CN103068515A - Laser processing device and laser processing method - Google Patents
Laser processing device and laser processing method Download PDFInfo
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- CN103068515A CN103068515A CN2011800396573A CN201180039657A CN103068515A CN 103068515 A CN103068515 A CN 103068515A CN 2011800396573 A CN2011800396573 A CN 2011800396573A CN 201180039657 A CN201180039657 A CN 201180039657A CN 103068515 A CN103068515 A CN 103068515A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
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- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Laser Beam Processing (AREA)
- Lasers (AREA)
- Mechanical Optical Scanning Systems (AREA)
Abstract
While preventing the edge deletion processing time of a thin-film photovoltaic cell panel from increasing, processing quality can be improved. A process is repeated in which a light spot is made to scan a thin-film photovoltaic cell panel (102) in a main scanning direction toward which an optical unit proceeds, is then moved to the next row, is then made to scan in the opposite direction to the main scanning direction, and is then moved to the next row in the order of arrows (311a, 311b, ..., 311k). After the light spot is made to scan in the direction of the arrow (311k), the light spot is made to scan in the direction of an arrow (311l) and is made to scan in the same manner also in the next processing block. This scanning is repeated until peeling of the thin film in a linear region along a side (301a) of the thin-film photovoltaic cell panel (102) is completed. The invention can be applied to, for example, a laser processing device for performing an edge deletion.
Description
Technical field
The present invention relates to laser processing device and laser aid method, relate in particular to the laser processing device and the laser processing that are adapted at using laser that film is used during from substrate desquamation.
Background technology
After thin-film solar cell panel such as the film protection by carrying out the processing of film forming, electrode, film surface in one piece of glass substrate of 1.1m * 1.4m etc., around panel, use the aluminium frame to fix and make.Therefore, if use for a long time thin-film solar cell panel, exist diaphragm to be penetrated, the hidden danger of aluminium frame and film surface short circuit.At this moment, in order to improve electrical insulating property, carrying out flash trimming is the edge film on every side of stripping film solar panel.
In flash trimming in the past, use sanding machine or whetstone.But, can become coarse with these method processing rear surfaces, the cohesive of diaphragm reduces, and exists to occur in the hidden danger of infiltrating the problems such as rainwater between diaphragm and the panel.
At this, in recent years, people pay close attention to and can need not to eliminate glass substrate and the flash trimming processing method of the use laser on stripping film surface only.
The example of the scan method of the laser when Fig. 1 shows and carries out the flash trimming of thin-film solar cell panel by Laser Processing.This scan method is such as shown in patent documentation 1 grade.In this scan method, by laser being scanned with zigzag to sub scanning direction (y direction of principal axis) scope 21 is interior, to main scanning direction (x direction of principal axis) laser is scanned as a whole simultaneously, thereby eliminate thin-film solar cell panel 11 edge 11A around, the film in the regional 11B that represents with oblique line.
When Fig. 2 was illustrated in mode according to Fig. 1 with laser scanning, Ear Mucosa Treated by He Ne Laser Irradiation was to the example of the position (hereinafter referred to as luminous point) of thin-film solar cell panel 11.In addition, among Fig. 2 each luminous point is represented with rectangle frame.As shown in the drawing, it is large that the area of the adjacent luminous point of coincidence becomes, its result, and process time is elongated.
Here, as shown in Figure 3, can expect luminous point is scanned according to clathrate, to reduce the coincidence of luminous point.At this moment, repeat following scanning, being about to luminous point is listed as to direction (sub scanning direction) scanning one of arrow 51a first, to the direction (main scanning direction) of the arrow 51b row that advance, in the next row to the direction of arrow 51c, the i.e. scanning direction opposite with first row is again to the direction (main scanning direction) of the arrow 51d row that advance.
Here, with reference to Fig. 4 two galvanometer scanners (galvanometer scanner) that laser is scanned to x direction of principal axis and y direction of principal axis, the situation that luminous point is scanned as shown in Figure 3 used is described.In addition, the arrow 61a to 61d of Fig. 4 represents the direction that laser scanned by galvanometer scanner.In addition, with lower, the position of thin-film solar cell panel 11 is fixed, and to the optical head (not shown) of the thin-film solar cell panel 11 shoot lasers direction to the arrow 52 of Fig. 3, namely the positive direction of x axle is at the uniform velocity carried.
At first, for the direction of luminous point to the arrow 51a of Fig. 3 scanned, laser scans to the direction (positive direction of the negative direction of x axle and y axle) of arrow 61a.That is, for luminous point to y direction of principal axis scanning, with laser to respect to the oblique rear of the carrying direction of optical head to scanning.In addition, the axial width of y of the scope 21 of the axial scanning distance Ly of y and Fig. 3 of the laser of this moment is almost identical, and in the axial scanning distance Lx of x and the interval that is listed as in spot scan one, optical head is almost identical to the distance that the x direction of principal axis moves.
Next, for the direction of luminous point to the arrow 51b of Fig. 3 scanned, laser scans to the direction (positive direction of x axle) of arrow 61b.Scanning distance and the distance L x of the x axle of the laser of this moment are almost identical.
Next, for the direction of luminous point to the arrow 51c of Fig. 3 scanned, laser scans to the direction (negative direction of the negative direction of x axle and y axle) of arrow 61c.That is, compare with the scanning direction of arrow 61a, the axial scanning direction of x is identical, and the axial scanning direction of y is opposite.
Next, for the direction of luminous point to the arrow 51d of Fig. 3 scanned, laser scans to the direction (positive direction of x axle) of arrow 61d.Scanning distance and the distance L x of the x axle of the laser of this moment are almost identical.
