CN103034895A - Novel mobile phone sticking outside integrated circuit (IC) card and manufacture method thereof - Google Patents
Novel mobile phone sticking outside integrated circuit (IC) card and manufacture method thereof Download PDFInfo
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- CN103034895A CN103034895A CN 201110303839 CN201110303839A CN103034895A CN 103034895 A CN103034895 A CN 103034895A CN 201110303839 CN201110303839 CN 201110303839 CN 201110303839 A CN201110303839 A CN 201110303839A CN 103034895 A CN103034895 A CN 103034895A
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- mobile phone
- card
- circuit board
- toroid winding
- antenna circuit
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Abstract
The invention provides a mobile phone sticking outside IC card which is stuck on the surface of a mobile phone and forms an integral whole with the mobile phone to achieve a micro-payment function. The mobile phone sticking outside IC card comprises an IC card which is stuck on the surface of the mobile phone. The IC card comprises a plastic protective layer, a printed circuit board (PCB) antenna circuit board, and a wave-absorbing material layer, wherein an IC chip is welded on the PCB antenna circuit board to form a radio-frequency circuit. The mobile phone sticking outside IC card is convenient to carry in the condition that the mobile phone is carried by a user, and the user can enjoy convenience brought by the micro-payment any time any where. The radio-frequency circuit is made of PCB with a certain thickness and can be used in any environment, and therefore the universality and stability of the IC card are effectively improved. The wave-absorbing material layer is adopted to be as shielding materials, the anti-metal effect and the mobile phone anti-interference effect of the IC card can be effectively achieved.
Description
Technical field
The present invention relates to a kind of IC-card, especially a kind of mobile phone pastes IC-card and preparation method thereof outward.
Background technology
Along with the development of radio-frequency (RF) IC card technology, realize that by mobile phone binding mass transit card small amount payment also just arises at the historic moment.How mass transit card and mobile phone are bundled, the mode that the telecom operators such as present China Mobile adopt is that NFC (short-range communication) chip and SIM card are merged, and realizes the several functions such as E-Payment and data download.The difficult problem that this scheme need to be captured comprises how allowing the chip signal that merges in SIM cards of mobile phones spread out of through battery, metal shell, thereby really realizes mobile phone card-brushing.And to realize that mobile phone NFC communication at first wants the user to change SIM card, and reconfigure card reader at all consumption terminals, the cost of each card reader is 3000 yuan at present, and the cost of each New type of S IM card is at 50 to 100 yuan; This scheme is unacceptable to each consumer or businessman undoubtedly; Therefore the popularization for the NFC scheme has also formed very large resistance.
Summary of the invention
The invention provides a kind of mobile phone and paste IC-card and preparation method thereof outward, IC-card is pasted on the mobile phone surface, form an integral body with mobile phone, to realize the function of small amount payment.
A kind of mobile phone of realizing the object of the invention pastes IC-card and preparation method thereof outward, comprises and pasting at the lip-deep IC-card of mobile phone, and described IC-card comprises plastic cement protective seam, PCB antenna circuit board and absorbing material layer from outside to inside successively; Be welded with the IC chip on the PCB antenna circuit board, form a radio circuit.Described absorbing material layer can shield the electromagnetic interference (EMI) of mobile phone.
The inboard of described absorbing material layer is provided with one deck tack coat, is used for IC-card is pasted on the mobile phone surface.
Described absorbing material layer is ferrite layer.
Be provided with pattern printed layers between described plastic cement protective seam and the PCB antenna circuit board, be used for arranging pattern attractive in appearance or advertising pattern.
Described PCB antenna circuit board is provided with two-sided etched toroid winding, two-sided toroid winding connected, and soldering surface mounted electric capacity on described toroid winding, described IC chips welding is at the toroid winding two ends that connect, thus the formation radio frequency integrated circuit.Connect the power that patch capacitor is used for strengthening inductive coil, thereby the reading/writing distance of IC-card is provided, reduce the shape size of IC-card antenna circuit board.
The beneficial effect that a kind of mobile phone of the present invention pastes IC-card outward is as follows:
1, the present invention is easy to carry as long as mobile phone at one's side, just can be enjoyed convenient that small amount payment brings whenever and wherever possible.
2, radio circuit of the present invention is to adopt to have certain thickness PCB antenna circuit board to make, and can use under any environmental baseline; Thereby popularity and stability that IC-card uses have effectively been promoted.
3, the present invention adopts absorbing material (ferrite) as shielding material, can effectively realize the anti-metal of IC-card and the effect that anti-mobile phone disturbs.
Description of drawings
Fig. 1 is the structural representation that a kind of mobile phone of the present invention pastes IC-card outward.
