CN103081101A - Method for manufacturing an antenna component by etching - Google Patents
Method for manufacturing an antenna component by etching Download PDFInfo
- Publication number
- CN103081101A CN103081101A CN2010800676902A CN201080067690A CN103081101A CN 103081101 A CN103081101 A CN 103081101A CN 2010800676902 A CN2010800676902 A CN 2010800676902A CN 201080067690 A CN201080067690 A CN 201080067690A CN 103081101 A CN103081101 A CN 103081101A
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- etching
- antenna
- antenna module
- designator
- conducting wire
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
- H01Q9/20—Two collinear substantially straight active elements; Substantially straight single active elements
- H01Q9/24—Shunt feed arrangements to single active elements, e.g. for delta matching
Abstract
A method for manufacturing an antenna component (2) by etching, the component comprising a substrate (3) and an electrically conductive line configuration (4) supported by the substrate (3). The electrically conductive line configuration (4) is formed by etching away locally by etchant an electrically conductive coating supported by the substrate (3). An extent of etching of the antenna component (2) is indicated by an etching indicator (10), the etching indicator (10) being located at the antenna component (2) to be etched or in proximity to the antenna component (2) to be etched and consisting of the same electrically conductive coating supported by the substrate (3) of the component (2) and being exposed to the etchant during etching. Further an antenna component (2) or a group (15) of antenna components (2) comprising an etching indicator (10) and an etching mask (12) for manufacturing an antenna component (2) by etching are introduced.
Description
Technical field
The present invention relates to for the method for making antenna module by etching, this assembly comprises substrate and the conducting wire configuration of being supported by substrate, and in its method, conducting wire configuration forms by the conductive coating that is fallen substrate by the etchant local etching and support.
The invention still further relates to antenna module or one group of antenna module, this assembly comprises substrate and the conducting wire configuration of being supported by substrate.
The invention still further relates to for the etching mask of making antenna module by etching, this assembly comprises substrate and the conducting wire configuration of being supported by substrate, the configuration of this conducting wire forms by the conductive coating that is fallen substrate by the etchant local etching and support, and this etching mask is determined the conducting wire configuration of assembly.
Background technology
Usually in the etching to printed circuit board (PCB) or other corresponding electronic module or product, the etch process deviation can cause the continuously remarkable deviation of the electrical characteristics of the circuit between the etched similar etched circuit.When the radio-frequency structure of etching such as antenna structure, especially true.For example, when the antenna that is used for RFID tags or RFID label was carried out etching, the process deviation in the etching can cause the frequency behavior deviation of etching antenna, and this further affects the electricity coupling of other part of antenna and RFID circuit.
The open prior art RFID tags 1 of Fig. 1 or RFID label 1, RFID label 1 is an example that can comprise the product of antenna module, wherein, this antenna module comprises by etching formed conducting wire configuration.RFID label 1 comprises the antenna module 2 that comprises substrate 3 and antenna 4, and antenna 4 is conducting wire configurations of antenna module 2, and substrate 3 is bearing in conductive coating that the during etching of antenna 4 partly removed one or more layers.Therefore antenna module 2 forms the part of the RFID label 1 that can use in many different types of application.For example, the RFID label is attachable to different types of commodity that department store sells, and is used for storing the relevant customizing messages of commodity attached to them.Antenna 4 is provided at RFID label 1 and is used for the device of reading tag 1 canned data or is used for sending the parts of transmission of information between the device of the information that will be stored in label 1.
RFID label 1 also comprises is arranged to the integrated circuit 5 or the chip 5 that are connected with conducting wire configuration or antenna 4, in order to store the customizing messages relevant with the attached commodity of RFID label 1.Antenna module 2 and the integrated circuit 5 that is attached to antenna module 2 also be attachable to contact adhesive, be paste 6 or other certain attachment element, thereby for example provide the finished product RFID label 1 that has been ready to be attached to the commodity that will sell in department store.Among Fig. 1, schematically illustrate paste 6 by the frame around antenna module 2.Except primary element shown in Figure 1, RFID label 1 also can comprise other layer that is laminated to this structure or is attached to this structure.
Especially in the UHF frequency range of operation RFID label, impedance matching element 4 " and radiant element 4 ' can by the coupling part 4 " ' interconnect physically, but in fact, impedance matching element 4 " and radiant element 4 ' intercouple via mutual inductance; namely, have the impedance matching element 4 of certain resonance frequency " be inductively coupled to the radiant element 4 ' with certain resonance frequency.Impedance matching element 4 " and radiant element 4 ' between coupling distance D, be impedance matching loop 4 " and radiant element 4 ' between beeline affect the frequency response of antenna 4.
Should be noted that concrete antenna structure shown in Figure 1 only provides as example.Individual impedance except radiant element 4 ' coupling loop 4 " also be typical for the RFID label antenna that is designed to the UHF scope.For example, in near-field operations UHF label (UHF NF), impedance matching loop 4 " loop structure can be implemented as antenna without any the spurious radiation element.
The present invention for describing after a while the most important thing is to be appreciated that the etch process deviation in the antenna manufacturing can change the physical size of antenna 4.The deviation of the physical size of antenna 4 means that antenna pattern size and initial designs target have certain and depart from, and its design object depends on frequency range and the type of the RFID label of discussing.The etch process deviation for example can produce the deviation of the temperature of self etching agent and composition or etchant for the effective time of conductive coating tool of falling to be etched.The deviation of the physical size of antenna 4 causes that the electrical quantity of antenna 4 changes, thus the tuning and impedance matching of antenna frequencies of change and integrated circuit 5.This frequency tuning changes the drift that can further be regarded as performance, so that the optimum performance of antenna begins degradation.
