CN103027757A - Micro electric field stimulation healing device for minitype dental implant - Google Patents
Micro electric field stimulation healing device for minitype dental implant Download PDFInfo
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Abstract
本发明公开了微型牙科种植体微电场刺激愈合装置,该装置具有与牙科种植体顶面相吻合的下表面,以及伸出接触部,金属制固位螺栓穿过该愈合装置上开设的圆形通孔,紧固于牙科种植体中,在固位螺栓之上填塞牙科树脂,使得固位螺栓与口腔环境隔离,并与该愈合装置其余部分成一体;绝缘保护层使得电子元件与口腔环境隔离,该装置还包括:微电压恒压电路模块或微电流恒流电路模块;阴电极设置于该愈合装置与牙科种植体相接处的下表面上,以及愈合装置下表面上方固位螺栓的螺杆外表面处;阳电极设置于伸出接触部上,阴电极和阳电极分别与绝缘保护层相连接。该愈合装置体积小,可以方便地安装到牙科种植体上,且固定性好,可长期使用,能显著缩短牙科种植体愈合周期。
The invention discloses a micro-electric field stimulation healing device for a miniature dental implant. The device has a lower surface matching the top surface of the dental implant and a protruding contact part. A metal retaining bolt passes through a circular opening on the healing device. The hole is fastened in the dental implant, and the dental resin is filled on the retaining bolt, so that the retaining bolt is isolated from the oral environment and integrated with the rest of the healing device; the insulating protective layer isolates the electronic components from the oral environment, The device also includes: a micro-voltage constant-voltage circuit module or a micro-current constant-current circuit module; the negative electrode is arranged on the lower surface of the joint between the healing device and the dental implant, and outside the screw rod of the fixing bolt above the lower surface of the healing device On the surface; the anode electrode is arranged on the protruding contact part, and the cathode electrode and the anode electrode are respectively connected with the insulating protection layer. The healing device is small in size, can be conveniently installed on the dental implant, has good fixation, can be used for a long time, and can significantly shorten the healing period of the dental implant.
Description
技术领域technical field
本发明涉及牙科种植体愈合装置,特别涉及微型牙科种植体微电场刺激愈合装置。The invention relates to a dental implant healing device, in particular to a micro electric field stimulating healing device for a miniature dental implant.
背景技术Background technique
20世纪60年代,瑞典学者Brannemark教授发现,金属钛与骨组织的表面微观结构之间能紧密结合形成“骨整合”。骨整合界面理论奠定了现代口腔种植学的基础。骨整合界面是确保种植体周围骨组织能长期保持稳定并承担功能负荷的基础。In the 1960s, Professor Brannemark, a Swedish scholar, discovered that titanium metal and the surface microstructure of bone tissue can be closely combined to form "osseointegration". The interface theory of osseointegration laid the foundation of modern dental implantology. The osseointegration interface is the basis to ensure that the bone tissue around the implant can maintain stability and bear functional load for a long time.
黏膜和种植体之间界面的成功愈合和保持稳定也是种植成功的关键因素。牙种植体穿透黏膜组织露出于口腔,需要建立一个良好的结缔组织封闭,为种植体提供防止口腔细菌及其毒素进入内环境的一道屏障。种植体周围的黏膜组织类似于自然牙周围的龈组织,但与天然牙牙龈相比,这层相对无血管的软组织防御机制较弱。Successful healing and stabilization of the interface between the mucosa and implant are also key factors for implant success. Dental implants penetrate the mucosal tissue to expose the oral cavity, and a good connective tissue seal needs to be established to provide a barrier for the implant to prevent oral bacteria and their toxins from entering the internal environment. The mucosal tissue around implants is similar to the gingival tissue around natural teeth, but this layer of relatively avascular soft tissue has weaker defense mechanisms than the gingiva of natural teeth.