Embodiment
As shown in Figure 1, a kind of mobile phone of the present invention pastes IC-card and preparation method thereof outward, comprises the IC-card of pasting on mobile phone surface 5, and described IC-card comprises plastic cement protective seam 4, PCB antenna circuit board 2 and absorbing material layer 1 from outside to inside successively; Be welded with the IC chip on the PCB antenna circuit board 2, form a radio circuit.Described absorbing material layer 1 can shield the electromagnetic interference (EMI) of mobile phone.The inboard of described absorbing material layer 1 is provided with one deck tack coat, is used for IC-card is pasted on mobile phone surface 5.Be provided with pattern printed layers 3 between described plastic cement protective seam 4 and the PCB antenna circuit board 2, be used for arranging pattern attractive in appearance or advertising pattern.
Described PCB antenna circuit board 2 is provided with two-sided etched toroid winding, two-sided toroid winding connected, and soldering surface mounted electric capacity on described toroid winding, described IC chips welding is at the toroid winding two ends that connect, thus the formation radio frequency integrated circuit.Connect the power that patch capacitor is used for strengthening inductive coil, thereby the reading/writing distance of IC-card is provided, reduce the shape size of IC-card antenna circuit board.
Can select according to actual needs the absorbing material layer 1 of respective thickness, and it is cut into needed shape, can be square, rectangle or circle.
Pattern printed layers 3 is used PET, PE, PVC or the needed pattern of halftone paper printing.
A kind of mobile phone of the present invention pastes IC-card outward, only needs IC-card is pasted the function that realizes small amount payment on the mobile phone surface; So both solved the Card Reader problem because disturbed by mobile phone electromagnetic wave and metal shell, the consumer does not need to change any accessory in the mobile phone simultaneously, and consumption terminal does not need card reader is reconfigured yet; And this mobile phone pastes outward that the IC-card manufacture craft is simple, and keyfob card and cell phone ornamental card that volume ratio own is common are little, can not have influence on the outward appearance of mobile phone, and easy to carry, as long as carrying mobile phone just can in all case be realized small amount payment.
Embodiment recited above is described preferred implementation of the present invention; be not that scope of the present invention is limited; design under the spiritual prerequisite not breaking away from the present invention; various distortion and improvement that the common engineering technical personnel in this area make technical solution of the present invention all should fall in the definite protection domain of claims of the present invention.
Claims (6)
1. Novel IC card adhered on surface of mobile phone and preparation method thereof, it is characterized in that: comprise and pasting at the lip-deep IC-card of mobile phone, described IC-card comprises plastic cement protective seam, PCB antenna circuit board and absorbing material layer from outside to inside successively; Be welded with the IC chip on the described PCB antenna circuit board, form a radio circuit.
2. Novel IC card adhered on surface of mobile phone according to claim 1 and preparation method thereof, it is characterized in that: the inboard of described absorbing material layer is provided with one deck tack coat.
3. Novel IC card adhered on surface of mobile phone according to claim 1 and preparation method thereof, it is characterized in that: described absorbing material layer is ferrite layer.
4. arbitrary described Novel IC card adhered on surface of mobile phone and preparation method thereof is characterized in that: be provided with pattern printed layers between described plastic cement protective seam and the PCB antenna circuit board according to claim 1-3.
5. arbitrary described Novel IC card adhered on surface of mobile phone and preparation method thereof according to claim 1-3, it is characterized in that: described PCB antenna circuit board is provided with two-sided etched toroid winding, two-sided toroid winding is connected, soldering surface mounted electric capacity on described toroid winding, the toroid winding two ends that described IC chips welding is connecting.
6. Novel IC card adhered on surface of mobile phone according to claim 4 and preparation method thereof, it is characterized in that: described PCB antenna circuit board is provided with two-sided etched toroid winding, two-sided toroid winding is connected, soldering surface mounted electric capacity on described toroid winding, the toroid winding two ends that described IC chips welding is connecting.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 201110303839 CN103034895A (en) | 2011-10-10 | 2011-10-10 | Novel mobile phone sticking outside integrated circuit (IC) card and manufacture method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN 201110303839 CN103034895A (en) | 2011-10-10 | 2011-10-10 | Novel mobile phone sticking outside integrated circuit (IC) card and manufacture method thereof |
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CN103034895A true CN103034895A (en) | 2013-04-10 |
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CN 201110303839 Pending CN103034895A (en) | 2011-10-10 | 2011-10-10 | Novel mobile phone sticking outside integrated circuit (IC) card and manufacture method thereof |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104463312A (en) * | 2014-11-19 | 2015-03-25 | 上海卡美循环技术有限公司 | Intelligent card and mobile terminal battery composite structure |
CN106711593A (en) * | 2015-07-15 | 2017-05-24 | 深圳市安特讯科技有限公司 | Nfc antenna manufacturing method |
-
2011
- 2011-10-10 CN CN 201110303839 patent/CN103034895A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104463312A (en) * | 2014-11-19 | 2015-03-25 | 上海卡美循环技术有限公司 | Intelligent card and mobile terminal battery composite structure |
CN104463312B (en) * | 2014-11-19 | 2018-05-04 | 上海卡美循环技术有限公司 | A kind of composite construction of smart card and battery of mobile terminal |
CN106711593A (en) * | 2015-07-15 | 2017-05-24 | 深圳市安特讯科技有限公司 | Nfc antenna manufacturing method |
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C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130410 |