CN103034357A - Manufacturing method of touch panel - Google Patents
Manufacturing method of touch panel Download PDFInfo
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- CN103034357A CN103034357A CN2012103166175A CN201210316617A CN103034357A CN 103034357 A CN103034357 A CN 103034357A CN 2012103166175 A CN2012103166175 A CN 2012103166175A CN 201210316617 A CN201210316617 A CN 201210316617A CN 103034357 A CN103034357 A CN 103034357A
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- 238000002360 preparation method Methods 0.000 claims abstract description 71
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- 238000000576 coating method Methods 0.000 claims abstract description 63
- 239000011248 coating agent Substances 0.000 claims abstract description 57
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- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 238000001039 wet etching Methods 0.000 claims description 3
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- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 3
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Abstract
A method for manufacturing a touch panel, which forms a conducting wire layer forming a touch image on a substrate, comprises the following steps: forming a wire preparation layer on the substrate by using a conductive material; (b) coating a light-shielding preparation layer made of a material having a lower reflectance than that of the wire preparation layer on the wire preparation layer; (c) exposing and developing a mask with a touch image to form a light shielding layer on the light shielding preparation layer; and (d) using the light-shielding layer as a mask of the conducting wire preparation layer, and etching and removing the uncovered area of the conducting wire preparation layer to form the conducting wire layer with the touch image. The invention uses only one lithography process and the formed light-shielding layer for self-alignment and then etching process to form the conducting wire layer and the light-shielding layer without position error, thereby improving the process yield and reducing the cost of manufacturing materials and time.
Description
Technical field
The present invention relates to a kind of method for making of panel, particularly relate to a kind of method for making of contact panel.
Background technology
Consult Fig. 1 and Fig. 2, general contact panel comprises a substrate 1, and one deck conductor layer 2.
This substrate 1 comprises a base material 11, a plurality ofly has predetermined pattern and take indium tin oxide as main material and be formed at the first nesa coating 12 and the second nesa coating 13 on this base material 11, and a plurality ofly consists of and slabbing and be formed at accordingly the dielectric film 14 on described the first nesa coating 12 surfaces with insulating material.
This conductor layer 2 has a plurality of conducting film pieces 21 that are formed on this insulation course and forms a touch-control pattern, this each conducting film piece 21 is formed on accordingly on each dielectric film 14 and stretches out and be electrically connected with the most adjacent the second nesa coating 13, and borrow the isolated of this dielectric film 14 and with the dielectric film 14 that is connected under the isolated and not conducting of electricity of the first nesa coating 12.
When the external world when described the first nesa coating 12 and the second nesa coating 13 provide electric energy, described dielectric film 14 and the first nesa coating 12 that is connected and the conducting film piece 21 that is electrically connected with the most contiguous the second nesa coating 13 form respectively electric capacity; When pressing this panel, the capacitance at the place of pressing changes and converts electric signal to, and the coordinate that transmits for these touched positions of contact panel of subsequent calculations via this first nesa coating 12 and the second nesa coating 13 of being electrically connected with this conductor layer 2.
Because, this conductor layer 2 is with conductive material--and normally metal or alloy consists of, so when using this contact panel, can be reflective because of this conductor layer 2, cause this conductor layer 2 visual high and easily discovered, and the zone of distribution wires layer 2 is subjected to that reflective to affect light quantity larger in the contact panel, and light quantity is not little relatively in the zone of distribution wires layer 2, and so light quantity is because this conductor layer 2 and skewness also causes the visual discomfort sense when using contact panel.Therefore, be on this conductor layer 2, to make again the light shield layer that one deck in pairs should conductor layer 2 states with the lower material of reflectivity at present, in order to reduce the reflection light quantity of this conductor layer 2, then this conductor layer 2 is difficult for being discovered.