种植修复是目前口腔临床和口腔医学研究的热点,提高牙龈组织及骨组织的愈合水平是所面临的任务。骨髓间充质干细胞迁移至种植体-骨界面并沉积骨质、表皮及牙周组织干细胞迁移至种植体-牙龈界面并形成种植体与牙龈上皮间的结合是种植体获得成功的关键。Implant restoration is a hotspot in oral clinical and oral medicine research at present, and improving the healing level of gingival tissue and bone tissue is the task we are facing. Bone marrow mesenchymal stem cells migrate to the implant-bone interface and deposit bone. The migration of epidermal and periodontal tissue stem cells to the implant-gingiva interface and the formation of a bond between the implant and the gingival epithelium is the key to the success of the implant.
直流电刺激的方法在促进骨折的愈合、创伤的治疗、神经的生长方面得到了广泛的应用。The method of direct current stimulation has been widely used in promoting fracture healing, trauma treatment, and nerve growth.
现有专利中记载的相关骨愈合的治疗仪器,如中国专利申请CN201120200642.8、CN90100934.2、CN200610061732.7所公开的的治疗仪器应用了直流电刺激的方法促进骨折愈合。但这些仪器都是通过电流刺激骨头促进其损伤愈合,目前尚未见到有采用电流、电压刺激的方法促进牙科种植体愈合的仪器,且这些仪器要么带有笨重的电脑主机,要么带有电容极板,携带不方便,具有局限性。The treatment instruments related to bone healing described in existing patents, such as those disclosed in Chinese patent applications CN201120200642.8, CN90100934.2, and CN200610061732.7, apply direct current stimulation to promote fracture healing. However, these instruments all stimulate the bone through electric current to promote its wound healing. At present, there is no instrument that uses current and voltage stimulation to promote the healing of dental implants, and these instruments either have a bulky computer host or have a capacitor pole. The board is inconvenient to carry and has limitations.
迄今,尚未有关于应用电刺激促进口腔中微小的牙科种植体愈合的报道。To date, there have been no reports of the application of electrical stimulation to promote healing of tiny dental implants in the oral cavity.
发明内容Contents of the invention
为了解决上述问题,本发明人进行了锐意研究,结果发现:通过恒定的微电流或微电压对牙科种植体进行电刺激,可以有效促进种植体的愈合,缩短愈合时间,具体而言,采用与牙科种植体上表面吻合接触的阴极,同时与阴极接触的金属制固位螺栓将阴极固定于牙科种植体上,在伸出的部分上设置与口腔内其他部位如软组织等接触的阳极,通过阴极和阳极分别向牙科种植体和口腔内其他部位提供电刺激,固位螺栓通过牙科树脂密封,并通过绝缘保护层与口腔其他部位绝缘,所得装置不仅可以实现牙科种植体的快速愈合,而且该装置体积微小,在牙科种植体上安装、拆卸方便,使用便捷,清洁容易,从而完成本发明。In order to solve the above-mentioned problems, the inventors have carried out intensive research, and found that electrical stimulation of dental implants through constant micro-current or micro-voltage can effectively promote the healing of the implants and shorten the healing time. The upper surface of the dental implant is in contact with the cathode. At the same time, the metal retaining bolt in contact with the cathode fixes the cathode on the dental implant. The protruding part is provided with an anode that is in contact with other parts of the oral cavity, such as soft tissue. Through the cathode and the anode provide electrical stimulation to the dental implant and other parts of the oral cavity respectively. The retaining bolt is sealed by dental resin and insulated from other parts of the oral cavity by an insulating protective layer. The resulting device can not only realize the rapid healing of the dental implant, but also the device The volume is small, the installation and disassembly on the dental implant are convenient, the use is convenient, and the cleaning is easy, thereby completing the present invention.