The quite typical factor that frequency tuning changes is impedance matching element 4 " and radiant element 4 ' between the variation of coupling distance D.The variation of coupling distance D further changes impedance matching and the frequency response of antenna 4 together with integrated circuit 5.For some Antenna Designs, the variation of the coupling distance D after the etching can be up to ± 10%.This variation of coupling distance D can have appreciable impact to the performance of antenna, the obvious distortion so that the frequency response of antenna becomes that for example begins to demote of the performance of antenna.In fact, this for example can notice by certain loss of reading distance of RFID label.
US announces 2007/0069037 A1 and discloses a kind of non-contact RF ID label that has as the antenna element of the antenna of radiant element and impedance matching wiring portion that comprises.The impedance matching wiring portion comprises some mounting portions of integrated circuit modules, so that when integrated circuit modules was installed in different installation site, the frequency characteristic of antenna element was different.By this solution, the individual antenna unit structure can be used as the basic antenna element that the RFID label is made, and the response of the final frequency of antenna element is selected by the specific installation site that integrated circuit modules is installed in the antenna element.This so that might be at country variant RFID label allow in the different situation of frequency band only have the RFID label of some types of different frequency bands based on a kind of antenna element manufacturing.RFID label according to US announcement 2007/069037 also comprises the specific markers position, and this specific markers position is formed into the corresponding installation site of integrated circuit modules, so that for example can be easy at a glance the country that definite manufacturing RFID label is used for.
Announce disclosed solution in 2007/0069037 by US, the RFID label with different frequency response characteristic can be by only constructing to make with one type antenna element.But disclosed RFID label still suffers variation or the deviation of the coupling distance between actual emanations element and the impedance matching wiring portion in the US announcement 2007/0069037, and this variation or deviation are derived from the etch process deviation in the antenna manufacturing.In addition, should be noted that wherein installation site is designed to cause sizable variation of the RFID label operating frequency corresponding with the frequency requirement of different geographic regions.These change than many greatly about the caused variation of any etch bias of the present invention.
Summary of the invention
Therefore, an object of the present invention is to provide a solution, by this solution, in the antenna module that further uses the etching conducting wire configuration that comprises the antenna that antenna module is provided, can consider to be derived from the variation of etch process deviation or the impact of deviation.The present invention is intended to help to eliminate the impact of etch bias aspect the electrical property of final products, such as the impact in the RFID label.
Be characterised in that by the etching designator according to a kind of method of the present invention and indicate etching degree to antenna module, this etching designator is arranged near antenna module to be etched place or the antenna module to be etched, and is supported and formed in the identical conduction coating that during etching is exposed to etchant by the substrate of antenna module.
Antenna module or one group of antenna module are characterised in that, in at least certain fabrication stage of at least one antenna module, near antenna module place or at least one antenna module, there is at least one etching designator, this etching designator provides the information relevant with the etching degree of at least one antenna module, and is comprised of the identical conduction coating that substrate supports.
Be characterised in that according to etching mask of the present invention; etching mask comprises that the conducting wire that will keep with during etching disposes the barrier material at least one corresponding main region; and etching mask also comprises the barrier material that is used to form the etching designator that the identical conduction coating that supported by substrate forms at least one subregion, and the etching designator is arranged to indicate the etching degree to antenna module.
In the method that is used for making by etching antenna module, assembly comprises substrate and the conducting wire configuration of being supported by substrate, and the conducting wire configuration of assembly forms by the conductive coating that is fallen substrate by the etchant local etching and support.Come the etching degree of marker antenna assembly by the etching designator, this etching designator is arranged near antenna module to be etched place or the antenna module to be etched, and is supported and formed in the identical conduction coating that during etching is exposed to etchant by the substrate of assembly.
The etching designator can be used in the indication etchant to the effect degree of conductive coating, etchant to the effect of conductive coating provide with etching process during the conducting wire dispose the relevant information of etched degree.By checking the etching designator, the conducting wire configuration that might determine antenna module is etching too much (crossing etching), very few (owing etching) or just in time disposes corresponding to designed target line.Thus, can before any integrated circuit or other similar part are attached to the etching antenna assembly, determine the availability of the antenna module in the electromagnetism sensing in the further fabrication stage.This is a key factor for reducing manufacturing cost.
According to an embodiment, the etching designator comprises a plurality of parallel lines that relative to each other have different in width, etching designator thereby have simple form or shape.
According to an embodiment, antenna module is intended to form the RFID tags that comprises integrated circuit or the part of RFID label, and the conducting wire configuration is intended to form at least a portion of the antenna of RFID label thus.Antenna can comprise one or more elements, for example radiant element and impedance matching element.When assembly to be manufactured is intended to form RFID label a part of, the configuration of the conducting wire of assembly is intended to form at least a portion of the antenna of RFID label, the etching designator can be used for indicating actual etching antenna pattern with respect to the frequency Tuning Characteristics of design object antenna, and indicates thus the availability of the antenna module in other fabrication stage of RFID label.
According to another embodiment, the antenna of RFID label or the impedance matching element of antenna comprise a plurality of possibility attachment point for attached integrated circuit, and determine by checking the etching designator for the specific attachment point of integrated circuit.By checking the etching designator, might determine that actual etching antenna pattern is with respect to the frequency Tuning Characteristics of design object antenna, and then, by selecting in the antenna or the suitable attachment point of the integrated circuit in the impedance matching element of antenna, might compensate the variation of the frequency Tuning Characteristics of antenna, wherein change the deviation (" mistake " or " owing " etching) that is derived from etch process, in order to the RFID label of can working is provided, and regardless of the process deviation that antenna pattern is carried out in the etched process.
