CN103052305A - Method, device and system for cooling power electronic heating element - Google Patents
Method, device and system for cooling power electronic heating element Download PDFInfo
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- CN103052305A CN103052305A CN2013100062380A CN201310006238A CN103052305A CN 103052305 A CN103052305 A CN 103052305A CN 2013100062380 A CN2013100062380 A CN 2013100062380A CN 201310006238 A CN201310006238 A CN 201310006238A CN 103052305 A CN103052305 A CN 103052305A
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Abstract
The invention discloses a method, a device and a system for cooling a power electronic heating element. The method comprises the following steps: introducing a liquid state refrigerant to a refrigerant bearing module surrounded on the periphery of the power electronic heating element; enabling the liquid state refrigerant to flow in the refrigerant bearing module, wherein the liquid state refrigerant which adsorbs the heat generated when the power electronic heating element operates is transformed into a gaseous state refrigerant; leading out a mixed refrigerant of the gaseous state refrigerant and the liquid state refrigerant; through enabling the liquid state refrigerant to flow in the refrigerant bearing module surrounded on the periphery of the power electronic heating element, and the liquid state refrigerant adsorbs the heat generated when the power electronic heating element operates, so that the liquid state refrigerant is transformed into the gaseous state refrigerant; and the absorbed heat is taken away while the refrigerant bearing module is led out, so that the good cooling and heat dissipation effects are achieved on the power electronic element in operation.
Description
Technical field
The present invention relates to field of power electronics, in particular, relate to a kind of cooling means, Apparatus and system of power electronic element.
Background technology
Along with developing rapidly of power electronics integrated technology, advance on the direction that power electronic equipment is more and more perfect towards function, volume is more and more less, power grade is more and more higher at present.Come, the high heat density that is produced by the power electronic element of power electronic equipment inside affect the reason of the normal operation of power electronic equipment, makes the technical problem that its problem of dispelling the heat has been become the primary solution of field of power electronics thereupon.
At present, the method that field of power electronics solves above-mentioned power electronic element heat dissipation problem mainly contains three kinds: the first is wind cooling method: the heat-sink unit that power electronic element will be housed is installed in the airtight air channel, utilize blower fan to rotate, air is flowed in the air channel, thereby take away the heat that power electronic element produces.This method need to be equipped with blower fan and airtight air channel, and is bulky, inconvenience is installed, and air-cooled radiating effect is bad.The second is the oil cooling method: utilize the fluxion strap of cold oil to walk the heat that the electric power electronic component produces.The cooling oil viscosity is large in this method, and radiating effect is limited, and the cold oil burning-point is lower, and the hidden danger of blast on fire is arranged in the large occasion of this heat accumulation of power electronic element.When dismounting, there is the possibility of contaminated environment in the cold oil of leakage simultaneously.The third is water-cooling method: utilize the fluxion strap of cooling water to walk the heat that the electric power electronic component produces.The easy fouling of cooling water in this method, blocking pipe, and cooling water icing just can not flowing in pipeline later when being lower than zero degree lowered the temperature.
This shows, above three kinds of heat dissipating methods all can not play good cooling effect to power electronic element, all have various problems, make the radiating effect of electron electric power element low.
Summary of the invention
In view of this, the invention provides a kind of cooling means, Apparatus and system of power electronic element, to overcome the heat dissipating method of the prior art problem low to the radiating effect of electron electric power element.
For achieving the above object, the invention provides following technical scheme:
A kind of cooling means of power electronic element comprises:
Introduce liquid refrigerants to being looped around in the described power electronic element refrigerant carrier module on every side;
Described liquid refrigerants is flowed in described refrigerant carrier module, and wherein, the liquid refrigerants of the heat that has produced when having absorbed described power electronic element work is converted into gaseous coolant;
Derive the mixing refrigerant of described gaseous coolant and described liquid refrigerants.
Preferably, also comprised before being looped around in the described power electronic element refrigerant carrier module on every side at the introducing liquid refrigerants:
The described liquid refrigerants that needs are introduced carries out flow control.
The detailed process of preferably, the liquid refrigerants of described introducing being carried out flow control comprises:
The temperature data that the temperature of the described power electronic element of Real-Time Monitoring and acquisition monitor;
Receive described temperature data and compare with preset temperature value;
When described temperature data is higher than preset temperature value, strengthen the liquid refrigerants flow;
When described temperature data is lower than preset temperature value, reduce the liquid refrigerants flow.