本发明的目的在于提供以下方面:The object of the present invention is to provide the following aspects:
(1)一种微型牙科种植体微电场刺激愈合装置,其特征在于,该装置具有与牙科种植体顶面相吻合的下表面,以及伸出接触部(2),金属制固位螺栓(1)穿过该愈合装置上开设的圆形通孔(1a),紧固于牙科种植体中,在固位螺栓之上填塞牙科树脂(7),使得固位螺栓与口腔环境隔离,并与该愈合装置其余部分成一体;绝缘保护层设置于该愈合装置的外表面,使得电子元件与口腔环境隔离;(1) A micro-electric field stimulation healing device for a miniature dental implant, characterized in that the device has a lower surface matching the top surface of the dental implant, and a protruding contact part (2), and a metal retaining bolt (1) Through the circular through hole (1a) opened on the healing device, it is fastened in the dental implant, and the dental resin (7) is filled on the retaining bolt, so that the retaining bolt is isolated from the oral environment and connected to the healing The rest of the device is integrated; an insulating protective layer is placed on the outer surface of the healing device to isolate the electronic components from the oral environment;
该愈合装置包括:This healing device consists of:
电源,power supply,
微电压恒压电路模块,用于为电极提供恒定的电压,The micro-voltage constant voltage circuit module is used to provide a constant voltage for the electrodes,
微电流恒流电路模块,用于为电极提供恒定的电流,The micro current constant current circuit module is used to provide a constant current for the electrode,
电极,包括阴电极(6)和阳电极(5),用于将微电流恒流电路或微电压恒压电路输出的电流或电压导出并分别提供给牙科种植体和人体口腔内其他部位,The electrodes, including the cathode electrode (6) and the anode electrode (5), are used to derive the current or voltage output by the micro-current constant current circuit or the micro-voltage constant voltage circuit and provide them to dental implants and other parts of the human oral cavity respectively,
其中,微电压恒压电路模块和微电流恒流电路模块二者不并存,择一存在,就是说,微型牙科种植体微电场刺激愈合装置或者包括微电压恒压电路模块或者包括微电流恒流电路模块;Among them, the micro-voltage constant-voltage circuit module and the micro-current constant-current circuit module do not coexist, and one of them exists, that is to say, the micro-electric field stimulation healing device for the micro-dental implant either includes a micro-voltage constant-voltage circuit module or a micro-current constant-current circuit module. circuit module;
阴电极(6)设置于该愈合装置与牙科种植体相接处的下表面上,以及愈合装置下表面上方固位螺栓(1)的螺杆外表面处,阳电极(5)设置于伸出接触部上,阴电极(6)和阳电极(5)分别与绝缘保护层(3)相连接。The negative electrode (6) is set on the lower surface where the healing device meets the dental implant, and on the outer surface of the screw rod of the retaining bolt (1) above the lower surface of the healing device, and the positive electrode (5) is set on the protruding contact On the upper part, the cathode electrode (6) and the anode electrode (5) are respectively connected with the insulating protective layer (3).
(2)根据上述方面所述的微型牙科种植体微电场刺激愈合装置,其特征在于,(2) The miniature dental implant microelectric field stimulation healing device according to the above aspect, characterized in that,
所述微电压恒压电路模块包括供电模块和恒压控制模块,供电模块为微电压恒压电路模块提供稳定的电源,恒压控制模块用于将供电模块提供的电源转换成恒压输出到电极。The microvoltage constant voltage circuit module includes a power supply module and a constant voltage control module, the power supply module provides stable power for the microvoltage constant voltage circuit module, and the constant voltage control module is used to convert the power provided by the power supply module into a constant voltage output to the electrodes .
(3)根据上述方面所述的微型牙科种植体微电场刺激愈合装置,其特征在于,(3) The miniature dental implant microelectric field stimulation healing device according to the above aspect, characterized in that,
所述微电流恒流电路模块包括供电模块和恒流控制模块,供电模块为微电流恒流电路模块提供稳定的电源,恒流控制模块用于将供电模块提供的电源转换成恒流输出到电极。The microcurrent constant current circuit module includes a power supply module and a constant current control module, the power supply module provides a stable power supply for the microcurrent constant current circuit module, and the constant current control module is used to convert the power provided by the power supply module into a constant current output to the electrode .
(4)根据上述方面所述的微型牙科种植体微电场刺激愈合装置,其特征在于,(4) The miniature dental implant micro-electric field stimulation healing device according to the above aspect, characterized in that,
牙科树脂(7)上表面与愈合装置其余部分的上表面高度相同。The upper surface of the dental resin (7) is at the same height as the upper surface of the rest of the healing device.
