CN103063071B - A kind of spring body for enhanced heat exchange and preparation method thereof - Google Patents
A kind of spring body for enhanced heat exchange and preparation method thereof Download PDFInfo
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- CN103063071B CN103063071B CN201310039938.XA CN201310039938A CN103063071B CN 103063071 B CN103063071 B CN 103063071B CN 201310039938 A CN201310039938 A CN 201310039938A CN 103063071 B CN103063071 B CN 103063071B
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- conductive wire
- thermal conductive
- spring
- heat exchange
- enhanced heat
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- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 238000005452 bending Methods 0.000 claims abstract description 13
- 239000007769 metal material Substances 0.000 claims description 3
- 229910052755 nonmetal Inorganic materials 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000005855 radiation Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Springs (AREA)
Abstract
The invention discloses a kind of spring body for enhanced heat exchange and preparation method thereof, a kind of spring body for enhanced heat exchange, comprise: thermal conductive wire body, described thermal conductive wire body is a single thermal conductive wire, described thermal conductive wire body is the spring unit that single thermal conductive wire carries out spiral pitch of the laps, and described spring unit joins end to end in the bending of " bow " font and is structure as a whole and is erected at the surface of heat-sink unit; For a preparation method for the spring body of enhanced heat exchange, first form spring unit by screw type being wrapped on flat plug of single thermal conductive wire, after then spring unit being carried out repeatedly the bending of " bow " font, form thermal conductive wire body.By the way, the invention solves thermal conductive wire body and make complicated, cost of manufacture is high, the problem that make efficiency is low, can realize the heat radiation of more highdensity pin rib.
Description
Technical field
The present invention relates to heat exchange applied technical field, particularly relate to a kind of spring body for enhanced heat exchange and preparation method thereof.
Background technology
In prior art, needle-like rib is better than sheet rib thermal diffusivity, and the manufacture method of traditional pin rib is all that production efficiency is low by extruded, and manufacturing cost is high.US Patent No. 20110185573 provides a kind of new-type preparation method, its preparation method have employed after bar-shaped core body is wound around and forms one section of spring-like heat-sink unit by the mode of extruding, because single heat-sink unit can not independently erect on thermal dissipating object, therefore need one piece of substrate for the support of spring-like heat-sink unit, multiple spring-like heat-sink unit is by welding with substrate, and formed one heat sink, by heat sink welding to need heat radiation surperficial time, volatile matter in solder not easily scatters and disappears, easy generation air gap thermal resistance, unfavorable to heat transfer; The preparation method of spring-like heat-sink unit disclosed in this needs to carry out extruding and could be formed in addition, and complex procedures, cost of manufacture is high.Chinese patent CN202420273 provides a kind of weaving, and by base cloth, this technique can support that needle-like rib erects, but also need the support of base cloth.Chinese patent CN202675988 provides a kind of bending technique, and this technique can realize realizing pin rib without the need to substrate support and erect, but this technique needs special wave apparatus of beating, and this technique is when realizing high density pin rib, and production efficiency is lower.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of spring body for enhanced heat exchange and preparation method thereof, and solve thermal conductive wire body and make complicated, cost of manufacture is high, the problem that make efficiency is low, can realize the heat radiation of more highdensity pin rib.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: provide a kind of spring body for enhanced heat exchange, comprise: thermal conductive wire body, described thermal conductive wire body is a single thermal conductive wire, described thermal conductive wire body is the spring unit that single thermal conductive wire carries out spiral pitch of the laps, and described spring unit joins end to end in the bending of " bow " font and is structure as a whole and is erected at the surface of heat-sink unit.
In a preferred embodiment of the present invention, be the surface enabling spring unit independently be erected at heat-sink unit, described spring unit joins end to end in the bending of " bow " font and is at least two rows.
In a preferred embodiment of the present invention, described heat-sink unit comprises tube surface and temperature-uniforming plate surface, dispels the heat in the surface that described thermal conductive wire body is attached to heat-sink unit by the mode welded or attach.