And the method for making that has at present the contact panel of light shield layer is to form the conduction preparation layer that one deck covers this substrate 1 whole surface on this substrate 1; Coating photoresistance and process are soft roasting on this conduction preparation layer again; Then, the light shield that one deck has the touch-control image is set on this photoresistance; Continue, aim at and exposure and make photoresistance become the predetermined touch image through this light shield; The photoresistance that will be covered in through developing again on the non-conduction preparation layer that becomes the touch-control image-region removes, and is hard roasting and harden into the photoresistance of touch-control image again; Continue, etching removes the zone that does not belong to the touch-control image in this conduction preparation layer as shade with the photoresistance that becomes the touch-control image; Remove at last the photoresistance of touch-control image, and become the conductor layer 2 with touch-control image.Afterwards, in this conductor layer 2 and this substrate 1 common surface that forms one deck shading preparation layer is set again; Then, on this shading preparation layer, be coated with photoresistance, use has the light shield of touch-control image and repeats all exposures of above-mentioned making conductor layer 2, development, hard little shadow step such as roasting, and it is same and be linked to light shield layer on this conductor layer 2 to obtain at last state and this conductor layer 2.
With regard to production, the greatest problem of making like this is accurately to use same light shield with touch-control image and the relative exposure process aimed at of conductor layer 2, as long as aim at not good, will be so that formed light shield layer can't fully cover this conductor layer 2, and can't effectively solve the reflective problem that conductor layer 2 produces, in addition, reflectively repeat to be coated with the making steps such as photoresistance, light shield aligning, exposure, development, etching to form the process of light shield layer for reducing, also increase and make material and time cost.
Summary of the invention
The object of the present invention is to provide a kind of method for making with contact panel of low light reflectivity amount.
The method for making of contact panel of the present invention forms a conductor layer that becomes the touch-control image on a substrate, comprise a step (a), a step (b), a step (c) and a step (d).
This step (a) consists of a layer conductor preparation layer with conductive material on this substrate.
The shading preparation layer that this step (b) is made of far below the material of the conductive material that consists of this wire preparation layer reflectivity at this wire preparation layer coating one deck.
This step (c) is used a shade that has corresponding to the pattern of this touch-control image, makes this shading preparation layer form the light shield layer that one deck becomes this touch-control image through overexposure, development and sclerosis.
This step (d) is with the shade of this light shield layer as this wire preparation layer, and etching removes the zone that this wire preparation layer is not covered by this light shield layer, and becomes the conductor layer of this one-tenth touch-control image.
Preferably, the method for making of aforementioned contact panel, wherein, the shading preparation layer of this step (c) is the negative sense photoresistance.
Preferably, the method for making of aforementioned contact panel, wherein, the wire preparation layer of this step (b) is selected from molybdenum, aluminium, titanium, silver, gold, and described one is combined as material and consists of.
Preferably, the method for making of aforementioned contact panel, wherein, the shading preparation layer of this step (c) is black matrix".
Preferably, the method for making of aforementioned contact panel, wherein, the thickness of this light shield layer of this step (c) is not less than 100am.
Preferably, the method for making of aforementioned contact panel, wherein, this step (d) is that the mode with wet etching removes the zone that this wire preparation layer is not covered by this light shield layer.
Preferably, the method for making of aforementioned contact panel, also comprise one in the front step (e) of this step (a), this step (e) is the first nesa coating that into strips a plurality of and each interval are set at a base material first, and a plurality of in twos the second intermembranous nesa coatings of adjacent the first electrically conducting transparent that are positioned at, again in a plurality of each intervals being set on each first nesa coating and being positioned at accordingly dielectric film on the imaginary line of the second nesa coating of these the first nesa coating both sides, and form this substrate, the light shield layer of this step (c) is arranged at the second nesa coating top of this dielectric film and these dielectric film both sides, then the conductor layer of this step (d) by this dielectric film and with this first nesa coating interval, and be electrically connected the second nesa coating of these dielectric film both sides.
Preferably, the method for making of aforementioned contact panel, wherein, the sheet resistance of this conductor layer is less than the sheet resistance of described the first nesa coating and described two nesa coatings.
Beneficial effect of the present invention is: utilize into the light shield layer of touch-control image as the shade of this wire preparation layer, and carry out self-aligned and directly etch this conductor layer, and then make this light shield layer and this conductor layer fully overlapping, to reduce the reflection light quantity of this conductor layer.
In should be understood that within the scope of the present invention, above-mentioned each technical characterictic of the present invention and can making up mutually between specifically described each technical characterictic in below (eg embodiment), thus consist of new or preferred technical scheme.As space is limited, this tired stating no longer one by one.