A kind of cooling device of power electronic element comprises:
Inside is provided with the heat-sink unit of power electronic element, and it is inner to be positioned at described heat-sink unit, is looped around described power electronic element refrigerant carrier module on every side;
The refrigerant inlet pipe that is connected with the refrigerant carrier module of described heat-sink unit entrance point, for the refrigerant carrier module that liquid refrigerants is introduced in the described heat-sink unit, described liquid refrigerants is flowed in described refrigerant carrier module, the liquid refrigerants of the heat that has produced when wherein, having absorbed described power electronic element work is converted into gaseous coolant;
The refrigerant that is connected with the refrigerant carrier module of the described heat-sink unit port of export goes out pipe, is used for deriving the mixing refrigerant of described gaseous coolant and described liquid refrigerants.
Preferably, in the cooling device of above-mentioned power electronic element, described refrigerant carrier module comprises:
Refrigerant pipe, described liquid refrigerants flow in described refrigerant pipe, and wherein, the liquid refrigerants of the heat that has produced when having absorbed described power electronic element work is converted into gaseous coolant.
Preferably, in the cooling device of above-mentioned power electronic element, described refrigerant carrier module comprises:
Refrigerant conduit, described liquid refrigerants flow in described refrigerant conduit, and wherein, the liquid refrigerants of the heat that has produced when having absorbed described power electronic element work is converted into gaseous coolant.
Preferably, in the cooling device of above-mentioned power electronic element, also comprise:
The flow controlling unit that is arranged at described refrigerant inlet pipe front end and is connected with described refrigerant inlet pipe is used for the described liquid refrigerants that needs to introduce is carried out flow control.
Preferably, in the cooling device of above-mentioned power electronic element, described flow controlling unit comprises:
Be arranged at the lip-deep a plurality of temperature sensors of described heat-sink unit, the temperature data that is used for the temperature of the described power electronic element of Real-Time Monitoring and obtains to monitor;
The host computer that is connected with described a plurality of temperature sensors is used for receiving described temperature data and comparing with preset temperature value;
The electric expansion valve that is connected with described host computer is used for strengthening the liquid refrigerants flow when described temperature data is higher than preset temperature value;
When described temperature data is lower than preset temperature value, reduce the liquid refrigerants flow.
Preferably, in the cooling device of above-mentioned power electronic element, also comprise:
Be arranged at respectively between described refrigerant inlet pipe and the described heat-sink unit, and be arranged at described refrigerant and go out break valve between pipe and the described heat-sink unit, two described break valves, be used for when the described heat-sink unit of dismounting, stop the refrigerant in the described heat-sink unit to go out the described heat-sink unit of pipe outflow by described refrigerant inlet pipe and/or described refrigerant.
A kind of cooling system of power electronic element comprises:
The cooling device of aforesaid power electronic element;
The power set that are connected with refrigerant inlet pipe in the cooling device of described power electronic element.
Via above-mentioned technical scheme as can be known, compared with prior art, the invention discloses a kind of cooling means, Apparatus and system of power electronic element, adopt the method for refrigerant cooling, at first, introduce liquid refrigerants to being looped around in the described power electronic element refrigerant carrier module on every side; Then, described liquid refrigerants is flowed in described refrigerant carrier module, the liquid refrigerants of the heat that has produced when wherein having absorbed described power electronic element work is converted into gaseous coolant; At last, derive the mixing refrigerant of described gaseous coolant and described liquid refrigerants.Flow by making in the refrigerant carrier module of liquid refrigerants around being looped around described power electronic element, the heat that liquid refrigerants produces in the time of can absorbing power electronic element work on every side, and then change into gaseous coolant, and taken away the heat that absorbs when being exported the refrigerant carrier module.Power electronic element in the work has been reached good cooling heat dissipation effect.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, the below will do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art, apparently, accompanying drawing in the following describes only is embodiments of the invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to the accompanying drawing that provides other accompanying drawing.