According to another embodiment, after antenna or antenna conductor structure are carried out etching, can change antenna or antenna conductor structure based on the indicated etching degree of etching designator.Remove electric conducting material and/or by adding electric conducting material at antenna structure to affect the radio frequency behavior of etching antenna, can locally change the antenna conductor structure by for example cutting from antenna structure via laser tuning or stamping.Also can be by the tuning structure that adds independently at antenna module, may lamination affect the radio frequency behavior of etching antenna, change antenna conductor structure.Thus, the information that the etching designator provides changes the antenna conductor structure after also being used in etching, as replenishing or substituting for the suitable attachment point of selecting integrated circuit at the antenna module place.
Description of drawings
With reference to accompanying drawing, the below will describe the present invention in more detail by preferred embodiment, in the accompanying drawing:
The top view of RFID tags in the schematically illustrated prior art of Fig. 1;
The schematically illustrated top view that comprises the antenna module of conducting wire configuration and etching designator of Fig. 2;
The top view of the details of the schematically illustrated antenna module according to Fig. 2 of Fig. 3;
The top view of the schematically illustrated etching designator of Fig. 4;
The top view of schematically illustrated the second etching designator of Fig. 5;
The top view of the schematically illustrated etching mask that can in the antenna module of making according to Fig. 2, use of Fig. 6; And
The schematically illustrated one group of antenna module that comprises an etching designator of every group of assembly of Fig. 7.
Embodiment
Fig. 2 is the top view that comprises the antenna module 2 of the conducting wire configuration on the substrate 3.The antenna module 2 of Fig. 2 forms the part of basic RFID tags, and it only lacks integrated circuit 5 and paste 6 when comparing with finished product RFID tags or RFID label.Form the antenna 4 of RFID label according to the conducting wire configuration of the assembly 2 of Fig. 2.Antenna 4 according to Fig. 2 comprises radiant element 4 ', impedance matching element 4 " and coupling element 4 ' ".For example, antenna can be designed for the UHF frequency range.
Impedance matching element 4 shown in Figure 2 " also comprise for about impedance matching element 4 " a plurality of attachment point of attached integrated circuit 5.Clearly show that impedance matching element shown in Figure 24 among Fig. 3 ".Impedance matching element 4 according to Fig. 2 and Fig. 3 " comprise five attachment point, namely attachment point 7a, 7b, 7c, 7d and 7e are used for about impedance matching element 4 " attached integrated circuit 5.Attachment point 7a-7e forms during the antenna of the identical conductive coating of etching and antenna 4, and conductive coating is by substrate 3 supportings.The attachment point configuration comprises two projections 8, projection 8 on every side of attachment point 7a-7e.Projection 8 is perpendicular to impedance matching element 4 " line configuring, and in the embodiment of Fig. 2 and Fig. 3, projection 8 is directed to impedance matching element 4 " the inside of loop structure, but they also can be directed in the rightabout naturally.Two projections 8 comprise five side projections 9, and side projection 9 is with corresponding projection 8 physical connections and perpendicular to projection 8, and side projection 9 is directed to another projection 8 that does not have physical connection with them.Be connected to the side projection 9 of relative projection 8 toward each other, but they connect without any direct physical each other before the attached integrated circuit 5 in specific attachment point 7a, 7b, 7c, 7d or 7e place.Each of attachment point 7a to 7e forms impedance matching element 4 " different physics loop-length; and thereby after integrated circuit has been attached in specific attachment point 7a to 7e, each of attachment point 7a to 7e provides impedance matching element 4 " the different frequency tuning characteristic.
Therefore attachment point and join domain can design according to some modes, and Fig. 2 and design shown in Figure 3 should only be understood to example.In addition, although should be noted that attachment point 7a to 7e is arranged to and impedance matching element 4 in Fig. 2 and embodiment shown in Figure 3 " relevant, it is relevant with certain other parts of antenna 4 that attachment point 7a to 7e can be arranged to, and this for example depends on antenna structure.
During etching at antenna 4, comprise that the antenna module 2 of substrate 3 is exposed to the effect of etchant, be used to form antenna 4 configurations, be radiant element 4 ', impedance matching element 4 " and coupling element 4 ' ", and in the situation according to the embodiment of Fig. 2, also be used to form projection 8 and side projection 9 that attachment point 7a to 7e is provided.At during etching, etchant not being subject to from the substrate 3 of antenna module 2 those parts of substrate 3 of the etching mask that uses protection remove conductive coatings.Etching mask comprises that wherein expectation keeps the barrier material on those parts of substrate 3 of designed conducting wire configuration.The basic principle of etch process itself is that those skilled in the art is general known, and thereby does not make more detailed description at this.
But as mentioned above, the etch process deviation of the antenna manufacturing of RFID label can change the physical size of antenna 4.The deviation of crossing or owing the physical size of the caused antenna 4 of etching causes antenna pattern size and initial designs target to have certain departing from.The etch process deviation for example can result from the deviation of the temperature of etchant and composition or etchant for the influential time of conductive coating tool of falling to be etched.The deviation of the physical size of antenna changes the electrical quantity of antenna 4, thereby changes the antenna frequencies tuning characteristic.This frequency tuning changes the drift that can further regard performance as, so that the optimum performance of antenna begins degradation.
