CN103060806A - A regular-array etching reinforcement copper sheet structure with no connection points - Google Patents
A regular-array etching reinforcement copper sheet structure with no connection points Download PDFInfo
- Publication number
- CN103060806A CN103060806A CN2012105806782A CN201210580678A CN103060806A CN 103060806 A CN103060806 A CN 103060806A CN 2012105806782 A CN2012105806782 A CN 2012105806782A CN 201210580678 A CN201210580678 A CN 201210580678A CN 103060806 A CN103060806 A CN 103060806A
- Authority
- CN
- China
- Prior art keywords
- copper sheet
- etching
- sheet structure
- connection points
- product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention discloses a regular-array etching reinforcement copper sheet structure with no connection points. The regular-array etching reinforcement copper sheet structure with no connection points comprises a copper sheet fixing carrier, an etching products and back glue. The copper sheet fixing carrier is compounded with an etching product, and the etching product is provided with the back glue. Via the manner described above, by using the structure of the present invention, disadvantage that existing products have to bear with connection points around can be overcome, and products without connection points around can be produced, so users do not need to break the etching product for use, at the same time no burrs, etc. will be generated to affect use; and etching face of the product has no gap, so the product is relatively beautiful.
Description
Technical field
The present invention relates to mobile phone and computer part processing and manufacturing field, particularly relate to a kind of connectionless point etching reinforcement copper sheet structure of regular array.
Background technology
For obtaining all around without burr, and the reinforcement copper sheet of queueing discipline, existing etching reinforcement copper sheet mainly adopts the production of band tie point etch structures, the former material of metal just is etched into the arrangement mode that needs after the two surface uniforms coating photosensitive-ink simultaneously, then remove surface ink, fit with the gum (hot-setting adhesive or pressure sensitive adhesive) of corresponding arrangement again and make fabricated part.
This kind etch copper chip architecture need to arrange tie point in the leaving certain gaps uncovered by the economic plan of profile etched facet, and tie point is usually less than product design, tie point need to be fractureed when the user takes off; When the bad reservation of the size control of tie point was bigger than normal, tie point is frangibility not then, or left the metal cusp after fractureing and be higher than the product design size, formed burr, and impact is used; Reserve when less than normal the risk that exists product to come off in the etching process; In addition product etched facet leaving certain gaps uncovered by the economic plan, not attractive in appearance.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of connectionless point etching reinforcement copper sheet structure of regular array, the currently available products periphery can be improved and this shortcoming of band tie point must be needed, can reach product periphery connectionless point, the user does not need the etching products use that fractures, and can not produce the impact such as burr simultaneously and use; Product etched facet non-notch exists, and is relatively attractive in appearance.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: the connectionless point etching reinforcement copper sheet structure that a kind of regular array is provided, the connectionless point etching reinforcement copper sheet structure of this regular array comprises copper sheet immobilization carrier, etching products and gum, be compounded with etching products on the described copper sheet immobilization carrier, etching products is provided with gum;
What preferably, described etching products with gum became the array rule is arranged in the copper sheet immobilization carrier.
The invention has the beneficial effects as follows: the connectionless point etching reinforcement copper sheet structure of a kind of regular array of the present invention, the currently available products periphery can be improved and this shortcoming of band tie point must be needed, can reach product periphery connectionless point, the user does not need the etching products use that fractures, and can not produce the impact such as burr simultaneously and use; Product etched facet non-notch exists, and is relatively attractive in appearance.
Description of drawings
Fig. 1 is the vertical view that tie point etching reinforcement copper sheet structure is arranged of a kind of regular array of the present invention;
Fig. 2 be a kind of regular array of the present invention tie point etching reinforcement copper sheet list product enlarged diagram arranged;
Fig. 3 is the vertical view of the connectionless point etching reinforcement copper sheet structure of a kind of regular array of the present invention;
Fig. 4 is the side figure of the connectionless point etching reinforcement copper sheet structure of a kind of regular array of the present invention.
Embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present invention is described in detail, thereby so that the advantage of invention and feature can be easier to be it will be appreciated by those skilled in the art that protection scope of the present invention is made more explicit defining.
See also Fig. 1 and Fig. 4, the embodiment of the invention comprises:
A kind of connectionless point etching reinforcement copper sheet structure of regular array, the connectionless point etching reinforcement copper sheet structure of this this regular array comprises copper sheet immobilization carrier 1, etching products 2 and gum 3, be compounded with etching products 2 on the described copper sheet immobilization carrier 1, etching products 2 is provided with gum 3; Described 2 one-tenth array rules of etching products with gum 3 be arranged in copper sheet immobilization carrier 1.
The connectionless point etching reinforcement copper sheet structure of a kind of regular array of the present invention, the currently available products periphery can be improved and this shortcoming of band tie point must be needed, can reach product periphery connectionless point, the user does not need can not produce the impact uses such as burr simultaneously to etching products uses that fracture; Product etched facet non-notch exists, and is relatively attractive in appearance.
