46.
The first protective layer 50 can be formed in piezo-activator 40 and the second substrate 30.More particularly, the first protective layer 50 is formed on the top surface of the second substrate 30 (with reference to Fig. 1), is corroded because of concentrated acidity or basic solvent steam with the top surface that prevents the second substrate 30.In addition, the first protective layer 50 is formed on the surface of piezo-activator 40, is corroded or oxygenated because of concentrated acidity or basic solvent steam with a part ( electrode 44 and 46 particularly) that prevents piezo-activator 40.
For this reason, the first protective layer 50 can be formed by the material that comprises the chemically-resistant component.For example, the first protective layer 50 can comprise the Parylene component.Selectively; the first protective layer can be formed by the one-component in N-type Parylene (parylene N) (two pairs of xylylenes), C type Parylene (parylene C) (dichloro xylylene), D type Parylene (parylene D) (tetrafluoro xylylene) or F type Parylene (parylene F) (octafluoro-[2,2] are to cyclophane).Selectively; the first protective layer can be formed by the blending ingredients that comprises at least a and insulating materials in N-type Parylene (two pairs of xylylenes), C type Parylene (dichloro xylylene), D type Parylene (tetrafluoro xylylene) and F type Parylene (octafluoro-[2,2] are to cyclophane).
Yet except said components, the first protective layer 50 can comprise any chemically-resistant component.
Simultaneously, can form the first protective layer 50 by the method such as deposition, coating, printing etc.The mode that can be immersed in the basal component 10 that will have the piezo-activator 40 that is attached to it in coating liquid that comprises the Parylene component in addition, forms the first protective layer 50.In this case, the opening portion (for example, nozzle 22) of basal component 10 can be closed to prevent that coating liquid is introduced in wherein.
Due to the part of the acidity that is subject to concentrate of having protected ink jet printing head assembly 100 by the first protective layer 50 or the impact of basic solvent steam, so can extend the life-span of the ink jet printing head assembly 100 of structure as described above.
In addition, due to the electrode acidity avoiding concentrating of protection piezo-activator 40 or the impact of basic solvent steam, so can have error ground accurately not carry out control to piezo-activator 40.
Therefore, according to example of the present invention, the black discharge performance of ink jet printing head assembly 100 can be stably kept, like this, the resolution ratio of printing the object that obtains can be improved.
As a reference, accompanying drawing and detailed description have illustrated and have described the ink jet printing head assembly and discharged China ink by the Piezoelectric Driving scheme of using piezo-activator 40, but the invention is not restricted to this.Therefore, if necessary, can use to have heating unit but not the ink jet printing head assembly of piezo-activator.
Next, with reference to Fig. 2 to Fig. 6, other embodiment of the present invention are described.As a reference, in the following examples of the present invention, can use identical label to represent the assembly identical with assembly in the first embodiment, therefore will omit the detailed description to same components.
To with reference to Fig. 2 and Fig. 3, the second embodiment of the present invention and the 3rd embodiment be described respectively.
Can also comprise enhancement Layer 60 according to the ink jet printing head assembly 100 of second embodiment of the invention.
The first protective layer 50 forms the form membrane with relative thin, and therefore, the first protective layer 50 may use because concentrated acid or alkaline steam is easy to consume along with the long-term of ink jet printing head assembly 100, perhaps may damage because of independent external factor.
Consider the problems referred to above, embodiments of the invention can also comprise the enhancement Layer 60 that is formed on the first protective layer 50.
In this case, enhancement Layer 60 can be formed by the component that comprises silicon, and can prevent that the first protective layer 50 from slowly consuming or preventing that the first protective layer 50 from gasifying in air at leisure because of concentrated acid or alkaline steam.
In addition, enhancement Layer 60 can absorb the heat that is produced by basal component 10.In order to realize this point, enhancement Layer 60 can comprise metal dust.
The enhancement Layer 60 that is formed as described above absorbs the heat that is produced by basal component 10, to suppress being stored in the viscosity of the China ink in balancing gate pit 32 because heat changes.
Simultaneously, enhancement Layer 60 has the chemically-resistant characteristic lower than the first protective layer 50.Therefore, as shown in Figure 3, can further form the second protective layer 52 on the top surface of enhancement Layer 60 in the third embodiment of the present invention.The second protective layer 52 also can be formed by Parylene component as above.
Because a plurality of protective layers 50,60 and 52 sequentially are formed on basal component 10 and piezo-activator 40, so the ink jet printing head assembly 100 of structure can more effectively prevent acid or alkaline steam corrosion and the oxidation that electrode is concentrated as described above.
