CN103029036A - Machining clamp of silicon wafer - Google Patents
Machining clamp of silicon wafer Download PDFInfo
- Publication number
- CN103029036A CN103029036A CN2012105864010A CN201210586401A CN103029036A CN 103029036 A CN103029036 A CN 103029036A CN 2012105864010 A CN2012105864010 A CN 2012105864010A CN 201210586401 A CN201210586401 A CN 201210586401A CN 103029036 A CN103029036 A CN 103029036A
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- CN
- China
- Prior art keywords
- clamping plate
- silicon chip
- silicon wafer
- clamp
- machining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention provides a machining clamp of a silicon wafer. The machining clamp comprises a positioning clamp and a locking screw, wherein a clamping plate is arranged in the positioning clamp; one end of the locking screw is inserted into the positioning clamp and is abutted against the clamping plate; the clamping plate is provided with an elastic spacer; since the clamping plate is provided with the elastic spacer, buffer is realized between the clamping plate and the silicon wafer through the elastic spacer and the silicon wafer is prevented from being damaged due to hard contact when the silicon wafer becomes loose due to vibration in a grinding process after the silicon wafer is clamped by the clamping plate, and the yield of the silicon wafer is improved; and the machining clamp has a simple structure.
Description
Technical field
The present invention relates to a kind of anchor clamps, particularly a kind of clamp for machining of silicon chip belongs to the technical field that silicon chip is processed.
Background technology
In silicon chip working process, silicon rod is processed into silicon chip after, can produce irregular shape on the silicon chip, in order not affect the quality of following process, be with should the removal of irregular limit.
The operation on traditional irregular limit of removal is: silicon chip is glued together, more irregular limit is ground away.But there is following shortcoming in Wafer bonding together:
1, after the size grinding step finishes, when carrying out the surface grinding operation, be first with the silicon chip that is bonded together by dissolving or the method for cleaning separately, thereby, increased the spoilage of silicon chip.
2, since silicon chip be common glue bond together, although, glue can be removed by cleaning, retain but still have remaining compound, thereby, affect the flatness of silicon chip surface, to next procedure increase difficulty.
In order to solve the problems of the technologies described above, recently, a kind of anchor clamps have appearred, these anchor clamps comprise locating clip, are provided with clamping plate and tie down screw in the locating clip, and tie down screw one end inserts in the locating clip, and withstand on the clamping plate, during use, with being placed in the folder of room of silicon chip marshalling, regulate tie down screw, make clamping plate with silicon wafer clamping, these anchor clamps have solved above-mentioned technical problem, but these anchor clamps are to promote clamping plate by tie down screw, the realization silicon wafer clamping, during use, without any buffering, in the process of lapping, silicon chip is produced damage between silicon chip and the clamping plate.
Summary of the invention
Technical problem to be solved by this invention provides a kind of clamp for machining of silicon chip simple in structure, and these anchor clamps can be avoided in the process of lapping, the damage of silicon chip.
In order to solve the problems of the technologies described above, the clamp for machining of a kind of silicon chip of the present invention comprises locating clip, tie down screw, be provided with clamping plate in the locating clip, described tie down screw one end inserts in the locating clip, and withstands on the clamping plate, wherein, described clamping plate is provided with elastomeric pad.
The clamp for machining of above-mentioned a kind of silicon chip, wherein, the face that described elastomeric pad contacts with silicon chip is provided with the annular knurl line.
The present invention can realize following beneficial effect:
1, because described clamping plate is provided with elastomeric pad, after clamping plate clamps silicon chip, when silicon chip is loosening because shaking in the process of lapping, cushion by elastomeric pad between clamping plate and the silicon chip, avoid silicon chip owing to hard contact damages, yield rate and the present invention of having improved silicon chip are simple in structure.
2, because the face that described elastomeric pad contacts with silicon chip is provided with the annular knurl line, improve the frictional force of clamping plate and silicon chip contact-making surface, avoided silicon chip because vibrations are unclamped.
Description of drawings
Fig. 1 is structural representation of the present invention.
The specific embodiment
The invention will be further described below in conjunction with accompanying drawing.
In order to solve the problems of the technologies described above, the clamp for machining of a kind of silicon chip of the present invention, comprise locating clip 1, clamping plate 2, tie down screw 3 is provided with clamping plate 2 in the locating clip 1, described tie down screw 3 one ends insert in the locating clip 1, and withstand on the clamping plate 2, during use, with being placed in the locating clip 1 of silicon chip 4 marshallings, regulate tie down screw 3, clamping plate 2 is clamped silicon chip 4, and described clamping plate 2 is provided with elastomeric pad 6, elastomeric pad 6 by glue bond on clamping plate 2, also can be installed in by other means on the clamping plate 2, elastomeric pad 6 can be rubber sheet gasket, also can be silica gel pad, and the face that described elastomeric pad 6 contacts with silicon chip 4 is provided with the annular knurl line.Locating clip 1 is integrated member, and this integrated member is established cavity 5.
