Connect public, paid and private patent data with Google Patents Public Datasets

Surface mounting method for electronic components and printed circuit boards manufactured using said method

Download PDF

Info

Publication number
CN103039130A
CN103039130A CN 201180022028 CN201180022028A CN103039130A CN 103039130 A CN103039130 A CN 103039130A CN 201180022028 CN201180022028 CN 201180022028 CN 201180022028 A CN201180022028 A CN 201180022028A CN 103039130 A CN103039130 A CN 103039130A
Authority
CN
Grant status
Application
Patent type
Prior art keywords
mounting
printed
section
method
electronic
Prior art date
Application number
CN 201180022028
Other languages
Chinese (zh)
Other versions
CN103039130B (en )
Inventor
河须崎聪
松田文彦
Original Assignee
日本梅克特隆株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3436Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/111Pads for surface mounting, e.g. lay-out
    • H05K1/112Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113Via provided in pad; Pad over filled via
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10234Metallic balls
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10674Flip chip
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions ; Methods of application thereof
    • H05K3/3478Applying solder paste, particles or preforms; Transferring prefabricated solder patterns
    • H05K3/3484Paste or slurry or powder
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
    • Y02P70/60Greenhouse gas [GHG] capture, heat recovery or other energy efficient measures relating to production or assembly of electric or electronic components or products, e.g. motor control
    • Y02P70/613Greenhouse gas [GHG] capture, heat recovery or other energy efficient measures relating to production or assembly of electric or electronic components or products, e.g. motor control involving the assembly of several electronic elements

Abstract

The invention can solve the following problem, namely an electronic component is surface mounted on a mounting pad section provided directly above a through via without sacrifice of productivity and reliability. As a solution means, the invention provides a method for surface-mounting the electronic component (60) to the mounting pad section (14) provided directly above the through via (11) in a printed wiring board (16) and a printed circuit board used by the method. Specifically, first, a lid body (30) that covers through holes of the through via (11) is mounted in the mounting pad section (14). Then, soldered platforms that bury the lid body (30) are formed on the mounting pad section (14) by solder printing. The electronic component (60) is then mounted on top of the printed wiring board (16) and the printed wiring board to which the electronic component (60) has been mounted is heat processed. The method of the invention can suit any printed wiring board provided with the mounting pad section structure directly above the through via.

Description

电子部件的表面安装方法及使用该方法制造的印刷电路板 The method of surface mounting an electronic component using a printed circuit board and the manufacturing method

技术领域 FIELD

[0001] 本发明涉及电子部件的表面安装方法,更详细而言,涉及在设置于印刷布线板的贯通通路(貫通e 了)的正上方的安装垫上对电子部件进行表面安装的方法,以及使用该方法制造的印刷电路板。 [0001] The present invention relates to a method of surface mounting an electronic component, more specifically, relates to a surface-mounted electronic component is provided on the printed wiring board through-passage (a through e) immediately above the mounting pads, and a method using a printed circuit board manufactured by the method.

背景技术 Background technique

[0002] 近年来,以便携电话为代表的电子设备的小型化及高功能化日益发展起来。 [0002] In recent years, downsizing to a mobile phone as the representative of electronic equipment and high functionality growing up. 与此相伴,也寻求在印刷布线板上安装更小型且高功能的电子部件。 Along with this, also seek a more compact and highly functional mounting electronic components on a printed wiring board. CSP (Chip Size Package :芯片尺寸封装)是这类电子部件中的一种。 CSP (Chip Size Package: a chip size package) is one such electronic components. CSP是通常在以0. 3^1. Omm左右的狭窄间距具有接合用焊球的封装件部件,表面安装于印刷布线板上。 CSP is typically at a narrow pitch of about 0. 3 ^ 1. Omm package member having a bonding solder balls, surface mounted on the printed wiring board.

[0003] 为配合电子部件连接部的高密度化,印刷布线板的安装垫部也需要高密度化。 [0003] The mounting mat portion with a high density, a printed wiring board of the electronic component connection portion also require a high density. 因此,可以考虑在贯通通路正上方设置安装垫部。 Thus, n may be considered disposed above the mounting mat portion a through passage.

[0004] 但以往难以通过在印刷布线板的贯通通路正上方设置安装垫来提高安装密度。 [0004] However, conventionally difficult by passage through the printed wiring board mounting mat disposed immediately above to increase the mounting density.

[0005] 在详细说明该问题之前,对根据现有技术制造的印刷布线板的构造,及对该印刷布线板进行电子部件的表面安装方法进行说明。 [0005] Before explaining the problem, according to the configuration of the printed wiring board manufactured by the prior art, and the method of surface mounting an electronic component to the printed wiring board will be described.

[0006] 作为具有贯通通路的印刷布线板一个例子,图5示出了多层印刷布线板120的结构。 [0006] As an example of a printed wiring board having a through passage, FIG. 5 shows the structure of a multilayer printed wiring board 120. 图5 (a)是具有贯通通路的多层印刷布线板120的平面图,图5 (b)是沿图5 (a)的A-A'线的端视图。 FIG 5 (a) is a plan showing the multilayer printed wiring board having a through passageway 120, FIG. 5 (b) is an end view taken along FIG. 5 (a) of A-A 'line.

[0007] 首先对多层印刷布线板120的平面构造进行说明。 [0007] First, a planar structure multilayer printed wiring board 120 will be described.

[0008] 如图5 (a)所示,多层印刷布线板120的表面除了开口部119A〜119E以外均被光阻焊剂(7才卜乂卟夕'一> 夕7卜)层115覆盖。 [0008] FIG. 5 (a), the surface of the multilayer printed wiring board 120 other than the solder resist opening portions are 119A~119E (7 porphyrin was Bu Xi Yi in 'a> Bu Xi 7) covering the layer 115.

[0009] 在开口部119A〜119D的底面设置有用于安装电子部件的安装垫部116A〜116D,&贯通通路118A〜118D。 [0009] The pad is provided with a mounting portion for mounting the electronic component 116A~116D, & 118A~118D passage through the bottom opening of 119A~119D. 由图5 (a)及(b)可知,安装垫部116A〜116D利用镀膜114与贯通通路118A〜118D分别电连接。 And (b) seen from FIG. 5 (a), the mounting mat portion 114 and the through 116A~116D plating film are electrically connected via 118A~118D. 此外,在开口部119E的底面设置有安装垫部116E,但是没有设置贯通通路。 Further, in the bottom of the opening portion 119E is provided with a pad mounting portion 116E, but no through-passage. 该安装垫部116E有时用于与电子部件的虚管脚接合。 The mounting mat may for engagement portion 116E and the virtual pins of the electronic component. 虚管脚并不用于实际的信号导通,而是用于保持在印刷布线板上表面安装的电子部件的平行度。 Virtual pins are not used for the actual signal is turned on, but for maintaining parallelism of the electronic component mounting surface of the printed wiring board.

[0010] 另外,在开口部119A119E底面露出的镀膜114,为了提高焊料润湿性,实施了镀金等的表面处理。 [0010] Further, the bottom surface is exposed in the opening portion 119A119E coating 114, in order to improve solder wettability, such as gold-plated surface treatment.

[0011] 接下来对多层印刷布线板120的截面构造进行说明。 [0011] Next, a sectional structure of a multilayer printed wiring board 120 will be described.

