CN103039130A - Surface mounting method for electronic components and printed circuit boards manufactured using said method - Google Patents
Surface mounting method for electronic components and printed circuit boards manufactured using said method Download PDFInfo
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- CN103039130A CN103039130A CN201180022028XA CN201180022028A CN103039130A CN 103039130 A CN103039130 A CN 103039130A CN 201180022028X A CN201180022028X A CN 201180022028XA CN 201180022028 A CN201180022028 A CN 201180022028A CN 103039130 A CN103039130 A CN 103039130A
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- electronic unit
- wiring board
- lid
- printed wiring
- surface mounting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10234—Metallic balls
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
Disclosed is a surface mounting method for electronic components whereby electronic components are surface mounted to mounting pad sections provided directly above through vias, without adversely affecting productivity or reliability. Specifically disclosed is a method for surface-mounting an electronic component (60) to mounting pad sections (14) provided directly above through vias (11) in a printed wiring board (16). First, lid bodies (30) that cover through holes of the through vias (11) are mounted in the mounting pad sections (14). Then, soldered platforms that bury the lid bodies (30) are formed on the mounting pad sections (14) by solder printing. The electronic component (60) is then mounted on top of the printed wiring board (16) and the printed wiring board to which the electronic component (60) has been mounted is heat processed.
Description
Technical field
The present invention relates to the method for surface mounting of electronic unit, more specifically, relate to be arranged at the perforation path of printed wiring board (Consistent leads to PVC ア) directly over mounting mat on electronic unit is carried out the method that install on the surface, and the printed circuit board (PCB) that uses the method to make.
Background technology
In recent years, the miniaturization of the electronic equipment take portable phone as representative and multifunction are growing.Accompany therewith, also seek at printed wiring board more small-sized and H.D electronic unit to be installed.CSP(Chip Size Package: chip size packages) be a kind of in this type of electrical component.CSP has the packaging part parts that engage with soldered ball usually with the narrow-pitch about 0.3 ~ 1.0mm, the surface is installed on the printed wiring board.
For cooperating the densification of electronic unit connecting portion, the mounting mat section of printed wiring board also needs densification.Therefore, can consider directly over connecting path, mounting mat section to be set.
But be difficult to improve packing density by directly over the perforation path of printed wiring board, mounting mat being set in the past.
Before describing this problem in detail, to the structure of the printed wiring board made according to prior art, and the method for surface mounting that this printed wiring board carries out electronic unit described.
As having the example of printed wiring board that connects path, Fig. 5 shows the structure of multilayer printed-wiring board 120.Fig. 5 (a) is the plane graph with the multilayer printed-wiring board 120 that connects path, and Fig. 5 (b) is the end-view along the A-A ' line of Fig. 5 (a).
At first the planar configuration of multilayer printed-wiring board 120 described.
Shown in Fig. 5 (a), the surface of multilayer printed-wiring board 120 is all covered by photoresistance solder flux (Off ォ ト ソ ル ダ ー レ ジ ス ト) layer 115 except peristome 119A ~ 119E.
Be provided with the 116A ~ 116D of mounting mat section for mounting electronic parts in the bottom surface of peristome 119A ~ 119D, and connect path 118A ~ 118D.Reached (b) as can be known by Fig. 5 (a), the 116A ~ 116D of mounting mat section utilizes plated film 114 to be electrically connected respectively with perforation path 118A ~ 118D.In addition, be provided with the 116E of mounting mat section in the bottom surface of peristome 119E, but the perforation path is not set.The 116E of this mounting mat section is used for engaging with the empty pin of electronic unit sometimes.Empty pin also is not used in actual signal conduction, but is used for remaining on the depth of parallelism of the electronic unit that the printed wiring board upper surface installs.
In addition, at the plated film 114 that peristome 119A ~ expose the 119E bottom surface, in order to improve solder wettability, implemented the surface treatment of gold-plated grade.
Next the cross-sectional configuration of multilayer printed-wiring board 120 described.
Shown in Fig. 5 (b), multilayer printed-wiring board 120 take via adhesive layer 109 multilayer circuit base material that two circuit base materials circuit base material 108 and the circuit base material 113 of coverlay (namely with) are bonding as essential structure.
