CN103076132B - A kind of sensor reducing error and measuring method thereof - Google Patents
A kind of sensor reducing error and measuring method thereof Download PDFInfo
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- CN103076132B CN103076132B CN201210585486.0A CN201210585486A CN103076132B CN 103076132 B CN103076132 B CN 103076132B CN 201210585486 A CN201210585486 A CN 201210585486A CN 103076132 B CN103076132 B CN 103076132B
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Abstract
The invention discloses a kind of sensor reducing error and measuring method thereof, sensor construction includes: first substrate, second substrate, the 3rd substrate, add thermal resistance, through hole, the diaphragm of first substrate, the cavity of first substrate, the diaphragm of second substrate, the cavity of second substrate.Measure pressure method: adding the cavity of thermal resistance electrified regulation first substrate, its sky chamber air flatulence of heat type is pressurized to second substrate diaphragm；Reduce the heating power adding thermal resistance；Measure the pressure on the diaphragm of second substrate.By above-mentioned steps, the diaphragm of second substrate can maintain on the unloading line of mechanical hysteresis curve, it is possible to avoids the uncertain problem of diaphragm position, containment mechanical hysteresis to offset the error caused, improve the certainty of measurement of pressure transducer.
Description
Technical field
The present invention relates to sensor technical field, particularly relate to solve gas pressure sensor mechanical hysteresis error
Structures and methods.
Background technology
Gas pressure measurement sets in industrial instrument, medical apparatus, air gauge, altimeter, pressure switch, inflation
Standby grade in many industrial equipments is applied widely.Traditional baroceptor, such as mercury thermometer, sky
Box air gauge etc., the drawbacks limit that its volume is big, precision is low range of application.Along with micro electronmechanical MEMS technology
Development, the technology of MEMS pressure sensor have also been obtained development and significantly improve, sensor bulk is increasingly
Little, certainty of measurement have also been obtained large increase.But during for measuring high accuracy air pressure, pressure transducer is certainly
The mechanical hysteresis error of body cannot be ignored.The pressure being applied to transmit on the diaphragm of pressure drops to from high to low
During force value F, and pressure is when as little as promotion to force value F, although final force value is identical, but by
In the hysteresis of machinery, diaphragm sag under identical stress effect is different, i.e. the film of sensor
The loaded line of sheet load not exclusively overlaps with unloading line.For pressure transducer, owing to pressure to be measured is micro-
Little variation tendency is random, it is difficult to determining the most corresponding real force value of the voltage signal recorded, this is just
The pressure causing measured diaphragm deformation corresponding has deviation with actual pressure, the pressure signal essence collected
Spend the highest.
Summary of the invention
The present invention proposes a kind of sensor measuring pressure reducing error and measuring method, its purpose purport
Overcome the drawbacks described above existing for prior art, reducing the error caused due to mechanical hysteresis, improve pressure
The certainty of measurement of power.
The technical solution of the present invention: it is characterized in that structure by first substrate, second substrate, the 3rd substrate,
Add thermal resistance, through hole, the diaphragm of first substrate, the cavity of first substrate, the diaphragm of second substrate, second
The cavity composition of substrate；Measuring method step is: the thermal resistance that adds on the diaphragm of first substrate is applied by (1)
Heating power；(2) the ohmically heating power of heating is reduced；(3) pressure on the diaphragm of second substrate is measured
Power.
The invention have benefit that: compared to prior art, inventive sensor uses first substrate empty
Chamber is can be with the semi-closed structure of ambient atmos convection current, by adding the thermal resistance empty intracavity gas to first substrate
Heating, when gases are heated, they expand produces gas pressure intensity and stresses on the diaphragm of second substrate, makes driven diaphragm bending exist
On the unloading line of retardant curve, it is to avoid the uncertain problem of diaphragm position, improve the certainty of measurement of sensor；
Utilize the structure of through hole, not only realize the mesh that under steady statue, inside and outside first substrate diaphragm, the pressure of gas is equal
, and small through hole both can connect the gas that cavity is interior and extraneous, can increase gaseous exchange resistance
Power, effectively controls the diaphragm flexes of second substrate so that it is maintain on the unloading line of retardant curve；Utilization adds
Thermal resistance controls the method for temperature, and easy to adjust, flexible, precision is higher；Heating distribution of resistance is at through hole two
End, is conducive to uniformly heating the gas in first substrate and cavity, it is to avoid the problem of hot-spot；Second base
Plate cavity is set to the vacuum chamber sealed, and can measure the absolute pressure of extraneous gas, measures scope bigger,
Application is wider；Sensor of the invention is made up of 3 substrates, simple in construction, can wafer level packaging,
Reduce cost.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of sensor construction.
Fig. 2 is the schematic top plan view of sensor first substrate.
In figure 1 is first substrate, 2 is second substrate, 3 is the 3rd substrate, 4 is to add thermal resistance, 5 be
Through hole, 6 be the diaphragm of first substrate, 7 be the cavity of first substrate, 8 be the diaphragm of second substrate, 9 be
The cavity of second substrate.
Detailed description of the invention
Comparison accompanying drawing 1, sensor by first substrate 1, second substrate the 2, the 3rd substrate 3, add thermal resistance 4,
Through hole 5, the diaphragm 6 of first substrate, the cavity 7 of first substrate, the diaphragm 8 of second substrate, second substrate
Cavity 9 form.Wherein first substrate 1 is connected with second substrate 2, second substrate 2 and the 3rd substrate 3
Connecting, the cavity 9 of second substrate is positioned at second substrate 2 and the 3rd substrate 3 junction, and this cavity is airtight
Vacuum chamber；The cavity 7 of first substrate is positioned at first substrate 1 and second substrate 2 junction, and through hole 5 is even
Connect the gas in first substrate cavity 7 and ambient atmos.