Fig. 1 is the cooling means flow chart of the embodiment of the invention one disclosed a kind of power electronic element;
Fig. 2 is the cooling means flow chart of the embodiment of the invention two disclosed another power electronic element;
Fig. 3 is the concrete grammar flow chart that the described liquid refrigerants in the cooling means of the embodiment of the invention two disclosed another power electronic element needs introduced carries out flow control;
Fig. 4 is the cooling device structural representation of the embodiment of the invention three disclosed a kind of power electronic elements;
Fig. 5 is the cooling device structural representation of the embodiment of the invention four disclosed another power electronic element;
Fig. 6 is the flow controlling unit structural representation in the cooling device of the embodiment of the invention four disclosed another power electronic element;
Fig. 7 is the cooling device structural representation of the embodiment of the invention five disclosed another power electronic element.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that obtains under the creative work prerequisite.
The invention discloses a kind of cooling means, Apparatus and system of power electronic element, to overcome the heat dissipating method of the prior art problem low to the radiating effect of electron electric power element.Concrete execution mode describes by following examples.
Embodiment one
The cooling means of the embodiment of the invention one disclosed a kind of power electronic element, its flow chart mainly may further comprise the steps as shown in Figure 1:
Step S11: introduce liquid refrigerants to being looped around in the described power electronic element refrigerant carrier module on every side;
In the process of execution in step S11, by the driven compressor refrigerant inlet pipe work under being driven by exterior motor, and then the refrigerant inlet pipe extracts outside liquid refrigerants to being looped around in the described power electronic element refrigerant carrier module on every side.
Step S12: described liquid refrigerants is flowed in described refrigerant carrier module, and wherein, the liquid refrigerants of the heat that has produced when having absorbed described power electronic element work is converted into gaseous coolant;
In the process of execution in step S12, when described refrigerant inlet pipe extracts outside liquid refrigerants to the refrigerant carrier module that is looped around around the described power electronic element the time, liquid refrigerants externally flows in the refrigerant carrier module under the drive of compressor, the heat that produces when power electronic element was worked around liquid refrigerants will absorb by phase inversion, and change into gaseous coolant.
Step S13: the mixing refrigerant of deriving described gaseous coolant and described liquid refrigerants.
In the process of execution in step S13, wherein, the liquid refrigerants of the heat that has produced when having absorbed described power electronic element work is converted into gaseous coolant, the mixing refrigerant of described gaseous coolant and described liquid refrigerants has externally been taken away the heat that absorbs under the drive of compressor when being exported the refrigerant carrier module, effectively reduce the working junction temperature of power electronic element, and then improved the electric current fan-out capability of power electronic element, improved simultaneously the parameter utilization rate of power device, reduce the working loss of power electronic element, prolonged the working life of power electronic element.
Via above-mentioned technical scheme as can be known, compared with prior art, the present embodiment at first, is introduced liquid refrigerants to being looped around in the described power electronic element refrigerant carrier module on every side by adopting the method for refrigerant cooling; Then, described liquid refrigerants is flowed in described refrigerant carrier module, the liquid refrigerants of the heat that has produced when wherein having absorbed described power electronic element work is converted into gaseous coolant; At last, derive the mixing refrigerant of described gaseous coolant and described liquid refrigerants.Flow by making in the refrigerant carrier module of liquid refrigerants around being looped around described power electronic element, the heat that liquid refrigerants produces in the time of can absorbing power electronic element work on every side, and then change into gaseous coolant, and taken away the heat that absorbs when being exported the refrigerant carrier module.Power electronic element in the work has been reached good cooling heat dissipation effect.The heat that produces when namely utilizing the refrigerant phase transformation to absorb power electronic element work, refrigerant is gaseous state at normal temperatures and pressures, can fouling in pipeline, and then can blocking pipe and contaminated environment.Refrigerant flows in the refrigerant carrier module simultaneously, does not need to install the structures such as blower fan, air channel, and volume compact is easy for installation.
Embodiment two
Based on the cooling means of above-described embodiment one disclosed a kind of power electronic element, on this basis, this embodiment of the invention two also discloses a kind of cooling means of power electronic element, and its flow chart mainly may further comprise the steps as shown in Figure 2:
Step S21: the described liquid refrigerants that needs are introduced carries out flow control;
In the process of execution in step S21, need to be operated in when power electronic element under the environment of higher electric current, the caloric value of power electronic element will be more, and the flow that at this moment then needs to strengthen refrigerant can satisfy the requirement of cooling heat dissipation; Be operated in when power electronic element under the environment of low current, when caloric value is few, then need reduce the flow of refrigerant.