By using above-mentioned etching designator 10, can estimate that this frequency tuning changes.This estimation can be calculated or simulation based on theory, and perhaps it can based on experience etching test, wherein be carried out a series of mistakes and owe the etching test, and measure these a series of mistakes and owe the effect of etching to the frequency characteristic of antenna.
During etch process, etchant is not only removed in the conductive coating the conductive coating on removed those parts in order to obtain the design object antenna pattern, but also removes conductive coating from form the part that the conducting wire corresponding with antenna 4 and etching designator 10 dispose.Thus, etchant is also removed material from line 11a to 11e at during etching.This can schematically see in the embodiment of Fig. 2, and wherein, when supposition Fig. 2 showed the antenna module 2 of etching process after finishing, the line 11c to 11e of etching designator 10 was in the complete obiteration of during etching to antenna 4.But for clarity, the line 11c to 11e that during etching disappears illustrates in Fig. 2 by a dotted line.If any of line 11a to 11e is in not yet complete obiteration of during etching, the amount of the line quantity of the etching designator 10 that disappears of during etching or the etching designator material that during etching disappears or measure to provide with the frequency tuning of antenna 4 and change relevant information then, the below describes.
By checking the residue etching designator 10 among Fig. 2, can see that only stay line 11a and 11b, line 11c to 11e is removed at during etching.If determined that median line 11c forms the reference section of etching designator 10, so that as the median line 11c with certain width and have the line 11d of less width (i.e. the corresponding characteristic less than reference section) and 11e when all having disappeared, this expression and antenna 4 corresponding conducting wires dispose be etched to the predictive role degree of etchant, be the corresponding degree of the design object of antenna 4.This means, the physical size of antenna and thus the frequency Tuning Characteristics of antenna 4 shown in Figure 2 and do not exist the frequency tuning according to the antenna 4 of Fig. 2 to change fully corresponding to physical size and the frequency Tuning Characteristics of design object antenna 4.For example, this means again, integrated circuit 5 is attachable at impedance matching element 4 " attachment point 7c, attachment point 7c in this example corresponding to being intended to for impedance matching element 4 in the situation that has design object frequency Tuning Characteristics or design object operating frequency at etching antenna 4 " impedance matching element 4 " that loop-length.
But for example, if only wired 11e disappears at during etching, then the inspection indication etchant to etching designator 10 is excessively low to the effect of conductive coating.This means, the physical size of antenna 4 is excessive when comparing with the physical size of design object antenna 4, namely, there is the variation of frequency Tuning Characteristics in this frequency Tuning Characteristics that represents actual etching antenna 4 not corresponding to the frequency Tuning Characteristics of design object antenna 4.But, at this moment can be by for example integrated circuit 5 being attached in impedance matching element 4 " attachment point 7e come this variation of compensating frequency tuning characteristic, thereby attachment point 7e is to be intended to for impedance ground matching element 4 in the situation of incorrect frequency Tuning Characteristics corresponding to have at etching antenna 4 that large many physical sizes of physical size than design object antenna cause comparing with the design object antenna without any compensation the time in this example " impedance matching element 4 " that loop-length.
But for example, if wired 11a to 11e has disappeared at during etching, then the inspection indication etchant to etching designator 10 is excessively strong to the effect of conductive coating.This means that the physical size of antenna 4 is too small when comparing with the physical size of design object antenna 4, this represents that the frequency Tuning Characteristics of actual etching antenna 4 does not have the frequency Tuning Characteristics corresponding to design object antenna 4.But, at this moment can be by for example integrated circuit 5 being attached in impedance matching element 4 " attachment point 7a come this variation of compensating frequency tuning characteristic, thereby attachment point 7a is intended to for impedance ground matching element 4 in the situation of the frequency Tuning Characteristics of the operating frequency that causes the off-design target antenna in the situation without any compensation corresponding to have the physical size more much smaller than the physical size of design object antenna at etching antenna 4 in this example " impedance matching element 4 " that loop-length.
After etching process and after the etchant on the substrate 3 of assembly 2 washed away, can determine etchant to the effect degree of conductive coating by checking etching designator 10, etchant to the effect of conductive coating provide with etching process during the configuration of etching conducting wire, be the relevant information of the degree of antenna pattern 4 of RFID label 1 in above-mentioned example.When comparing with the citation form of etching designator for example shown in Figure 4 or shape, the actual etching antenna pattern good degree corresponding with the design object antenna indicated in the variation of etching designator 10.Based on the inspection to those variations of etching designator 10, can determine the variation of the frequency Tuning Characteristics of the variation of size of antenna pattern and antenna 4.For example, as mentioned above, if the effect of etching designator 10 indication etchants low so that not yet obtain the design object antenna configuration, then this causes the difference of the frequency Tuning Characteristics between actual antennas 4 and the design object antenna 4.But, can by integrated circuit 5 being attached among that attachment point 7a, 7b, 7c, 7d or the 7e corresponding with the variation of the frequency Tuning Characteristics of antenna 4, come this variation of compensating frequency tuning characteristic.Integrated circuit 5 is attached to the impedance matching loop 4 of antenna 4 " different attachment point 7a to 7e in the different frequency tuning characteristic of antenna 4 is provided.Thus, by using etching designator 10, might determine etchant to the effect degree of conductive coating and determine thus may the changing of frequency Tuning Characteristics when comparing with design object antenna 4, and then, by selecting the suitable attachment point of integrated circuit 5, the frequency tuning that might compensate the antenna that is derived from etching process changes, and is more approaching or be in the design object value fully, and thereby provides the RFID label of can working.Therefore, the etch process deviation can be after a while in RFID label manufacture process for example by integrated circuit 5 is inserted in impedance matching element 4 " in suitable attachment point proofread and correct.This means that no matter the deviation of etch process is same, the RFID label antenna assembly 2 that is included in the low-qualityer antenna 4 in frequency Tuning Characteristics aspect also can be used in the manufacturing of RFID label.This appearance by the waste product antenna blank that reduces or prevent from causing because of the etch process deviation has fully reduced manufacturing cost.Can be for example by the inspection to etching designator 10 be provided with camera technology and image recognition technology.