(5)根据上述方面所述的微型牙科种植体微电场刺激愈合装置,其特征在于,(5) The micro-electric field stimulation healing device for the miniature dental implant according to the above aspect, characterized in that,
绝缘保护层由瓷、树脂、塑料或其他高分子绝缘材料制成。The insulating protective layer is made of porcelain, resin, plastics or other polymer insulating materials.
(6)根据上述方面所述的微型牙科种植体微电场刺激愈合装置,其特征在于,(6) The micro-electric field stimulation healing device for the miniature dental implant according to the above aspect, characterized in that,
伸出接触部具有横向伸出部分以及纵向接触部分,表面被覆绝缘保护层,内部为电源、微电压恒压电路模块或微电流恒流电路模块,The protruding contact part has a horizontal protruding part and a longitudinal contact part, the surface is covered with an insulating protective layer, and the inside is a power supply, a micro-voltage constant-voltage circuit module or a micro-current constant-current circuit module,
横向伸出部分与牙龈保持一定间隙,便于局部清洁卫生。The lateral protruding part maintains a certain gap with the gums, which is convenient for local cleaning and sanitation.
(7)根据上述方面述的微型牙科种植体微电场刺激愈合装置,其特征在于,(7) The micro-electric field stimulation healing device for the miniature dental implant according to the above aspect, characterized in that,
阳电极(5)设置于接触部的底端。The positive electrode (5) is arranged at the bottom end of the contact part.
(8)根据上述方面的微型牙科种植体微电场刺激愈合装置,其特征在于,(8) The miniature dental implant microelectric field stimulation healing device according to the above aspect, characterized in that,
阳电极与牙龈或口腔内其他软组织相接触。The positive electrode is in contact with the gums or other soft tissues in the mouth.
(9)根据上述方面的微型牙科种植体微电场刺激愈合装置,其特征在于,(9) The miniature dental implant microelectric field stimulation healing device according to the above aspect, characterized in that,
阴电极分别与固位螺栓的螺杆和牙科种植体抵接。The negative electrode abuts against the screw rod of the retaining bolt and the dental implant respectively.
(10)根据上述方面的微型牙科种植体微电场刺激愈合装置,其特征在于,(10) The miniature dental implant microelectric field stimulation healing device according to the above aspect, characterized in that,
微电压恒压电路模块提供5V以下电压;The micro-voltage constant voltage circuit module provides a voltage below 5V;
微电流恒流电路模块提供10-200μA的电流。The micro current constant current circuit module provides a current of 10-200μA.
根据本发明提供的微型牙科种植体微电场刺激愈合装置体积非常微小,可以方便地安装于牙科种植体上,并且不对患者口腔环境造成不便,不影响患者正常生活,可以长期为牙科种植体提供电刺激,使得牙科种植体快速愈合,而且清洁容易,适于长期使用。患者的牙科种植体愈合后,拆除密封的牙科树脂,取下固位螺栓即可将整个愈合装置拆除,拆卸非常便利。The miniature dental implant micro-electric field stimulation healing device provided by the present invention is very small in size, can be conveniently installed on the dental implant, does not cause inconvenience to the patient's oral environment, does not affect the patient's normal life, and can provide electric power for the dental implant for a long time. Stimulates fast healing of dental implants and is easy to clean for long-term use. After the patient's dental implant is healed, the sealed dental resin is removed, and the entire healing device can be removed by removing the retaining bolt, which is very convenient to disassemble.