Here, be by polyimide film 106(for example to paste at the back side of circuit base material 104 with the circuit base material 108 of coverlay, 12 μ m are thick) and adhesive layer 105(formed thereon is for example, 15 μ m are thick) coverlay 107 that consists of forms.Adhesive layer 105 is formed by for example propylene class or epoxies binding agent.
Circuit base material 104 processes as follows: at the flexible dielectric base material 101(thick polyimide film of 25 μ m for example) two-sidedly have Copper Foil 102 and 103(respectively for for example 12 μ m are thick) double-side copper-applying foil laminate plate, make with the light processing method Copper Foil be processed into set pattern.In addition, in the light processing method, form the photoresist layer, form the resist pattern on the Copper Foil by exposing and being developed in, thereafter, carry out the etching of Copper Foil take this resist pattern as mask, thereby form the Copper Foil (circuit pattern) with set pattern.
Circuit base material 113 processes as follows: the two-sided double-side copper-applying foil laminate plate with Copper Foil 111 and 112 at flexible dielectric base material 110 makes with the light processing method Copper Foil is processed into set pattern.
The perforation path 118A ~ 118D of multilayer printed-wiring board 120, form the perforation hole that through-thickness connects at both allocations of above-mentioned multilayer circuit base material, and by this being connected hole implements that conductive treatment and electrolytic copper plating are processed and the plated film 114(that forms for example 8 μ m are thick) formation.Connecting path 118A ~ 118D works as the interlayer conductive path that is electrically connected each layer wiring.In addition, connecting the hole utilizes NC Drilling operation etc. to form for example size of Φ 150 μ m.
The below uses Fig. 6 A and Fig. 6 B, to the method that electronic unit carries out installing on the surface being described on above-mentioned multilayer printed-wiring board 120 according to prior art.Fig. 6 A and Fig. 6 B are the operation end-views for the method for surface mounting of explanation electronic unit.
(1) at first, prepare the metallograph (metal mask) 130 that solder printing is used.Metallograph 130 have with the 116A of mounting mat section of multilayer printed-wiring board 120 ~ 116E respectively corresponding a plurality of peristomes 131,131 ...
Then, such as Fig. 6 A(1) shown in, with the peristome 131,131 of metallograph 130 ... with the 116A of mounting mat section of multilayer printed-wiring board 120 ~ 116E overlapping mode respectively, settle metallographs 130 at multilayer printed-wiring board 120.
(2) then, such as Fig. 6 A(2) shown in, pile up welding paste 140 rear slip scrapers 150 at metallograph 130, carry out solder printing.Thus, imbed welding paste 140 in the inside of the peristome 131 of metallograph 130.
(3) then, such as Fig. 6 B(3) shown in, metallograph 130 is unloaded from multilayer printed-wiring board 120.The scolder platform that is consisted of by welding paste thus, (preparation solder layer) 141,141 ... be formed on each 116A ~ 116E of mounting mat section.
(4) then, the electronic unit 160(for preparing to be provided with soldered ball at terminal 161 is CSP for example).Then, after being placed in mode on the scolder platform 141 electronic unit 160 and multilayer printed-wiring board 120 are carried out contraposition with the soldered ball of electronic unit 160, electronic unit 160 is carried on multilayer printed-wiring board 120.
The multilayer printed-wiring board 120 that carried electronic unit 160 carried out heat treated (reflow process) (5) thereafter.Thus, such as Fig. 6 B(4) shown in, utilize the welding paste of scolder platform 141 and the soldered ball of electronic unit 160 to melt the solder bonds section 142 that forms, electronic unit 160 is bonded on the 116A ~ 116E of mounting mat section.
Then, describe the problem of above-mentioned prior art in detail, that is, this problem of mounting mat section can not be set in that the perforation path 118A ~ 118D with the multilayer printed-wiring board 120 that connects path is upper.