In the embodiment according to Fig. 2, etching designator 10 is arranged on the intra-zone that the radiant element 4 ' of antenna 4 is limit, but etching designator 10 can be arranged on any appropriate location in the assembly 2, in this position, the remainder of the etching designator 10 after the etching process does not have the operation of potato masher antenna 4.
In above-mentioned example, etching designator 10 uses with antenna 4, and wherein antenna 4 comprises the impedance matching antenna 4 that comprises for the some different attachment point 7a to 7e of integrated circuit 5 ".But, etching designator 10 also can with only have for one of integrated circuit 5 may attachment point antenna pattern use.In this case, the inspection of etching designator 10 can be used for indicating the frequency tuning character of the etching antenna 4 before any integrated circuit is attached in antenna 4.In this way, might be by integrated circuit 5 and paste 6 and antenna module 2 be abandoned all at defectiveness antenna module aspect the frequency Tuning Characteristics before the attached structure of finishing the RFID label.
Note that the size of the etching designator 10 that Fig. 2 and Fig. 4 are extremely shown in Figure 7 not in proportion, but the size of only having amplified for convenience of explanation and greatly etching designator 10.In fact, the etching indicator size is more much smaller than the etching indicator size in the accompanying drawing, in order to can cross or to owe the etching situation more responsive antenna.In fact, for example depend on the impedance matching element 4 in the UHF antenna " shape and size, etching designator 10 designed accordingly and definite size so that sensitivity, thereby indicate the etching state of such antenna module.In addition, the attachment point 7a to 7e of integrated circuit also is designed to have suitable tuning range, so that can the compensate for typical etch bias.The design of etching designator 10 is intended to optimize it to the sensitivity of typical etch bias, and the design of attachment point 7a to 7e is intended to accurately to compensate tuning range and the impact of this deviation when integrated circuit is attached to suitable attachment point.
Should also be noted that, the antenna structure here is example, and therefore the actual antennas design can omit independent radiant element and only based on impedance matching element 4 " similar circular element, perhaps it can omit radiant element 4 ' and impedance matching element 4 " between current coupling part 4 ' ' ' and alternatively be coupled based on inductance/capacitance.The example that comprises in the accompanying drawing is intended to only to emphasize some representative region for the antenna structure of etch bias sensitivity.
As measuring to affect tuning the replenishing or substituting of the RFID label after the antenna etch phase with the etching designator of any attachment point of integrated circuit 5 that be used for to select RFID label 1 or any other, the conditioned disjunction state of etching designator also can be used for controlling etching process, for example the composition of the duration of etching process or etchant.This control can be arranged to use by the etching process operating personnel visual examination of etching designator is carried out, and perhaps it also can be arranged to use machine vision or similar techniques automatically to carry out.
As to the selection of the suitable attachment point that is used for integrated circuit substitute or replenish other measure also and can provide based on the etching designator after the etching of antenna structure.These include but not limited to that for example the tuning structure of possibility lamination comes partial alteration's antenna conductor structure with the radio frequency behavior that affects etching antenna except electric conducting material and/or by the interpolation electric conducting material or by adding independently at antenna module 2 by for example cutting via laser tuning or stamping after the etching.For example, this additional tuning structure that can have the loop form can for example be selected from a series of different sizes, and is attachable to a series of zoness of different, and it can be changed into and etching antenna structure inductance or capacitive coupling.
In above-mentioned example, etching designator 10 is used in the manufacturing of RFID label.But, the etching designator 10 of similar kind can be used for comprising in the manufacturing of any other electric antenna module of conducting wire configuration, be used to indicate etchant to the effect of conductive coating, and determine thus with respect to the antenna module of design object antenna module the conducting wire configuration, be the electrical characteristics of the part of antenna or antenna.In this way, for example might before any integrated circuit is arranged on the assembly, determine whether this assembly is suitable as the part of electric equipment.
Fig. 5 is the top view of the second etching designator 10 or the second etching designator pattern 10.Also comprise a plurality of parts of pattern according to the etching designator 10 of Fig. 5, i.e. line 11a, 11b, 11c, 11d and 11e, they relative to each other are configured to continuous lines.Among Fig. 5, the end of line 11a to 11e is arranged to be in contact with one another, but line 11a to 11e also can be arranged to have little gap between the end of line.Similarly, as mentioned above, median line 11c forms the reference section of etching designator pattern 10 so that the design object configuration has been reached in the disappearance indication conducting wire configuration of the line 11c during the etching process or size may be set up.
When etching designator 10 comprised a plurality of parallel or continuous lines that relative to each other has different in width, etching designator 10 can be easy to be realized and detects.Etching designator form and large I especially are designed to be used in machine vision or other automatic partition analysis method is easy to understand.The automatic analysis result of this class can further be arranged to control the integrated circuit location of making on the line, perhaps controls based on any other of analysis result and measures.