Then, laser is according to the order multiple scanning of the direction of the direction of the direction of the direction of arrow 61a, arrow 61b, arrow 61c, arrow 61d.
The prior art document
Patent documentation 1: JP 2002-244069 communique
Summary of the invention
The problem that invention will solve
The example of the position of the luminous point of Fig. 5 when representing that in more detail laser carried out scanning as described above with reference to Fig. 4.
With laser during to the scanning direction of the direction of the arrow 61a of Fig. 4 and arrow 51c, two galvanometer scanners of demand motive x direction and y direction.Therefore, two galvanometer scanners all become kinetic force of friction and do work in the state at the movable position of the bearing of the turning cylinder of scanning usefulness.Generally speaking, the coefficient of kinetic friction is less than confficient of static friction, therefore drives galvanometer scanner and turning cylinder when rotating, when turning cylinder does not rotate than not driving galvanometer scanner, and the impact of the external interference of more easily being vibrated etc.Therefore, laser is to when the direction of arrow 61a and arrow 61c direction scan, easily unstable because of the vibration of the external interference laser such as vibration, thereby the easy complications of laser.Its result produces as the oblique line position among the scope 71a to 71d of Fig. 5, and because of not irradiation of laser (luminous point), film is not stripped from and residual zone.
In addition, when the scanning direction of laser is switched to the direction of arrow 61c from the direction of arrow 61a through the direction of arrow 61b, produce the delay of the response of galvanometer scanner because of initialization.Its result, shown in the scope 71e of Fig. 5, at the end of the scope 21 of Fig. 3, irregular because of the position of luminous point, film is not stripped from and residual part becomes zigzag.Its result, when long-time use thin-film solar cell panel 11, the film surface begins from the position that is processed as pectination to worsen, and the risk that comes off increases.
The present invention makes in view of this situation, can suppress the increase of process time of the flash trimming of thin-film solar cell panel, improves simultaneously crudy.
Be used for solving the means of problem
The laser processing device of an aspect of of the present present invention is set to a kind of laser processing device, use laser from the substrate desquamation film, comprising: processing department, comprise sweep unit, this sweep unit in the scope of the regulation of first direction and with the scope of the regulation of the second direction of described first direction quadrature in described laser in the enterprising line scanning of described substrate; And, moving-member, in mobile described processing department and the described substrate at least one, and the relative position between described processing department and the described substrate is moved to described first direction at least, wider from the beam diameter of the described laser of described substrate desquamation Width, and during the film in the first area of the linearity that extends to first direction, by described moving-member the relative position between described processing department and the described substrate is moved to described first direction, with respect to the direction of advance that described substrate advances laser is scanned to described processing department by described sweep unit simultaneously, thereby in described first area the irradiation position of described laser is scanned to described direction of advance.
In the laser processing device of an aspect of of the present present invention, wider from the beam diameter of substrate desquamation Width laser, and during the film in the first area of the linearity that extends to first direction, relative position between processing department and the substrate is moved to first direction, laser is scanned with respect to the direction of advance that substrate advances to processing department simultaneously, thereby in the first area irradiation position forward direction of described laser is scanned.
Therefore, can suppress the increase of process time of the flash trimming of thin-film solar cell panel, improve simultaneously crudy.
This sweep unit for example is comprised of galvanometer scanner.This moving-member is such as being comprised of linear motor, lift, actuator etc.
Can for: after described laser scanned to described direction of advance, further, by described sweep unit described laser is moved to described second direction, the opposite direction of described laser to described direction of advance scanned, thereby in the irradiation position of the described laser when to described direction of advance laser being scanned adjacent position on described second direction, the irradiation position of the described laser opposite direction to described direction of advance is scanned.
Thus, can more shorten the process time of the flash trimming of thin-film solar cell panel.
Can for: by described sweep unit, scope according to the regulation of the described first direction of each described first area, the irradiation position of described laser is moved to described second direction, replacing property of opposite direction ground to described direction of advance or described direction of advance scans simultaneously, peels off the film of each scope according to the order of described direction of advance.
Thus, can more shorten the process time of the flash trimming of thin-film solar cell panel.
Can for: wider from the beam diameter of the described laser of substrate desquamation Width, and during the film in the second area of the linearity that extends to described second direction, by described moving-member the relative position between described processing department and the described substrate is moved to described second direction, with respect to the direction of advance that described substrate advances laser is scanned to described processing department by described sweep unit simultaneously, thereby scan to described direction of advance at the irradiation position of described second area with described laser.
Thus, can carry out the processing of first and second both direction.
The section that incides the laser of substrate can be rectangle.
Thus, the coincidence area of adjacent luminous point is diminished, thereby can more shorten the process time of the flash trimming of thin-film solar cell panel.
This sweep unit can comprise described first galvanometer scanner of laser to described first direction scanning; And, with second galvanometer scanner of described laser to described second direction scanning.
Thus, can accurately, at high speed laser be scanned.
The laser generation parts that laser is vibrated can also be set.
The laser processing of an aspect of of the present present invention, comprise that the laser processing device of processing department is wider from the beam diameter of the described laser of described substrate desquamation Width, and during the film in the zone of the linearity that extends to first direction, by described moving-member the relative position between described processing department and the described substrate is moved to described first direction, with respect to the direction of advance that described substrate advances described laser is scanned to described processing department by described sweep unit simultaneously, thereby the irradiation position with described laser in described zone scans to described direction of advance, wherein, described processing department comprises sweep unit, this sweep unit to first direction and with the second direction of described first direction quadrature with described laser in the enterprising line scanning of described substrate.