By above-mentioned surperficial installation procedure as can be known, arrange in the situation of mounting mat section directly over connecting path, the scolder that melts in reflow process will flow in the through hole that connects path.Consequently, the amount of solder of solder bonds section is not enough, thereby produces the anxiety of bad connection.Further, because the amount of solder that flows into is different to each through hole, so produce electronic unit can not be kept the depth of parallelism with respect to the multilayer printed-wiring board inclination anxiety.Such problem is not limited only to the structure of multilayer printed-wiring board 120, has any printed wiring board that connects path and all may occur.
For the foregoing reasons, though the mounting mat section of printed wiring board in the past general sacrifice packing density also can avoid connecting path directly over arrange.
In addition, proposed directly over connecting path, electronic unit to be carried out the method (patent documentation 1) that install on the surface in the past.In the method, at first, the mounting mat section (solder pads 12) directly over perforation path (through hole 17 that is plated) prints soldering paste.Next, carry out heat treated, the soldering paste of fusing is introduced in the through hole that connects path, and it is solidified in through hole.Repeatedly carry out this preparation scolder operation, make in the through hole and filled by scolder fully.Next, after making the mounting mat portion flattening, mounting electronic parts.
The problem of the method is, needs repeatedly to prepare the scolder operation before mounting electronic parts, and operation is miscellaneous, and productivity ratio is low.And, because to printed wiring board cause thermal side repeatedly, thus will have produce various bad (connect crack, the insulating resin of path expansion, peel off etc.) anxiety.
In addition, in recent years, the situation of using lead-free solder although consider environmental problem is increasing, and it is relatively poor that lead-free solder and eutectic solder are compared wetability.Therefore, in the situation of using lead-free solder, it is in fact very difficult that scolder is filled in all through holes equably.
Also having to consider to use as other method of surface mounting has end path.For example in the patent documentation 2, disclose possess end path is arranged (blind via hole 30), can carry out the assembly type multilayer printed-wiring board of high-density installation.In the situation that end path is arranged because scolder do not flow out, so directly over blind via hole 30 mounting electronic parts, can be than being easier to.
Yet, in the manufacturing of assembly type multilayer printed-wiring board, generally speaking, need a lot of man-hour and material.And, need to be formed with end path by the laser processing that requires detailed condition to set, be difficult to by formation such as NC Drilling operations.
As mentioned above, all the time, need a kind ofly to take into account productivity ratio and reliability, and can carry out the method that electronic unit is installed being arranged at the mounting mat section that connects directly over the path.
The prior art document
Patent documentation
Patent documentation 1: JP 7-112109 communique
Patent documentation 2: TOHKEMY 2004-200260 communique.
Summary of the invention
The present invention is based on the understanding of above-mentioned technology is made, its purpose is, provide in a kind of situation not damaging productivity ratio and reliability, electronic unit is carried out the method that install on the surface being arranged in the mounting mat section that connects directly over the path, and the printed circuit board (PCB) that uses the method to make.
According to a kind of mode of the present invention, a kind of method of surface mounting of electronic unit is provided, in the mounting mat section that is arranged at directly over the perforation path of printed wiring board electronic unit being carried out the surface installs, it is characterized in that, the lid that covers the through hole of described perforation path is placed in the described mounting mat section, form the scolder platform of burying described lid underground in described mounting mat section by carrying out solder printing, with the connecting portion of described electronic unit be placed in mode on the described scolder platform with described electro part carrying on described printed wiring board, and the described printed wiring board that has carried described electronic unit carried out heat treated.
According to another kind of mode of the present invention, a kind of printed circuit board (PCB) is provided, it is characterized in that having: the printed wiring board that carries out the perforation path of interlayer connection; Solder bonds section, be arranged at described perforation path through hole directly over; Lid covers the through hole of described perforation path and is embedded in the described solder bonds section; And electronic unit, be installed on described printed wiring board via described solder bonds section.
According to these features, the present invention has following effect.
Settle the lid that covers the through hole that connects path at the through hole that connects path, form the scolder platform (preparation solder layer) of burying described lid underground.Thus, when reflow process, because lid has clogged through hole, so that the scolder of fusing does not flow in the through hole.Therefore, can not reduce owing to consist of the amount of solder at junction surface, so not only improved the reliability of solder bonds section, can keep electronic unit with respect to the depth of parallelism of printed wiring board yet.