With reference to Fig. 4, the fourth embodiment of the present invention is described.
Can also comprise flexible substrates 70 according to the ink jet printing head assembly 100 of fourth embodiment of the invention.
Simultaneously, flexible substrates 70 can be passed through anisotropic conductive film (ACF) and is electrically connected to the electrode 44 and 46 of piezo-activator 40.In this case, anisotropic conductive film comprises conductive material and jointing material, thereby it can allow stable connection the between the electrode 44 and 46 of flexible substrates 70 and piezo-activator 40.
Yet, with the electrode 44 of piezo-activator 40 with are connected the member that is connected with flexible substrates 70 and are not limited to various different in nature conducting films, and can be formed by the adhesive that comprises conductive material or scolder etc.
Can be with the material coating flexible substrate 70 with component identical with the component of the first protective layer.For example, can form the 3rd protective layer 54, the three protective layers 54 on the surface of flexible substrates 70 can be formed by the component identical with the component of the first protective layer 50.
Therefore, according to embodiments of the invention, can protect the impact of the acid or alkaline steam that piezo-activator 40 and flexible substrates 70 avoid concentrating.
Simultaneously, as shown in Fig. 5 and Fig. 6, in the fifth embodiment of the present invention, the first protective layer 50 can also be provided with enhancement Layer 60, and in the 6th embodiment, the first protective layer 50 can also be provided with enhancement Layer 60 and the second protective layer 52.
In this case, enhancement Layer 60 can comprise that adhesive component also can keep the connection between piezo-activator 40 and flexible substrates 70 safely.That is, because flexible substrates 70 may be because external force moves flexibly, so may deteriorated flexible substrates 70 and piezo-activator 40 between electrical connection.
In an embodiment of the present invention, consider the problems referred to above, can form the enhancement Layer 60 with predetermined thickness on the first protective layer 50.Can wait sclerosis enhancement Layer 60 by ultraviolet ray, therefore, can firmly fix flexible substrates 70 with respect to the position of piezo-activator 40.
Due to the coupling part with piezo-activator 40 and flexible substrates 70 be held in fixing, so can transfer to exactly piezo-activator 40 by the signal of telecommunication of flexible substrates 70.
Simultaneously, as mentioned above, enhancement Layer 60 can have relatively low chemically-resistant characteristic, and therefore, as shown in Figure 6, in the 6th embodiment, the second protective layer 52 can be formed on enhancement Layer 60 further.
As mentioned above, according to embodiments of the invention, the electrode that can prevent ink jet printing head is included in solvent vapour corrosion or the oxidation in China ink.
Therefore, according to embodiments of the invention, can improve the reliability of the driving signal that transfers to piezo-activator, thereby also can improve the output resolution ratio of ink jet printing head.
Although illustrate in conjunction with the embodiments and described the present invention, will be significantly in the situation that do not break away from the spirit and scope of the present invention that are defined by the claims, can make and revise and change those skilled in the art.
Claims (17)
1. ink jet printing head assembly, described ink jet printing head assembly comprises:
Basal component comprises ink passage;
Piezo-activator is formed on basal component; And
The first protective layer is formed on piezo-activator and basal component, and is formed by the material with chemically-resistant characteristic.
2. ink jet printing head assembly as claimed in claim 1, wherein, the first protective layer comprises the Parylene component.
3. ink jet printing head assembly as claimed in claim 1, wherein, the first protective layer is formed by the one-component in N-type Parylene, C type Parylene, D type Parylene or F type Parylene.
4. ink jet printing head assembly as claimed in claim 1, wherein, the first protective layer is by comprising that at least a and blending ingredients insulating materials in N-type Parylene, C type Parylene, D type Parylene and F type Parylene forms.
5. ink jet printing head assembly as claimed in claim 1, described ink jet printing head assembly also comprises the enhancement Layer that is formed on the first protective layer.
6. ink jet printing head assembly as claimed in claim 5, described ink jet printing head assembly also comprises the second protective layer that is formed on enhancement Layer.
7. ink jet printing head assembly as claimed in claim 6, wherein, the second protective layer comprises the Parylene component.
8. ink jet printing head assembly, described ink jet printing head assembly comprises:
Basal component comprises ink passage;
Piezo-activator is formed on basal component;
Flexible substrates is connected to the external circuit board with the electrode of piezo-activator; And
The first protective layer is formed on piezo-activator and basal component, and is formed by the material with chemically-resistant characteristic.