Step S22: introduce liquid refrigerants to being looped around in the described power electronic element refrigerant carrier module on every side;
In the process of execution in step S22, by the driven compressor refrigerant inlet pipe work under being driven by exterior motor, and then the refrigerant inlet pipe extracts outside liquid refrigerants to being looped around in the described power electronic element refrigerant carrier module on every side.
Step S23: described liquid refrigerants is flowed in described refrigerant carrier module, and wherein, the liquid refrigerants of the heat that has produced when having absorbed described power electronic element work is converted into gaseous coolant;
In the process of execution in step S23, when described refrigerant inlet pipe extracts outside liquid refrigerants to the refrigerant carrier module that is looped around around the described power electronic element the time, liquid refrigerants externally flows in the refrigerant carrier module under the drive of compressor, the heat that produces when power electronic element was worked around liquid refrigerants will absorb by phase inversion, and change into gaseous coolant.
Step S24: the mixing refrigerant of deriving described gaseous coolant and described liquid refrigerants.
In the process of execution in step S24, wherein, the liquid refrigerants of the heat that has produced when having absorbed described power electronic element work is converted into gaseous coolant, the mixing refrigerant of described gaseous coolant and described liquid refrigerants has externally been taken away the heat that absorbs under the drive of compressor when being exported the refrigerant carrier module, effectively reduce the working junction temperature of power electronic element, and then improved the electric current fan-out capability of power electronic element, improved simultaneously the parameter utilization rate of power device, reduce the working loss of power electronic element, prolonged the working life of power electronic element.
Based on the cooling means of above-mentioned power electronic element, concrete, as shown in Figure 3, the detailed process that the described liquid refrigerants of in execution in step S21 needs being introduced carries out flow control comprises:
S211: the temperature data that the temperature of the described power electronic element of Real-Time Monitoring and acquisition monitor;
In the process of execution in step S211, on the heat-sink unit surface a plurality of temperature sensors have been installed, the temperature of Real-Time Monitoring heat-sink unit inside, and obtain separately the temperature data that monitors.
S212: receive described temperature data and compare with preset temperature value;
In the process of execution in step S212, be provided with the host computer that is connected with a plurality of temperature sensors among the above-mentioned steps S211, the temperature data that described a plurality of temperature sensor will monitor separately is sent to host computer, then host computer many groups temperature data that will obtain is sued for peace, average, obtain average temperature data, last compare, analyze with the preset temperature value of storage inside again.When relatively drawing described average temperature data value and be higher than preset temperature value, then send the signal that strengthens the liquid refrigerants flow; When relatively drawing described average temperature data value and be lower than preset temperature value, then send the signal that reduces the liquid refrigerants flow.
S213: when described temperature data is higher than preset temperature value, strengthen the liquid refrigerants flow;
When described temperature data is lower than preset temperature value, reduce the liquid refrigerants flow.
In the process of execution in step S213, be provided with the electric expansion valve that is connected with host computer among the above-mentioned steps S212, receive host computer about the signal of flow control.When receiving the signal that strengthens the liquid refrigerants flow, an amount of Open valve then strengthens the flow of liquid refrigerants; When receiving the signal that reduces the liquid refrigerants flow, an amount of valve-off then reduces the flow of liquid refrigerants.
Via above-mentioned technical scheme as can be known, compared with prior art, the present embodiment increase introduce liquid refrigerants to the refrigerant carrier module that is looped around around the described power electronic element before, the step that the described liquid refrigerants that needs are introduced carries out flow control, regulate the flow of refrigerant according to the heating situation of actual power electronic element, need to be operated in when power electronic element under the environment of higher electric current, the caloric value of power electronic element will be more, at this moment the flow that then needs to strengthen refrigerant can satisfy the requirement of cooling heat dissipation, reaches good radiating effect; Be operated in when power electronic element under the environment of low current, when caloric value is few, then need reduce the flow of refrigerant, improved the utilization rate of refrigerant, so that save the consumption of refrigerant, Cost reduction.
Describe a kind of cooling means of power electronic element among the disclosed embodiment of the invention described above in detail, cooling means for a kind of power electronic element disclosed in this invention can adopt the device of various ways to realize, therefore the invention also discloses the cooling device of following a kind of power electronic element, the below provides specific embodiment and is elaborated.
Embodiment three
The embodiment of the invention three discloses a kind of cooling device of power electronic element, and its structure mainly comprises as shown in Figure 4: heat-sink unit A1, refrigerant carrier module A2, refrigerant inlet pipe A3 and refrigerant go out to manage A4.