In the laser processing of an aspect of of the present present invention, wider from the beam diameter of substrate desquamation Width laser, and during the film in the zone of the linearity that extends to first direction, relative position between processing department and the substrate is moved to first direction, laser is scanned with respect to the direction of advance that substrate advances to processing department simultaneously, thereby in the zone, the irradiation position forward direction of described laser is scanned.
Therefore, can suppress the increase of process time of the flash trimming of thin-film solar cell panel, improve simultaneously crudy.
This sweep unit for example is comprised of galvanometer scanner.
The invention effect
According to an aspect of the present invention, can carry out the flash trimming of thin-film solar cell panel.Especially according to an aspect of the present invention, can suppress the increase of process time of the flash trimming of thin-film solar cell panel, improve simultaneously crudy.
Description of drawings
Fig. 1 is the figure for first example of the scan method of explanation laser.
Fig. 2 is the figure for first example of the scan method of explanation laser.
Fig. 3 is the figure for second example of the scan method of explanation laser.
Fig. 4 is the figure for second example of the scan method of explanation laser.
Fig. 5 is for the figure of explanation by the problem of the second Laser Scanning generation.
Fig. 6 is the stereogram of example of the structure of the expression outward appearance of using laser processing device of the present invention.
Fig. 7 is the block diagram of example of the structure of the expression circuit of using laser processing device of the present invention.
Fig. 8 is the figure of the end face of the square optical fiber of expression.
Fig. 9 is with importing and by the figure of the example of the light distribution of the section of the multimodal laser pulse after the outgoing before the square optical fiber of expression imports.
Figure 10 is the figure of the structure example of expression galvanometer scanner.
Figure 11 is the figure of the galvanometric structure example of expression.
Figure 12 is the block diagram of structure example of the control part of expression laser processing device.
Figure 13 is the flow chart of processing for the Laser Processing that explanation is carried out by laser processing device.
Figure 14 is the flow chart for the details of explanation flash trimming processing.
Figure 15 is the figure of the processing sequence of expression flash trimming.
Figure 16 is the position of expression luminous point and the figure of scanning direction.
Figure 17 is the figure of the scanning direction of expression laser.
The specific embodiment
Below, illustrate about being used for implementing mode of the present invention (hereinafter referred to as embodiment).In addition, illustrate in the following order and carry out:
1. embodiment
2. variation
＜1. embodiment 〉
With reference to Fig. 6 to Figure 12 structure example as the laser processing device 101 of one embodiment of the present invention is described.Laser processing device 101 is the device for the flash trimming that carries out thin-film solar cell panel 102.
[structure example of the outward appearance of laser processing device]
Fig. 6 is the stereogram of structure example of the outward appearance of expression laser processing device.Laser processing device 101 is comprised of laser oscillator 111, square optical fiber 112, optics section 113, gantry 114, table top 115 and pedestal 116.Laser oscillator 111 is connected via square optical fiber 112 with optics section 113.Optics section 113 is arranged on the front of gantry 114.Gantry 115 be arranged on table top 115 above.Pedestal 116 is arranged on the top almost middle position of table top.
In addition, below, as the x direction of principal axis, and direction from left to right is as positive direction with the width of table top 115.In addition, as the y direction of principal axis, and direction from back to front is as positive direction with the depth direction of table top 115.Have, as the z direction of principal axis, and direction from top to bottom is as positive direction with the short transverse of table top 115 again.
In addition, optics section 113 can be by the linear motor 121 that arranges previously at gantry 114, to x direction of principal axis parallel.Have, gantry 114 can be by linear motor 122a, the 122b of the setting of the limit, the left and right sides above table top 115, to y direction of principal axis parallel again.Then, by mobile optical section 113 and gantry 114, the irradiation position to the laser of thin-film solar cell panel 102 can be moved to x direction of principal axis and y direction of principal axis.
In addition, on table top 115, the carry strap 123a, the 123b that extend to the y axle are arranged on every about pedestal 116, by carry strap 123a, 123b thin-film solar cell panel 102 are carried to the y direction of principal axis.
[structure example of the circuit of laser processing device]
Fig. 7 is the block diagram of structure example of the circuit of expression laser processing device 101.The laser oscillator 111 of laser processing device 101 comprises: impulse generator 151, laser oscillator 152, subtract the device that declines (ATT) 153, collimating mirror 154 and lens 155.The optics section 113 of laser processing device 101 comprises: beam expander 171, galvanometer scanner 172a, 172b, and f θ lens 173.
155 pairs of laser of lens carry out light harvesting, import to square optical fiber 112.
In addition, the amount of declining that subtracts that subtracts the device 153 that declines is variable, and any value can be set.
Square optical fiber 112 is comprised of multimodal optical fiber.In addition, Fig. 8 has represented the end face (plane of incidence or exit facet) of square optical fiber 112, as scheming, the section of the entrance port of square optical fiber 112 or exit portal 112A is rectangle.Therefore, by the laser of square optical fiber 112, its section is shaped as rectangle and from square optical fiber 112 outgoing.
In addition, as mentioned above, be multimodal laser pulse from laser oscillator 152 emitting lasers, there are several peak values in the light distribution of the section of each laser pulse before importing to square optical fiber 112 shown in Fig. 9 left side.Then because the interference of multimodal laser pulse (link up, coherency) low, through the multipath reflection in square optical fiber 112 and the light distribution of the section of each laser pulse of outgoing shown in Fig. 9 right side, do not have interference stripes, peak value is almost smooth.That is, square optical fiber 112 with the range-independence from this center, is to be almost uniformly in the light intensity of the section of each laser pulse of outgoing end face.In addition, the light intensity of section is uniform laser pulse, and is inhomogeneous etc. such as the processing that can reduce the part that pulse shines, and therefore is suitable for flash trimming.