Description of drawings
Fig. 1 is the operation end-view for the manufacture method that the multilayer printed-wiring board that has mounting mat section directly over the perforation path is described;
Fig. 2 (a) is the plane graph that is provided with the printed wiring board of mounting mat section directly over the perforation path, (b) is the end-view along the A-A ' line of (a);
Fig. 3 A is the end face key diagram of operation of method of surface mounting that the electronic unit of embodiments of the present invention is shown;
Then Fig. 3 A, Fig. 3 B are the end face key diagrams of operation of method of surface mounting that the electronic unit of embodiments of the present invention is shown;
Then Fig. 3 B, Fig. 3 C are the end face key diagrams of operation of method of surface mounting that the electronic unit of embodiments of the present invention is shown;
Fig. 4 is the end face key diagram at the printed wiring board of the lid of through hole arrangement variation;
Fig. 5 (a) is the plane graph with the printed wiring board that leaves the mounting mat section that connects channel setting, (b) is the end-view along the A-A ' line of (a);
Fig. 6 A is the operation end-view that the method for surface mounting of the electronic unit that adopts prior art is shown;
Follow Fig. 6 A, Fig. 6 B is the operation end-view that the method for surface mounting of the electronic unit that adopts prior art is shown.
The drawing reference numeral explanation
1A, 1B, 101,110 flexible dielectric base materials; 2A, 2B, 3A, 3B, 102,103,111,112 Copper Foils; 4A, 4B, 104,113 circuit base materials; 5,107 coverlays; The 5a dielectric film; 5b, 109 adhesive layers; 6, the 108 circuit base materials with coverlay; 7,105 adhesive layers; 8 stacked circuit base materials; 9 connect the hole; 10,114 plated films; 11 connect path; 12A, 12B outer circuit pattern; 13,115 photoresistance welding flux layers; 14 mounting mat sections; 15 peristomes; 16,120 multilayer printed-wiring boards; 20,130 metallographs (metal mask); 21,131 peristomes; 30,30A, 30B, 30C lid; The 30C1 disc; The 30C2 column; 40,150 scrapers; 50,140 welding pastes; 51,141 scolder platforms (preparation solder layer); 52,142 solder bonds sections; 60,160 electronic units; 61,161 terminals; 70 multilayer boards; 106 polyimide films; 116A, 116B, 116C, 116D, 116E mounting mat section; 118A, 118B, 118C, 118D connect path; 119A, 119B, 119C, 119D, 119E peristome.
Embodiment
Below, with reference to accompanying drawing embodiments of the present invention are described.In addition, the structural element that has same function among each figure uses identical label, can repeatedly not describe in detail for the structural element of same numeral.
At first, in conjunction with Fig. 1 the manufacture method that is provided with mounting mat section multilayer flexible printed wiring plate directly over the perforation path is described.
(1) prepare the thick polyimide film of 25 μ m for example at flexible dielectric base material 1A() two-sidedly have Copper Foil 2A and Copper Foil 3A(for example is that 12 μ m are thick separately) the flexibility double face copper clad panel.And, shown in Fig. 1 (1), make and use the light processing method, Copper Foil 2A is processed into set circuit pattern, make the circuit base material 4A of assembling usefulness.
(2) then, prepare the thick polyimide film of 25 μ m for example at flexible dielectric base material 1B() two-sidedly have Copper Foil 2B and Copper Foil 3B(for example is that 12 μ m are thick separately) the flexibility double face copper clad panel.And, use the light processing method identical with the situation of circuit base material 4A, Copper Foil 3B is processed into set circuit pattern, shop drawings 1(2) shown in assembling electricity consumption roadbed material 4B.
(3) then, by Fig. 1 (3) as can be known, at the bonding coverlay 5 in the back side of circuit base material 4B (downside among the figure), make the circuit base material 6 with coverlay.This coverlay 5 is at the dielectric film 5a(thick polyimide film of 12 μ m for example) for example 15 μ m are thick to form the adhesive layer 5b(that the binding material by propylene class or epoxies consists of) form.
(4) then, shown in Fig. 1 (3), circuit base material 4A carried out contraposition with circuit base material 6 with coverlay after, stacked via the bonding material layer 7 that the binding material by propylene class or epoxies consists of, make stacked circuit base material 8.