Description of drawings
Fig. 1 is that the dielectric film that contact panel in the past is described is arranged on the substrate, and one deck conductor layer is arranged at the vertical view on this dielectric film;
Fig. 2 is the cross-sectional schematic that contact panel in the past is described;
Fig. 3 is the cross-sectional schematic of the produced contact panel of explanation preferred embodiment of the present invention;
Fig. 4 is the process flow diagram of a preferred embodiment of the method for making of explanation contact panel of the present invention;
Fig. 5 is step 50 cross-sectional schematic of explanation preferred embodiment of the present invention;
Fig. 6 is step 51 cross-sectional schematic of explanation preferred embodiment of the present invention;
Fig. 7 is step 52 cross-sectional schematic of explanation preferred embodiment of the present invention;
Fig. 8 is step 53 cross-sectional schematic of explanation preferred embodiment of the present invention.
Embodiment
The present invention is described in detail below in conjunction with drawings and Examples:
Consult Fig. 4, the contact panel of a preferred embodiment made of the method for making of contact panel of the present invention is to comprise that shown in Fig. 1,3 substrate 1, an one deck are formed at the conductor layer 2 on this substrate 1 surface, and one deck is formed at this conductor layer 2 away from the light shield layer 3 on this substrate 1 surface.
Consult Fig. 1, Fig. 3, this substrate 1 has a base material 11, a plurality of this base material 11 surfaces and into strips and arrange the first nesa coating 12 in a row, a plurality of the second nesa coating 13 and a plurality of dielectric films 14 that are positioned on each first nesa coating 12 of being formed at.
In more detail, the base material 11 on this substrate 1 is plastic cement soft board or laminar clear glasses of deflection.Described first, second nesa coating 12,13 consists of as main take indium tin oxide usually, but is not limited with indium tin oxide, and the essence equal altitudes be formed at this base material 11 surfaces.Each the first nesa coating 12 has the conducting portion 121 of a plurality of each intervals, and connects the in twos connecting portion 122 of adjacent conducting portion 121.Common described conducting portion 121 diamondwises, but also can be circle, strip, or square, because described conducting portion 121 is not emphasis of the present invention, no longer add to give unnecessary details at this.
Described the second nesa coating 13 is formed at the space of the shape in a row of 12 of two adjacent the first nesa coatings, and is intervally installed; In addition, also corresponding described connecting portion 122 of the position of each the second nesa coating 13.In other words, the connecting portion 122 of each the first nesa coating 12 is positioned on the imaginary line of the second the most contiguous nesa coating 13.The dielectric film 14 of this substrate 1 consists of with insulating material such as monox, silicon nitrides usually, and flakiness shape ground encloses connecting portion 122 surfaces of covering described the first nesa coating 12.
This conductor layer 2 is arranged at this substrate 1 surface, and have most conducting film pieces 21 that connect dielectric film 14 surfaces of these substrates 1, each conducting film piece 21 is arranged at this dielectric film 14 surfaces, and link with the second nesa coating 13 of these dielectric film 14 both sides and be electrically connected, and this conducting film piece 21 is isolated with the first nesa coating 12 under it by this dielectric film 14, then 2 one-tenth touch-control images of this conductor layer.
This light shield layer 3 consists of with the material that absorbs visible light, and be formed at this conductor layer 2 and cover this conductor layer 2 away from the surface of this substrate 1, extraneous light is absorbed for this light shield layer 3, and no longer shine this conductor layer 2, therefore, this light shield layer 3 effectively reduces the probability that this conductor layer 2 is accepted light and reflection ray.
The connecting portion 122 of described the first nesa coating 12, described dielectric film 14, the conducting film piece 21 that reaches described conductor layer 2 match becomes the electric capacity that a plurality of one-tenth matrixes are arranged.When described first and second nesa coating 12,13 and this conductor layer 2 match and when accepting extraneous electric energy, the arbitrary electric capacity of finger presses, this capacitance will produce change, and the capacitance that changes is again via described first and second nesa coating 12,13 and this conductor layer 2 and be sent to extraneous union and go out touch-control in the absolute location coordinates of contact panel.
It should be noted that, because the conducting film piece 21 of this conductor layer 2 is second the most adjacent nesa coatings 13 of both sides of the described dielectric film 14 of cross-over connection, and the sheet resistance of this conductor layer 2 is less than described first and second nesa coating 12,13 sheet resistance, can make the transmission that changes the electric signal that capacitance forms more rapid.