Thus, in laser processing device 101, need not to use costliness and the large devices of optical energy loss such as homogenizer, and the simple structure of just multimodal laser pulse being passed through to square optical fiber 112, just can obtain efficiently to be suitable for the uniform laser pulse of light intensity of the section of flash trimming.
Turn back to Fig. 7, incide optics section 113 from square optical fiber 112 emitting lasers.The laser that incides optics section 113 enlarges beam diameter when keeping rectangle by beam expander 171, becomes collimated light beam.Reflected to f θ lens 173 by galvanometer scanner 172a, 172b from beam expander 171 emitting lasers, incide thin-film solar cell panel 102 via f θ lens 173, in the machined surface imaging of thin-film solar cell panel 102.
[structure example of galvanometer scanner]
The structure example of galvanometer scanner 172a, 172b is described with reference to Figure 10 and Figure 11 here.
As shown in figure 10, galvanometer scanner 172a is comprised of galvanometer 181a, turning cylinder 182a and minute surface 183a.Incide minute surface 183a from beam expander 171 emitting lasers, by the direction reflection of minute surface 183a to galvanometer scanner 172b.Minute surface 183a rotates centered by turning cylinder 182a according to the control of galvanometer 181a, thereby can change the incident angle of laser.Then, change the reflection direction of laser to the incident angle of the laser of minute surface 183a by change, laser scans to the x direction of principal axis on thin-film solar cell panel 102.
Figure 11 represents the structure example of galvanometer 181a.Galvanometer 181a is comprised of moving coil 201, helical spring 202 and permanent magnet 203N, 203S.
Moving coil 201 is propped up in turning cylinder 182a by axle, places the magnetic field that generates between permanent magnet 203N and the permanent magnet 203S.In addition, when turning cylinder 182a was connected with helical spring 202, the one end was installed minute surface 183a, and the other end is supported by not shown bearing.
If moving coil 201 current flowings in the magnetic field, then moving coil 201 is drawn the counter-rotation of the direction of turning cylinder 182a over to one's side to helical spring 202 centered by turning cylinder 182a.Then, when the power that the power that moving coil 201 rotates and spiral winding 202 are drawn turning cylinder 182a over to one's side equated, turning cylinder 182a stopped operating.Thus, with the angle initialization of minute surface 183a angle corresponding to size for the electric current by moving coil 201, thereby change reflection direction according to the laser of minute surface 183a.Therefore, the electric current that flows through moving coil 201 by control is controlled the reflection direction according to the laser of minute surface 183a, thereby laser is scanned.
Yet for fixedly the time, turning cylinder 182a does not rotate at the electric current that flows through moving coil 201, so has stiction to have an effect at the movable position of the bearing of support rotating axle 182a.On the other hand, if change the electric current flow through moving coil 201, turning cylinder 182a rotates, and therefore has kinetic force of friction to have an effect at the movable position of the bearing of support rotating axle 182a.Therefore the generally speaking coefficient of kinetic friction as implied above is compared with the situation that turning cylinder 182a does not rotate less than confficient of static friction, is more prone to the impact of external interference such as being vibrated at the situation turning cylinder 182a of turning cylinder 182a rotation.That is, compare fixedly the time with minute surface 183a, minute surface 183a is more easily occured when rotating around the turning cylinder 182a rocking of the minute surface 183a that caused by external interference.In addition, the generations such as vibration that cause when driving gantry 114 by linear motor 122a, 122b of this external interference.
In addition, the galvanometer 181b of galvanometer scanner 172b also has identical structure with galvanometer 181a, omits repeat specification.
Like this, the minute surface 183a by galvanometer scanner 172a rotates centered by turning cylinder 182a, and the minute surface 183b of galvanometer scanner 172b rotates centered by turning cylinder 182b, and laser changes to incoming position and the incident angle of f θ lens 173.Then, according to the incident angle of f θ lens 173 or the variation of incoming position, the image space of the laser of the machined surface of thin-film solar cell panel 102 moves to horizontal direction.That is, by galvanometer scanner 172a, 172b, the irradiation position of laser to thin-film solar cell panel 102 scanned.
Turn back to Fig. 7, thin-film solar cell panel 102 is the thin-film solar cell panel of monocrystalline silicon type, the transparent substrates 102A that makes according to glass from figure top, by ITO, SnO
2, the transparent electrode layer 102B that consists of of the TCO such as ZnO, the semiconductor layer 102C that is consisted of by a-Si, the backplate layer 102D that consisted of by the Ag electrode sequential cascade.Then, by laser ablation transparent electrode layer 102B to backplate layer 102D.
[structure example of the control part of laser processing device 101]
Figure 12 represents the block diagram for the structure example of the control part 251 of the action of control laser processing device 101.Control part 251 is for example by CPU(Central Processing Unit, central processing unit) etc. the control program that puts rules into practice of processor realize.Control part 251 comprises: output control part 261, drive control part 262 and scan control section 263.
Drive control part 262 drives linear motor 121, the axial position of x of control optics section 113.In addition, drive control part 262 drives linear motor 122a, 122b, controls the axial position of y of optics section 113 by the axial position of y of control gantry 114.Have, drive control part 262 drives carry strap 123a, 123b again, the axial position of y of control thin-film solar cell panel 102.
In addition, output control part 261, drive control part 262 and scan control section 263 are shared mutually the information such as operating state.
[Laser Processing processing]
Next, the flow chart with reference to Figure 13 illustrates the Laser Processing processing of being carried out by laser processing device 101.
