CN103077826A - Layered ceramic capacitor - Google Patents
Layered ceramic capacitor Download PDFInfo
- Publication number
- CN103077826A CN103077826A CN2013100280559A CN201310028055A CN103077826A CN 103077826 A CN103077826 A CN 103077826A CN 2013100280559 A CN2013100280559 A CN 2013100280559A CN 201310028055 A CN201310028055 A CN 201310028055A CN 103077826 A CN103077826 A CN 103077826A
- Authority
- CN
- China
- Prior art keywords
- conductive layer
- shaped conductive
- aluminium nitride
- metal column
- ceramic capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention discloses a layered ceramic capacitor, which comprises a first U-shaped conducting layer and a second U-shaped conducting layer clamped between an aluminium nitride substrate and an aluminum oxide substrate; the aluminium nitride substrate, the first U-shaped conducting layer and the aluminum oxide substrate are provided with two first through holes which run through the aluminium nitride substrate, the first U-shaped conducting layer and the aluminum oxide substrate, first metal posts are filled in the first through holes, the aluminium nitride substrate, the second U-shaped conducting layer and the aluminum oxide substrate are provided with two second through holes which run through the aluminium nitride substrate, the second U-shaped conducting layer and the aluminum oxide substrate, and second metal posts are filled in the second through holes; each of the first metal posts and the second metal posts is composed of a central copper post and a tungsten layer wrapping the copper post; and metal patches which are used for being electrically contacted with a circuit board are fixed on the surfaces of both ends of the first metal posts and the second metal posts. The layered ceramic capacitor has high quality factor, so that high-frequency loss is reduced, and moreover, the layered ceramic capacitor has a stable temperature coefficient; secondly, the probability of the sinking of the metal surfaces in the connecting holes is greatly decreased during sintering, consequently, the production of holes is effectively prevented, and the reliability and yield of the product are increased.
Description
Technical field
The present invention relates to a kind of laminated ceramic capacitor, belong to the capacitor technology field.
Background technology
In recent years, be accompanied by the popularizing of the mobile apparatus such as portable phone, as high speed and the high frequency of the semiconductor element of the critical piece of PC etc., for the multi-layer ceramic capacitor in the machine that has been equipped on this kind electricity, in order to satisfy the characteristic as bypass capacitor, requirement small-sized, high capacity improves constantly.But there is following technical problem:
Existing ceramic capacitor volume is larger, the raising capacitance can cause taking the larger space of electronic product, therefore when reducing device volume, increase capacitance and become technological difficulties, and existing radio frequency is arranged on fixing position with load point and the earth point of electric capacity, so when antenna is mounted to circuit board, can only be installed on the circuit board ad-hoc location, can not arrange flexibly;
Secondly, ceramic capacitor need to be with being separated from each other that circuit point does that conducting connects or when doing heat conduction between the substrate two sides and processing, betiding easily and do not fill up fully in the connecting hole and hole is arranged, thereby at the yield keyholed back plate of product its bottleneck is arranged on the substrate two sides.Therefore, how to solve the problems of the technologies described above, become the direction that those of ordinary skills make great efforts.
Summary of the invention
The object of the invention provides a kind of laminated ceramic capacitor, and this ceramic capacitor has high quality factor under high frequency, thereby has reduced high-frequency loss, and has stable temperature coefficient; Secondly, the metal surface when greatly having fallen sintering in the connecting hole produces the probability of depression, thereby has effectively avoided empty generation, has improved reliability and the yield of product.
For achieving the above object, the technical solution used in the present invention is: a kind of laminated ceramic capacitor, comprise aluminium nitride chip and alumina substrate, accompany between this aluminium nitride chip and the alumina substrate to have and be positioned at the conplane first U-shaped conductive layer, the second U-shaped conductive layer, electricity isolation between this first U-shaped conductive layer and the second U-shaped conductive layer; Have two the first intercommunicating pores that connect the three in described aluminium nitride chip, the first U-shaped conductive layer and the alumina substrate, be filled with the first metal column in this first intercommunicating pore, have two the second intercommunicating pores that connect the three in described aluminium nitride chip, the second U-shaped conductive layer and the alumina substrate, be filled with the second metal column in this second intercommunicating pore, described the first metal column, the second metal column are comprised of the copper post that is positioned at the center and the tungsten layer that is coated on around the copper post; One metal patch that is used for electrically contacting with circuit board is fixed in the surface at the first metal column, the second metal column two ends.