Consult Fig. 3, Fig. 4, the preferred embodiment of the method for making of contact panel of the present invention mainly comprises a step 51 that consists of a layer conductor preparation layer 61 on this substrate 1 with conductive material, the step 52 of a shading preparation layer 62 that is consisted of far below the material of the conductive material that consists of this wire preparation layer 61 by reflectivity at this wire preparation layer 61 coating one decks, one is used a shade that has corresponding to the pattern of this touch-control image, through overexposure, develop and make this shading preparation layer 62 form the step 53 that one deck becomes the light shield layer 3 of this touch-control image with sclerosis, reach one with the shade of this light shield layer 3 as this wire preparation layer 61, etching removes the zone that these wire preparation layer 61 these light shield layers 3 cover, and become the step 54 of the conductor layer 2 of this one-tenth touch-control image, below will go deep into respectively explanation.
In addition, because this preferred embodiment is to make aforementioned capacitance type touch-control panel with light shield layer 3, so in this step 51 is front carries out first a step 50 carrying out, so can more clearly understand the complete manufacturing process of contact panel.
Cooperate and consult Fig. 5, this step 50 be prepare first a deflection the plastic cement soft board as base material 11(but be not limited with the plastic cement soft board), an electrically conducting transparent that covers whole base material 11 surfaces is set on this base material 11 again prepares the film (not shown), and through little shadow, define the pattern of described the first nesa coating 12 and described the second nesa coating 13, and through etching unwanted part is removed again, and this electrically conducting transparent is prepared the state that film production goes out described the first nesa coating 12 and described the second nesa coating 13.Then, again in described first, second nesa coating 12,13 and the surface jointly defined, the exposed zone of this base material 11 on an insulation that covers whole surface be set prepare the film (not shown), and similarly pass through little shadow, define the pattern of described dielectric film 14, and through etching unwanted part is removed again, prepare the state that film production goes out described dielectric film 14 and will insulate.At this moment, formed substrate 1 comprises this base material 11, described first, second nesa coating 12,13, and described dielectric film 14.
Consult Fig. 4 and Fig. 6, come, carry out this step 51, at this substrate 1 deposition one layer conductor preparation layer 61, in this preferred embodiment, the mode that deposits this wire preparation layer 61 is selected from sputter, evaporation, and physics or chemical vapour deposition technique formation.And this wire preparation layer 61 to be being selected from molybdenum, aluminium, titanium, silver, gold, and it described one is combined as material and consists of, and possesses the good characteristic of conduction.
Consult Fig. 4 and Fig. 7, continue, carry out this step 52, one deck shading preparation layer 62 is set on this wire preparation layer 61, especially, in this preferred embodiment, this shading preparation layer 62 is negative sense photoresistances, and the mode of available rotary coating is formed at this wire preparation layer 61 surfaces, carries out soft roasting (soft bake) behind this shading preparation layer 62 of coating again, and this shading preparation layer 62 is comparatively finalized the design.And the degree of the absorption visible light of this shading preparation layer 62 is much larger than these wire preparation layer 61 light absorbing degree, in other words, the reflectivity of this shading preparation layer 62 is far below this wire preparation layer 61, and the shading preparation layer 62 of this preferred embodiment is black matrix" (black matrix), and thickness is not less than 100am.
Consult Fig. 4 and Fig. 8, continue, carry out this step 53, uses a pattern to hard light shield 4 that should the touch-control image, and in this shading preparation layer 62 through aiming at and expose, and define the touch-control image at this shading preparation layer 62; Because this shading preparation layer 62 is the black matrix"s that belong to the negative sense photoresistance, so the part that these hard light shield 4 actual pattern are corresponding touch-control image is hollow out, thus this shading preparation layer 62 after exposure, the zone of corresponding touch-control image is subjected to light and hardens; Then, the making of developing utilizes developer solution only can dissolve not to be subjected to light and the characteristic of unhardened photoresistance will not dissolved by the zone of light in this shading preparation layer 62, stays into the zone that is subjected to photo-hardening of touch-control image, becomes into the light shield layer 3 of this touch pattern; Preferably, if after development, firmly toast again (hard bake), can make this light shield layer 3 interior generation thermal motions, over-exposed with under-exposed molecule is rearranged, to reduce standing wave effect.