In step S1, drive control part 262 determines whether and has inserted thin-film solar cell panel 102.For example, drive control part detects whether be provided with thin-film solar cell panel 102 at carry strap 123a, 123b based on the information from the not shown sensor that arranges on the table top 115.When on carry strap 123a, the 123b thin-film solar cell panel 102 not being set, drive control part 262 is judged to be and does not insert thin-film solar cell panel 102, and carry when being provided with thin-film solar cell panel 102 on 123a, the 123b, drive control part 262 is judged to be and has inserted thin-film solar cell panel 102.Repeat this determination processing, inserted thin-film solar cell panel 102 until be judged to be, when being judged to be when having inserted thin-film solar cell panel 102, process moving to step S2.
In step S2, the introducing of laser processing device 101 beginning thin-film solar cell panels 102.That is, drive control part 262 drives carry strap 123a, 123b, and beginning is to the negative direction carrying of the y axle of thin-film solar cell panel 102.
In step S3, drive control part 262 judges whether thin-film solar cell panel 102 is introduced in the position of pedestal 116.For example, drive control part 262 is based on judging from the information of the not shown sensor that arranges on the table top 115 whether thin-film solar cell panel 102 is introduced in the position of pedestal 116.Repeat this determination processing, until be judged to be the position that thin-film solar cell panel 102 is introduced in pedestal 116, when being judged to be thin-film solar cell panel 102 and being introduced in the position of pedestal 116, process moving to step S4.
In step S4, laser processing device 101 is set to thin-film solar cell panel 102 on the pedestal 116.That is, drive control part 262 stops the driving of carry strap 123a, 123b, for example controls not shown lift, and thin-film solar cell panel 102 is set on the pedestal 116.
In step S5, laser processing device 101 carries out flash trimming to be processed.In addition, about the details that flash trimming is processed, narrate in the back with reference to Figure 14.
In step S6, laser processing device 101 begins drawing of thin-film solar cell panels 102.That is, drive control part 262 is for example controlled not shown lift, thin-film solar cell panel 102 is arranged on carry strap 123a, the 123b, and driving carry strap 123a, 123b begins the positive direction carrying to the y axle of thin-film solar cell panel 102.
In step S7, drive control part 262 judges whether drawing of thin-film solar cell panel 102 finishes.For example, drive control part 262 is based on judging from the information of the not shown sensor that arranges on the table top 115 whether drawing of thin-film solar cell panel 102 finishes.Repeat this determination processing, finish until be judged to be drawing of thin-film solar cell panel 102, when being judged to be drawing of thin-film solar cell panel 102 and finishing, the Laser Processing processing finishes.
[details that flash trimming is processed]
Next, the flow chart with reference to Figure 15 illustrates the details that the flash trimming of the step S5 among Figure 13 is processed.
In step S51, drive control part 262 moves to the irradiation position of laser the starting position on the limit of next processing.
When Figure 15 represents that thin-film solar cell panel 102 carried out flash trimming, the example of processing sequence.In this example, carry out flash trimming according to the order of arrow 305a, arrow 305b, arrow 305c, arrow 305d.
That is, the scope 302a of Ear Mucosa Treated by He Ne Laser Irradiation around the 301a of the limit of thin-film solar cell panel 102, the oblique line among the dissection scope 302a represents, the film of the regional 303a of the linearity wider than the beam diameter of laser.Next, the scope 302b of Ear Mucosa Treated by He Ne Laser Irradiation around the 301b of the limit of thin-film solar cell panel 102, the oblique line among the dissection scope 302b represents, the film of the regional 303b of the linearity wider than the beam diameter of laser.Next, the scope 302c of Ear Mucosa Treated by He Ne Laser Irradiation around the 301c of the limit of thin-film solar cell panel 102, the oblique line among the dissection scope 302c represents, the film of the regional 303c of the linearity wider than the beam diameter of laser.Then, last, the scope 302d of Ear Mucosa Treated by He Ne Laser Irradiation around the 301d of the limit of thin-film solar cell panel 102, the oblique line among the dissection scope 302d represents, the film of the regional 303d of the linearity wider than the beam diameter of laser.
In addition, when carrying out the flash trimming of regional 303a, begin the irradiation of laser from the starting position 304a in the lower left corner of scope 302a.In addition, when carrying out the flash trimming of regional 303b, begin the irradiation of laser from the starting position in the upper left corner of scope 302b.When the flash trimming that carries out regional 303c is arranged again, begin the irradiation of laser from the starting position 304c in the upper right corner of scope 302c.In addition, when carrying out the flash trimming of regional 303d, begin the irradiation of laser from the starting position 304d in the lower right corner of scope 302d.
Therefore, for present embodiment, because limit 301a at first becomes processing object, therefore drive control part 262 drives linear motor 121 and linear motor 122a, 122b, mobile optical section 113 and gantry 114 are until optics section 113 emitting lasers shine the position of starting position 304a.
In step S52, drive control part 262 so that optics section 113 along the mobile beginning on the limit of processing.At this moment, drive linear motor 121 beginnings to the movement of the positive direction of the x axle of optics section 113.Thus, optics section 113 beginning is to mobile along the direction of the arrow 305a of the limit 301a of processing at first (regional 303a than length direction).
In addition, the below is called main scanning direction with optics section 113 with respect to the moving direction of thin-film solar cell panel 102.In addition, the below is called sub scanning direction with direction vertical with main scanning direction on the thin-film solar cell panel 102.Therefore, when carrying out the flash trimming of regional 303a, main scanning direction is the positive direction of x axle, and sub scanning direction is the y direction of principal axis.Have, the below is called again line direction with main scanning direction again, and sub scanning direction is called again column direction.
In step S53, laser oscillator 111 begins the output of laser according to the control of output control part 261.Begin thus to the irradiation of the laser of thin-film solar cell panel 102.
In step S54, the scanning of scan control section 263 beginning laser.