Further improved technical scheme is as follows in the technique scheme:
As preferably, the described first U-shaped conductive layer, the second U-shaped conductive layer include two lateral electrodes and the hearth electrode that is connected two lateral electrode bottoms; Lateral electrode of described the first U-shaped conductive layer embeds in the groove area that lateral electrode and hearth electrode by the second U-shaped conductive layer form.
As preferably, silver medal slurry weld layer is between metal patch and the first metal column, the second metal column.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
1. laminated ceramic capacitor of the present invention, its ceramic sintered bodies is comprised of aluminium nitride chip and alumina substrate, has conductive layer between the lower surface of this aluminium nitride chip and the upper surface of alumina substrate, both had high quality factor, thereby reduced high-frequency loss, and have stable temperature coefficient, also be convenient to machining.
2. laminated ceramic capacitor of the present invention, its first metal column, the second metal column are comprised of the copper post that is positioned at the center and the tungsten layer that is coated on around the copper post, reduce intercommunicating pore resistivity and substrate signal response time, also effectively prevented the diffusion of copper, greatly improved the reliability of product.
3. laminated ceramic capacitor of the present invention, its first U-shaped conductive layer, the second U-shaped conductive layer include two lateral electrodes and the hearth electrode that is connected two lateral electrode bottoms; Lateral electrode of described the first U-shaped conductive layer embeds in the groove area that lateral electrode and hearth electrode by the second U-shaped conductive layer form, and has increased capacitance when reducing device volume, thereby has been conducive to device miniaturization, has improved reliability and the yield of product.
4. laminated ceramic capacitor of the present invention, its silver slurry weld layer is covered in respectively the first intercommunicating pore of described aluminium nitride chip, the second intercommunicating pore end face separately of alumina substrate, because the uncured front curtain coating of silver slurry is good, the metal surface that has greatly fallen in the connecting hole produces the probability that caves in, thereby effectively avoided empty generation, improved reliability and the yield of product.
Description of drawings
Accompanying drawing 1 is laminated ceramic capacitor interlayer structure schematic diagram of the present invention;
Accompanying drawing 2 is laminated ceramic capacitor cross section structure schematic diagram of the present invention.
In the above accompanying drawing: 1, aluminium nitride chip; 2, alumina substrate; 3, the first U-shaped conductive layer; 4, the second U-shaped conductive layer; 5, the first intercommunicating pore; 6, the first metal column; 7, the second intercommunicating pore; 8, the second metal column; 9, silver slurry weld layer; 10, metal patch; 11, lateral electrode; 12, hearth electrode; 13, groove area; 14, copper post; 15, tungsten layer.
Embodiment
The invention will be further described below in conjunction with drawings and Examples:
Embodiment 1: a kind of laminated ceramic capacitor, comprise aluminium nitride chip 1 and alumina substrate 2, accompany between this aluminium nitride chip 1 and the alumina substrate 2 to have and be positioned at the conplane first U-shaped conductive layer 3, the second U-shaped conductive layer 4, electricity isolation between this first U-shaped conductive layer 3 and the second U-shaped conductive layer 4; Have two the first intercommunicating pores 5 that connect the three in described aluminium nitride chip 1, the first U-shaped conductive layer 3 and the alumina substrate 2, be filled with the first metal column 6 in this first intercommunicating pore 5, have two the second intercommunicating pores 7 that connect the three in described aluminium nitride chip 1, the second U-shaped conductive layer 4 and the alumina substrate 2, be filled with the second metal column 8 in this second intercommunicating pore 7; , described the first metal column 6, the second metal column 8 are comprised of the copper post 14 that is positioned at the center and the tungsten layer 15 that is coated on around the copper post 14; One metal patch 10 that is used for electrically contacting with circuit board is fixed in the surface at the first metal column 6, the second metal column 8 two ends.