It should be noted that, when this shading preparation layer 62 is the eurymeric photoresistance, the part that this hard light shield actual pattern is corresponding non-touch-control image is hollow out, so this shading preparation layer 62 is after exposure, non-corresponding touch-control image-region is dissolved by light and little movie queen, and staying the zone that is not subjected to light, i.e. the part of corresponding touch-control image becomes the light shield layer 3 of this touch pattern.
Consult Fig. 3 and Fig. 4, come, carry out this step 54, the light shield layer 3 that hardens to be subjected to light is as the shade of this wire preparation layer 61, utilize etched mode to remove the zone that is not covered by this light shield layer 3 in this wire preparation layer 61, and make the conductor layer 2 that covered by this light shield layer 3; And preferably, this etching making is to carry out from the single direction of these wire preparation layer 61 past these substrates 1 in the mode of wet etching, and can obtain more accurate touch-control image.
Because the reflectivity of this light shield layer 3 is far below this conductor layer 2, and can effectively absorb the light that comes from the outside.
The present invention sequentially aims at, exposes through light shield 4, and the mode of little shadow, need not make through etching, and directly produce first the light shield layer 3 with touch-control image; Then this wire preparation layer 61 does not need again to pass through the making such as light shield 4 alignings, exposure, development, but directly utilizes this light shield layer 3 as shade, produces this conductor layer 2 with the direct etching of the mode of self-aligned; So the present invention only needs light shield 4 alignings, exposure, development and etching through once, just can produce this state, the position is same and complete overlapping light shield layer 3 and conductor layer 2.
Therefore, first advantage of the present invention be conductor layer 2 that the mode etching with self-aligned makes also can be covered by this light shield layer 3 fully and the position identical, therefore if do not consider that the light shield on this wire preparation layer can't be misplaced causing this light shield layer and this conductor layer, cause the problem that this conductor layer 2 still can extraneous ray of reflecting; Second advantage is to omit one etching to make when making light shield layer 3, and omits the making such as coating photoresistance, light shield aligning, exposure, development and saved photoresistance material, integral manufacturing panel time when making conductor layer 2.The 3rd advantage is directly to utilize this light shield layer 3 as shade, so the generation type of this conductor layer 2 is to make self-aligned with this light shield layer 3, do not need such as present aligning prior to the light shield that tries again on this wire preparation layer.
By above explanation as can be known, the present invention utilizes this light shield layer 3 as the shade of this wire preparation layer 61, and make self-aligned by this light shield layer 3 and do not need the aligning and the exposure that are coated with in addition again photoresistance and make light shield 4, except reach this conductor layer 2 fully by this light shield layer 3 cover be not exposed to, also can save the time of making and the cost of material, really can reach the present invention.
All quote in this application as a reference at all documents that the present invention mentions, just as each piece document is quoted separately as a reference.Should be understood that in addition those skilled in the art can make various changes or modifications the present invention after having read above-mentioned instruction content of the present invention, these equivalent form of values fall within the application's appended claims limited range equally.
Claims (8)
1. the method for making of a contact panel forms the conductor layer that one deck becomes the touch-control image on a substrate, it is characterized in that, comprises: (a) consist of a layer conductor preparation layer with conductive material on this substrate; (b) the shading preparation layer that is consisted of far below the material of the conductive material that consists of this wire preparation layer by reflectivity at this wire preparation layer coating one deck; (c) use a shade that has corresponding to the pattern of this touch-control image, make this shading preparation layer form the light shield layer that one deck becomes this touch-control image with development through overexposure; And (d) with the shade of this light shield layer as this wire preparation layer, etching removes the zone that this wire preparation layer is not covered by this light shield layer, and becomes the conductor layer of this one-tenth touch-control image.
2. the method for making of contact panel as described in claim 1, it is characterized in that: the shading preparation layer of this step (c) is the negative sense photoresistance.
3. the method for making of contact panel as described in claim 2, it is characterized in that: the wire preparation layer of this step (b) is selected from molybdenum, aluminium, titanium, silver, gold, and aforesaid one is combined as material and consists of.
4. the method for making of contact panel as described in claim 3, it is characterized in that: the shading preparation layer of this step (c) is black matrix".
5. the method for making of contact panel as described in claim 4, it is characterized in that: the thickness of this light shield layer of this step (c) is not less than 100am.
6. the method for making of contact panel as described in claim 5 is characterized in that: this step (d) is that the mode with wet etching removes the zone that this wire preparation layer is not covered by this light shield layer.