The details of the scan method of laser is described with reference to Figure 16 and Figure 17 here.Figure 16 represents position and the scanning direction of the luminous point among the scope 302a.The scanning direction of the laser when in addition, Figure 17 represents that luminous point carried out scanning such as Figure 16.
As mentioned above, the irradiation of laser is from the 304a of starting position.Then, scan control section 263 drives galvanometer scanner 172a with the direction (positive direction of x axle) of laser to the arrow 331a of Figure 17, and namely main scanning direction scans.The scanning distance of this moment for example is set to scan control section 263 can be with laser near the ultimate range of the scanning direction of x axle.Thus, luminous point is main scanning direction scanning to the direction of the arrow 311a of Figure 16.In addition, this moment, Ear Mucosa Treated by He Ne Laser Irradiation was so that overlap with the end part of luminous point adjacent on the x direction of principal axis.
Next, scan control section 263 drives galvanometer scanner 172b with the direction (negative direction of y axle) of laser to the arrow 331b of Figure 17, and namely sub scanning direction scans, until the adjacent row of row that laser is scanned to the direction of arrow 331a.Thus, delegation is moved to the negative direction of y axle in the position of luminous point.In addition, at this moment, optics section 113 moves to the positive direction of x axle, so luminous point scanning to the tilted direction of the negative direction of the positive direction of x axle and y axle like that shown in arrow 311b.In addition, the position of the luminous point of the second row is set, so that the end of the luminous point of the first row that scans to the direction of arrow 311a overlaps with the end part of the luminous point of next the second row that scans to the direction of arrow 311c.
Next, scan control section 263 drives galvanometer scanner 172b with the direction (negative direction of x axle) of laser to the arrow 331c of Figure 17, and namely the opposite direction of main scanning direction scans.Almost equal distance when the scanning distance of this moment for example is set to direction to arrow 331a laser be scanned.Thus, luminous point is in the position adjacent with the position of the luminous point of the first row, and to the direction of the arrow 311c of Figure 16, namely the opposite direction to main scanning direction scans.In addition, shine laser this moment so that overlap with the end part of luminous point adjacent on the x direction of principal axis.
Next, scan control section 263 drives galvanometer scanner 172b with the direction (negative direction of y axle) of laser to the arrow 331d of Figure 17, and namely sub scanning direction scans, until the adjacent row of row that laser is scanned to the direction of arrow 331c.Thus, luminous point scans to the direction with the almost identical arrow 311d of the arrow 311b of Figure 16, and delegation is moved to the negative direction of y axle in the position of luminous point.In addition, the position of the luminous point of the third line is set, so that the end of the luminous point of the second row that scans to the direction of arrow 311c overlaps with the end sections of the luminous point of next the third line that scans to the direction of arrow 311e.
Then, according to arrow 331e, the arrow 331f of Figure 17 ..., arrow 331k order laser is scanned.That is, repeat following the processing: after laser is scanned to main scanning direction, move to adjacent lines to sub scanning direction, after scanning to the opposite direction of main scanning direction, move to adjacent lines to sub scanning direction.Thus, according to arrow 311e, the arrow 311f of Figure 16 ..., arrow 311k order luminous point is scanned.That is, when luminous point is mobile line by line to sub scanning direction, according to the scanning that hockets of reciprocal every delegation of main scanning direction or main scanning direction.
Then, scan control section 263 is finishing after the scanning of the laser of the direction of arrow 331k, driving galvanometer scanner 172b, is that sub scanning direction scans with laser to the direction (positive direction of y axle) of arrow 331l, with the position movement of the y direction of the luminous point position to the first row.In addition, this moment, optics section 113 positive directions to the x axle moved, so luminous point is as arrow 311l represents, scanned to the tilted direction of the positive direction of the positive direction of x axle and y axle.In addition, the sweep speed of scan control section 263 control laser is so that the position of the end of the luminous point that the position of the luminous point during to the end of scan of the direction of arrow 311l and direction to arrow 311a scan is almost identical.
In addition, below will by according to 331a, 331b ..., 331l order laser is carried out run-down, and zone that can stripping film is called processing block.
Then, similarly, according to arrow 331a, the arrow 331b of Figure 17 ..., arrow 311l order laser is scanned, according to arrow 312a, the arrow 312b of Figure 16 ..., arrow 312l order luminous point is scanned.In addition, repeat same scanning, until the peeling off of the film of end region 303a.Thus, in each processing block, when luminous point moves line by line to sub scanning direction, according to the scanning that hockets of reciprocal every delegation of main scanning direction or main scanning direction, be stripped from according to the film in each processing block of order of main scanning direction, finish until the film of regional 303a is peeled off.
Yet, when laser is scanned to the opposite direction of main scanning direction and main scanning direction, galvanometer scanner 172a is driven, become following state, that is: kinetic force of friction is had an effect at the movable position of the bearing of galvanometer scanner 172a, galvanometer scanner 172b stops simultaneously, and stiction is had an effect at the movable position of the bearing that drives galvanometer scanner 172a.Therefore, the turning cylinder 182b of galvanometer scanner 172b is not vulnerable to the impact of external interference such as vibrating, and the axial vibration of the y of laser is stablized.Its result, does not rock the position of luminous point, is almost to the straight line of the direction of x axle.Therefore, in the end of regional 303a (part of stripping film and not part critical of stripping film), the luminous point of rectangle is almost the straight line to main scanning direction, and the end of regional 303a can be not uneven, and almost be aligned to straight line.In addition, in regional 303a, can eliminate not by Ear Mucosa Treated by He Ne Laser Irradiation and the residual region that film is not stripped from.