Fig. 4 and Fig. 5 illustrate two different embodiment of etching designator 10, but the embodiment of other kind of etching designator 10 also is possible naturally.Other possible geometrical arrangements can comprise for example concentric ring, rectangle or other shape.
Fig. 6 illustrates and can be used in the top view of making according to the etching mask 12 in the antenna module 2 of Fig. 2.Etching mask is used for by come removal and the maintenance of Partial controll conductive coating with etchant.In assembly 2, during the etching of beginning antenna 4, be arranged on the substrate 3 that comprises conductive coating according to the etching mask 12 of Fig. 6.Etching mask 12 comprises the first main region 13 and the second main region 13 ' and the 3rd main region 13 of etching mask 12 " on etching mask material or barrier material; the shape of the radiant element 4 ' of the antenna 4 that the shape of the first main region 13 will keep corresponding to during etching; the impedance matching element 4 of the antenna 4 that the shape of the second main region 13 ' will keep corresponding to during etching " shape, and the 3rd main region 13 " the coupling element 4 of the shape antenna 4 that will keep corresponding to during etching " ' shape.Etching mask also comprises the barrier material on the subregion 14 that is arranged on the intra-zone that the first main region 13 limits.Subregion 14 comprises five lines of the barrier material that relative to each other has different in width, is used to form the line of the conductive coating corresponding with the line 11a to 11e of etching designator 10 shown in Figure 4.
Usually, etching mask 12 is arranged on the conductive coating that substrate 3 supports, so that in the phase I, apply whole substrate by mask material or anticorrosive additive material.After this, expose mask pattern in mask material, and then remove exposure or the unexposed portion of mask material by etchant, this depends on the positive or negative photoresistance mask material of use.In the etching of antenna, usually use negative photoresistance mask material.The mode of other kind that those skilled in the art is general known also can be used for etching mask 12 is arranged on the substrate 3, for example uses the resist protective material such as paint.But, be most frequently used in etching fine pattern or the line configuring based on the said method of photoetching.
On the assembly 2 that comprises the substrate 3 that contains conductive coating, be provided with after the etching mask 12 according to Fig. 6, etchant is applied on the assembly 2.Etchant is removed the conductive coating on the part of the coating be not subject to the barrier material protection so that conductive coating be retained in etching mask 12 the one 13, the 2 13 ' and the 3 13 " in zone corresponding to main region and subregion 14.Therefore, assembly 2 is being carried out etched certain point, assembly 2 comprises at least to a certain extent the conducting wire configuration corresponding with design object antenna pattern 4.Similarly, carrying out etched certain point, depend on etchant to the effect of etching designator 10, assembly 2 does not also comprise line 11a to 11e at all, does not at least part ofly comprise at least some line 11a to 11e or does not comprise wired 11a to 11e fully.The other parts of conductive coating are removed from assembly 2 by etchant.
No matter the protective layer of barrier material but at least some line 11a to 11e may at least part of removed reason be derived from etchant is also removed conductive coating to the side under the protection barrier material the fact during the etching process.Therefore, the barrier material in the etching mask is dimensioned to considers that etchant advances to the side under barrier material, so that the size of the configuration of the conducting wire after the etching is as much as possible corresponding to the design object size of antenna 4.
Fig. 2 illustrates and comprises and be intended to indicate etchant only to the individual antenna assembly 2 of the etching designator 10 of the effect of that specific components 2.Fig. 7 is the top view of three group of 15 antenna module 2, and wherein in the embodiment shown in fig. 7, every group 15 comprises three antenna modules 2 adjacent one another are.But, wherein one group of assembly can comprise some groups of assemblies of the assembly of any right quantity adjacent one another are, for example thousands of groups of assemblies can be arranged to form long ribbon shape structure 16, this structure 16 moves forward in etching process continuously, so that every group of 15 assembly 2 are exposed to the effect special time period of etchant in etching machine.In the embodiment of Fig. 7, only be provided with an etching designator 10 for every group 15, etching designator 10 is arranged on the marginal portion 17 of band, that is, and near the antenna module 2.In this embodiment, this single etching designator 10 is used to indicate etchant to the effect of the conductive coating in each of the assembly 2 that belongs to same particular group 15.Among Fig. 7, the form that assembly 2 is had after etching process with them illustrates, and, comprises antenna pattern 4 that is, but for reason clearly, etching designator 10 illustrates with its original design shape or form.Again, compare with antenna module, the etching designator does not illustrate by its correct proportions, but has been exaggerated for clarity.
In the embodiment according to Fig. 7, be intended to indicate etchant also can be placed on antenna module 2 inside of group 15 rather than the edge 17 of band structure 16 to the single etching designator 10 of the effect of the conductive coating in each of the assembly 2 that belongs to same particular group 15.But, also possiblely be that each assembly 2 in the group 15 comprises etching designator 10, perhaps only exists to be intended to indicate etchant to an etching designator of the effect of the assembly 2 in some continuous group 15.
Those skilled in the art is apparent, and along with the progress of technology, inventive concept can realize by variety of way.The present invention and embodiment are not limited to above-mentioned example, but can change within the scope of claims.
Claims (26)
1. one kind is used for making the method for antenna module (2) by etching, described assembly comprises the conducting wire configuration (4) that substrate (3) and described substrate (3) support, and in described method, form described conducting wire configuration (4) by fall the conductive coating that described substrate (3) supports via the etchant local etching, it is characterized in that, indicate the etching degree of described antenna module (2) by etching designator (10), described etching designator (10) be arranged on that described antenna module (2) to be etched is located or described antenna module (2) to be etched near, and supported and formed in the identical conduction coating that during etching is exposed to etchant by the described substrate (3) of described antenna module (2).
