CN103077908A - Wafer cleaning device and process thereof - Google Patents
Wafer cleaning device and process thereof Download PDFInfo
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- CN103077908A CN103077908A CN201210401230XA CN201210401230A CN103077908A CN 103077908 A CN103077908 A CN 103077908A CN 201210401230X A CN201210401230X A CN 201210401230XA CN 201210401230 A CN201210401230 A CN 201210401230A CN 103077908 A CN103077908 A CN 103077908A
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Abstract
The present invention relates to a wafer cleaning device and a process thereof, and particularly, to the wafer cleaning device which can totally eliminate wafer particles for providing high-quality wafers in the cleaning process for removing the wafer particles and the process thereof.
Description
Technical field
The present invention relates to wafer cleaner and operation method thereof, in more detail, can not remove wafer cleaner and the operation method thereof that above-mentioned particle provides the wafer of high-quality fully with neutral lotion even relate in the cleaning process that is used for removal wafer particle yet.
Background technology
In general, comprise in the wafer manufacturing process process wafer polishing operation of using chemical/mechanical polishing equipment (CMP equipment) etc. to carry out, be used for removing the wafer cleaning operation of the particle (Particle) of the impurity that conduct produces in above-mentioned wafer polishing operation.
In this wafer cleaning operation, in order to improve the cleaning force of the horizontal type brush of carrying type, as shown in Figure 1, repeatedly the neutral lotions such as chemicals (chemical) are appended to the particle that removes wafer in the matting and are used as final operation.
Yet although there is the requirement that should remove easily the particle on the wafer when using neutral lotion with the operation of brush brush, there is the problem that still has the sessile form particle residue after the end matting in the wafer cleaning operation that the neutral lotion of this utilization carries out.
And, because the wafer cleaning operation need to use neutral lotion, thereby the problem that exists the manufacturing unit price of wafer to rise.
Summary of the invention
The present invention proposes in order to address the above problem, the object of the invention is to, provide following wafer cleaner and operation method thereof: after initially cleaning the wafer that is accommodated in the box by ultra-pure water, the step of again cleaning, namely, the rotating brush that rotates separately by with above-mentioned wafer rotation the time, and the centrifugal force that above-mentioned wafer time rotational is produced is set as for the parameter of removing separately particle (parameter), do not use neutral lotion only individually to clean above-mentioned wafer after above-mentioned initial cleaning with ultra-pure water, thereby can improve cleaning force.
And a further object of the present invention is, provides because not using neutral lotion can reduce wafer cleaner and the operation method thereof of the manufacturing unit price of wafer.
And, another object of the present invention is to, provide to have a plurality ofly for realizing that the unit that again clean can clean a large amount of wafers at short notice, thereby can shorten wafer cleaner and the operation method thereof of matting required time.
In order to solve aforesaid technical problem, wafer cleaner of the present invention comprises: the first cleaning part, for the wafer that is accommodated in the box, utilize the nitrogen foam to clean above-mentioned wafer at the impregnating unit that contains ultra-pure water; The second cleaning part with the adjacent setting of above-mentioned the first cleaning part, is positioned over rotary chuck with the above-mentioned wafer after cleaning, and again cleans above-mentioned wafer by rotation and the rotating brush of above-mentioned rotary chuck; Drying section with the adjacent setting of above-mentioned the second cleaning part, is used for the above-mentioned wafer after again cleaning is carried out drying; Handover section, for transferring above-mentioned wafer from above-mentioned the first cleaning part to above-mentioned the second cleaning part or transferring above-mentioned wafer from above-mentioned the second cleaning part to above-mentioned drying section, this handover section has wafer processor; And control part, be used for controlling above-mentioned the first cleaning part, the second cleaning part, drying section and handover section.
And preferably, above-mentioned the second cleaning part is with a plurality of cell formations, with the operation of repeatedly carrying out repeatedly above-mentioned wafer being cleaned again..
And, preferably, comprising the first distributing nozzle in above-mentioned the second cleaning part, this first distributing nozzle is used for spraying ultra-pure water to the rotary chuck direction.