[0012] 如图5 (b)所示,多层印刷布线板120以经由粘结剂层109将两个电路基材(即带有覆盖I旲的电路基材108和电路基材113)粘合的多层电路基材为基本构造。 [0012] FIG. 5 (b), the multilayer printed wiring board 120 to the base 109 of the two circuits (i.e., circuit substrate 108 and the circuit substrate 113 covered with Dae I) via an adhesive layer adhered the multilayer circuit substrate is bonded to the basic structure.

[0013] 这里,带有覆盖膜的电路基材108是在电路基材104的背面粘贴由聚酰亚胺膜106(例如,12 iim厚)及形成于其上的粘结剂层105 (例如,15 iim厚)构成的覆盖膜107而成的。 [0013] Here, the circuit substrate is covered with a film 108 is a polyimide film adhesive 106 (e.g., 12 iim thick) is formed on the back surface of the substrate 104 and the circuit adhesive layer 105 thereon (e.g. , 15 iim thickness) of the cover film 107 formed. 粘结剂层105由例如丙烯类或环氧类粘结剂形成。 Adhesive layer 105 is formed of, for example, acrylic or epoxy adhesive.

[0014] 电路基材104如下地加工而成:对在挠性绝缘基底材料101(例如25 ii m厚的聚酰亚胺膜)的双面具有铜箔102及103 (各为例如12iim厚)的双面敷铜箔叠层板,使用光加工方法将铜箔加工成既定图案。 [0014] The circuit substrate 104 processed as follows: In a double-sided flexible insulating base material 101 (e.g., a polyimide film 25 ii m thick) having a copper foil 102 and 103 (e.g. 12iim thick each) the double-sided copper-clad laminates, copper foil processing method using a light processed into a predetermined pattern. 此外,在光加工方法中,形成光致抗蚀剂层,通过曝光及显影在铜箔上形成抗蚀剂图案,其后,以该抗蚀剂图案为掩模进行铜箔的蚀刻,从而形成具有既定图案的铜箔(电路图案)。 Further, in the optical processing method, a photoresist layer, forming a resist pattern on the copper foil by exposure and development, and thereafter, the resist pattern as an etching mask the copper foil, thereby forming copper foil (circuit pattern) having a predetermined pattern.

[0015] 电路基材113如下地加工而成:对在挠性绝缘基底材料110的双面具有铜箔111及112的双面敷铜箔叠层板,使用光加工方法将铜箔加工成既定图案。 [0015] The circuit substrate 113 processed as follows: having a copper foil 111 and double-sided copper-clad laminate 112 on both sides of a flexible insulating base material 110, optical processing method using the copper foil is processed into a predetermined pattern.

[0016] 多层印刷布线板120的贯通通路118A118D,在上述的多层电路基材的既定位置形成沿厚度方向贯通的贯通孔穴,并由对该贯通孔穴实施导电化处理及电解镀铜处理而形成的镀膜114 (例如Sym厚)构成。 [0016] a through passage 118A118D multilayer printed wiring board 120 is formed a through hole penetrating in the thickness direction at a predetermined position of the multilayer circuit substrate, a conductive treatment by the embodiment and the electrolytic copper plating treatment and the through-hole film 114 (e.g. Sym thick) formed configuration. 贯通通路118A118D作为电连接各层布线的层间导电路而起作用。 118A118D through passage as an interlayer conducting path is electrically connected to the wiring layers to function. 此外,贯通孔穴利用NC钻孔加工等形成为例如0150iim的大小。 Further, an NC drilling through-hole or the like, for example, the size of 0150iim.

[0017] 下面使用图6A及图6B,对根据现有技术在上述多层印刷布线板120上对电子部件进行表面安装的方法进行说明。 [0017] Next, FIGS. 6A and 6B, the method of surface-mounted electronic component on the multilayer printed wiring board 120 according to the prior art will be described. 图6A及图6B,是用于说明电子部件的表面安装方法的工序端视图。 6A and 6B, the step is an end view for explaining a method of surface mounting an electronic component.

[0018] (I)首先,准备焊料印刷用的金属版(金属掩模)130。 [0018] (I) First, a metal plate used in solder printing (metal mask) 130. 金属版130具有与多层印刷布线板120的安装垫部116A〜116E分别对应的多个开口部131、131、…。 A metal plate 130 having a plurality of openings 131, 131 and the mounting pad portion of the multilayer printed wiring board 120 corresponding to each 116A~116E, ....

[0019] 然后,如图6A (I)所示,以金属版130的开口部131、131、…与多层印刷布线板120的安装垫部116A〜116E分别重叠的方式,在多层印刷布线板120上安置金属版130。 [0019] Then, as shown in FIG 6A (I), the metal plate 130 of the opening 131, 131, ... overlapped with each 116A~116E mounted pad portion 120 of the multilayer printed wiring board, multilayer printed wiring metal plate 120 on the mounting plate 130.

[0020] (2)接着,如图6A (2)所示,在金属版130上堆积焊糊140后滑动刮刀150,进行焊料印刷。 After sliding blade 150 [0020] (2) Next, as shown in FIG. 6A (2), the metal plate 130 stacked on the solder paste 140, a solder printing. 由此,在金属版130的开口部131的内部埋入焊糊140。 Thus, in the interior of the opening portion 131 of the metal plate 130 is embedded in the cream solder 140.

[0021] (3)接着,如图6B (3)所示`,将金属版130从多层印刷布线板120上卸下。 [0021] (3) Next, as shown in FIG 6B (3) 'as shown, the metal plate 130 is removed from the multilayer printed wiring board 120. 由此,由焊糊构成的焊料台(预备焊料层)141、141、…形成于各安装垫部116A116E上。 Thus, a solder station (preliminary solder layer) 141, 141, ... made of solder paste on each mounting pad formed portion 116A116E.

[0022] (4)接着,准备在端子161上设置了焊球的电子部件160 (例如CSP)。 [0022] (4) Next, a solder ball is provided an electronic component 160 (e.g. CSP) on the terminal 161. 然后,以电子部件160的焊球安置在焊料台141上的方式对电子部件160与多层印刷布线板120进行对位后,电子部件160被搭载在多层印刷布线板120上。 Then, the electronic component to a solder ball 160 is disposed on the solder station 141 on the way the electronic component 160 and the multilayer printed wiring board 120 of the bit, the electronic component 160 is mounted on the multilayer printed wiring board 120.

[0023] (5)其后,对搭载了电子部件160的多层印刷布线板120进行加热处理(回流工序)。 [0023] (5) Thereafter, an electronic component mounted on the multilayer printed wiring board 160, 120 a heat treatment (reflow process). 由此,如图6B (4)所示,利用焊料台141的焊糊及电子部件160的焊球熔化形成的焊料接合部142,电子部件160接合在安装垫部116A〜116E上。 Thus, 6B (4), the 142, 160 engage the electronic component shown in FIG solder joint with solder balls of solder paste station 141 and the electronic component 160 is melted to form a mat on the mounting portion 116A~116E.

[0024] 接着,详细说明上述现有技术的问题,S卩,在具有贯通通路的多层印刷布线板120的贯通通路118A118D上不能够设置安装垫部这一问题。 [0024] Next, a detailed description of the problems of the prior art, S Jie, pad mounting portions can be provided without problem in the through passage 118A118D multilayer printed wiring board having a through passage 120.