9. ink jet printing head assembly as claimed in claim 8, wherein, the first protective layer comprises the Parylene component.
10. ink jet printing head assembly as claimed in claim 8, described ink jet printing head assembly also comprises the 3rd protective layer that is coated on flexible substrates.
11. ink jet printing head assembly as claimed in claim 8, wherein, electrode and the flexible substrates of piezo-activator are bonded to each other by anisotropic conductive film.
12. ink jet printing head assembly as claimed in claim 9, wherein, the first protective layer is formed by the one-component in N-type Parylene, C type Parylene, D type Parylene or F type Parylene.
13. ink jet printing head assembly as claimed in claim 8, wherein, the first protective layer is by comprising that at least a and blending ingredients insulating materials in N-type Parylene, C type Parylene, D type Parylene and F type Parylene forms.
14. ink jet printing head assembly as claimed in claim 8, described ink jet printing head assembly also comprises enhancement Layer, and enhancement Layer forms on the first protective layer and the electrode of piezo-activator is firmly bonded to flexible substrates.
15. ink jet printing head assembly as claimed in claim 14, wherein, enhancement Layer comprises silicon components.
16. ink jet printing head assembly as claimed in claim 14, described ink jet printing head assembly also comprises the second protective layer that is formed on enhancement Layer.
17. ink jet printing head assembly as claimed in claim 16, wherein, the second protective layer comprises the Parylene component.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2011-0111270 | 2011-10-28 | ||
| KR1020110111270A KR101328304B1 (en) | 2011-10-28 | 2011-10-28 | Inkjet print head assembly |
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| CN103085474A true CN103085474A (en) | 2013-05-08 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107685538A (en) * | 2016-08-05 | 2018-02-13 | 东芝泰格有限公司 | Ink gun |
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| CN101219598A (en) * | 2007-01-12 | 2008-07-16 | 三星电子株式会社 | Inkjet print head chip, method for manufacturing an inkjet print head chip, structure for connecting an inkjet print head chip and a flexible printed circuit board, and method for connecting an inkjet |
| JP2009202473A (en) * | 2008-02-28 | 2009-09-10 | Toshiba Tec Corp | Method for manufacturing inkjet head and inkjet head |
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| KR100612883B1 (en) * | 2004-12-29 | 2006-08-14 | 삼성전자주식회사 | Method of fabricating inkjet printhead |
| KR101153562B1 (en) * | 2006-01-26 | 2012-06-11 | 삼성전기주식회사 | Piezoelectric inkjet printhead and method of manufacturing the same |
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| JPH11235818A (en) * | 1998-02-23 | 1999-08-31 | Seiko Epson Corp | Ink jet recording head |
| JP2000071451A (en) * | 1998-09-02 | 2000-03-07 | Konica Corp | Piezoelectric ceramic element and production thereof |
| US20040032466A1 (en) * | 2002-08-12 | 2004-02-19 | Sharp Kabushiki Kaisha | Method for producing organic insulating coating and ink-jet printhead produced according to the method |
| US20040085410A1 (en) * | 2002-08-12 | 2004-05-06 | Seiko Epson Corporation | Method of manufacturing silicon device, method of manufacturing liquid jet head and liquid jet head |
| US20060027937A1 (en) * | 2004-08-06 | 2006-02-09 | Brad Benson | Electrical contact encapsulation |
| CN101219598A (en) * | 2007-01-12 | 2008-07-16 | 三星电子株式会社 | Inkjet print head chip, method for manufacturing an inkjet print head chip, structure for connecting an inkjet print head chip and a flexible printed circuit board, and method for connecting an inkjet |
| JP2009202473A (en) * | 2008-02-28 | 2009-09-10 | Toshiba Tec Corp | Method for manufacturing inkjet head and inkjet head |
| US20110134196A1 (en) * | 2009-12-04 | 2011-06-09 | Samsung Electro-Mechanics Co., Ltd. | Inkjet head |
| JP2011187788A (en) * | 2010-03-10 | 2011-09-22 | Seiko Epson Corp | Mounting structure of flexible board, mounting method of flexible board, droplet discharge head, and method of manufacturing the same |
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| CN107685538A (en) * | 2016-08-05 | 2018-02-13 | 东芝泰格有限公司 | Ink gun |
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| KR101328304B1 (en) | 2013-11-14 |
| KR20130046727A (en) | 2013-05-08 |
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