In addition, when the scanning direction of laser was inverted to the opposite direction (for example direction of the arrow 331c of Figure 17) of main scanning direction or is inverted to main scanning direction (for example direction of the arrow 331a of Figure 17) from the opposite direction (for example direction of the arrow 331c of Figure 17) of main scanning direction from main scanning direction (for example direction of the arrow 331a of Figure 17), galvanometer scanner 172a and galvanometer scanner 172b were simultaneously driven at short notice.Therefore, with in the above with reference to the same reason of the described phenomenon of Fig. 5, may become zigzag in inversion section.But, as expression in the scope 313 of Figure 16, overlap by the end that makes adjacent processing block, can peel off neatly film residual on the sawtooth, thereby eliminate this problem.
Have again, with reference to Fig. 3 and Fig. 4 and described scan method is identical, can reduce the area of adjacent spots coincide with in the above.Have again, be made as rectangle by the section (luminous point) with laser, can compare the area that more reduces adjacent spots coincide with circular or oval-shaped situation.Its result can shorten process time.
Turn back to Figure 14, in step S55, scan control section 263 judges whether the processing on the limit that is processing finishes.Repeat this determination processing, until be judged to be the process finishing on the limit that is processing, when being judged to be the process finishing on the limit that is processing, process moving to step S56.
In step S56, laser oscillator 111 stops the output of laser according to the control of output control part 261.Thus, stop to the irradiation of the laser of thin-film solar cell panel 102.
In step S57, scan control section 263 determines whether the processing on whole limit that is through with.When being judged to be the man-hour that adds that does not finish whole limits, process turning back to step S51.
After this, until in step S57, be judged to be the processing of the processing repeated execution of steps S51 to S57 on whole limit that is through with.Thus, by with in the above with reference to Figure 16 and Figure 17 and the identical method of described scan method, laser is illuminated according to the order of scope 302b, scope 302c, scope 302d, film is stripped from according to the order of scope 302b, scope 302c, scope 302d.
In addition, main scanning direction adds man-hour at opposite side 301b, change into arrow 305b direction (positive direction of y axle), add man-hour at opposite side 301c, change into arrow 305c direction (negative direction of x axle), add man-hour at opposite side 301d, change into the direction (negative direction of y axle) of arrow 305d.Therefore, according to the change according to main scanning direction, adjust the order and the scanning direction that drive galvanometer scanner 172a, 172b, thereby adjust the scanning direction of laser.
For example, opposite side 301b adds man-hour, adjusts the scanning direction of laser, so that the direction of the arrow 331a of Figure 17 becomes the positive direction of y axle, the direction of arrow 331b becomes the positive direction of x axle.Then, in regional 302b luminous point is scanned, so that the direction of the arrow 311a of Figure 16 becomes the positive direction of y axle, the direction of arrow 311b becomes the positive direction of x axle.In addition, opposite side 301c adds man-hour, adjusts the scanning direction of laser, so that the direction of the arrow 331a of Figure 17 becomes the negative direction of x axle, the direction of arrow 331b becomes the positive direction of y axle.Then, in regional 302c luminous point is scanned, so that the direction of the arrow 311a of Figure 16 becomes the negative direction of x axle, the direction of arrow 311b becomes the positive direction of y axle.Have, opposite side 301d adds man-hour again, adjusts the scanning direction of laser, so that the direction of the arrow 331a of Figure 17 becomes the negative direction of y axle, the direction of arrow 331b becomes the negative direction of x axle.Then, in regional 302d luminous point is scanned, so that the direction of the arrow 311a of Figure 16 becomes the negative direction of y axle, the direction of arrow 311b becomes the negative direction of x axle.
On the other hand, in step S57, be judged to be the man-hour that adds on whole limit that is through with, finish flash trimming and process.
By more than, can suppress the increase of process time of the flash trimming of thin-film solar cell panel 102, improve simultaneously crudy.
＜2. variation 〉
In addition, in the above description, show applicable example of the present invention when carrying out the flash trimming of thin-film solar cell panel 102, in addition, but the present invention also goes for for example using laser straight wire ground from the substrate desquamation film, in other words, use laser from the situation of the film in the zone of substrate desquamation rectangle.
In addition, in the above description, show the position of mobile optical section 113 by the position of fixed film solar panel 102, come the example of the relative position between mobile thin-film solar cell panel 102 and the optics section 113, but position that also can be by the fixed light department of the Chinese Academy of Sciences 113 and the position of mobile thin-film solar cell panel 102, perhaps move both, thus the relative position between mobile thin-film solar cell panel 102 and the optics section 113.
Have, in the above description, the section that shows laser is the example of rectangle again, but also can be for beyond the rectangle, and is for example circular or oval.
In addition, in the above description, show the example with laser scanning by galvanometer scanner 172a, 172b, but also can use other sweep units that laser is scanned.
In addition, embodiments of the present invention are not limited to above-mentioned embodiment, can do various changes in the scope that does not break away from aim of the present invention.
The explanation of label
101 laser processing devices
102 thin-film solar cell panels
111 laser oscillators
112 square optical fiber
113 optics sections
114 gantries
115 table tops
116 pedestals
121 linear motors
112a, 112b linear motor
123a, 123b carry strap
171 beam expanders
172a, 172b galvanometer scanner
173f θ lens
181a, 181b galvanometer
183a, 183b minute surface
251 control parts
261 output control parts
262 drive control parts
263 scan control section
Claims (8)
1. a laser processing device uses laser from the substrate desquamation film, it is characterized in that, comprising:
Processing department comprises sweep unit, this sweep unit in the scope of the regulation of first direction and with the scope of the regulation of the second direction of described first direction quadrature in described laser in the enterprising line scanning of described substrate; And,
Moving-member moves at least one in described processing department and the described substrate, and the relative position between described processing department and the described substrate is moved to described first direction at least,
During film in the first area of linearity wider from the beam diameter of the described laser of described substrate desquamation Width and that extend to first direction, by described moving-member the relative position between described processing department and the described substrate is moved to described first direction, with respect to the direction of advance that described substrate advances described laser is scanned to described processing department by described sweep unit simultaneously, thereby in described first area the irradiation position of described laser is scanned to described direction of advance.