[0025] 由上述表面安装工序可知,在贯通通路正上方设置安装垫部的情况下,在回流工序中熔化的焊料,将流入贯通通路的贯通孔中。 [0025] From the above surface mounting process, the through-passage in the case where mounting mat disposed immediately above the portion, the molten solder in the reflow process, the flow into the through hole penetrating passage. 其结果是,焊料接合部的焊料量不足,从而产生连接不良之虞。 As a result, insufficient amount of solder of the solder joint, resulting in connection failure risk. 进一步,由于流入的焊料量对每个贯通孔不同,所以产生电子部件相对于多层印刷布线板倾斜而不能维持平行度之虞。 Further, since the amount of solder flowing different for each through-hole, the electronic component is generated with respect to the multilayer printed circuit board can not be maintained inclined fear of parallelism. 这样的问题不仅限于多层印刷布线板120的构造,具有贯通通路的任意印刷布线板都可能发生。 Such a problem is not limited to the multilayer printed circuit board structure 120, a printed wiring board having a through any path may occur.

[0026] 基于上述理由,印刷布线板的安装垫部以往一般即使牺牲安装密度也会避开贯通通路的正上方来设置。 [0026] For the above reasons, the printed wiring board mounting pad portion of a conventional general will avoid the sacrifice of the mounting density just above the through-passage is set.

[0027] 此外,以往提出了在贯通通路正上方对电子部件进行表面安装的方法(专利文献I)。 [0027] Further, conventionally proposed (Patent Document I) just above the surface of the electronic component mounted in the through passage. 在该方法中,首先,在贯通通路(被镀的贯通孔17)正上方的安装垫部(焊料•垫12)上印刷好焊膏。 In this method, first, a through via (plated through hole 17) being installed above the pad portion (• solder pad 12) on the printed solder paste is good. 接下来,进行加热处理,将熔化的焊膏引入贯通通路的贯通孔中,并使其在贯通孔内固化。 Subsequently, a heat treatment, the introduction of the molten solder paste through hole extending through the passage, and cured inside the through hole. 反复进行该预备焊料工序,使贯通孔内完全被焊料填充。 This preliminary step is repeated solder, the through-hole is completely filled with solder. 接下来,在使安装垫部平坦化以后,安装电子部件。 Next, the mounting portion planarizing pad after mounting the electronic component.

[0028] 该方法的问题在于,在安装电子部件之前需要反复进行预备焊料工序,工序烦杂,生产率低下。 [0028] The problem with this method is that it requires repeated preliminary step prior to solder the electronic component mounting, complicated process, low productivity. 并且,由于对印刷布线板多次地造成热损伤,所以将会有产生各种不良(贯通通路的裂缝、绝缘树脂的膨胀、剥离等)之虞。 Further, since thermal damage to the printed wiring board many times, so there will be danger of generating various problems (cracks in the through passage, the expansion of the insulating resin, peeling, etc.).

[0029] 另外,近年来,尽管考虑到环境问题而使用无铅焊料的情况在增加,但无铅焊料与共晶焊料相比润湿性较差。 [0029] Further, in recent years, although in view of environmental problems in case of using a lead-free solder is increasing, but the lead-free solder eutectic solder has poor wettability compared. 因此,在使用无铅焊料的情况下,使焊料在所有贯通孔内均匀地填充实际上非常困难。 Thus, in the case where the lead-free solder, the solder is actually very difficult to uniformly fill all of the through hole.

[0030] 作为其他的表面安装方法也有考虑使用有底通路的。 [0030] As another method of surface mounting also considered the use of a bottomed passage. 例如专利文献2中,公开了具备有底通路(盲通孔30)、能够进行高密度安装的装配型多层印刷布线板。 For example, Patent Document 2 discloses a bottom provided with passage (blind via hole 30) can be assembled type multilayer printed wiring board high-density mounting. 在有底通路的情况下,由于焊料不流出,所以在盲通孔30的正上方安装电子部件,会比较容易。 In the case of a bottom passage, since the solder does not flow out, so that the electronic component is mounted directly above the blind via hole 30, it will be easier.

[0031] 然而,在装配型多层印刷布线板的制造中,一般而言,需要很多的工时和材料。 [0031] However, in the manufacturing assembly type multilayer printed wiring board, in general, it requires a lot of time and materials. 并且,需要通过要求详细的条件设定的激光加工来形成有底通路,难以通过NC钻孔加工等形成。 Further, the passage needs to be formed by laser processing bottomed detailed requirements set conditions, is difficult to form the NC drilling and the like.

[0032] 如上所述,一直以来,需要一种兼顾生产率及可靠性、并能在设置于贯通通路正上方的安装垫部上进行电子部件安装的方法。 [0032] As described above, it has been a need for a balance between productivity and reliability, and can be provided in the method of mounting an electronic component mounting pad on the portion directly above the through-passage.

[0033] 现有技术文献专利文献 [0033] PRIOR ART DOCUMENTS Patent Documents

专利文献1:特公平7-112109号公报专利文献2 :日本特开2004-200260号公报。 Patent Document 1: JP KOKOKU No. 7-112109 Patent Document 2: Japanese Laid-Open Patent Publication No. 2004-200260.

发明内容 SUMMARY

[0034] 本发明是基于对上述技术的认识而做出的,其目的在于,提供一种在不损害生产率及可靠性的情况下,在设置于贯通通路正上方的安装垫部上对电子部件进行表面安装的方法,以及使用该方法制造的印刷电路板。 [0034] The present invention is based on the recognition made in the techniques described above, and its object is to provide a case without impairing productivity and reliability, in the n-channel mounting mat disposed above the through portion of the electronic component method for surface mounting, and a printed circuit board produced using this method.

[0035] 依据本发明的一种方式,提供一种电子部件的表面安装方法,在设置于印刷布线板的贯通通路正上方的安装垫部上对电子部件进行表面安装,其特征在于,将盖住所述贯通通路的贯通孔的盖体安置于所述安装垫部上,通过进行焊料印刷在所述安装垫部上形成埋设所述盖体的焊料台,以所述电子部件的连接部安置于所述焊料台上的方式将所述电子部件搭载于所述印刷布线板上,并对搭载了所述电子部件的所述印刷布线板进行加热处理。 [0035] According to one embodiment of the present invention, there is provided an electronic component mounting method for a surface, disposed on the printed wiring board via a through n-pad portion above the mounting surface for mounting the electronic component, wherein the lid live the through-hole passage through the cover is disposed on the mounting pad portion formed on the embedded portion of the mounting pad by solder printing station of the cover of the solder to the electronic component connecting portion is disposed stage manner to the solder the electronic component mounted on the printed wiring board, and said printed wiring board carrying the electronic component is subjected to heat treatment.

[0036] 依据本发明的另一种方式,提供一种印刷电路板,其特征在于,具有:进行层间连接的贯通通路的印刷布线板;焊料接合部,设置于所述贯通通路的贯通孔的正上方;盖体,盖住所述贯通通路的贯通孔并埋设于所述焊料接合部内;以及电子部件,经由所述焊料接合部安装于所述印刷布线板。 [0036] According to a further embodiment of the present invention, there is provided a printed circuit board, comprising: a printed wiring board through a via interlayer connection; solder joint, a through hole is provided in the through passage immediately above; lid to cover the through passage and the through hole is embedded in the solder joint portion; and an electronic component is mounted via the solder joint on the printed wiring board.

[0037] 根据这些特征,本发明具有以下效果。 [0037] According to these features, the present invention has the following effects.