Here description of the invention and application is illustrative, is not to want that therefore, the present invention is not subjected to the restriction of the present embodiment with scope restriction of the present invention in the above-described embodiments, and the technical scheme that any employing equivalence replacement obtains is all in the scope of protection of the invention.
Claims (2)
1. the clamp for machining of a silicon chip comprises locating clip, tie down screw, is provided with clamping plate in the locating clip, and described tie down screw one end inserts in the locating clip, and withstands on the clamping plate, it is characterized in that, described clamping plate is provided with elastomeric pad.
2. a kind of clamp for machining of silicon chip as claimed in claim 1 is characterized in that, the face that described elastomeric pad contacts with silicon chip is provided with the annular knurl line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105864010A CN103029036A (en) | 2012-12-29 | 2012-12-29 | Machining clamp of silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105864010A CN103029036A (en) | 2012-12-29 | 2012-12-29 | Machining clamp of silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103029036A true CN103029036A (en) | 2013-04-10 |
Family
ID=48016701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012105864010A Pending CN103029036A (en) | 2012-12-29 | 2012-12-29 | Machining clamp of silicon wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103029036A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106969969A (en) * | 2017-04-05 | 2017-07-21 | 东莞长盈精密技术有限公司 | Localization tool |
| CN111360690A (en) * | 2020-03-17 | 2020-07-03 | 北京航天时代光电科技有限公司 | Clamp capable of grinding chips with multiple lengths |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007296832A (en) * | 2006-04-28 | 2007-11-15 | Hidekazu Obayashi | Tip holder of cutter wheel for brittle materials |
| CN101973078A (en) * | 2010-10-25 | 2011-02-16 | 镇江市港南电子有限公司 | Clamping device of silicon slice cutting device |
| CN201856162U (en) * | 2010-10-28 | 2011-06-08 | 镇江市港南电子有限公司 | Grinding clamp for silicon chip |
| CN201856163U (en) * | 2010-10-28 | 2011-06-08 | 镇江市港南电子有限公司 | Processing fixture for silicon wafer |
| CN202167578U (en) * | 2011-01-13 | 2012-03-14 | 东莞新能源科技有限公司 | Flexible package lithium-ion secondary battery formation clamp |
| CN102569895A (en) * | 2010-12-20 | 2012-07-11 | 深圳市比克电池有限公司 | Battery cell clamping apparatus, battery cell baking device and battery cell baking method for soft package battery |
| CN203062494U (en) * | 2012-12-29 | 2013-07-17 | 镇江市港南电子有限公司 | Machining clamp of silicon wafer |
-
2012
- 2012-12-29 CN CN2012105864010A patent/CN103029036A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007296832A (en) * | 2006-04-28 | 2007-11-15 | Hidekazu Obayashi | Tip holder of cutter wheel for brittle materials |
| CN101973078A (en) * | 2010-10-25 | 2011-02-16 | 镇江市港南电子有限公司 | Clamping device of silicon slice cutting device |
| CN201856162U (en) * | 2010-10-28 | 2011-06-08 | 镇江市港南电子有限公司 | Grinding clamp for silicon chip |
| CN201856163U (en) * | 2010-10-28 | 2011-06-08 | 镇江市港南电子有限公司 | Processing fixture for silicon wafer |
| CN102569895A (en) * | 2010-12-20 | 2012-07-11 | 深圳市比克电池有限公司 | Battery cell clamping apparatus, battery cell baking device and battery cell baking method for soft package battery |
| CN202167578U (en) * | 2011-01-13 | 2012-03-14 | 东莞新能源科技有限公司 | Flexible package lithium-ion secondary battery formation clamp |
| CN203062494U (en) * | 2012-12-29 | 2013-07-17 | 镇江市港南电子有限公司 | Machining clamp of silicon wafer |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106969969A (en) * | 2017-04-05 | 2017-07-21 | 东莞长盈精密技术有限公司 | Localization tool |
| CN111360690A (en) * | 2020-03-17 | 2020-07-03 | 北京航天时代光电科技有限公司 | Clamp capable of grinding chips with multiple lengths |
| CN111360690B (en) * | 2020-03-17 | 2021-08-10 | 北京航天时代光电科技有限公司 | Clamp capable of grinding chips with multiple lengths |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130410 |