2. laser processing device as claimed in claim 1 is characterized in that,
After described laser scanned to described direction of advance, further, by described sweep unit described laser is moved to described second direction, the opposite direction of described laser to described direction of advance scanned, thereby in the irradiation position of the described laser when to described direction of advance laser being scanned adjacent position on described second direction, the irradiation position of the described laser opposite direction to described direction of advance is scanned.
3. laser processing device as claimed in claim 2 is characterized in that,
By described sweep unit, scope according to the regulation of the described first direction of each described first area, the irradiation position of described laser is moved to described second direction, replacing property of opposite direction ground to described direction of advance or described direction of advance scans simultaneously, peels off the film of each scope according to the order of described direction of advance.
4. laser processing device as claimed in claim 1 is characterized in that,
During film in the second area of linearity wider from the beam diameter of the described laser of described substrate desquamation Width and that extend to described second direction, by described moving-member the relative position between described processing department and the described substrate is moved to described second direction, with respect to the direction of advance that described substrate advances described laser is scanned to described processing department by described sweep unit simultaneously, thereby scan to described direction of advance at the irradiation position of described second area with described laser.
5. laser processing device as claimed in claim 1 is characterized in that,
The section that incides the laser of described substrate is rectangle.
6. laser processing device as claimed in claim 1 is characterized in that,
This sweep unit comprises:
With first galvanometer scanner of described laser to described first direction scanning; And,
With second galvanometer scanner of described laser to described second direction scanning.
7. laser processing device as claimed in claim 1 is characterized in that,
Also comprise the laser generation parts that described laser is vibrated.
8. a laser processing is characterized in that,
The laser processing device that comprises processing department, described processing department comprises sweep unit, this sweep unit to first direction and with the second direction of described first direction quadrature with described laser in the enterprising line scanning of described substrate,
Wider from the beam diameter of the described laser of described substrate desquamation Width, and during the film in the zone of the linearity that extends to first direction, by described moving-member the relative position between described processing department and the described substrate is moved to described first direction, with respect to the direction of advance that described substrate advances described laser is scanned to described processing department by described sweep unit simultaneously, thereby in described zone, the irradiation position of described laser is scanned to described direction of advance.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010137928A JP2012000640A (en) | 2010-06-17 | 2010-06-17 | Laser processing device and laser processing method |
| JP2010-137928 | 2010-06-17 | ||
| PCT/JP2011/056234 WO2011158539A1 (en) | 2010-06-17 | 2011-03-16 | Laser processing device and laser processing method |
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| Publication Number | Publication Date |
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| CN103068515A true CN103068515A (en) | 2013-04-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011800396573A Pending CN103068515A (en) | 2010-06-17 | 2011-03-16 | Laser processing device and laser processing method |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2012000640A (en) |
| KR (1) | KR20130079481A (en) |
| CN (1) | CN103068515A (en) |
| TW (1) | TW201208799A (en) |
| WO (1) | WO2011158539A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102916081B (en) * | 2012-10-19 | 2015-07-08 | 张立国 | Edge deletion method for thin-film solar cells |
| CN103084736A (en) * | 2013-01-16 | 2013-05-08 | 中国重型机械研究院股份公司 | Laser edge cutting system |
| JP2018091931A (en) * | 2016-11-30 | 2018-06-14 | 澁谷工業株式会社 | Terahertz light generation device |
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| JPH08229693A (en) * | 1995-02-28 | 1996-09-10 | Toshiba Corp | Laser beam irradiating equipment |
| JP2001079680A (en) * | 1999-09-14 | 2001-03-27 | Matsushita Electric Ind Co Ltd | Laser beam machining device and method therefor |
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| CN101657292A (en) * | 2006-11-27 | 2010-02-24 | 伊雷克托科学工业股份有限公司 | laser machining |
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2010
- 2010-06-17 JP JP2010137928A patent/JP2012000640A/en active Pending
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- 2011-03-16 WO PCT/JP2011/056234 patent/WO2011158539A1/en active Application Filing
- 2011-03-16 CN CN2011800396573A patent/CN103068515A/en active Pending
- 2011-03-16 KR KR1020137001161A patent/KR20130079481A/en not_active Application Discontinuation
- 2011-06-16 TW TW100120972A patent/TW201208799A/en unknown
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| JPH08229693A (en) * | 1995-02-28 | 1996-09-10 | Toshiba Corp | Laser beam irradiating equipment |
| JP2001079680A (en) * | 1999-09-14 | 2001-03-27 | Matsushita Electric Ind Co Ltd | Laser beam machining device and method therefor |
| JP2004098116A (en) * | 2002-09-09 | 2004-04-02 | Mitsubishi Electric Corp | Mask transfer laser pattern machining method |
| JP2004322106A (en) * | 2003-04-21 | 2004-11-18 | Sumitomo Heavy Ind Ltd | Laser beam machining method, and laser beam machining apparatus |
| CN101657292A (en) * | 2006-11-27 | 2010-02-24 | 伊雷克托科学工业股份有限公司 | laser machining |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20130079481A (en) | 2013-07-10 |
| JP2012000640A (en) | 2012-01-05 |
| TW201208799A (en) | 2012-03-01 |
| WO2011158539A1 (en) | 2011-12-22 |
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