The above only is embodiments of the invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes specification sheets of the present invention and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (2)
1. the connectionless point etching reinforcement copper sheet structure of a regular array, it is characterized in that: the connectionless point etching reinforcement copper sheet structure of this regular array comprises copper sheet immobilization carrier, etching products and gum, be compounded with etching products on the described copper sheet immobilization carrier, etching products is provided with gum.
2. the connectionless point etching reinforcement copper sheet structure of a kind of regular array according to claim 1 is characterized in that: what described etching products with gum became the array rule is arranged in the copper sheet immobilization carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105806782A CN103060806A (en) | 2012-12-28 | 2012-12-28 | A regular-array etching reinforcement copper sheet structure with no connection points |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105806782A CN103060806A (en) | 2012-12-28 | 2012-12-28 | A regular-array etching reinforcement copper sheet structure with no connection points |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103060806A true CN103060806A (en) | 2013-04-24 |
Family
ID=48103693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012105806782A Pending CN103060806A (en) | 2012-12-28 | 2012-12-28 | A regular-array etching reinforcement copper sheet structure with no connection points |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103060806A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108188517A (en) * | 2017-11-23 | 2018-06-22 | 苏州中拓专利运营管理有限公司 | A kind of process of reinforcing chip continuous discharge deburring |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6131788A (en) * | 1998-12-09 | 2000-10-17 | Worktools, Inc. | Built-in extendible staple gun wire guide |
| US20040231141A1 (en) * | 2001-07-06 | 2004-11-25 | Masaru Nishinaka | Laminate and its producing method |
| JP2006511700A (en) * | 2002-11-20 | 2006-04-06 | レオナード クルツ ゲーエムベーハー ウント コンパニー カーゲー | Method for producing a film element partially coated with a metal coating |
| EP2400042A1 (en) * | 2010-06-23 | 2011-12-28 | Shenzhen Futaihong Precision Industry Co., Ltd. | Metal-and-resin composite and method for making same |
-
2012
- 2012-12-28 CN CN2012105806782A patent/CN103060806A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6131788A (en) * | 1998-12-09 | 2000-10-17 | Worktools, Inc. | Built-in extendible staple gun wire guide |
| US20040231141A1 (en) * | 2001-07-06 | 2004-11-25 | Masaru Nishinaka | Laminate and its producing method |
| JP2006511700A (en) * | 2002-11-20 | 2006-04-06 | レオナード クルツ ゲーエムベーハー ウント コンパニー カーゲー | Method for producing a film element partially coated with a metal coating |
| EP2400042A1 (en) * | 2010-06-23 | 2011-12-28 | Shenzhen Futaihong Precision Industry Co., Ltd. | Metal-and-resin composite and method for making same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108188517A (en) * | 2017-11-23 | 2018-06-22 | 苏州中拓专利运营管理有限公司 | A kind of process of reinforcing chip continuous discharge deburring |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9313887B2 (en) | Conductive film, manufacturing method thereof, and touch screen having the same | |
| US20140218637A1 (en) | Conductive film, manufacturing method thereof, and touch screen including the conducting film | |
| US10622330B2 (en) | Flexible display panel and preparation method thereof, flexible display device | |
| TW201437872A (en) | Touch panel and conductive layer of the same | |
| CN202786100U (en) | Directionally separated double-sided adhesive tape | |
| CN203144519U (en) | Regular-matrix connection-point-free etched reinforcing steel sheet structure | |
| KR20160028931A (en) | Display device and manufacturing method thereof | |
| CN107980155B (en) | Touch screen and flexible display | |
| CN103060806A (en) | A regular-array etching reinforcement copper sheet structure with no connection points | |
| CN203144518U (en) | Regular-matrix connection-point-free etched reinforcing aluminum sheet structure | |
| CN103144395B (en) | Production technology of regular array etching reinforcement steel sheet without connection point | |
| CN203144517U (en) | Regular-matrix connection-point-free etched reinforcing copper sheet structure | |
| CN103060808A (en) | A regular-array etching reinforcement steel sheet structure with no connection points | |
| CN103060807A (en) | A regular-array etching reinforcement aluminum sheet structure with no connection points | |
| CN202189504U (en) | Metal mark installed on casing | |
| CN202752109U (en) | Dispensing needle | |
| CN204681674U (en) | The mounting structure of a kind of metal clips and circuit board | |
| CN204763921U (en) | Electronic equipment's protective sheath | |
| CN203606812U (en) | Touch display device | |
| CN207461637U (en) | Laptop bags anticollision corner protector | |
| CN205912333U (en) | Bent FPC of proof warp | |
| CN204751636U (en) | High frictional force type membrane roller of metallized film cutting machine | |
| CN205945828U (en) | Three -dimensional breakage -proof tempering protection film mechanism | |
| CN205282344U (en) | Metallic film button bump laminating structure | |
| CN203025360U (en) | 3D glasses protecting film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130424 |
|
| RJ01 | Rejection of invention patent application after publication |