(5) then, shown in Fig. 1 (4), utilize the NC Drilling operation to form perforation hole 9(Φ 150 μ m at both allocations of stacked circuit base material 8).In addition, the diameter that connects hole 9 need to be considered to connect hole 9 and determine with the balance of the shape of the connecting portion of the electronic unit that carries.Generally speaking, processing cost can uprise easily in the little situation in aperture, on the other hand, in the large situation in aperture, can affect the setting height(from bottom) of the electronic unit that after this carries.Therefore, the diameter that connects hole 9 is set as in the scope of 100 ~ 300 μ m for example.
In addition, connect hole 9 and be not limited to the NC Drilling operation, also can be formed by the laser processing of adopting various laser (UV-YAG laser, carbonic acid laser, excimer laser etc.).
(6) follow, by Fig. 1 (5) as can be known, after connecting hole 9 enforcement conductive treatments, by the skin of enforcement electrolytic copper plating processing at multilayer circuit base material 8, for example 8 μ m are thick to reach the inwall formation plated film 10(that connects hole 9).Thus, obtain carrying out the perforation path 11 that interlayer connects.
(7) then, make and use the light processing method, multilayer circuit base material 8 outer field conducting films (Copper Foil+plated film) are processed into set pattern, at two-sided formation outer circuit pattern 12A and the 12B of multilayer circuit base material 8.
In addition, the photoresist that in the light processing method of this operation, uses, the preferred use has the dry film photoresist that can cover the thickness (for example 20 μ m are thick) that connects hole 9.In addition, even if use aqueous resist or electricity to adhere to resist, also can protect to connect path 11.
(8) then, shown in Fig. 1 (5), form photoresistance welding flux layer 13 in the zone that needs insulation protection.Photoresistance welding flux layer 13 be formed on the bottom surface expose the 14(of mounting mat section comprise connect path 11) peristome 15.
, the plated film 10 that at peristome 15 expose implemented gold-plated wait surface treatment, and carry out sharp processing, obtain having the multilayer printed-wiring board 16 that connects path thereafter.
Fig. 2 (a) shows the plane graph of the multilayer printed-wiring board 16 of making by said method.Fig. 2 (b) is the end-view along the A-A ' line of Fig. 2 (a).
By Fig. 2 (a) and Fig. 2 (b) as can be known, the mounting mat section 14 of multilayer printed-wiring board 16 is arranged on and connects directly over the path 11.Thus, compare with above-mentioned multilayer printed-wiring board 120, the configuration density of the mounting mat section of multilayer printed-wiring board 16 improves, and can tackle the situation of high-density installation.
Then, in conjunction with Fig. 3 A to Fig. 3 C the method for electronic unit being carried out installing on the surface on this multilayer printed-wiring board 16 is described.
(1) at first, prepare the metallograph (metal mask) 20 that solder printing is used.Metallograph 20 have with the mounting mat section 14,14 of multilayer printed-wiring board 16 ... the peristome 21,21 of difference correspondence ...
And, such as Fig. 3 A(1) shown in, with the peristome 21,21 of metallograph 20 ... with the mounting mat section 14,14 of multilayer printed-wiring board 16 ... overlapping mode is settled metallograph 20 at multilayer printed-wiring board 16 respectively.
In addition, the peristome 21 of metallograph 20 forms the size that can pass through a lid about 30 described later.That is, the diameter of peristome 21 is larger than the diameter of spherical lid 30.Meanwhile, in order to prevent putting into two lids 30 in 1 peristome 21, preferably 2 times of not enough lid 30 diameters of the diameter of peristome 21.
(2) then, such as Fig. 3 A(2) shown in, the mode that covers the through hole that connects path 11 with the spherical lid 30 that is made of metal is settled lid 30 in each mounting mat section 14.
More specifically, metallograph 20 pile up a plurality of lids 30,30 ... after, mode with the upper surface of inswept mask 20 is slided scraper 40, so that lid 30 one by one falls into the peristome 21 of mask 20 is inner and mode that clog the through hole that connects path 11 is settled.Then, fix lid 30 by carrying out air adsorption from perforation path 11 lower side.
