CN103074514A - Beryllium-copper alloy for secondary electron emission - Google Patents
Beryllium-copper alloy for secondary electron emission Download PDFInfo
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- CN103074514A CN103074514A CN2013100188463A CN201310018846A CN103074514A CN 103074514 A CN103074514 A CN 103074514A CN 2013100188463 A CN2013100188463 A CN 2013100188463A CN 201310018846 A CN201310018846 A CN 201310018846A CN 103074514 A CN103074514 A CN 103074514A
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Abstract
The invention provides beryllium-copper alloy for secondary electron emission. With adoption of the beryllium-copper alloy, the secondary electron emission shows peak-like features in 150-1000 V and achieves a peak in 500-600 V, wherein the beryllium-copper alloy is composed of the following components in percentage by mass: 2.7-3.0 wt% of beryllium, less than or equal to 0.31 wt% of nickel, less than or equal to 0.058 wt% of iron, less than or equal to 0.013 wt% of aluminum, less than or equal to 0.028 wt% of silicon, less than or equal to 0.0020 wt% of lead, less than or equal to 0.0020 wt% of cadmium, less than or equal to 0.0020 wt% of zinc, and less than or equal to 0.43 wt% of other impurity elements. According to the beryllium-copper alloy for secondary electron emission, the secondary electron emission shows the peak-like features in 150-1000 V and achieves the peak in 500-600 V, and the peak can be over 9 that is far more than the existing peak level of 5.
Description
Technical field
The present invention relates to a kind of secondary electron emission with high beryllium copper material, belong to metal material field.
Technical background
Berylliumbronze is a kind of typical precipitation hardenable alloy, and cold working or ageing treatment can obtain very high intensity and elasticity again after solution treatment, along with the increase of Be content, and the also corresponding increase of its timeliness hardness.Its formability, fatigue resistance and stress relaxation aspect also be other copper alloy can't be obtained.Because berylliumbronze has these good secondary electron emission and resilient energy is widely used in the industrial circles such as electronics, communication, space flight, aviation, makes various high-grade elastic elements and electronic component.
Do the time spent when material and electron beam, the part in its surface tissue electronics may obtain enough energy and escape from from material surface, and this is called the secondary electron emission phenomenon.It is different from backscattered electron, when the incident charged particle is that electronics and wherein some are namely produced backscattered electron by the opposite direction reflex time, if projectile is not electronics, does not just have backscattered electron and produces (but still can produce secondary electron).When if projectile is electronics, then produce simultaneously backscattered electron and secondary electron.The energy of backscattered electron is generally the part of incident electron energy, and the energy of secondary electron is lower, representative value is less than 1 keV, and the backscattered electron yield is less than or equal to 1 all the time with respect to incident electron, and secondary electron yield is usually greater than 1, and secondary electron coefficient refers to secondary current I
sWith primary electrical subflow I
pRatio.
Beraloy, the treated skim beryllium oxide that forms on the surface, it is the main layer of secondary emitter, therefore the beryllium amount that contains in the beraloy and the impurity content secondary electron emission performance that determined beraloy, at present, beryllium copper on the market contains the beryllium amount and is mainly 1.5wt.% ~ 2.0wt.%, impurity content is high, secondary electron yield is unstable and peak value is not high, in order to make the beryllium copper material of high secondary electron yield, its requirement contains the beryllium amount more than 2.7 %, Heavy Metals foreign matter content (lead, cadmium etc.) be controlled at below 0.1%.
Produce the beraloy that meets above requirement, mainly contain following two problems: the first, beryllium is about 2.1wt.%. in the limit solid solubility in the copper matrix, and along with the increase that contains the beryllium amount, its ununiformity increases gradually, and control end article homogeneity difficulty is large; The second, fusion process control is difficult, can't accurately control foreign matter content in fusion process.
Summary of the invention
The object of the present invention is to provide a kind of high secondary electron emission beryllium copper material, secondary emission is peak shape characteristic (reaching peak value at 500 ~ 600V) in 150 ~ 1000V.Its alloying constituent model (wt.%): Be:2.7-3.0wt.%, Ni :≤0.31wt.%Fe≤0.058wt.%, Al≤0.013wt.%, Si≤0.028wt.%, Pb :≤0.0020wt.%, Cd :≤0.0020wt.%, Zn :≤0.0020wt.%, other impurity element sum≤0.43wt.%, all the other are Cu.Make in the steps below thickness and be 0.1 ~ 0.2mm secondary electron emission with high beryllium copper strip:
A. in mass ratio copper powder is mixed with the beryllium copper master alloy powder, carry out mechanical alloying in ball mill, ratio of grinding media to material is 5 ~ 20:1, and medium is alcohol, and the time is 4 ~ 20h;
B. the powder that mixes is carried out the plasticising extruding, add tackiness agent, at 850 ~ 900 ℃, sinter base under hydrogen and the nitrogen environment after the degreasing, sintering time is 6 ~ 20h, and finally making thickness is the thick ingot blank of 2 ~ 5mm;
C. ingot blank is carried out rolling deformation at hot rolls, reduction in pass is controlled at 20% ~ 40%, carries out anneal between the passage, annealing temperature is 700 ~ 750 ℃, annealing time is 15 ~ 30min, carries out afterwards pickling, and making surface cleaning thickness is the thick sheet material of 0.3 ~ 0.4mm;
D. be the sheet material of 0.3 ~ 0.4mm with thickness, carry out the control of finish rolling and template at milling train, final rolling is the strip of 0.1 ~ 0.2mm for thickness, in vacuum oven, heat-treat, make secondary electron emission with high beryllium copper strip.