[0038] 在贯通通路的贯通孔上安置盖住贯通通路的贯通孔的盖体,形成埋设所述盖体的焊料台(预备焊料层)。 [0038] positioned to cover the through hole via the through hole penetrating in the through passage of the lid, a solder station is embedded in the cover (the preliminary solder layer). 由此,在回流工序时,由于盖体塞住了贯通孔,使得熔化的焊料不流入贯通孔内。 Accordingly, when the reflow process, since the lid member through hole plug, such that the molten solder does not flow into the through hole. 因此,由于构成接合部的焊料量不会减少,所以不仅提高了焊料接合部的可靠性,也能够维持电子部件相对于印刷布线板的平行度。 Accordingly, since the amount of solder joint will not be reduced, not only improve the reliability of solder joint, can be maintained parallel with respect to the electronic components of the printed wiring board. 附图说明 BRIEF DESCRIPTION

[0039] 图1是用于说明在贯通通路正上方具有安装垫部的多层印刷布线板的制造方法的工序端视图; [0039] FIG. 1 is a view of an end just above mounting method having a step of manufacturing a multilayer printed wiring board pad portion in the through passage;

图2 (a)是在贯通通路正上方设置了安装垫部的印刷布线板的平面图,(b)是沿(a)的AA '线的端视图; FIG 2 (a) is provided immediately above the through-passage plan view of a printed wiring board mounting portion of the pad, (b) is an end view along AA (a) 'line;

图3A是示出本发明的实施方式的电子部件的表面安装方法的工序的端面说明图;接着图3A,图3B是示出本发明的实施方式的电子部件的表面安装方法的工序的端面说明图; FIG 3A is an end process of the surface mounting method illustrated embodiment of the present invention is an electronic component explanatory diagram; Next FIGS. 3A, 3B is an end view illustrating the steps of a surface mounting method illustrated embodiment of the present invention an electronic component Figure;

接着图3B,图3C是示出本发明的实施方式的电子部件的表面安装方法的工序的端面说明图; Next FIG. 3B, 3C is an end surface mounting step illustrating a method embodiment of the present invention described in FIG electronic component;

图4是在贯通孔上安置变形例的盖体的印刷布线板的端面说明图; FIG 4 is a printed circuit board disposed end faces of a modification of the lid is an explanatory view on a through hole;

图5 (a)是具有离开贯通通路设置的安装垫部的印刷布线板的平面图,(b)是沿(a)的AA '线的端视图; FIG 5 (a) is a plan view of a printed wiring board having a pad mounting portion away from the through-passage is provided, (b) is an end view line AA 'in (a) of;

图6A是示出采用现有技术的电子部件的表面安装方法的工序端视图; 6A is a diagram illustrating the electronic components of the prior art process using an end view of the surface mounting method;

接着图6A,图6B是示出采用现有技术的电子部件的表面安装方法的工序端视图。 Next FIG. 6A, 6B is an end view of a step showing a method of surface mounting electronic component of the prior art.

[0040] 附图标号说明 [0040] Reference numerals

1A、1B、101、110 挠性绝缘基底材料;2A、2B、3A、3B、102、103、111、112 铜箔;4A、4B、104,113电路基材;5、107覆盖膜;5a绝缘膜;5b、109粘结剂层;6、108带有覆盖膜的电路基材;7、105粘结剂层;8层叠电路基材;9贯通孔穴;10、114镀膜;11贯通通路;12A、12B外层电路图案;13、115光阻焊剂层;14安装垫部;15开口部;16、120多层印刷布线板;20、130金属版(金属掩模);21、131开口部;30、30A、30B、30C盖体;30C1圆盘体;30C2柱状体;40,150刮刀;50、140焊糊;51、141焊料台(预备焊料层);52、142焊料接合部;60,160电子部件;61、161端子;70多层印刷电路板;106聚酰亚胺膜;116A、116B、116C、116DU16E 安装垫部;118A、118B、118C、118D 贯通通路;119A、119B、119C、119D、119E 开口部。 1A, 1B, 101,110 flexible insulating base material; 2A, 2B, 3A, 3B, 102,103,111,112 foil; 4A, 4B, 104,113 circuit substrate; 5,107 cover film; an insulating film. 5A; 5b, 109 adhesive layer; 9 a through hole;; 6,108 with a cover film circuit substrate; 7,105 adhesive layer; film 8 laminated circuit substrate 10, 114; 11 a through passage; 12A, 12B outer layer circuit pattern; 13,115 photo solder resist layer; mounting pad portion 14; the opening portion 15; 16,120 multilayer printed wiring board; 20,130 metal plate (metal mask); 21,131 opening portion; 30, 30A, 30B, 30C lid; 30c1 disc body; 30C2 columnar body; doctor blade 40, 150; 50, 140 solder paste; 51,141 solder station (preliminary solder layer); solder joint 52,142; 60,160 electronic component; terminals 61, 161; 70 multilayered printed circuit board; a polyimide film 106; 116A, 116B, 116C, 116DU16E pad mounting portion; 118A, 118B, 118C, 118D of the through passage; 119A, 119B, 119C, 119D, 119E opening unit.

具体实施方式 detailed description

[0041] 以下,参照附图对本发明的实施方式进行说明。 [0041] Hereinafter, with reference to the accompanying drawings of embodiments of the present invention will be described. 此外,各图中具有同等功能的结构要素使用相同的标号,对于相同标号的结构要素不会反复详细说明。 In the drawings, like reference numerals have the same function of the components used, the same reference numerals for the components will not be described repeatedly in detail.

[0042] 首先,结合图1对在贯通通路的正上方设置有安装垫部多层柔性印刷布线板的制造方法进行说明。 [0042] First, in conjunction with FIG. 1 just above the through-passage is provided with a method for manufacturing a multilayer pad portion of the flexible printed wiring board is mounted will be described.

[0043] (I)准备在挠性绝缘基底材料IA (例如25 ii m厚的聚酰亚胺膜)的双面具有铜箔2A及铜箔3A (各自例如为12 iim厚)的挠性双面敷铜箔叠层板。 [0043] (I) preparing a copper foil 2A and 3A a flexible insulating base material IA (e.g. polyimide film 25 ii m thick) of a double-sided (for example, each 12 iim thick) flexible bis surface of copper-clad laminates. 而且,如图1 (I)所示,使用光加工方法,将铜箔2A加工成既定电路图案,制造装配用的电路基材4A。 Further, in FIG. 1 (I), the use of optical processing method, the copper foil is processed into a predetermined circuit pattern 2A, 4A manufacturing a circuit substrate for assembly.

[0044] (2)接着,准备在挠性绝缘基底材料IB (例如25 ii m厚的聚酰亚胺膜)的双面具有铜箔2B及铜箔3B (各自例如为12 iim厚)的挠性双面敷铜箔叠层板。 [0044] (2) Next, a copper foil having a foil 2B and 3B in a flexible insulating base material IB (e.g. polyimide film 25 ii m thick) of a double-sided (for example, each 12 iim thick) flexible a double-sided copper-clad laminate. 而且,使用与电路基材4A的情况相同的光加工方法,将铜箔3B加工成既定的电路图案,制造图1 (2)所示的装配用电路基材4B。 Further, the circuit substrate using the same processing method of the light. 4A, 3B copper foil is processed into a predetermined circuit pattern, producing the assembly shown in FIG. 1 (2) of the circuit substrate 4B. [0045] (3)接着,由图1 (3)可知,在电路基材4B的背面(图中下侧)粘合覆盖膜5,制造带有覆盖膜的电路基材6。 [0045] (3) Next, seen from FIG. 1 (3), an adhesive film 5 covering the rear surface (lower side in the drawing) of the circuit substrate 4B, manufacturing a circuit substrate 6 with a cover film. 该覆盖膜5是在绝缘膜5a (例如12 um厚的聚酰亚胺膜)上形成由丙烯类或环氧类的粘结材料构成的粘结剂层5b (例如15 厚)而成的。 The cover film 5 is formed an adhesive layer 5b (e.g. 15 thick) made of adhesive material made of acrylic or epoxy on the insulating film 5a (e.g. 12 um thick polyimide film).