In addition, the diameter of lid 30 is set to the value than large 10 ~ 20 μ m of diameter (about 130 μ m) that connect path 11.In order to ensure the depth of parallelism of electronic unit, preferably make the size (diameter) of lid 30 unanimously be fixed value.
(3) then, such as Fig. 3 B(3) shown in, after metallograph 20 is piled up welding paste 50, make scraper 40 slips and carry out solder printing.Thus, welding paste 50 is imbedded the inside of the peristome 21 of metallograph 20, and the lids 30 in the peristome 21 are embedded in the welding paste 50 and are fixed.
(4) then, such as Fig. 3 B(4) shown in, metallograph 20 is unloaded from multilayer printed-wiring board 16.Thus, be embedded with lid 30 scolder platform (preparation solder layer) 51,51 ... each mounting mat section 14,14 ... upper formation.
(5) then, the electronic unit 60(of preparation surface installation usefulness is CSP for example), the connecting portion (terminal 61 of electronic unit 60, or the soldered ball that arranges on the terminal 61) of this electronic unit 60 is placed on the scolder platform 51, electronic unit 60 and multilayer printed-wiring board 16 are carried out contraposition.Electronic unit 60 be equipped on multilayer printed-wiring board 16 on thereafter.
(6) then, the multilayer printed-wiring board 16 that has carried electronic unit 60 is carried out heat treated (reflow process).Thus, such as Fig. 3 C(5) shown in, the welding paste of scolder platform 51 melts and formation solder bonds section 52.Utilize this solder bonds section 52, electronic unit 60 is engaged in the mounting mat section 14 of multilayer printed-wiring board 16.
In this operation, owing to the lid of lid 30 as the through hole that connects path 11 works, so the scolder of fusing can not flow into through hole.Thus, can not reduce owing to consist of the amount of solder of solder bonds section 52, thus the Reliability Enhancement of solder bonds section 52, and can keep electronic unit 60 with respect to the depth of parallelism of printed wiring board 16.
Further, lid 30 is spheroids, because fixing height is formed on its top, so the setting height(from bottom) of electronic unit 60 (balance) is stable, can more guarantee the depth of parallelism.
Through above-mentioned operation, can access be arranged at connect path 11 directly over mounting mat section 14 multilayer board 70 of electronic unit 60 has been installed.
Such as Fig. 3 C(5) shown in, multilayer board 70 across be arranged at the through hole that connects path 11 directly over solder bonds section 52 and have the electronic unit 60 that is installed on multilayer printed-wiring board 16.In addition, lid 30 is embedded in the solder bonds section 52, clogs the through hole that connects path 11.
As described above, according to present embodiment, in the situation of not damaging productivity ratio and reliability, can be arranged at connect path 11 directly over mounting mat section on electronic unit is carried out surface installation.In addition, according to present embodiment, can provide electronic unit, solder bonds section reliability height and the good printed circuit board (PCB) of the electronic unit depth of parallelism that narrow-pitch is installed.
In addition, in the above description, although the material of lid 30 is used metal, the present invention is not limited to this.That is, the material lost so long as can not melt in reflow process as the function of lid of the material of lid 30 gets final product.Therefore, also can be the insulator of resin etc.But from the viewpoint of solder wettability, the surface of preferred lid is metal.Therefore, as lid, also can use the nucleome enforcement electroplating processes that is consisted of by resin and the resin core that has formed conductive film (for example Ni/Au coating) on the surface.
In addition, for the printed wiring board of electronic unit (printed circuit board (PCB)) buffering effect of stress is being installed, the thermal coefficient of expansion that also can establish the material of lid is the numerical value between the thermal coefficient of expansion of the thermal coefficient of expansion of electronic unit and printed wiring board.Have the resin of such thermal coefficient of expansion by use as the material of lid 30, can utilize the elasticity of resin to cushion because the stress that the electronic unit 60 of installing and the thermal expansion difference between the multilayer printed-wiring board 16 produce.