Comparison Fig. 2, the diaphragm 6 of first substrate has and adds thermal resistance 4, through hole 5, add thermal resistance 4 and be placed in
Through hole 5 two ends, it is simple to the uniformly gas in heating first substrate cavity 7.
Measuring method is: first the thermal resistance 4 that adds on the diaphragm 6 of first substrate is applied heating power, makes
Apply power by the method for pulsewidth modulation to adding thermal resistance, the dutycycle of impulse waveform successively by 10%, 30%,
70%, the mode of 90% is gradually increased；Then reducing and add the heating power on thermal resistance 4, heating-up temperature reaches
During design temperature, the diaphragm 6 of first substrate stops after bending to or exceeding on the peak-to-peak value position of retardant curve
Only heating, the gas temperature in first substrate cavity 7 is gradually reduced, and carries out gas pair with ambient atmos simultaneously
Stream, second substrate diaphragm 8 shape is slowly replied.After a predetermined time, second substrate diaphragm 8 shape is returned
After answering on unloading line, measure the pressure on second substrate diaphragm 8 by signal processing circuit.
Claims (2)
1. the gas pressure sensor that can reduce mechanical hysteresis error, it is characterised in that this gas pressure sensor structure is by
One substrate, second substrate, the 3rd substrate, add thermal resistance, through hole, the diaphragm of first substrate, the cavity of first substrate, second
The diaphragm of substrate, the cavity composition of second substrate, wherein first substrate and second substrate connect, and second substrate and the 3rd substrate are even
Connect, add thermal resistance and through hole is positioned on the diaphragm of first substrate, add thermal resistance and be positioned at through hole two ends, first substrate and second substrate
Connecting the cavity forming first substrate, this cavity is connected with outside air by through hole, and second substrate and the 3rd substrate connect formation
The cavity of second substrate, this cavity is airtight vacuum chamber；By adding thermal resistance, the empty intracavity gas of first substrate is heated, drive
The diaphragm flexes of dynamic second substrate is on the unloading line of retardant curve.
2. use the method that gas pressure sensor as claimed in claim 1 measures gas pressure, it is characterised in that measuring process is:
(1) thermal resistance that adds on the diaphragm of first substrate is applied heating power, wherein use the method for pulsewidth modulation to apply adding thermal resistance
Power, and the dutycycle of impulse waveform is gradually increased by the mode of 10%, 30%, 70%, 90% successively；(2) reduction adds thermoelectricity
Heating power in resistance, the diaphragm flexes of first substrate stops heating after meeting or exceeding on the peak-to-peak value position of retardant curve；(3)
After second substrate diaphragm shapes is returned to unload on line, measure the gas to be measured on second substrate diaphragm by signal processing circuit
Body pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210585486.0A CN103076132B (en) | 2012-12-26 | 2012-12-26 | A kind of sensor reducing error and measuring method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210585486.0A CN103076132B (en) | 2012-12-26 | 2012-12-26 | A kind of sensor reducing error and measuring method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103076132A CN103076132A (en) | 2013-05-01 |
| CN103076132B true CN103076132B (en) | 2016-10-05 |
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| CN201210585486.0A Active CN103076132B (en) | 2012-12-26 | 2012-12-26 | A kind of sensor reducing error and measuring method thereof |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104101459B (en) * | 2014-07-30 | 2016-04-06 | 东南大学 | A kind of baroceptor encapsulating structure of Wind-Pressure Resistance |
| CN115979500B (en) * | 2023-03-17 | 2023-06-13 | 成都凯天电子股份有限公司 | Double-air-pressure cavity core, pressure scanning valve and preparation method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101106839A (en) * | 2006-07-10 | 2008-01-16 | 雅马哈株式会社 | Pressure sensor and manufacturing method therefor |
| CN101308110A (en) * | 2008-07-11 | 2008-11-19 | 中国电子科技集团公司第四十九研究所 | Low-power consumption double module integrated humidity sensitive chip with heating function and its manufacture method |
| CN202974545U (en) * | 2012-12-26 | 2013-06-05 | 南京高华科技有限公司 | Sensor capable of reducing errors |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4638530B2 (en) * | 2008-08-19 | 2011-02-23 | 日本電波工業株式会社 | Piezoelectric component and manufacturing method thereof |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101106839A (en) * | 2006-07-10 | 2008-01-16 | 雅马哈株式会社 | Pressure sensor and manufacturing method therefor |
| CN101308110A (en) * | 2008-07-11 | 2008-11-19 | 中国电子科技集团公司第四十九研究所 | Low-power consumption double module integrated humidity sensitive chip with heating function and its manufacture method |
| CN202974545U (en) * | 2012-12-26 | 2013-06-05 | 南京高华科技有限公司 | Sensor capable of reducing errors |
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Address after: God horses road science and Technology Park in Qixia District of Nanjing City, Jiangsu Province, No. 2 210049 Applicant after: NANJING GAOHUA TECHNOLOGY CO., LTD. Address before: God horses road science and Technology Park in Qixia District of Nanjing City, Jiangsu Province, No. 2 210049 Applicant before: Nanjing GaoHua Technology Co., Ltd. |
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