Inside is provided with the heat-sink unit A1 of power electronic element, and it is inner to be positioned at described heat-sink unit A1, is looped around described power electronic element refrigerant carrier module A2 on every side;
The refrigerant inlet pipe A3 that is connected with the refrigerant carrier module A2 of described heat-sink unit A1 entrance point, for the refrigerant carrier module A2 that liquid refrigerants is introduced in the described heat-sink unit A1, described liquid refrigerants is flowed in described refrigerant carrier module A2, the liquid refrigerants of the heat that has produced when wherein, having absorbed described power electronic element work is converted into gaseous coolant;
The refrigerant that is connected with the refrigerant carrier module A2 of the described heat-sink unit A1 port of export goes out to manage A4, is used for deriving the mixing refrigerant of described gaseous coolant and described liquid refrigerants.
By the driven compressor refrigerant inlet pipe A3 work under being driven by exterior motor, and then refrigerant inlet pipe A3 extracts outside liquid refrigerants to being looped around among the described power electronic element refrigerant carrier module A2 on every side.Liquid refrigerants externally flows in refrigerant carrier module A2 under the drive of compressor, the heat that produces during power electronic element work around liquid refrigerants will absorb by phase inversion, and change into gaseous coolant.The mixing refrigerant of described gaseous coolant and described liquid refrigerants externally goes out to manage A4 from the refrigerant that is connected with the refrigerant carrier module A2 of the described heat-sink unit A1 port of export under the drive of compressor and is exported refrigerant carrier module A2, taken away simultaneously the heat that absorbs, effectively reduce the working junction temperature of power electronic element, and then improved the electric current fan-out capability of power electronic element, improved simultaneously the parameter utilization rate of power device, reduce the working loss of power electronic element, prolonged the working life of power electronic element.
Based on the cooling device of above-mentioned power electronic element, concrete, the described power electronic element refrigerant carrier module A2 on every side that is looped around comprises:
Refrigerant pipe B1, described liquid refrigerants flow in described refrigerant pipe B1, and wherein, the liquid refrigerants of the heat that has produced when having absorbed described power electronic element work is converted into gaseous coolant.
Concrete, the described power electronic element refrigerant carrier module A2 on every side that is looped around comprises:
Refrigerant conduit B2, described liquid refrigerants flow in described refrigerant conduit B2, and wherein, the liquid refrigerants of the heat that has produced when having absorbed described power electronic element work is converted into gaseous coolant.
Structure based on the cooling device of the disclosed a kind of power electronic element of the invention described above when the cooling device that utilizes this power electronic element carries out the cooling of power electronic element, is specially:
At first, introduce liquid refrigerants to being looped around the described power electronic element refrigerant carrier module A2 on every side from the refrigerant inlet pipe A3 that is connected with the refrigerant carrier module A2 of described heat-sink unit A1 entrance point.
Then, described liquid refrigerants is flowed in described refrigerant carrier module A2, the liquid refrigerants of the heat that has produced when wherein having absorbed described power electronic element work is converted into gaseous coolant.
At last, the refrigerant through being connected with the refrigerant carrier module A2 of the described heat-sink unit A1 port of export goes out to manage the mixing refrigerant that A4 derives described gaseous coolant and described liquid refrigerants.
Cooling means based on above-mentioned power electronic element, flow by making among the refrigerant carrier module A2 of liquid refrigerants around being looped around described power electronic element, the heat that liquid refrigerants produces in the time of can absorbing power electronic element work on every side, and then change into gaseous coolant, and along with going out to manage, refrigerant taken away the heat that absorbs when A4 is exported refrigerant carrier module A2.Power electronic element in the work has been reached good cooling heat dissipation effect.The heat that produces when namely utilizing the refrigerant phase transformation to absorb power electronic element work, refrigerant is gaseous state at normal temperatures and pressures, can fouling in pipeline, and then can blocking pipe and contaminated environment.Refrigerant flows in the refrigerant carrier module simultaneously, does not need to install the structures such as blower fan, air channel, and volume compact is simple in structure, easy for installation.
Embodiment four
The embodiment of the invention four discloses a kind of cooling device of power electronic element, and its structure mainly comprises as shown in Figure 5: heat-sink unit A1, refrigerant carrier module A2, refrigerant inlet pipe A3, refrigerant go out to manage A4 and flow controlling unit A5.