And, preferably, also have transferring arm in the above-mentioned handover section.
And, preferably, having dry chuck in the above-mentioned drying section, this drying chuck is used for making the wafer rotation via above-mentioned the second cleaning part.
Wafer cleaning method of the present invention may further comprise the steps: step 1), will be accommodated in wafer storage in the box in the ultra-pure water of accommodating at impregnating unit, and utilize for the first time step of clean wafers of nitrogen foam; Step 2), utilize rotary chuck and rotating brush to use ultra-pure water again to clean through above-mentioned steps 1) after the step of wafer; Step 3) is to through above-mentioned steps 2) after wafer carry out dry step.
And, preferably, above-mentioned steps 2) in, above-mentioned rotary chuck and rotating brush are respectively by positive direction or contrary direction rotation, and above-mentioned rotary chuck cleans above-mentioned wafer with rotating brush by mutual different direction rotation.
At this moment, preferably, above-mentioned rotating brush scans mobile on one side on one side from the center one lateral edge direction of above-mentioned wafer.
And, preferably, above-mentioned steps 2) undertaken by a plurality of unit, to clean successively above-mentioned wafer, the wait state that the some at least unit in above-mentioned a plurality of unit are repeatedly realized cleaning the operating state of above-mentioned wafer or do not cleaned above-mentioned wafer.
And, preferably, above-mentioned steps 2) in, under wait state, use ultra-pure water to clean above-mentioned rotating brush.
According to the present invention, by ultra-pure water is initial clean the wafer that is accommodated in the box after, the step of again cleaning, namely, the rotating brush that rotates separately by with above-mentioned wafer rotation the time, and the centrifugal force that above-mentioned wafer time rotational is produced is set as for the parameter of removing separately particle, do not use neutral lotion only individually to clean above-mentioned wafer after above-mentioned initial cleaning with ultra-pure water, thereby has the effect that can improve cleaning force.
And, because not using neutral lotion, and have the effect of the manufacturing unit price that can reduce wafer.
And, have a plurality of unit for realizing again cleaning, can clean at short notice a large amount of wafers, thereby have the effect that can shorten the matting required time.
Description of drawings
Fig. 1 represents the cleaning device of the neutral lotion clean wafers of utilization in the past.
Fig. 2 represents the wafer cleaner of embodiments of the invention.
Fig. 3 represents the first cleaning part of the wafer cleaner of embodiments of the invention.
Fig. 4 represents the second cleaning part of the wafer cleaner of embodiments of the invention.
Fig. 5 represents the drying section of the wafer cleaner of embodiments of the invention.
Fig. 6 is the block diagram of the wafer cleaning method of expression embodiments of the invention.
Embodiment
Below, describe with reference to the structure of accompanying drawing to embodiments of the invention.
At first, with reference to Fig. 2, the wafer cleaner 1 of embodiments of the invention comprises the section of setting 10, the first cleaning part 20, the second cleaning part 30, drying section 40, handover section 50 and control part 60 substantially.
At first, the structure member that section 10 arranges as the first cleaning part 20, the second cleaning part 30, drying section 40, handover section 50 and the control part 60 that supply hereinafter is set, by being combined into of horizontal frame and vertical frame.
And the first cleaning part 20 is fixedly installed on the section of setting 10, and this first cleaning part 20 comprises impregnating unit 21 and foam jet (Bubble Nozzle) 27 as the structure member that the wafer W that is accommodated among the box C is cleaned with ultra-pure water and nitrogen foam.
, as shown in Figure 3, form the receiving space 23 that can accommodate ultra-pure water in the bottom of impregnating unit 21 here, whole to accommodate the box C that takes in wafer W.
At this moment, impregnating unit 21 can have the lowering or hoisting gear (not shown) that carries out the rise/fall action, accommodates to use ultra-pure water to accommodate box C or the releasing of taking in wafer W.
And preferably, impregnating unit 21 also has fixed mechanism 25, is out of shape because of handover section 50 with the position that prevents box C.