附图说明Description of drawings
图1示出根据本发明优选实施方式的微型牙科种植体微电场刺激愈合装置的俯视示意图;Fig. 1 shows a schematic top view of a miniature dental implant micro-electric field stimulation healing device according to a preferred embodiment of the present invention;
图2示出根据本发明优选实施方式的微型牙科种植体微电场刺激愈合装置的剖面结构示意图;Fig. 2 shows the schematic diagram of the sectional structure of the miniature dental implant microelectric field stimulation healing device according to the preferred embodiment of the present invention;
图3示出根据本发明优选实施方式的微型牙科种植体微电场刺激愈合装置的剖面结构示意图;Fig. 3 shows the schematic cross-sectional structure diagram of the miniature dental implant micro-electric field stimulation healing device according to the preferred embodiment of the present invention;
图4示出根据本发明优选实施方式的微型牙科种植体微电场刺激愈合装置的安装结构示意图;Fig. 4 shows the schematic diagram of the installation structure of the miniature dental implant micro-electric field stimulation healing device according to the preferred embodiment of the present invention;
图5示出根据本发明优选实施方式的微型牙科种植体微电场刺激愈合装置的供电模块的结构示意图;Fig. 5 shows a schematic structural view of a power supply module of a miniature dental implant micro-electric field stimulation healing device according to a preferred embodiment of the present invention;
图6示出根据本发明优选实施方式的微型牙科种植体微电场刺激愈合装置的恒压控制模块的结构示意图;Fig. 6 shows a schematic structural view of the constant voltage control module of the miniature dental implant microelectric field stimulation healing device according to a preferred embodiment of the present invention;
图7示出根据本发明优选实施方式的微型牙科种植体微电场刺激愈合装置的微电流恒压控制模块的电路原理图。Fig. 7 shows a schematic circuit diagram of a micro-current constant-voltage control module of a micro-electric field stimulation healing device for a micro-dental implant according to a preferred embodiment of the present invention.
附图标号说明:Explanation of reference numbers:
1-固位螺栓1-retaining bolt
1a-通孔1a-through hole
2-伸出接触部2- protruding contact part
3-绝缘保护层3- Insulation protective layer
4-微型电池4- Micro battery
5-阳电极5- Anode
6-阴电极6- Cathode
7-牙科树脂7- Dental resin
8-牙科种植体8- Dental Implants
21-直流电转换器21-DC Converter
22-直流电转换器22-DC Converter
23-控制器23-Controller
23a-模数变换器23a-Analog-to-digital converter
23b-数字模拟转换器23b-Digital to Analog Converter
24-运算放大器组24-op amp bank
24a-运算放大器24a - Operational amplifier
24b-运算放大器24b-op amp
24c-电阻24c-resistor
具体实施方式Detailed ways
下面通过对本发明进行详细说明,本发明的特点和优点将随着这些说明而变得更为清楚、明确。The following describes the present invention in detail, and the features and advantages of the present invention will become more clear and definite along with these descriptions.
在这里专用的词“示例性”意为“用作例子、实施例或说明性”。这里作为“示例性”所说明的任何实施例不必解释为优于或好于其它实施例。尽管在附图中示出了实施例的各种方面,但是除非特别指出,不必按比例绘制附图。The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration." Any embodiment described herein as "exemplary" is not necessarily to be construed as superior or better than other embodiments. While various aspects of the embodiments are shown in drawings, the drawings are not necessarily drawn to scale unless specifically indicated.
本发明人经过研究发现,组织受损伤后即在损伤组织与未损伤组织之间形成一个稳定的内源性电场(约100-200mv),该电场持续时间较长(数日至数周),分布于损伤组织周围数毫米的空间范围内,距离损伤组织越近,电场越明显;在负电位处总是能恒定的产生新骨沉积,而正电位处往往产生骨吸收,这揭示出可移位的电荷对骨生长过程的重要意义。此外,关于皮肤干细胞的研究也表明,在微电场的作用下,表皮干细胞向电场的阴极移动。因此,本发明人认为:对牙种植体施加外来电场可以有效提高干细胞的迁移,促进种植体周围组织的愈合及与种植体结合,改善种植体的愈合,提高成功率。The inventors have found through research that after the tissue is damaged, a stable endogenous electric field (about 100-200mv) is formed between the damaged tissue and the undamaged tissue, and the electric field lasts for a long time (several days to several weeks). Distributed in the space of a few millimeters around the damaged tissue, the closer the distance to the damaged tissue, the more obvious the electric field; at negative potentials, new bone deposition can always be generated constantly, while at positive potentials, bone resorption often occurs, which reveals that the mobile The significance of the electrical charge of the bit to the bone growth process. In addition, studies on skin stem cells have also shown that under the action of a micro-electric field, epidermal stem cells move toward the cathode of the electric field. Therefore, the inventors believe that applying an external electric field to the dental implant can effectively increase the migration of stem cells, promote the healing of tissues around the implant and the combination with the implant, improve the healing of the implant, and increase the success rate.