Inside is provided with the heat-sink unit A1 of power electronic element, and it is inner to be positioned at described heat-sink unit A1, is looped around described power electronic element refrigerant carrier module A2 on every side;
The refrigerant inlet pipe A3 that is connected with the refrigerant carrier module A2 of described heat-sink unit A1 entrance point, for the refrigerant carrier module A2 that liquid refrigerants is introduced in the described heat-sink unit A1, described liquid refrigerants is flowed in described refrigerant carrier module A2, the liquid refrigerants of the heat that has produced when wherein, having absorbed described power electronic element work is converted into gaseous coolant;
The refrigerant that is connected with the refrigerant carrier module A2 of the described heat-sink unit A1 port of export goes out to manage A4, is used for deriving the mixing refrigerant of described gaseous coolant and described liquid refrigerants;
The flow controlling unit A5 that is arranged at described refrigerant inlet pipe A3 front end and is connected with described refrigerant inlet pipe A3 is used for the described liquid refrigerants that needs to introduce is carried out flow control.
Need to be operated in when power electronic element under the environment of higher electric current, the caloric value of power electronic element will be more, at this moment then need can satisfy by the flow that the flow controlling unit A5 that is connected with described refrigerant inlet pipe A3 strengthens refrigerant the requirement of cooling heat dissipation; Be operated in when power electronic element under the environment of low current, when caloric value is few, then need to reduce by the flow controlling unit A5 that is connected with described refrigerant inlet pipe A3 the flow of refrigerant.
Concrete, as shown in Figure 6, described flow controlling unit A5 comprises: temperature sensor A51, host computer A52 and electric expansion valve A53.
Be arranged at the lip-deep a plurality of temperature sensor A51 of described heat-sink unit A1, the temperature data that is used for the temperature of the described power electronic element of Real-Time Monitoring and obtains to monitor;
The host computer A52 that is connected with described a plurality of temperature sensor A51 is used for receiving described temperature data and comparing with preset temperature value;
The electric expansion valve A53 that is connected with described host computer A52 is used for strengthening the liquid refrigerants flow when described temperature data is higher than preset temperature value;
When described temperature data is lower than preset temperature value, reduce the liquid refrigerants flow.
Describedly be arranged at the temperature data that the lip-deep a plurality of temperature sensor A51 of described heat-sink unit A1 will monitor separately and be sent to host computer A52, then host computer A52 many groups temperature data that will obtain is sued for peace, average, obtain average temperature data, last compare, analyze with the preset temperature value of storage inside again.When relatively drawing described average temperature data value and be higher than preset temperature value, then send the signal of increasing liquid refrigerants flow to the electric expansion valve A53 that is connected with host computer A52, after described electric expansion valve A53 receives the signal of the increasing liquid refrigerants flow that host computer A52 sends, an amount of Open valve, the flow of increasing liquid refrigerants; When relatively drawing described average temperature data value and be lower than preset temperature value, then send the signal that reduces the liquid refrigerants flow to the electric expansion valve A53 that is connected with host computer A52, after described electric expansion valve A53 receives the signal that reduces the liquid refrigerants flow of host computer A52 transmission, an amount of valve-off reduces the flow of liquid refrigerants.
Structure based on the cooling device of the disclosed a kind of power electronic element of the invention described above, when the cooling device that utilizes this power electronic element carries out the cooling of power electronic element, the present embodiment increase introduce liquid refrigerants to the refrigerant carrier module A2 that is looped around around the described power electronic element before, the step that the described liquid refrigerants that needs are introduced carries out flow control, regulate the flow of refrigerant according to the heating situation of actual power electronic element, need to be operated in when power electronic element under the environment of higher electric current, the caloric value of power electronic element will be more, at this moment the flow that then needs to strengthen refrigerant can satisfy the requirement of cooling heat dissipation, reaches good radiating effect; Be operated in when power electronic element under the environment of low current, when caloric value is few, then need reduce the flow of refrigerant, improved the utilization rate of refrigerant, so that save the consumption of refrigerant, Cost reduction.
Embodiment five
The embodiment of the invention five discloses a kind of cooling device of power electronic element, and its structure mainly comprises as shown in Figure 7: heat-sink unit A1, refrigerant carrier module A2, refrigerant inlet pipe A3, refrigerant go out to manage A4, flow controlling unit A5 and break valve A6.