Embodiment 2: a kind of laminated ceramic capacitor, comprise aluminium nitride chip 1 and alumina substrate 2, accompany between this aluminium nitride chip 1 and the alumina substrate 2 to have and be positioned at the conplane first U-shaped conductive layer 3, the second U-shaped conductive layer 4, electricity isolation between this first U-shaped conductive layer 3 and the second U-shaped conductive layer 4; Have two the first intercommunicating pores 5 that connect the three in described aluminium nitride chip 1, the first U-shaped conductive layer 3 and the alumina substrate 2, be filled with the first metal column 6 in this first intercommunicating pore 5, have two the second intercommunicating pores 7 that connect the three in described aluminium nitride chip 1, the second U-shaped conductive layer 4 and the alumina substrate 2, be filled with the second metal column 8 in this second intercommunicating pore 7; , described the first metal column 6, the second metal column 8 are comprised of the copper post 14 that is positioned at the center and the tungsten layer 15 that is coated on around the copper post 14; One metal patch 10 that is used for electrically contacting with circuit board is fixed in the surface at the first metal column 6, the second metal column 8 two ends.
The above-mentioned first U-shaped conductive layer 3, the second U-shaped conductive layer 4 include two lateral electrodes 11 and the hearth electrode 12 that is connected two lateral electrode 11 bottoms; The lateral electrode 11 of the described first U-shaped conductive layer 3 embeds in the groove area 13 that lateral electrode 11 and hearth electrode 12 by the second U-shaped conductive layer 4 form.
One silver medal slurry weld layer 9 is between metal patch 10 and the first metal column 6, the second metal column 8.
When adopting above-mentioned laminated ceramic capacitor, its ceramic sintered bodies is comprised of aluminium nitride chip and alumina substrate, has conductive layer between the lower surface of this aluminium nitride chip and the upper surface of alumina substrate, both had high quality factor, thereby reduced high-frequency loss, and have stable temperature coefficient, also be convenient to machining; Secondly, its first metal column, the second metal column are comprised of the copper post that is positioned at the center and the tungsten layer that is coated on around the copper post, have reduced intercommunicating pore resistivity and substrate signal response time, also effectively prevent the diffusion of copper, have greatly improved the reliability of product; Again, its first U-shaped conductive layer, the second U-shaped conductive layer include two lateral electrodes and the hearth electrode that is connected two lateral electrode bottoms; Lateral electrode of described the first U-shaped conductive layer embeds in the groove area that lateral electrode and hearth electrode by the second U-shaped conductive layer form, and has increased capacitance when reducing device volume, thereby has been conducive to device miniaturization, has improved reliability and the yield of product; Again, its silver slurry weld layer is covered in respectively the first intercommunicating pore of described aluminium nitride chip, the second intercommunicating pore end face separately of alumina substrate, because the uncured front curtain coating of silver slurry is good, the metal surface that has greatly fallen in the connecting hole produces the probability that caves in, thereby effectively avoided empty generation, improved reliability and the yield of product.
Above-described embodiment only is explanation technical conceive of the present invention and characteristics, and its purpose is to allow the personage who is familiar with technique can understand content of the present invention and according to this enforcement, can not limit protection scope of the present invention with this.All equivalences that Spirit Essence is done according to the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (3)
1. laminated ceramic capacitor, it is characterized in that: comprise aluminium nitride chip (1) and alumina substrate (2), accompany between this aluminium nitride chip (1) and the alumina substrate (2) to have and be positioned at the conplane first U-shaped conductive layer (3), the second U-shaped conductive layer (4), electricity isolation between this first U-shaped conductive layer (3) and the second U-shaped conductive layer (4); Described aluminium nitride chip (1), have two the first intercommunicating pores (5) that connect the three in the first U-shaped conductive layer (3) and the alumina substrate (2), be filled with the first metal column (6) in this first intercommunicating pore (5), described aluminium nitride chip (1), have two the second intercommunicating pores (7) that connect the three in the second U-shaped conductive layer (4) and the alumina substrate (2), be filled with the second metal column (8) in this second intercommunicating pore (7), described the first metal column (6), the second metal column (8) is by the copper post (14) that is positioned at the center and be coated on copper post (14) tungsten layer (15) all around and form; One metal patch (10) that is used for electrically contacting with circuit board is fixed in the surface at the first metal column (6), the second metal column (8) two ends.
2. laminated ceramic capacitor according to claim 1, it is characterized in that: the described first U-shaped conductive layer (3), the second U-shaped conductive layer (4) include two lateral electrodes (11) and the hearth electrode (12) that is connected two lateral electrodes (11) bottom; The lateral electrode (11) of the described first U-shaped conductive layer (3) embeds in the groove area (13) that lateral electrode (11) and hearth electrode (12) by the second U-shaped conductive layer (4) form.