[0046] (4)接着,如图1 (3)所示,将电路基材4A与带有覆盖膜的电路基材6进行对位后,经由由丙烯类或环氧类的粘结材料构成的粘结材料层7层叠,制造层叠电路基材8。 [0046] (4) Next, as shown in FIG. 1 (3), the circuit substrate with the circuit substrate 4A and the cover film 6 after bit, through the adhesive material is made of acrylic or epoxy type the adhesive layer 7 are stacked, laminated circuit substrate 8 manufactured.

[0047] (5)接着,如图1 (4)所示,利用NC钻孔加工在层叠电路基材8的既定位置形成贯通孔穴9 (0150um)0此外,贯通孔穴9的直径需要考虑贯通孔穴9与搭载的电子部件的连接部的形状的平衡而决定。 [0047] (5) Next, as shown in FIG. 1 (4), an NC drilling a through hole formed at a predetermined position of the multilayer circuit substrate 8 9 (0150um) 0 Further, the diameter of the through hole 9 through the apertures to be considered 9 and the connecting portion of the equilibrium shape of the electronic component mounted is determined. 一般而言,孔径小的情况下加工成本会容易变高,另一方面,孔径大的情况下,会影响此后搭载的电子部件的安装高度。 Generally, the pore diameter is small where the processing cost tends to be high, on the other hand, the pore diameter is large, the height of the electronic component mounting affect thereafter mounted. 因此,贯通孔穴9的直径设定为例如IOOlOOiim的范围内。 Accordingly, the diameter of the through hole 9 is set in the range of, for example, the IOOlOOiim.

[0048] 此外,贯通孔穴9 不限于NC钻孔加工,也可以由采用各种激光(UV-YAG激光,碳酸激光,准分子激光等)的激光加工来形成。 [0048] In addition, the through-hole 9 is not limited to the NC drilling process, may be formed using various laser (UV-YAG laser, a carbonic acid laser, excimer laser, etc.) of the laser processing.

[0049] (6)接着,由图1 (5)可知,对贯通孔穴9实施导电化处理后,通过实施电解镀铜处理在多层电路基材8的外层,及贯通孔穴9的内壁形成镀膜10(例如Sym厚)。 [0049] (6) Next, seen from FIG. 1 (5), after the implementation of the conductive treatment through cavities 9, by performing electrolytic copper plating process is formed on the inner wall of an outer layer of the multilayer circuit substrate 8, and the through hole 9 film 10 (e.g. thickness Sym). 由此,得到进行层间连接的贯通通路11。 Thus, a through-passage 11 connected between the layers.

[0050] (7)接着,使用光加工方法,将多层电路基材8外层的导电膜(铜箔+镀膜)加工成既定图案,在多层电路基材8的双面形成外层电路图案12A及12B。 [0050] (7) Next, the optical processing method, the conductive film multilayer circuit substrate 8 the outer layer (coating + copper) processed into a predetermined pattern, formed on both sides of outer layer circuit of the multilayer circuit substrate 8 patterns 12A and 12B.

[0051] 此外,在本工序的光加工方法中使用的光致抗蚀剂,优选使用具有能掩盖贯通孔穴9的厚度(例如20 ym厚)的干膜抗蚀剂。 [0051] Further, a dry film resist is a photoresist, preferably having a thickness (e.g. thickness of 20 ym) can cover the through hole 9 of the light used in the process of this step. 此外,即便使用液状抗蚀剂或电附着抗蚀剂,也能保护贯通通路11。 Further, even when using a liquid resist or electrodeposition resists, but also to protect the through passage 11.

[0052] (8)接着,如图1 (5)所示,在需要绝缘保护的区域形成光阻焊剂层13。 [0052] (8) Next, as shown in FIG. 1 (5), a solder resist layer 13 is formed in the insulating protection required area. 在光阻焊剂层13形成在底面露出安装垫部14 (包含贯通通路11)的开口部15。 In the solder resist layer 13 formed on the bottom exposed pad mounting portion 14 (comprising a through passage 11) of the opening portion 15.

[0053] 其后,对在开口部15露出的镀膜10实施镀金等表面处理,并进行外形加工,得到具有贯通通路的多层印刷布线板16。 [0053] Thereafter, a surface treatment such as gold plating 10 in the opening portion of the film 15 is exposed, and trimmed to obtain a multilayer printed wiring board 16 having a through passage.

[0054] 图2 Ca)示出了通过上述方法制造的多层印刷布线板16的平面图。 [0054] FIG. 2 Ca) shows a plan view of the multilayer printed wiring board manufactured by the above method 16. 图2 (b)是沿图2 (a)的A-A'线的端视图。 FIG 2 (b) is along 2 (a) of A-A 'line in end view.

[0055] 由图2 (a)及图2 (b)可知,多层印刷布线板16的安装垫部14设置在贯通通路11正上方。 [0055] (a) and FIG. 2 (b) is clear from FIG. 2, right above the mounting pads 11 of the multilayer printed wiring board 16 is disposed in the through passage 14. 由此,与上述的多层印刷布线板120相比,多层印刷布线板16的安装垫部的配置密度提高,能够应对高密度安装的情况。 Thus, as compared with the multilayer printed wiring board 120, mounting pad arrangement density multilayer printed circuit board portion 16 is increased, it can cope with a high density mounting.

[0056] 接着,结合图3A至图3C对在该多层印刷布线板16上对电子部件进行表面安装的方法进行说明。 [0056] Next, FIGS. 3A through 3C in conjunction with a method of surface-mounting the electronic component on the multilayer printed wiring board 16 will be described.

[0057] (I)首先,准备焊料印刷用的金属版(金属掩模)20。 [0057] (I) First, a solder metal plate for printing (metal mask) 20. 金属版20具有与多层印刷布线板16的安装垫部14、14、…分别对应的开口部21、21、…。 The metal plate 20 having a pad mounting portion 14, 14 and the multilayer printed wiring board 16, ... respectively corresponding to the opening portions 21, 21, ....

[0058] 而且,如图3A (I)所示,以金属版20的开口部21、21、…与多层印刷布线板16的安装垫部14、14、…分别重叠的方式在多层印刷布线板16上安置金属版20。 [0058] Further, in FIG. 3A (I), the metal plate 20 and the opening portion 21, 21, ... with the mounting pads 16 of the multilayer printed wiring board 14, 14, ... respectively overlap the multilayer printed the metal plate 20 disposed on the wiring board 16.

[0059] 此外,金属版20的开口部21形成能通过一个后述的盖体30左右的大小。 [0059] Further, the opening portion 21 of the metal plate 20 is formed about the size of a can lid 30 will be described later. S卩,开口部21的直径比球状盖体30的直径更大。 S Jie, the opening portion 21 has a diameter larger than the diameter of the spherical body 30 of the cap. 与此同时,为了防止I个开口部21中放入两个盖体30,优选开口部21的直径不足盖体30直径的2倍。 At the same time, in order to prevent the I into two openings 21 in the cover 30, preferably less than the diameter of the opening portion 21 of the lid 30 twice the diameter of the body.