Inside is provided with the heat-sink unit A1 of power electronic element, and it is inner to be positioned at described heat-sink unit A1, is looped around described power electronic element refrigerant carrier module A2 on every side;
The refrigerant inlet pipe A3 that is connected with the refrigerant carrier module A2 of described heat-sink unit A1 entrance point, for the refrigerant carrier module A2 that liquid refrigerants is introduced in the described heat-sink unit A1, described liquid refrigerants is flowed in described refrigerant carrier module A2, the liquid refrigerants of the heat that has produced when wherein, having absorbed described power electronic element work is converted into gaseous coolant;
The refrigerant that is connected with the refrigerant carrier module A2 of the described heat-sink unit A1 port of export goes out to manage A4, is used for deriving the mixing refrigerant of described gaseous coolant and described liquid refrigerants;
The flow controlling unit A5 that is arranged at described refrigerant inlet pipe A3 front end and is connected with described refrigerant inlet pipe A3 is used for the described liquid refrigerants that needs to introduce is carried out flow control;
Be arranged at respectively between described refrigerant inlet pipe A3 and the described heat-sink unit A1, and be arranged at described refrigerant and go out to manage break valve A6 between A4 and the described heat-sink unit A1, two described break valve A6, be used for when the described heat-sink unit of dismounting, stop the interior refrigerant of described heat-sink unit to go out to manage A4 by described refrigerant inlet pipe A3 and/or described refrigerant and flow out described heat-sink unit A1.
When needs are dismantled described heat-sink unit A1, can will be arranged at respectively between described refrigerant inlet pipe A3 and the described heat-sink unit A1, and be arranged at described refrigerant and go out to manage break valve A6 locking between A4 and the described heat-sink unit A1, refrigerant among the refrigerant carrier module A2 just can not be through refrigerant inlet pipe A3 like this, and/or, refrigerant goes out to manage A4 and flows out described heat-sink unit A1, also just can not cause the waste of refrigerant.
Further, the invention also discloses a kind of cooling system of power electronic element, comprising:
The as above cooling device of described power electronic element;
The power set that are connected with refrigerant inlet pipe A3 in the cooling device of described power electronic element.
Described power set comprise:
Motor, and the compressor that is connected with motor, described compressor are connected on the refrigerant inlet pipe A3 in the cooling device of described power electronic element.
The motor drives compressor flows in described refrigerant carrier module A2 and goes out to manage the mixing refrigerant of deriving described gaseous coolant and described liquid refrigerants the A4 from described refrigerant power is provided for introducing liquid refrigerants, liquid refrigerants from described refrigerant inlet pipe A3 to described refrigerant carrier module A2.
In sum:
Compared with prior art, the invention discloses a kind of cooling means, Apparatus and system of power electronic element, adopt the method for refrigerant cooling, at first, introduce liquid refrigerants to being looped around in the described power electronic element refrigerant carrier module on every side; Then, described liquid refrigerants is flowed in described refrigerant carrier module, the liquid refrigerants of the heat that has produced when wherein having absorbed described power electronic element work is converted into gaseous coolant; At last, derive the mixing refrigerant of described gaseous coolant and described liquid refrigerants.Flow by making in the refrigerant carrier module of liquid refrigerants around being looped around described power electronic element, the heat that liquid refrigerants produces in the time of can absorbing power electronic element work on every side, and then change into gaseous coolant, and taken away the heat that absorbs when being exported the refrigerant carrier module, the heat that produces when namely utilizing the refrigerant phase transformation to absorb power electronic element work has reached good cooling heat dissipation effect to the power electronic element in the work.
Each embodiment adopts the mode of going forward one by one to describe in this specification, and what each embodiment stressed is and the difference of other embodiment that identical similar part is mutually referring to getting final product between each embodiment.For the disclosed device of embodiment, because it is corresponding with the disclosed method of embodiment, so description is fairly simple, relevant part partly illustrates referring to method and gets final product.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the present invention.Multiple modification to these embodiment will be apparent concerning those skilled in the art, and General Principle as defined herein can be in the situation that do not break away from the spirit or scope of the present invention, in other embodiments realization.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (10)
1. the cooling means of a power electronic element is characterized in that, comprising:
Introduce liquid refrigerants to being looped around in the described power electronic element refrigerant carrier module on every side;
Described liquid refrigerants is flowed in described refrigerant carrier module, and wherein, the liquid refrigerants of the heat that has produced when having absorbed described power electronic element work is converted into gaseous coolant;
Derive the mixing refrigerant of described gaseous coolant and described liquid refrigerants.