3. laminated ceramic capacitor according to claim 1 is characterized in that: silver medal slurry weld layer (9) is positioned between metal patch (10) and the first metal column (6), the second metal column (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100280559A CN103077826A (en) | 2013-01-25 | 2013-01-25 | Layered ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100280559A CN103077826A (en) | 2013-01-25 | 2013-01-25 | Layered ceramic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103077826A true CN103077826A (en) | 2013-05-01 |
Family
ID=48154327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013100280559A Pending CN103077826A (en) | 2013-01-25 | 2013-01-25 | Layered ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103077826A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105161295A (en) * | 2015-08-31 | 2015-12-16 | 苏州斯尔特微电子有限公司 | Radio-frequency ceramic capacitor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1303132A (en) * | 1999-12-14 | 2001-07-11 | 株式会社东芝 | MIM capacitor |
| US20040174655A1 (en) * | 2003-03-04 | 2004-09-09 | Tse-Lun Tsai | Interdigitated capacitor structure for an integrated circuit |
| CN101916657A (en) * | 2010-07-30 | 2010-12-15 | 广东风华高新科技股份有限公司 | High-frequency and high-Q-value chip multilayer ceramic capacitor |
| CN203055686U (en) * | 2013-01-25 | 2013-07-10 | 苏州斯尔特微电子有限公司 | Laminated ceramic capacitor |
-
2013
- 2013-01-25 CN CN2013100280559A patent/CN103077826A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1303132A (en) * | 1999-12-14 | 2001-07-11 | 株式会社东芝 | MIM capacitor |
| US20040174655A1 (en) * | 2003-03-04 | 2004-09-09 | Tse-Lun Tsai | Interdigitated capacitor structure for an integrated circuit |
| CN101916657A (en) * | 2010-07-30 | 2010-12-15 | 广东风华高新科技股份有限公司 | High-frequency and high-Q-value chip multilayer ceramic capacitor |
| CN203055686U (en) * | 2013-01-25 | 2013-07-10 | 苏州斯尔特微电子有限公司 | Laminated ceramic capacitor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105161295A (en) * | 2015-08-31 | 2015-12-16 | 苏州斯尔特微电子有限公司 | Radio-frequency ceramic capacitor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8941015B2 (en) | Embedded capacitor substrate module | |
| KR20150011268A (en) | Embedded multilayer ceramic electronic part and print circuit board having embedded multilayer ceramic electronic part | |
| CN104576044A (en) | Array-type multilayer ceramic electronic component and board having the same mounted thereon | |
| KR101499715B1 (en) | Embedded multilayer ceramic electronic part and print circuit board having embedded multilayer ceramic electronic part | |
| AU2017403198B2 (en) | Mainboard for consumer electronic product, and terminal | |
| US9449762B2 (en) | Embedded package substrate capacitor with configurable/controllable equivalent series resistance | |
| KR101525667B1 (en) | Embedded multilayer ceramic electronic part and print circuit board having embedded multilayer ceramic electronic part | |
| CN101312095A (en) | Monolithic ceramic capacitor | |
| CN203055686U (en) | Laminated ceramic capacitor | |
| US10297386B2 (en) | Multilayer ceramic capacitor and board having the same | |
| KR101973438B1 (en) | Capacitor Component | |
| CN106100662B (en) | Printed circuit board and wireless communication device with printed circuit board | |
| CN203057693U (en) | Capacitive type ceramic circuit board | |
| US20130248235A1 (en) | Embedded capacitor module | |
| KR102097325B1 (en) | Multi layered ceramic capacitor and board having the same mounted thereon | |
| CN104112593B (en) | Multilayer ceramic capacitor and its mounting plate | |
| CN103077826A (en) | Layered ceramic capacitor | |
| CN203055684U (en) | Miniaturized ceramic capacitor | |
| KR20160044250A (en) | Multi layered ceramic capacitor and board having the same mounted thereon | |
| CN203055681U (en) | Radio frequency used ceramic capacitor | |
| CN203057702U (en) | Multi-layer ceramic circuit board | |
| CN203055683U (en) | Ceramic capacitor structure used in antenna | |
| CN202143291U (en) | Two-layer printed circuit board and mobile communication terminal | |
| CN203491039U (en) | Thin type surface-mounted inductor device | |
| CN102332625A (en) | 150W load sheet of high-power aluminum nitride ceramic substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130501 |