[0060] (2)接着,如图3A (2)所示,以由金属构成的球状盖体30盖住贯通通路11的贯通孔的方式在各个安装垫部14安置盖体30。 Covering the through-hole 30 through passage 11 in a manner [0060] (2) Next, as shown in FIG. 3A (2), a ball made of metal to the lid member 14 is disposed in each of the mounting pad cover body portion 30.

[0061] 更具体而言,在金属版20上堆积多个盖体30、30、…后,以扫过掩模版20的上表面的方式使刮刀40滑动,以使盖体30逐个地落入掩模版20的开口部21内部而塞住贯通通路11的贯通孔的方式安置。 After [0061] More specifically, the metal plate 20 stacked on the plurality of lid 30, 30, ..., so as to sweep the upper surface of the reticle 20 so that the blade 40 is slid, so that the cover 30 one by one fall disposed inside the opening portion 21 of the reticle 20 and the plug 11 of the through hole penetrating passage way. 然后,通过从贯通通路11下部侧进行空气吸附来固定盖体30。 Then, by the air suction side of the through passage 11 from the lower cover member 30 is fixed.

[0062] 此外,盖体30的直径设置为比贯通通路11的直径(约130iim)大l(T20iim的值。为了确保电子部件的平行度,优选使盖体30的大小(直径)一致为固定值。 [0062] Further, the cover body diameter 30 is set to coincide than diameter of the through passage 11 (approximately 130iim) a large value of l (T20iim To ensure parallelism of the electronic component, it is preferable that the size of the lid body 30 (diameter) of the fixed value.

[0063] (3)接着,如图3B (3)所示,在金属版20上堆积焊糊50之后,使刮刀40滑动并进行焊料印刷。 After [0063] (3) Next, as shown in FIG 3B (3), on the metal plate 20 deposited solder paste 50, so that the blade slide 40 and the solder printing. 由此,焊糊50埋入金属版20的开口部21的内部,并且开口部21内的盖体30被埋设于焊糊50内而被固定。 Thereby, the cream solder 50 is embedded in the opening portion 21 of the metal plate 20, and the opening portion 21 in the lid 30 is embedded in the solder paste 50 is fixed.

[0064] (4)接着,如图3B (4)所示,将金属版20从多层印刷布线板16上卸下。 [0064] (4) Next, as shown in FIG 3B (4), the metal plate 20 is detached from the multilayer printed wiring board 16. 由此,埋设有盖体30的焊料台(预备焊料层)51、51、…在各安装垫部14、14、…上形成。 Thereby, the cover is embedded solder station (the preliminary solder layer) 51, 51, ... in each of the mounting pads 14, 14, 30, ... formed.

[0065] (5)接着,准备表面安装用的电子部件60 (例如CSP),将该电子部件60的连接部(电子部件60的端子61,或端子61上设置的焊球)安置于焊料台51上,对电子部件60和多层印刷布线板16进行对位。 [0065] (5) Next, a surface-mounted electronic component 60 is used (e.g. the CSP), (solder balls 61 provided on the electronic component 60 of the terminal, or terminals 61) connected to the electronic component unit 60 is disposed on the solder station 51, the electronic component 60 and the multilayer printed wiring board 16 for alignment. 其后,将电子部件60搭载于多层印刷布线板16上。 Thereafter, the electronic component 60 is mounted on the multilayer printed wiring board 16.

[0066] (6)接着,对搭载了电子部件60的多层印刷布线板16进行加热处理(回流工序)。 [0066] (6) Next, the electronic component 60 mounted on the multilayer printed wiring board 16 to heat treatment (reflow process). 由此,如图3C (5)所示,焊料台51的焊糊熔化而形成焊料接合部52。 Accordingly, as shown in FIG 3C (5), the cream solder 51 in molten solder station 52 and the solder joint formed. 利用该焊料接合部52,电子部件60接合于多层印刷布线板16的安装垫部14上。 By the mounting pad portion 16 of the multilayer printed wiring board of the solder joint 52, 60 is bonded to the electronic component 14.

[0067] 在本工序中,由于盖体30作为贯通通路11的贯通孔的盖而起作用,所以熔化的焊料不会流入贯通孔。 [0067] In this step, since the cover member 30 via a through hole penetrating the lid 11 and acts so that the molten solder does not flow into the through-hole. 由此,由于构成焊料接合部52的焊料量不会减少,所以焊料接合部52的可靠性提高,并且能够维持电子部件60相对于印刷布线板16的平行度。 Accordingly, since the amount of solder constituting the solder joint 52 will not be reduced, thus improving the reliability of the solder joint 52, and the electronic component 60 can be maintained with respect to the parallelism of the printed wiring board 16.

[0068] 进一步,盖体30是球体,由于其顶部形成固定的高度,所以电子部件60的安装高度(平衡)稳定,能够更加确保平行度。 [0068] Further, the cover body 30 is a sphere, due to its top to form a fixed height, the height of the electronic component 60 is mounted (balance) is stable and can further ensure parallelism.

[0069] 经过上述工序,能够得到在设置于贯通通路11的正上方的安装垫部14上安装了电子部件60的多层印刷电路板70。 [0069] After the above process, can be obtained in a through passage provided directly above the pad 11 of the mounting portion 14 of the electronic component 60 of the multilayer printed circuit board 70 is mounted.

[0070] 如图3C (5)所示,多层印刷电路板70隔着在设置于贯通通路11的贯通孔的正上方的焊料接合部52而具有安装于多层印刷布线板16的电子部件60。 [0070] FIG 3C (5), the multilayer printed circuit board 70 via the through-passage is provided directly above the through hole 11 of the solder joint 52 having electronic components mounted on the multilayer printed wiring board 16 60. 另外,盖体30埋设于焊料接合部52内,塞住贯通通路11的贯通孔。 Further, the lid member 30 is embedded in the solder joint 52, the through holes plugged through passage 11.

[0071] 如以上说明的那样,依据本实施方式,在不损害生产率及可靠性的情况下,能够在设置于贯通通路11的正上方的安装垫部上对电子部件进行表面安装。 [0071] As explained above, according to the present embodiment, without impairing productivity and reliability, it can be provided on the pad mounting portion immediately above the through-passage 11 for surface mounting of electronic components. 另外,依据本实施方式,能够提供安装有狭窄间距的电子部件、焊料接合部可靠性高且电子部件平行度良好的印刷电路板。 Further, according to the present embodiment, it is possible to provide a narrow pitch are mounted electronic components, high reliability and good solder joint of the electronic component parallel to the printed circuit board.

[0072] 此外,在上述的说明中,虽然盖体30的材质使用金属,但本发明并不限于此。 [0072] Further, in the above description, the material of a metal lid body 30, but the present invention is not limited thereto. 即,盖体30的材质只要是不会在回流工序中熔化而丧失作为盖体的功能的材质即可。 That is, as long as the material of the cover body 30 is not melted to lose the function as the cover material to the reflow process. 因此,也可以是树脂等的绝缘体。 Thus, the insulator may be a resin or the like. 但是,从焊料润湿性的观点来看,优选盖体的表面是金属。 However, from the viewpoint of view of solder wettability, the surface of the cover is preferably a metal. 因此,作为盖体,也可使用对由树脂构成的核体实施电镀处理并在表面形成了导电薄膜(例如Ni/Au镀层)的树脂核。 Thus, a lid may be used for the core body made of a resin plating process and a conductive film formed on the surface (e.g., Ni / Au plating) of the resin core.