2. method according to claim 1 is characterized in that, also comprises before being looped around in the described power electronic element refrigerant carrier module on every side at the introducing liquid refrigerants:
The described liquid refrigerants that needs are introduced carries out flow control.
3. method according to claim 2 is characterized in that, the detailed process of the liquid refrigerants of described introducing being carried out flow control comprises:
The temperature data that the temperature of the described power electronic element of Real-Time Monitoring and acquisition monitor;
Receive described temperature data and compare with preset temperature value;
When described temperature data is higher than preset temperature value, strengthen the liquid refrigerants flow;
When described temperature data is lower than preset temperature value, reduce the liquid refrigerants flow.
4. the cooling device of a power electronic element is characterized in that, comprising:
Inside is provided with the heat-sink unit of power electronic element, and it is inner to be positioned at described heat-sink unit, is looped around described power electronic element refrigerant carrier module on every side;
The refrigerant inlet pipe that is connected with the refrigerant carrier module of described heat-sink unit entrance point, for the refrigerant carrier module that liquid refrigerants is introduced in the described heat-sink unit, described liquid refrigerants is flowed in described refrigerant carrier module, the liquid refrigerants of the heat that has produced when wherein, having absorbed described power electronic element work is converted into gaseous coolant;
The refrigerant that is connected with the refrigerant carrier module of the described heat-sink unit port of export goes out pipe, is used for deriving the mixing refrigerant of described gaseous coolant and described liquid refrigerants.
5. device according to claim 4 is characterized in that, described refrigerant carrier module comprises:
Refrigerant pipe, described liquid refrigerants flow in described refrigerant pipe, and wherein, the liquid refrigerants of the heat that has produced when having absorbed described power electronic element work is converted into gaseous coolant.
6. device according to claim 4 is characterized in that, described refrigerant carrier module comprises:
Refrigerant conduit, described liquid refrigerants flow in described refrigerant conduit, and wherein, the liquid refrigerants of the heat that has produced when having absorbed described power electronic element work is converted into gaseous coolant.
7. device according to claim 4 is characterized in that, also comprises:
The flow controlling unit that is arranged at described refrigerant inlet pipe front end and is connected with described refrigerant inlet pipe is used for the described liquid refrigerants that needs to introduce is carried out flow control.
8. device according to claim 7 is characterized in that, described flow controlling unit comprises:
Be arranged at the lip-deep a plurality of temperature sensors of described heat-sink unit, the temperature data that is used for the temperature of the described power electronic element of Real-Time Monitoring and obtains to monitor;
The host computer that is connected with described a plurality of temperature sensors is used for receiving described temperature data and comparing with preset temperature value;
The electric expansion valve that is connected with described host computer is used for strengthening the liquid refrigerants flow when described temperature data is higher than preset temperature value;
When described temperature data is lower than preset temperature value, reduce the liquid refrigerants flow.
9. device according to claim 4 is characterized in that, also comprises:
Be arranged at respectively between described refrigerant inlet pipe and the described heat-sink unit, and be arranged at described refrigerant and go out break valve between pipe and the described heat-sink unit, two described break valves, be used for when the described heat-sink unit of dismounting, stop the refrigerant in the described heat-sink unit to go out the described heat-sink unit of pipe outflow by described refrigerant inlet pipe and/or described refrigerant.
10. the cooling system of a power electronic element is characterized in that, comprising:
The cooling device of the described power electronic element of any one among the claim 4-9;
The power set that are connected with refrigerant inlet pipe in the cooling device of described power electronic element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100062380A CN103052305A (en) | 2013-01-08 | 2013-01-08 | Method, device and system for cooling power electronic heating element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100062380A CN103052305A (en) | 2013-01-08 | 2013-01-08 | Method, device and system for cooling power electronic heating element |
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| Publication Number | Publication Date |
|---|---|
| CN103052305A true CN103052305A (en) | 2013-04-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013100062380A Pending CN103052305A (en) | 2013-01-08 | 2013-01-08 | Method, device and system for cooling power electronic heating element |
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