In a preferred embodiment of the present invention, according to area and the radiating rate of heat radiation, the cross section of described single thermal conductive wire is circle, polygon or ellipse.
In a preferred embodiment of the present invention, described single thermal conductive wire is metal material or nonmetal polymer, as copper, iron, stainless steel or aluminium alloy etc.
Present invention also offers a kind of preparation method of the spring body for enhanced heat exchange, first form spring unit by screw type being wrapped on flat plug of single thermal conductive wire, after then spring unit being carried out repeatedly the bending of " bow " font, form thermal conductive wire body.
The invention has the beneficial effects as follows: the present invention adopts the good wire rod that conducts heat, formed spring unit on flat plug is wrapped in by multi-circle spiral flow formula, then to spring unit more repeatedly bending form the spring body structure of the 3 D stereo that can independently erect, form block intensive pin array, the bottom of spring body structure is done support without the need to substrate and shapingly separately can be erected at heat-delivery surface, spring body structure is because there being single thermal conductive wire shaping, middle no-welding-spot contactless, this technique makes simple, cost is low, and adds heat exchange area.
Accompanying drawing explanation
Fig. 1 is the perspective view of the present invention for spring body one preferred embodiment of enhanced heat exchange;
Fig. 2 is the front view of the present invention for the spring body of enhanced heat exchange;
Fig. 3 is the left view of the present invention for the spring body of enhanced heat exchange;
Fig. 4 is the top view of the present invention for the spring body of enhanced heat exchange;
Fig. 5 is the using state figure of the present invention for the spring body of enhanced heat exchange;
Fig. 6 is the present invention another using state figure for the spring body of enhanced heat exchange;
Fig. 7 is the preparation method schematic diagram of the present invention for the spring body of enhanced heat exchange.
In accompanying drawing, the mark of each parts is as follows: 1, thermal conductive wire body; 2, heat-sink unit; 3, flat plug; 11, single thermal conductive wire; 12, spring unit; 20, tube surface; 21, temperature-uniforming plate surface.
Detailed description of the invention
Below in conjunction with accompanying drawing, preferred embodiment of the present invention is described in detail, can be easier to make advantages and features of the invention be readily appreciated by one skilled in the art, thus more explicit defining is made to protection scope of the present invention.
Refer to Fig. 1 to Fig. 4, the embodiment of the present invention comprises: a kind of spring body for enhanced heat exchange, comprise: thermal conductive wire body 1, thermal conductive wire body 1 is a single thermal conductive wire 11, thermal conductive wire body 1 is the spring unit 12 that single thermal conductive wire 11 carries out spiral pitch of the laps, spring unit 12 joins end to end in the bending of " bow " font and is structure as a whole and is erected at the surface of heat-sink unit 2, spring unit 12 joins end to end in the bending of " bow " font and is at least two rows, heat-sink unit 2 comprises tube surface 20 and temperature-uniforming plate surface 21, dispel the heat in the surface that thermal conductive wire body 1 is attached to heat-sink unit 2 by the mode welded or attach.。
Furtherly, the cross section of single thermal conductive wire 11 is circle, polygon or ellipse, and the material of this single thermal conductive wire 11 is metal material or alloy that thermal conductivity is good, as copper, and iron, stainless steel or aluminium alloy etc., or nonmetal polymer.
As shown in Figure 5, thermal conductive wire body 1 is attached to welding material or binding material and is needed on the tube surface 20 of enhance heat, formed a kind of pin rib enhance heat type heat pipe.
As shown in Figure 6, thermal conductive wire body 1 is attached to welding material or binding material and is needed on the temperature-uniforming plate surface 21 of enhance heat, formed a kind of pin rib enhance heat temperature-uniforming plate.