Secondary electron emission of the present invention is with high beryllium copper material, and containing the beryllium amount is 2.7% ~ 3.0%, and its secondary electron emission in 150 ~ 1000V is peak shape characteristic, reaches peak value at 500 ~ 600V, and peak value can arrive more than 9, is 5 level considerably beyond present peak value.
Embodiment 1
To containing Be:2.70%, Ni:0.25%, Fe:0.045%, Al:0.009%, Si:0.020%, Pb:0.0018%, other impurity element sum≤0.43wt.% makes 0.21mm, width is the sheet material of 100mm, secondary electron emission is peak shape characteristic in 150 ~ 1000V, reaches peak value at 500 ~ 600V, and peak value can arrive 9.
Embodiment 2
To containing Be:2.8%, Ni:0.28%, Fe:0.040%, Al:0.010%, Si:0.024%, Pb:0.0017%, other impurity element sum≤0.43wt.% makes 0.20mm, width is the sheet material of 100mm, secondary electron emission is peak shape characteristic in 150 ~ 1000V, reaches peak value at 500 ~ 600V, and peak value can arrive 9.5.
Embodiment 3
To containing Be:2.85%, Ni:0.24%, Fe:0.043%, Al:0.008%, Si:0.022%, Pb:0.0018%, other impurity element sum≤0.43wt.% is rolled into 0.20mm, width is the sheet material of 100mm, secondary electron emission is peak shape characteristic in 150 ~ 1000V, reaches peak value at 500 ~ 600V, and peak value can arrive 10.
Embodiment 4
To containing Be:2.90%, Ni:0.22%, Fe:0.041%, Al:0.009%, Si:0.025%, Pb:0.0016%, other impurity element sum≤0.43wt.% is rolled into 0.20mm, width is the sheet material of 100mm, secondary electron emission is peak shape characteristic in 150 ~ 1000V, reaches peak value at 500 ~ 600V, and peak value can arrive 10.5.
Embodiment 5
To containing Be:3. 0%, Ni:0.25%, Fe:0.045%, Al:0.009%, Si:0.020%, Pb:0.0018%, other impurity element sum≤0.43wt.% is rolled into 0.20mm, width is the sheet material of 100mm, secondary electron emission is peak shape characteristic in 150 ~ 1000V, reaches peak value at 500 ~ 600V, and peak value can arrive 11.
Claims (3)
1. secondary electron emission beryllium copper, it is characterized in that composition is: contain beryllium: 2.7-3.0wt.%, nickeliferous :≤0.31wt.%, iron content :≤0.058wt.% contains aluminium :≤0.013wt.%, siliceous :≤0.028wt.%, leaded :≤0.0020wt.% contains cadmium :≤0.0020wt.% contains zinc :≤0.0020wt.%, other impurity element sum≤0.43wt.%, surplus is copper.
2. secondary electron emission beryllium copper according to claim 1, it is characterized in that: the beryllium percentage composition is 2.7-2.8wt.%.
3. described secondary electron emission beryllium copper according to claim 1 and 2, it is characterized in that: secondary emission is peak shape characteristic in 150 ~ 1000V, reaches peak value at 500 ~ 600V.
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| CN2013100188463A CN103074514A (en) | 2013-01-18 | 2013-01-18 | Beryllium-copper alloy for secondary electron emission |
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| CN2013100188463A CN103074514A (en) | 2013-01-18 | 2013-01-18 | Beryllium-copper alloy for secondary electron emission |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106498226A (en) * | 2016-10-20 | 2017-03-15 | 苏州金江铜业有限公司 | A kind of photomultiplier tube dynode is with high beallon preparation method |
| CN108950291A (en) * | 2018-07-20 | 2018-12-07 | 湘潭大学 | A kind of preparation method of the high beryllium beallon band short route of photomultiplier tube dynode |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB517083A (en) * | 1937-12-29 | 1940-01-19 | Seri Holding S A | High quality alloys and process for their manufacture |
| JPH09312161A (en) * | 1996-05-23 | 1997-12-02 | Ngk Insulators Ltd | Power collector of electrochemical element and electrochemical element |
| JP2000079485A (en) * | 1998-09-04 | 2000-03-21 | Nippon Steel Corp | Electrode die in flush butt welding machine |
-
2013
- 2013-01-18 CN CN2013100188463A patent/CN103074514A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB517083A (en) * | 1937-12-29 | 1940-01-19 | Seri Holding S A | High quality alloys and process for their manufacture |
| JPH09312161A (en) * | 1996-05-23 | 1997-12-02 | Ngk Insulators Ltd | Power collector of electrochemical element and electrochemical element |
| JP2000079485A (en) * | 1998-09-04 | 2000-03-21 | Nippon Steel Corp | Electrode die in flush butt welding machine |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106498226A (en) * | 2016-10-20 | 2017-03-15 | 苏州金江铜业有限公司 | A kind of photomultiplier tube dynode is with high beallon preparation method |
| CN108950291A (en) * | 2018-07-20 | 2018-12-07 | 湘潭大学 | A kind of preparation method of the high beryllium beallon band short route of photomultiplier tube dynode |
| CN108950291B (en) * | 2018-07-20 | 2019-07-26 | 湘潭大学 | A kind of preparation method of the high beryllium beallon band short route of photomultiplier tube dynode |
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Application publication date: 20130501 |
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