In addition, as long as lid 30 becomes on the perforation path of mounting mat section directly over being arranged at it, do not need to be arranged on the perforation path that does not become mounting mat section directly over it and arrange.Like this, at needs position configuration lid, can make manufacturing process more economical by only.
In addition, in above-mentioned explanation, although lid 30 be shaped as spheroid, the present invention is not limited to this.That is, the shape of lid 30 as long as can cover the through hole that connects path, for example, also can be that oval spherical lid 30A(is with reference to Fig. 4 (a)), or the lid 30B(of disc-shape is with reference to Fig. 4 (b)).
In addition, identical with the spheroid situation, as the shape that more can guarantee the depth of parallelism of electronic unit, also can use by the disc 30C1 that covers through hole and (with reference to Fig. 4 (c)) lid 30C of consisting of with the column 30C2 of this disc 30C1 quadrature.In this case, the length of column 30C2 is preferably greater than the diameter of peristome 15.
In addition, the installation method of electronic unit of the present invention is not limited to above-mentioned multilayer printed-wiring board 16, can be applicable to have any printed wiring board that is provided with mounting mat section structure directly over the perforation path.
Based on above-mentioned record, those skilled in the art may can both expect additional effect of the present invention and various distortion, but mode of the present invention is not limited to above-mentioned execution mode.In the scope that does not break away from the conceptual thought of the present invention that derives from content and the equivalent thereof of the scope defined of patent request, aim, various additional, changes and part deletion are all possible.
Claims (15)
1. the method for surface mounting of an electronic unit carries out the surface to electronic unit and installs in the mounting mat section directly over the perforation path that is arranged at printed wiring board, it is characterized in that,
The lid that covers the through hole of described perforation path is placed in described mounting mat section,
Form the scolder platform of burying described lid underground by carrying out solder printing in described mounting mat section,
With the connecting portion of described electronic unit be placed in mode on the described scolder platform with described electro part carrying on described printed wiring board, and
The described printed wiring board that is equipped with described electronic unit is carried out heat treated.
2. the method for surface mounting of electronic unit as claimed in claim 1 is characterized in that, being shaped as of described lid be spherical, oval spherical, discoid or by disc and the shape that consists of with the column of described disc quadrature.
3. the method for surface mounting of electronic unit as claimed in claim 2 is characterized in that, described lid is made of the material that does not melt because of described heat treated.
4. the method for surface mounting of electronic unit as claimed in claim 3 is characterized in that, described lid is made of the resin that metal, resin or surface have conductive film.
5. the method for surface mounting of electronic unit as claimed in claim 3 is characterized in that, the thermal coefficient of expansion of described lid is the value between the thermal coefficient of expansion of the thermal coefficient of expansion of described electronic unit and described printed wiring board.
6. the method for surface mounting of electronic unit as claimed in claim 2 is characterized in that, after described lid being placed in described mounting mat section, fixes described lid by carrying out air adsorption from the lower side of described perforation path.
7. the method for surface mounting of electronic unit as claimed in claim 1 is characterized in that, described lid is made of the material that does not melt because of described heat treated.
8. the method for surface mounting of electronic unit as claimed in claim 1 is characterized in that, after described lid being placed in described mounting mat section, fixes described lid by carrying out air adsorption from the lower side of described perforation path.
9. the method for surface mounting of electronic unit as claimed in claim 1 is characterized in that,
Described solder printing,
The metallograph that will have the peristome corresponding with described mounting mat section, the mode overlapping with described peristome and described mounting mat section is placed on the described printed wiring board,
Mode with the upper surface of inswept described metallograph is slided scraper, will imbed at the welding paste that described metallograph is piled up the described peristome of described metallograph, and
Described metallograph is unloaded from described printed wiring board.
10. printed circuit board (PCB) is characterized in that having:
Printed wiring board with the perforation path that carries out the interlayer connection,
Solder bonds section, be arranged at described perforation path through hole directly over,
Lid covers the through hole of described perforation path and buries underground in described solder bonds section, and
Electronic unit is installed on described printed wiring board across described solder bonds section.
11. printed circuit board (PCB) as claimed in claim 10 is characterized in that, being shaped as of described lid be spherical, oval spherical, discoid or by disc and the shape that consists of with the column of described disc quadrature.