As shown in Figure 7, preparation method for the spring body of enhanced heat exchange: first form spring unit 12 by screw type being wrapped on flat plug 3 of single thermal conductive wire 11, forms thermal conductive wire body 1 after then carrying out repeatedly the bending of " bow " font to spring unit 12.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (6)
1. the spring body for enhanced heat exchange, it is characterized in that, comprise: thermal conductive wire body, described thermal conductive wire body is a single thermal conductive wire, described thermal conductive wire body is the spring unit that upper and lower side that single thermal conductive wire carries out spiral pitch of the laps formation on flattened rectangular plug is horizontal straight flange, and described spring unit joins end to end in the bending of " bow " font and is structure as a whole and is erected at the surface of heat-sink unit.
2. according to the spring body for enhanced heat exchange described in claim 1, it is characterized in that: described spring unit joins end to end in the bending of " bow " font and is at least two rows.
3. according to the spring body for enhanced heat exchange described in claim 1, it is characterized in that: described heat-sink unit comprises tube surface or temperature-uniforming plate surface, dispels the heat in the surface that described thermal conductive wire body is attached to heat-sink unit by the mode welded or attach.
4. according to the spring body for enhanced heat exchange described in claim 1, it is characterized in that: the cross section of described single thermal conductive wire is circle, polygon or ellipse.
5. according to the spring body for enhanced heat exchange described in claim 1, it is characterized in that: described single thermal conductive wire is metal material or nonmetal polymer.
6. the preparation method for the spring body of enhanced heat exchange, it is characterized in that: first form spring unit by screw type being wrapped on flattened rectangular plug of single thermal conductive wire, after then spring unit being carried out repeatedly the bending of " bow " font, form thermal conductive wire body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310039938.XA CN103063071B (en) | 2013-02-01 | 2013-02-01 | A kind of spring body for enhanced heat exchange and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310039938.XA CN103063071B (en) | 2013-02-01 | 2013-02-01 | A kind of spring body for enhanced heat exchange and preparation method thereof |
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| Publication Number | Publication Date |
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| CN103063071A CN103063071A (en) | 2013-04-24 |
| CN103063071B true CN103063071B (en) | 2015-08-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310039938.XA Active CN103063071B (en) | 2013-02-01 | 2013-02-01 | A kind of spring body for enhanced heat exchange and preparation method thereof |
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| Country | Link |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB963281A (en) * | 1961-01-23 | 1964-07-08 | Heath Spring & Notion Company | Improvements relating to the manufacture of helical wire springs |
| CN102519294A (en) * | 2012-01-17 | 2012-06-27 | 魏辉 | Heat exchange unit |
| CN202675988U (en) * | 2012-07-03 | 2013-01-16 | 苏州图卡节能科技有限公司 | Needle type heat exchange unit |
| CN203069027U (en) * | 2013-02-01 | 2013-07-17 | 陈黎清 | Spring body used for heat transfer enhancement |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6898082B2 (en) * | 2002-05-10 | 2005-05-24 | Serguei V. Dessiatoun | Enhanced heat transfer structure with heat transfer members of variable density |
| US8850704B2 (en) * | 2010-02-03 | 2014-10-07 | Sum q, Inc. | Heat sink |
-
2013
- 2013-02-01 CN CN201310039938.XA patent/CN103063071B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB963281A (en) * | 1961-01-23 | 1964-07-08 | Heath Spring & Notion Company | Improvements relating to the manufacture of helical wire springs |
| CN102519294A (en) * | 2012-01-17 | 2012-06-27 | 魏辉 | Heat exchange unit |
| CN202675988U (en) * | 2012-07-03 | 2013-01-16 | 苏州图卡节能科技有限公司 | Needle type heat exchange unit |
| CN203069027U (en) * | 2013-02-01 | 2013-07-17 | 陈黎清 | Spring body used for heat transfer enhancement |
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| Publication number | Publication date |
|---|---|
| CN103063071A (en) | 2013-04-24 |
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Effective date of registration: 20170106 Address after: The front 215011 Suzhou Road, Jiangsu province Suzhou high tech Development Zone No. 6 Patentee after: Suzhou Mega precision spring Hardware Co., Ltd. Address before: 215011 Jiangsu Province, Suzhou City District Tower Road No. 203 Green garden 26-1011 Patentee before: Chen Liqing Patentee before: Wei Hui |