2. the method for claim 1, it is characterized in that, indicate the effect degree of the described conductive coating that described etchant supports described substrate (3) by described etching designator (10), described etchant provides the information relevant with the etching degree of the described conducting wire configuration (4) of described antenna module (2) to the effect degree of described conductive coating.
3. method as claimed in claim 1 or 2 is characterized in that, described etching designator (10) comprises a plurality of parts of pattern, and described part relative to each other has the identical characteristics of different size.
4. method as claimed in claim 3 is characterized in that, the described quantity of the part of the pattern that disappears by during etching is indicated the etching degree of the described conducting wire configuration (4) of described antenna module (2).
5. such as claim 3 or 4 described methods, it is characterized in that the described part of pattern is a plurality of parallel or continuous lines (11a, 11b, 11c, 11d, 11e) that relative to each other has different in width.
6. such as each the described method in the above claim, it is characterized in that, described etching designator (10) comprises the reference section (11c) of described etching designator (10), and the disappearance of described part (11d, 11e) of pattern of only having described reference section (11c) and having a described etching designator (10) of the during etching characteristic less than the corresponding characteristic of described reference section (11c) indicates the described conducting wire configuration (4) of described antenna module (2) to etch into and the degree of expecting that the etching degree is corresponding.
7. such as each the described method in the above claim, it is characterized in that, adjust described etching process based on the etching degree of described etching designator (10).
8. such as each the described method in the above claim, it is characterized in that, described antenna module (2) is intended to form the part of RFID tags (1) or the RFID label (1) comprise integrated circuit (5), and described conducting wire configuration (4) is intended to form at least a portion of the antenna (4) of described RFID label (1) thus.
9. method as claimed in claim 8 is characterized in that, described antenna (4) comprises radiant element (4 ') and impedance matching element (4 ") at least.
10. method as claimed in claim 9, it is characterized in that the described impedance matching element of described antenna (4) (4 ") comprises for may attachment point (7a, 7b about a plurality of of described impedance matching element (4 ") attached described integrated circuit (5), 7c, 7d, 7e), and be identified for the described specific attachment point (7a of described integrated circuit (5) based on the etching degree of described etching designator (10), 7b, 7c, 7d, 7e).
11. as each described method in the above claim, it is characterized in that, etching degree based on the described etching designator (10) after the etching of described antenna (4), by removing or adding electric conducting material or by adding the independent tuning structure at described antenna module (2) to affect the radio frequency behavior of described antenna (4), come the described antenna conductor structure of local change.
12. an antenna module (2) or one group of (15) antenna module (2), described assembly (2) comprises the conducting wire configuration (4) that substrate (3) and described substrate (3) support, it is characterized in that, at least in certain fabrication stage of described at least one antenna module (2), described antenna module (2) locate or at least one antenna module (2) near have at least one etching designator (10), described etching designator (10) provides the information relevant with the etching degree of described at least one antenna module (2), and the identical conduction coating that is supported by described substrate (3) forms.
13. antenna module as claimed in claim 12 (2) or one group of (15) antenna module (2), it is characterized in that, described etching designator (10) is arranged to indicate the effect degree of the described conductive coating that described etchant supports described substrate (3), and described etchant provides the information relevant with the etching degree of the described conducting wire configuration (4) of described antenna module (2) to the effect degree of described conductive coating.
14. such as claim 12 or 13 described antenna modules (2) or one group of (15) antenna module (2), it is characterized in that, described etching designator (10) comprises a plurality of parts of pattern, and described part relative to each other has the identical characteristics of different size.
15. antenna module as claimed in claim 14 (2) or one group of (15) antenna module (2), it is characterized in that the described quantity of the part of the pattern that disappears at the during etching of at least one antenna module (2) is arranged to indicate the etching degree of the described conducting wire configuration (4) of described at least one antenna module (2).
16., it is characterized in that the described part of pattern is a plurality of parallel or continuous lines (11a that relative to each other has different in width such as the described antenna module of claims 14 or 15 (2) or one group of (15) antenna module (2), 11b, 11c, 11d, 11e).
17. such as each described antenna module (2) or one group of (15) antenna module (2) among the claim 12-16, it is characterized in that, described etching designator (10) comprises the reference section (11c) of described etching designator (10), and only having described reference section (11c) and having during etching wants the described conducting wire configuration (4) of disappearance described at least one antenna module of indication (2) of described part (11d, 11e) of pattern of the described etching designator (10) of little characteristic to be etched to the degree corresponding with desired etching degree than the corresponding characteristic of described reference section (11c).
18. such as each described antenna module (2) or one group of (15) antenna module (2) among the claim 12-17, it is characterized in that, described antenna module (2) is intended to form the part of the RFID tags (1) or the RFID label (1) that comprise integrated circuit (5), and described conducting wire configuration (4) is intended to form the antenna (4) of described RFID label (1) thus.
19. antenna module as claimed in claim 18 (2) or one group of (15) antenna module (2), it is characterized in that, described antenna (4) comprises radiant element (4 ') and impedance matching element (4 ") at least; the described impedance matching element of described antenna (4) (4 ") comprises for may attachment point (7a; 7b; 7c, 7d, 7e) about attached a plurality of of described impedance matching element (4 ") with described integrated circuit (5).