And foam jet 27 arranges in the mode adjacent with impregnating unit 21, and this foam jet 27 is used for generating the nitrogen foam to the inboard of ultra-pure water.
And, the second cleaning part 30 is arranged on the section of setting 10 in the mode adjacent with the first cleaning part 20, this second cleaning part 30 comprises rotary chuck 31, rotating brush 33 and the first distributing nozzle 35 as the structure member that is used for again cleaning the wafer W after above-mentioned the first cleaning part 20 cleans.
, as shown in Figure 4, form placing component 31a at rotary chuck 31 here, this placing component 31a is positioned over the top of CD-ROM drive motor 31b in the mode of the outer peripheral face of encirclement wafer W.
And rotating brush 33 is formed at the top of above-mentioned rotary chuck 31 in the mode of the predetermined distance of being separated by, and rotating brush 33 comprises with the brush 33a of the upper surface friction of the wafer W that is placed on placing component 31a and is used for driving the CD-ROM drive motor 33b of above-mentioned brush 33a.
At this moment, the second cleaning part 30 has for the first distributing nozzle 35 of supplying with ultra-pure water, and above-mentioned the first distributing nozzle 35 has to the upper surface of the wafer W that is placed on placing component 31a supplies with ultrapure Water structure.
And preferably, the second cleaning part 30 is arranged on the section of setting 10 with a plurality of unit.
And, drying section 40 is arranged on the section of setting 10 in the mode adjacent with the second cleaning part 30, this drying section 40 carries out dry structure member as the wafer W that is used for after cleaning through above-mentioned the second cleaning part 30, comprises anti-disperse film 41, dry chuck 43 and the second distributing nozzle 45.
, form spatial portion 41a in the inboard of the anti-film 41 that disperses here, form peristome 41b on the top of the anti-film 41 that disperses, wafer W this peristome 41b that comes in and goes out.
And dry chuck 43 is formed at the inboard of the anti-film 41 that disperses, and this drying chuck 43 can rotate by CD-ROM drive motor under wafer W is fixed the state of placing.
And the second distributing nozzle 45 is arranged at the inboard of the anti-film 41 that disperses, and is used for supplying with ultra-pure water to the upper surface of wafer W.
At this moment, preferably, also form tap 47 at drying section 40, so that the ultra-pure water that disperses along with the rotation of above-mentioned dry chuck 43 is discharged to the outside along the inwall of the anti-film 41 that disperses.
And handover section 50 is arranged on the section of setting 10, and this handover section 50 comprises wafer processor (handler) 51 and transferring arm 53 as the structure member that is used for transferring respectively to the first above-mentioned cleaning part 20, the second cleaning part 30 and drying section 40 wafer W.
Here, wafer W is taken in or drawn to wafer processor 51 along the rail moving that is formed on the section of setting 10.
At this moment, preferably, above-mentioned wafer processor 51 is arranged between the first cleaning part 20 and the second cleaning part 30 or is separately positioned between the second cleaning part 30 and the drying section 40, takes in or draw wafer W.
And transferring arm 53 is accommodated wafer W or is drawn wafer W at the second cleaning part 30 with individual unit or a plurality of cell formations along the rail moving that is formed on the section of setting 10.
And control part 60 is as the structure member that is used for control the first cleaning part 20, the second cleaning part 30, drying section 40 and handover section 50, can be arranged on the section of setting 10 or arranges separately and carry out automatically controlled according to operational environment.
Below, will describe wafer cleaning method of the present invention as the basis take said structure.
At first, the box C that takes in wafer W is accommodated the impregnating unit 21 that contains ultra-pure water, generate the nitrogen foam by foam jet 27 in the inboard of above-mentioned ultra-pure water, implement to clean for the first time the step (step S10) of above-mentioned wafer W
Then, in the box C that takes in the wafer W after cleaning for the first time, utilize wafer processor 51 above-mentioned wafer W to be positioned over the rotary chuck 31 of the second cleaning part 30, when utilizing the rotation of the rotation of above-mentioned rotary chuck 31 and rotating brush 33, supply with the ultra-pure water of being supplied with by the first distributing nozzle 35 to the upper surface of above-mentioned wafer W, implement the step of cleaning for the second time.(step S20)
At this moment, preferably, in the above-mentioned second time cleaning step, in order to improve the efficient of the impurity of removing wafer W, if rotary chuck 31 is by the positive direction rotation, then make rotating brush 33 move one side by contrary direction rotation to the edge direction of above-mentioned wafer W on one side, impurity is discharged to the outside, so clean.