12. the method for surface mounting of electronic unit as claimed in claim 11 is characterized in that, described lid is made of the resin that metal, resin or surface have conductive film.
13. the method for surface mounting of electronic unit as claimed in claim 10 is characterized in that, described lid is made of the resin that metal, resin or surface have conductive film.
14. the method for surface mounting of electronic unit as claimed in claim 10 is characterized in that, the thermal coefficient of expansion of described lid is the value between the thermal coefficient of expansion of the thermal coefficient of expansion of described electronic unit and described printed wiring board.
15. the method for surface mounting of electronic unit as claimed in claim 10 is characterized in that, described printed wiring board is the flexible printing wiring board take flexible insulation film as base material.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-139271 | 2010-06-18 | ||
| JP2010139271A JP5389748B2 (en) | 2010-06-18 | 2010-06-18 | Electronic component surface mounting method and printed circuit board manufactured using the method |
| PCT/JP2011/051456 WO2011158524A1 (en) | 2010-06-18 | 2011-01-26 | Surface mounting method for electronic components and printed circuit boards manufactured using said method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103039130A true CN103039130A (en) | 2013-04-10 |
| CN103039130B CN103039130B (en) | 2015-06-24 |
Family
ID=45347938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180022028.XA Active CN103039130B (en) | 2010-06-18 | 2011-01-26 | Surface mounting method for electronic components and printed circuit boards manufactured using said method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5389748B2 (en) |
| CN (1) | CN103039130B (en) |
| TW (1) | TWI498068B (en) |
| WO (1) | WO2011158524A1 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5275330A (en) * | 1993-04-12 | 1994-01-04 | International Business Machines Corp. | Solder ball connect pad-on-via assembly process |
| CN1245007A (en) * | 1997-01-16 | 2000-02-16 | 福特环球技术公司 | Optimized solder joints for surface mount chips |
| US6199273B1 (en) * | 1995-12-19 | 2001-03-13 | Sumitomo Metal Industries, Ltd. | Method of forming connector structure for a ball-grid array |
| CN1759642A (en) * | 2003-03-10 | 2006-04-12 | 日立金属株式会社 | Method and device for mounting conductive ball |
| US20070090171A1 (en) * | 2005-10-25 | 2007-04-26 | Fujitsu Limited | Method for manufacturing a printed circuit board for electronic devices and an electronic device using the same |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI413471B (en) * | 2006-01-27 | 2013-10-21 | Ibiden Co Ltd | Method and device for mounting solder ball |
| JP5024009B2 (en) * | 2007-12-10 | 2012-09-12 | 日本電気株式会社 | Electronic circuit mounting method and mounting structure |
-
2010
- 2010-06-18 JP JP2010139271A patent/JP5389748B2/en active Active
-
2011
- 2011-01-26 CN CN201180022028.XA patent/CN103039130B/en active Active
- 2011-01-26 WO PCT/JP2011/051456 patent/WO2011158524A1/en active Application Filing
- 2011-06-17 TW TW100121240A patent/TWI498068B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5275330A (en) * | 1993-04-12 | 1994-01-04 | International Business Machines Corp. | Solder ball connect pad-on-via assembly process |
| US6199273B1 (en) * | 1995-12-19 | 2001-03-13 | Sumitomo Metal Industries, Ltd. | Method of forming connector structure for a ball-grid array |
| CN1245007A (en) * | 1997-01-16 | 2000-02-16 | 福特环球技术公司 | Optimized solder joints for surface mount chips |
| CN1759642A (en) * | 2003-03-10 | 2006-04-12 | 日立金属株式会社 | Method and device for mounting conductive ball |
| US20070090171A1 (en) * | 2005-10-25 | 2007-04-26 | Fujitsu Limited | Method for manufacturing a printed circuit board for electronic devices and an electronic device using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5389748B2 (en) | 2014-01-15 |
| TWI498068B (en) | 2015-08-21 |
| TW201221003A (en) | 2012-05-16 |
| WO2011158524A1 (en) | 2011-12-22 |
| JP2012004418A (en) | 2012-01-05 |
| CN103039130B (en) | 2015-06-24 |
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