20. one kind is used for making the etching mask (12) of antenna module (2) by etching, described assembly (2) comprises the conducting wire configuration (4) that substrate (3) and described substrate (3) support, described conducting wire configuration (4) forms by the conductive coating that falls described substrate (3) via the etchant local etching and support, described etching mask (12) is determined the described conducting wire configuration (4) of described assembly (2), it is characterized in that, described etching mask (12) comprises at least one main region (13 corresponding to described conducting wire configuration (4) that will keep with during etching, 13 ') barrier material on, and described etching mask (12) also comprises the barrier material that is used to form the coat composed etching designator of the identical conduction that is supported by described substrate (3) (10) at least one subregion (14), and described etching designator (10) is arranged to indicate the etching degree of described antenna module (2).
21. etching mask as claimed in claim 20 (12), it is characterized in that, the described subregion (14) that comprises the barrier material that is used to form etching designator (10) be arranged in described etching mask (12) that described antenna module (2) to be etched is located or described antenna module (2) to be etched near.
22. such as claim 20 or 21 described etching masks (12), it is characterized in that, the described subregion (14) that comprises the barrier material that is used to form etching designator (10) comprises a plurality of parts of pattern, and described part relative to each other has the identical characteristics of different size.
23. etching mask as claimed in claim 22 (12) is characterized in that, the described part of pattern is corresponding to having the relative to each other a plurality of parallel or continuous lines (11a, 11b, 11c, 11d, 11e) of different in width.
24. such as each the described etching mask (12) among the claim 20-23, it is characterized in that, described antenna module (2) is intended to form the part of the RFID tags (1) or the RFID label (1) that comprise integrated circuit (5), and described conducting wire configuration (4) is intended to form the antenna (4) of described RFID label (1) thus.
25. etching mask as claimed in claim 24 (12), it is characterized in that, described antenna (4) comprises radiant element (4 ') and impedance matching element (4 ") at least, thus described etching mask (12) comprise at least the barrier material corresponding with the described radiant element (4 ') of described antenna (4) the first main region (13) and with the second main region (13 ') of barrier material corresponding to the described impedance matching element of described antenna (4) (4 ").
26. etching mask as claimed in claim 25 (12), it is characterized in that, described second main region (13 ') of barrier material comprises be used to providing described integrated circuit (5) about the attached a plurality of barrier materials that may attachment point (7a; 7b; 7c; 7d, 7e) of the described impedance matching element of described antenna (4) (4 ").
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/FI2010/050349 WO2011135153A1 (en) | 2010-04-29 | 2010-04-29 | Method for manufacturing an antenna component by etching |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103081101A true CN103081101A (en) | 2013-05-01 |
| CN103081101B CN103081101B (en) | 2016-01-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201080067690.2A Expired - Fee Related CN103081101B (en) | 2010-04-29 | 2010-04-29 | A kind of antenna module and method and etching mask for being manufactured antenna module by etching |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101644493B1 (en) |
| CN (1) | CN103081101B (en) |
| WO (1) | WO2011135153A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103972640A (en) * | 2014-04-17 | 2014-08-06 | 杭州电子科技大学 | Ultrahigh RFID near field antenna |
| CN111190059A (en) * | 2018-11-15 | 2020-05-22 | 铨鼎塑胶股份有限公司 | System for measuring and adjusting antenna radiation pattern |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06302934A (en) * | 1993-04-12 | 1994-10-28 | Sharp Corp | Etching method for printed wiring board |
| US6535175B2 (en) * | 2000-06-01 | 2003-03-18 | Intermec Ip Corp. | Adjustable length antenna system for RF transponders |
| CN101501930A (en) * | 2006-08-14 | 2009-08-05 | 泰科电子瑞侃株式会社 | Antenna element and method for manufacturing same |
| US20100090833A1 (en) * | 2008-10-03 | 2010-04-15 | Neology, Inc. | Non-transferable radio frequency identification label or tag |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6030903A (en) * | 1998-11-05 | 2000-02-29 | Lucent Technologies Inc. | Non-destructive method for gauging undercut in a hidden layer |
| JP4905934B2 (en) | 2005-12-27 | 2012-03-28 | サムコ株式会社 | Plasma processing method and plasma apparatus |
-
2010
- 2010-04-29 KR KR1020127031167A patent/KR101644493B1/en active IP Right Grant
- 2010-04-29 WO PCT/FI2010/050349 patent/WO2011135153A1/en active Application Filing
- 2010-04-29 CN CN201080067690.2A patent/CN103081101B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06302934A (en) * | 1993-04-12 | 1994-10-28 | Sharp Corp | Etching method for printed wiring board |
| US6535175B2 (en) * | 2000-06-01 | 2003-03-18 | Intermec Ip Corp. | Adjustable length antenna system for RF transponders |
| CN101501930A (en) * | 2006-08-14 | 2009-08-05 | 泰科电子瑞侃株式会社 | Antenna element and method for manufacturing same |
| US20100090833A1 (en) * | 2008-10-03 | 2010-04-15 | Neology, Inc. | Non-transferable radio frequency identification label or tag |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103972640A (en) * | 2014-04-17 | 2014-08-06 | 杭州电子科技大学 | Ultrahigh RFID near field antenna |
| CN103972640B (en) * | 2014-04-17 | 2017-01-25 | 杭州电子科技大学 | Ultrahigh RFID near field antenna |
| CN111190059A (en) * | 2018-11-15 | 2020-05-22 | 铨鼎塑胶股份有限公司 | System for measuring and adjusting antenna radiation pattern |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103081101B (en) | 2016-01-06 |
| WO2011135153A1 (en) | 2011-11-03 |
| KR101644493B1 (en) | 2016-08-10 |
| KR20130098164A (en) | 2013-09-04 |
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