Simultaneously, cleaning step is undertaken by a plurality of unit for the second time, with a plurality of wafer W of easy cleaning, some at least unit in above-mentioned a plurality of unit move by transferring arm 53 on one side and carry out the cleaning second time on one side, with the wait state that repeatedly realizes cleaning the operating state of above-mentioned wafer W and do not clean above-mentioned wafer W.
And then, preferably, in the cleaning step, under wait state, utilize the ultra-pure water of the first distributing nozzle 35 to clean rotating brush 33 for the second time.
That is, under the wait state of not cleaning wafer W, the ultra-pure water of the first distributing nozzle 35 is put into rotating brush 33 remove the impurity that may in the cleaning step second time (step S20), adhere to, thereby the above-mentioned wafer W of high-quality is provided.
Then, transfer wafer W behind second time cleaning step with transferring arm 53, and this wafer W is placed on dry chuck 43 implements drying steps, wherein, dry chuck 43 is arranged on the inboard (step S30) of the anti-film 41 that disperses
At this moment, preferably, in the drying steps, utilize the ultra-pure water that is dropped into by the second distributing nozzle 45 to carry out implementing behind the rinsing process drying of wafer W.
Namely, behind above-mentioned rinsing process, if be placed with dry chuck 43 rotations of wafer W, will produce centrifugal force, residual impurity together disperses with the ultra-pure water that is present in above-mentioned wafer W, and the ultra-pure water that disperses and impurity are discharged to the outside by tap 47 along the inwall of the anti-film 41 that disperses.
Then, if drying steps (step S30) finishes, just utilize wafer processor 51 to be transplanted on operation afterwards, wafer cleaning method of the present invention finishes at this point.
The scope that the present invention asks for protection is not limited to above-described embodiment, so long as the those of ordinary skill in relevant art field just can be understood, in the scope that does not exceed thought of the present invention and technical field, can carry out various modifications and distortion to the present invention.
Claims (10)
1. a wafer cleaner is characterized in that, comprising:
The first cleaning part for the wafer that is accommodated in the box, utilizes the nitrogen foam to clean above-mentioned wafer at the impregnating unit that contains ultra-pure water;
The second cleaning part with the adjacent setting of above-mentioned the first cleaning part, is positioned over rotary chuck with the above-mentioned wafer after cleaning, and again cleans above-mentioned wafer by rotation and the rotating brush of above-mentioned rotary chuck;
Drying section with the adjacent setting of above-mentioned the second cleaning part, is used for the above-mentioned wafer after again cleaning is carried out drying;
Handover section is used for transferring above-mentioned wafer from above-mentioned the first cleaning part to above-mentioned the second cleaning part, or transfers above-mentioned wafer from above-mentioned the second cleaning part to above-mentioned drying section, and this handover section has wafer processor; And
Control part is used for controlling above-mentioned the first cleaning part, the second cleaning part, drying section and handover section.
2. wafer cleaner according to claim 1 is characterized in that, above-mentioned the second cleaning part is with a plurality of cell formations, with the operation of repeatedly carrying out repeatedly above-mentioned wafer being cleaned again.
3. wafer cleaner according to claim 1 is characterized in that, comprises the first distributing nozzle in above-mentioned the second cleaning part, and this first distributing nozzle is used for spraying ultra-pure water to the rotary chuck direction.
4. wafer cleaner according to claim 1 is characterized in that, also has transferring arm in the above-mentioned handover section.
5. wafer cleaner according to claim 1 is characterized in that, has dry chuck in the above-mentioned drying section, and this drying chuck is used for making the wafer rotation via above-mentioned the second cleaning part.