7. the method for making of contact panel as described in claim 1, it is characterized in that: the method for making of this contact panel also comprises one in the front step (e) of this step (a), this step (e) is the first nesa coating that into strips a plurality of and each interval are set at a base material first, and a plurality of in twos the second intermembranous nesa coatings of adjacent the first electrically conducting transparent that are positioned at, again in a plurality of each intervals being set on each first nesa coating and being positioned at accordingly dielectric film on the imaginary line of the second nesa coating of these the first nesa coating both sides, and form this substrate, the light shield layer of this step (c) is arranged at the second nesa coating top of this dielectric film and these dielectric film both sides, then the conductor layer of this step (d) by this dielectric film and with this first nesa coating interval, and be electrically connected the second nesa coating of these dielectric film both sides.
8. the method for making of contact panel as described in claim 7, it is characterized in that: the sheet resistance of this conductor layer is less than the sheet resistance of described the first nesa coating and described two nesa coatings.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100134982A TWI442282B (en) | 2011-09-28 | 2011-09-28 | The method of making the touch panel |
| TW100134982 | 2011-09-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103034357A true CN103034357A (en) | 2013-04-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012103166175A Pending CN103034357A (en) | 2011-09-28 | 2012-08-30 | Manufacturing method of touch panel |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103034357A (en) |
| TW (1) | TWI442282B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104536611A (en) * | 2014-12-31 | 2015-04-22 | 深圳市华星光电技术有限公司 | Preparation method of array substrate |
| CN105039939A (en) * | 2014-04-22 | 2015-11-11 | 达兴材料股份有限公司 | Method for forming metal wire |
| US9483148B2 (en) | 2013-12-30 | 2016-11-01 | Shanghai Tianma Micro-electronics Co., Ltd. | Method for manufacturing touch substrate |
| CN114121380A (en) * | 2021-11-22 | 2022-03-01 | 无锡变格新材料科技有限公司 | Preparation method of conductive film, touch module and touch panel |
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| CN101424817A (en) * | 2008-12-17 | 2009-05-06 | 友达光电股份有限公司 | Method for making colourful filtering touch control substrate |
| US20090309850A1 (en) * | 2008-06-16 | 2009-12-17 | Kai-Ti Yang | Capacitive touch panel |
| CN201429838Y (en) * | 2009-06-25 | 2010-03-24 | 深圳莱宝高科技股份有限公司 | Capacitive touch screen |
| CN101989160A (en) * | 2009-08-07 | 2011-03-23 | 铼宝科技股份有限公司 | Capacitive touch panel |
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2011
- 2011-09-28 TW TW100134982A patent/TWI442282B/en not_active IP Right Cessation
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2012
- 2012-08-30 CN CN2012103166175A patent/CN103034357A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20090309850A1 (en) * | 2008-06-16 | 2009-12-17 | Kai-Ti Yang | Capacitive touch panel |
| CN101424817A (en) * | 2008-12-17 | 2009-05-06 | 友达光电股份有限公司 | Method for making colourful filtering touch control substrate |
| CN201429838Y (en) * | 2009-06-25 | 2010-03-24 | 深圳莱宝高科技股份有限公司 | Capacitive touch screen |
| CN101989160A (en) * | 2009-08-07 | 2011-03-23 | 铼宝科技股份有限公司 | Capacitive touch panel |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9483148B2 (en) | 2013-12-30 | 2016-11-01 | Shanghai Tianma Micro-electronics Co., Ltd. | Method for manufacturing touch substrate |
| CN105039939A (en) * | 2014-04-22 | 2015-11-11 | 达兴材料股份有限公司 | Method for forming metal wire |
| CN104536611A (en) * | 2014-12-31 | 2015-04-22 | 深圳市华星光电技术有限公司 | Preparation method of array substrate |
| CN104536611B (en) * | 2014-12-31 | 2017-09-22 | 深圳市华星光电技术有限公司 | A kind of preparation method of array base palte |
| CN114121380A (en) * | 2021-11-22 | 2022-03-01 | 无锡变格新材料科技有限公司 | Preparation method of conductive film, touch module and touch panel |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI442282B (en) | 2014-06-21 |
| TW201314514A (en) | 2013-04-01 |
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Application publication date: 20130410 |