[0073] 另外,为了在安装有电子部件的印刷布线板(印刷电路板)上缓冲应力作用,也可以设盖体的材料的热膨胀系数为电子部件的热膨胀系数与印刷布线板的热膨胀系数之间的数值。 [0073] Further, in order to stress in mounting the printed wiring board with electronic components (printed circuit board) on the buffer, but also the thermal expansion coefficient of the material of the body may be provided a cover for the thermal expansion coefficient of the thermal expansion coefficient of the printed wiring board of the electronic component between value. 通过使用具有那样的热膨胀系数的树脂作为盖体30的材料,能够利用树脂的弹性来缓冲由于安装的电子部件60与多层印刷布线板16之间的热膨胀差产生的应力。 By using a resin having a thermal expansion coefficient of an elastic material such as a lid 30, can be utilized to buffer the resin due to thermal stress between the electronic component 60 and the multilayer printed wiring board 16 is mounted to expansion difference generated.

[0074] 另外,盖体30只要设置于其正上方成为安装垫部的贯通通路上即可,不需要设置于其正上方不成为安装垫部的贯通通路上设置。 [0074] Further, as long as the cover member 30 can be disposed immediately above it, no need to provide a through passage on its mounting portion immediately above the pad does not become a through-passage is provided on the mounting portion of the pad. 这样,通过仅在需要部位配置盖体,能够使制造工序更为经济。 Thus, by arranging the cover only in a predetermined position, the manufacturing process can be more economical.

[0075] 另外,在上述的说明,虽然盖体30的形状为球体,但本发明并不限于此。 [0075] In the above description, although the shape of the cover body 30 is a sphere, but the present invention is not limited thereto. 即,盖体30的形状,只要能够盖住贯通通路的贯通孔即可,例如,也可以是椭圆球状的盖体30A (参照图4 (a)),或圆盘形状的盖体30B (参照图4 (b))。 That is, the shape of the lid 30, as long as capable of covering the through hole can be a through passage, e.g., may be spheroidal lid 30A (see FIG. 4 (a)), or a disk-shaped lid body 30B (refer to FIG. 4 (b)).

[0076] 此外,与球体情况相同,作为更能够确保电子部件的平行度的形状,也可以使用由盖住贯通孔的圆盘体30C1及与该圆盘体30C1正交的柱状体30C2构成的(参照图4 (c))盖体30C。 [0076] Further, the case of the same sphere, as the shape of parallelism can be ensured more electronic components may be used by the disk member covers the through holes 30C1 and 30C1 columns orthogonal to the disk body formed of 30C2 (see FIG. 4 (c)) the lid 30C. 在该情况下,柱状体30C2的长度,优选大于开口部15的直径。 In this case, the length of the columnar body 30C2 is preferably larger than the diameter of the opening portion 15.

[0077] 另外,本发明的电子部件的安装方法并不限于上述的多层印刷布线板16,能够适用于具有在贯通通路正上方设置有安装垫部结构的任意印刷布线板。 [0077] Further, an electronic component mounting method of the present invention is not limited to the multilayer printed wiring board 16 can be applied to a through passage having a mounting is provided immediately above the printed wiring board in any of the pad structure.

[0078] 基于上述记载,本领域技术人员可能都能够想到本发明的附加的效果及各种变形,但本发明的方式并不限定于上述实施方式。 [0078] Based on the above description, one skilled in the art will be able to think of possible additional effect of the present invention and various modifications, but the embodiment of the present invention is not limited to the above embodiments. 在不脱离从专利请求的范围所规定的内容及其等价物导出的本发明概念性思想、宗旨的范围内,各种的附加、变更及部分删除均有可倉泛。 Without departing from the general concept of the present invention as defined from the scope of the patent and their equivalents requested content derived gist, various additions, changes, and may have a partial deletion of the cartridge pan.

Claims (15)

1. 一种电子部件的表面安装方法,在设置于印刷布线板的贯通通路的正上方的安装垫部上对电子部件进行表面安装,其特征在于, 将盖住所述贯通通路的贯通孔的盖体安置于所述安装垫部, 通过进行焊料印刷来在所述安装垫部形成埋设所述盖体的焊料台, 以所述电子部件的连接部安置于所述焊料台上的方式将所述电子部件搭载于所述印刷布线板上,并且对搭载有所述电子部件的所述印刷布线板进行加热处理。 CLAIMS 1. A method of surface mounting electronic component on the mounting pad portion disposed in the through passage of the printed wiring board just above the mounting surface of the electronic part, wherein the cover through hole of the through passage the cover portion is disposed in said mounting pad, by printing a solder pad to the mounting portion in a manner forming a solder station is embedded in the cover, the connecting portion of the electronic component to the solder disposed on the table will be said electronic component mounted on the printed wiring board, the printed wiring board and the electronic component mounted to the heat treatment.
2.如权利要求1所述的电子部件的表面安装方法,其特征在于,所述盖体的形状为球状、椭圆球状、圆盘状或者由圆盘体及与所述圆盘体正交的柱状体构成的形状。 2. The method of surface mounting electronic component according to claim 1, wherein the shape of the lid is spherical, spheroidal, disc-shaped or disk-shaped body and perpendicular to the body of the disc constituting the columnar body shape.
3.如权利要求2所述的电子部件的表面安装方法,其特征在于,所述盖体由不因所述加热处理而熔化的材质构成。 The method of claim 2 surface mounted electronic component as claimed in claim 3, wherein said lid body is made by the heat treatment is not melted material.
4.如权利要求3所述的电子部件的表面安装方法,其特征在于,所述盖体由金属、树脂或表面具有导电薄膜的树脂构成。 A surface mounting method of electronic component of claim 3, wherein the cover has a metal, a resin, or a surface of the conductive resin film.
5.如权利要求3所述的电子部件的表面安装方法,其特征在于,所述盖体的热膨胀系数为所述电子部件的热膨胀系数与所述印刷布线板的热膨胀系数之间的值。 5. The method of surface mounting electronic component of claim 3, wherein the value of the coefficient of thermal expansion between the coefficient of thermal expansion of the printed wiring board with a thermal expansion coefficient of the material for an electronic component of the cover.
6.如权利要求2所述的电子部件的表面安装方法,其特征在于,在将所述盖体安置于所述安装垫部之后,通过从所述贯通通路的下部侧进行空气吸附来固定所述盖体。 6. The method of surface mounting electronic component according to claim 2, characterized in that, after the cover portion is disposed in said mounting pad, by air from a lower side of the suction passage through the fixed said lid.
7.如权利要求1所述的电子部件的表面安装方法,其特征在于,所述盖体由不因所述加热处理而熔化的材质构成。 7. The method of surface mounting electronic component according to claim 1, characterized in that the cover of the heat treatment is not due to a material having melted.
8.如权利要求1所述的电子部件的表面安装方法,其特征在于,在将所述盖体安置于所述安装垫部之后,通过从所述贯通通路的下部侧进行空气吸附来固定所述盖体。 8. The method of surface mounting electronic component according to claim 1, wherein, after the cover portion is disposed in said mounting pad, by air from a lower side of the suction passage through the fixed said lid.
9.如权利要求1所述的电子部件的表面安装方法,其特征在于, 所述焊料印刷, 将具有与所述安装垫部对应的开口部的金属版,以所述开口部与所述安装垫部重叠的方式安置于所述印刷布线板上, 以扫过所述金属版的上表面的方式使刮刀滑动,将在所述金属版上堆积的焊糊埋入所述金属版的所述开口部,并且将所述金属版从所述印刷布线板上卸下。 9. The method of surface mounting electronic component according to claim 1, characterized in that the solder printing, the mounting pad having a portion corresponding to the opening portion of the metal plate to the opening portion of the mounting a pad portion disposed in a manner to overlap the printed wiring board to sweep the upper surface of the metal plate so that the blade slide, the deposited solder paste is embedded in the metal plate on the metal plate an opening portion, and the metal plate is detached from the printed wiring board.
10. 一种印刷电路板,其特征在于,具有: 具有进行层间连接的贯通通路的印刷布线板, 焊料接合部,设置于所述贯通通路的贯通孔的正上方, 盖体,将所述贯通通路的贯通孔盖住并在所述焊料接合部内埋设,以及电子部件,隔着所述焊料接合部安装于所述印刷布线板。 10. A printed circuit board comprising: a printed wiring board having a through passage for inter-layer connection, a solder joint, disposed directly above the through passage of the through-hole lid, the a through hole penetrating passage covered and embedded in the solder joint, and an electronic component is mounted via the solder joint on the printed wiring board.
11.如权利要求10所述的印刷电路板,其特征在于,所述盖体的形状为球状、椭圆球状、圆盘状或者由圆盘体及与所述圆盘体正交的柱状体构成的形状。 11. The printed circuit board according to claim 10, wherein said lid body is a spherical shape, elliptic spherical, disk-shaped or disk-shaped body and the columnar body of the disk body constituting orthogonal shape.
12.如权利要求11所述的电子部件的表面安装方法,其特征在于,所述盖体由金属、树脂或表面具有导电薄膜的树脂构成。 12. The method of surface mounting electronic component of claim, wherein the cover has a metal, a resin, or a surface of the conductive resin film.
13.如权利要求10所述的电子部件的表面安装方法,其特征在于,所述盖体由金属、树脂或表面具有导电薄膜的树脂构成。 13. The method of surface mounting an electronic component according to claim 10, wherein the conductive resin film having a lid made of metal, resin, or surface configuration.
14.如权利要求10所述的电子部件的表面安装方法,其特征在于,所述盖体的热膨胀系数为所述电子部件的热膨胀系数与所述印刷布线板的热膨胀系数之间的值。 14. The method of surface mounting electronic component of claim 10, wherein the value of the coefficient of thermal expansion between the coefficient of thermal expansion of the printed wiring board with a thermal expansion coefficient of the material for an electronic component of the cover.
15.如权利要求10所述的电子部件的表面安装方法,其特征在于,所述印刷布线板是以挠性绝缘膜为基材的柔性印刷布线板。 15. The method of surface mounting an electronic component according to claim 10, wherein said printed wiring board is a flexible printed wiring board of the flexible insulating film as a base material.
CN 201180022028 2010-06-18 2011-01-26 Surface mounting method for electronic components and printed circuit boards manufactured using said method CN103039130B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010139271A JP5389748B2 (en) 2010-06-18 2010-06-18 Surface mounting method of electronic components, and printed circuit board fabricated using the method
JP2010-139271 2010-06-18
PCT/JP2011/051456 WO2011158524A1 (en) 2010-06-18 2011-01-26 Surface mounting method for electronic components and printed circuit boards manufactured using said method