6. a wafer cleaning method utilizes such as each described wafer cleaner in the claim 1 to 5, and above-mentioned wafer cleaning method is characterised in that, may further comprise the steps:
Step 1) will be accommodated in wafer storage in the box in the ultra-pure water of accommodating at impregnating unit, utilizes for the first time step of clean wafers of nitrogen foam;
Step 2), utilize rotary chuck and rotating brush, and use ultra-pure water again to clean through above-mentioned steps 1) after the step of wafer;
Step 3) is to through above-mentioned steps 2) after wafer carry out dry step.
7. wafer cleaning method according to claim 6, it is characterized in that, above-mentioned steps 2) in, above-mentioned rotary chuck and rotating brush are respectively by positive direction or contrary direction rotation, and above-mentioned rotary chuck cleans above-mentioned wafer with rotating brush by mutual different direction rotation.
8. wafer cleaning method according to claim 7 is characterized in that, above-mentioned rotating brush scans mobile on one side on one side from the center one lateral edge direction of above-mentioned wafer.
9. wafer cleaning method according to claim 6 is characterized in that,
Above-mentioned steps 2) undertaken by a plurality of unit, to clean successively above-mentioned wafer;
The wait state that some at least unit in above-mentioned a plurality of unit are repeatedly realized cleaning the operating state of above-mentioned wafer or do not cleaned above-mentioned wafer.
10. wafer cleaning method according to claim 9 is characterized in that, above-mentioned steps 2) in, under wait state, use ultra-pure water to clean above-mentioned rotating brush.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20120004199 | 2012-01-13 | ||
| KR10-2012-0004199 | 2012-01-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103077908A true CN103077908A (en) | 2013-05-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210401230XA Pending CN103077908A (en) | 2012-01-13 | 2012-10-19 | Wafer cleaning device and process thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103077908A (en) |
| TW (1) | TW201330084A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108284384A (en) * | 2017-01-10 | 2018-07-17 | 株式会社迪思科 | Grinding device |
| CN113140485A (en) * | 2021-03-31 | 2021-07-20 | 中国电子科技集团公司第十三研究所 | Wafer cleaning equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000223394A (en) * | 1999-01-29 | 2000-08-11 | Dainippon Screen Mfg Co Ltd | Substrate-treating device and method for treating substrate |
| US6334902B1 (en) * | 1997-09-24 | 2002-01-01 | Interuniversitair Microelektronica Centrum (Imec) | Method and apparatus for removing a liquid from a surface |
| TW563196B (en) * | 2000-10-30 | 2003-11-21 | Dainippon Screen Mfg | Substrate processing apparatus |
| TW200818282A (en) * | 2006-05-19 | 2008-04-16 | Tokyo Electron Ltd | Susbtrate cleaning method, substrate cleaning apparatus, and program recording medium |
-
2012
- 2012-10-17 TW TW101138152A patent/TW201330084A/en unknown
- 2012-10-19 CN CN201210401230XA patent/CN103077908A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6334902B1 (en) * | 1997-09-24 | 2002-01-01 | Interuniversitair Microelektronica Centrum (Imec) | Method and apparatus for removing a liquid from a surface |
| JP2000223394A (en) * | 1999-01-29 | 2000-08-11 | Dainippon Screen Mfg Co Ltd | Substrate-treating device and method for treating substrate |
| TW563196B (en) * | 2000-10-30 | 2003-11-21 | Dainippon Screen Mfg | Substrate processing apparatus |
| TW200818282A (en) * | 2006-05-19 | 2008-04-16 | Tokyo Electron Ltd | Susbtrate cleaning method, substrate cleaning apparatus, and program recording medium |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108284384A (en) * | 2017-01-10 | 2018-07-17 | 株式会社迪思科 | Grinding device |
| CN113140485A (en) * | 2021-03-31 | 2021-07-20 | 中国电子科技集团公司第十三研究所 | Wafer cleaning equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201330084A (en) | 2013-07-16 |
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Application publication date: 20130501 |