Publications (2)

Publication Number Publication Date
CN103039130A true true CN103039130A (en) 2013-04-10
CN103039130B CN103039130B (en) 2015-06-24

Family

ID=45347938

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201180022028 CN103039130B (en) 2010-06-18 2011-01-26 Surface mounting method for electronic components and printed circuit boards manufactured using said method

Country Status (3)

Country Link
JP (1) JP5389748B2 (en)
CN (1) CN103039130B (en)
WO (1) WO2011158524A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5275330A (en) * 1993-04-12 1994-01-04 International Business Machines Corp. Solder ball connect pad-on-via assembly process
CN1245007A (en) * 1997-01-16 2000-02-16 福特环球技术公司 Optimized solder joints for surface mount chips
US6199273B1 (en) * 1995-12-19 2001-03-13 Sumitomo Metal Industries, Ltd. Method of forming connector structure for a ball-grid array
CN1759642A (en) * 2003-03-10 2006-04-12 日立金属株式会社 Method and device for mounting conductive ball
US20070090171A1 (en) * 2005-10-25 2007-04-26 Fujitsu Limited Method for manufacturing a printed circuit board for electronic devices and an electronic device using the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5024009B2 (en) * 2007-12-10 2012-09-12 日本電気株式会社 Mounting method and mounting structure of an electronic circuit

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5275330A (en) * 1993-04-12 1994-01-04 International Business Machines Corp. Solder ball connect pad-on-via assembly process
US6199273B1 (en) * 1995-12-19 2001-03-13 Sumitomo Metal Industries, Ltd. Method of forming connector structure for a ball-grid array
CN1245007A (en) * 1997-01-16 2000-02-16 福特环球技术公司 Optimized solder joints for surface mount chips
CN1759642A (en) * 2003-03-10 2006-04-12 日立金属株式会社 Method and device for mounting conductive ball
US20070090171A1 (en) * 2005-10-25 2007-04-26 Fujitsu Limited Method for manufacturing a printed circuit board for electronic devices and an electronic device using the same

Also Published As

Publication number Publication date Type
JP2012004418A (en) 2012-01-05 application
JP5389748B2 (en) 2014-01-15 grant
WO2011158524A1 (en) 2011-12-22 application
CN103039130B (en) 2015-06-24 grant

Similar Documents

Publication Publication Date Title
US6744135B2 (en) Electronic apparatus
US5260518A (en) Multilayer circuit board for mounting ICs and method of manufacturing the same
US7122901B2 (en) Semiconductor device
US20060208356A1 (en) Wiring board and method of manufacturing the same
JP2005209689A (en) Semiconductor device and its manufacturing method
US20090290317A1 (en) Printed circuit board, method of fabricating printed circuit board, and semiconductor device
US20090242262A1 (en) Multi-layer wiring board and method of manufacturing the same
US7115818B2 (en) Flexible multilayer wiring board and manufacture method thereof
JP2005217225A (en) Semiconductor device and method for manufacturing the same
US20070126112A1 (en) Metal core, package board, and fabricating method thereof
JP2001196525A (en) Semiconductor device and manufacturing method therefor
JP2009200389A (en) Method of manufacturing electronic component built-in board
JP2002313996A (en) Substrate for semiconductor package, and its manufacturing method
US20100288549A1 (en) Coreless packaging substrate and method for manufacturing the same
US20080230892A1 (en) Chip package module
US20090052150A1 (en) Wiring board, method of manufacturing the same, and semiconductor device having wiring board
JP2008251702A (en) Manufacturing method for wiring board, manufacturing method for semiconductor device, and wiring board
US20090242245A1 (en) Multi-layer wiring board and method of manufacturing the same
US20100025087A1 (en) Flex-rigid wiring board and method for manufacturing the same
US20090290318A1 (en) Printed wiring board and method for manufacturing the same
US8238109B2 (en) Flex-rigid wiring board and electronic device
US20120227261A1 (en) Method for manufacturing printed wiring board
US20100301473A1 (en) Component built-in wiring board and manufacturing method of component built-in wiring board
US20100053920A1 (en) Packaging substrate with embedded semiconductor component and method for fabricating the same
US20120217049A1 (en) Wiring board with built-in imaging device

Legal Events

Date Code Title Description
C06 Publication
C10 Entry into substantive examination
C14 Grant of patent or utility model