本发明公开的是一种可以促进牙科种植体愈合的微型牙科种植体微电场刺激愈合装置,使用该装置利于牙种植体的愈合,提高临床种植修复的成功率。The invention discloses a miniature dental implant micro-electric field stimulating healing device that can promote the healing of the dental implant. Using the device facilitates the healing of the dental implant and improves the success rate of clinical implant restoration.
在根据本发明的一个优选实施方式中,如图1-4中所示,提供一种微型牙科种植体微电场刺激愈合装置,该装置具有与牙科种植体顶面相吻合的下表面,以及伸出接触部2,金属制固位螺栓1穿过该愈合装置上开设的圆形通孔1a,紧固于牙科种植体中,在固位螺栓之上填塞牙科树脂7,使得牙科树脂7与该愈合装置其余部分成一体;In a preferred embodiment according to the present invention, as shown in Fig. 1-4, provide a kind of miniature dental implant micro-electric field stimulation healing device, this device has the lower surface that coincides with the dental implant top surface, and protruding The
该愈合装置包括:This healing device consists of:
电源,power supply,
微电压恒压电路模块,用于为电极提供恒定的电压,The micro-voltage constant voltage circuit module is used to provide a constant voltage for the electrodes,
微电流恒流电路模块,用于为电极提供恒定的电流,The micro current constant current circuit module is used to provide a constant current for the electrode,
电极,包括阴电极6和阳电极5,用于将微电流恒流电路或微电压恒压电路输出的电流或电压导出并分别提供给牙科种植体和人体口腔内其他部位,The electrodes, including the
绝缘保护层3,设置于该愈合装置的外表面,使得电子元件与口腔环境隔离;The insulating
其中,微电压恒压电路模块和微电流恒流电路模块二者不并存,择一存在,就是说,微型牙科种植体微电场刺激愈合装置或者包括微电压恒压电路模块或者包括微电流恒流电路模块;Among them, the micro-voltage constant-voltage circuit module and the micro-current constant-current circuit module do not coexist, and one of them exists, that is to say, the micro-electric field stimulation healing device for the micro-dental implant either includes a micro-voltage constant-voltage circuit module or a micro-current constant-current circuit module. circuit module;
阴电极6设置于该愈合装置与牙科种植体相接处的下表面上,以及愈合装置下表面上方固位螺栓1的螺杆外表面处,阳电极5设置于伸出接触部上,阴电极6和阳电极5分别与绝缘保护层3相连接。The
其中,为了方便地与牙科种植体安装固定,根据本发明提供的微型牙科种植体下表面与牙科种植体上表面相吻合,这样安装后两者之间无缝隙,可以防止异物侵入其间而导致牙科种植体与周围组织间难以愈合。Among them, in order to install and fix the dental implant conveniently, the lower surface of the miniature dental implant provided by the present invention coincides with the upper surface of the dental implant, so that there is no gap between the two after installation, which can prevent foreign matter from invading and causing dental implants. Difficulty healing between implant and surrounding tissue.
在根据本发明的优选实施方式中,微型牙科种植体微电场刺激愈合装置包括圆桶状主体部分和伸出接触部2,如图1、2和3所示。其中,主体部分用于与牙科种植体进行安装、固定,并容纳电路模块如微电压恒压电路模块或微电流恒流电路模块;伸出接触部用于与口腔内其他部位如软组织接触。In a preferred embodiment according to the present invention, the miniature dental implant microelectric field stimulation healing device includes a barrel-shaped main body part and a
在根据本发明的微电场刺激愈合装置中,通过固位螺栓1将该愈合装置固定到牙科种植体上表面,使得该愈合装置在治愈牙科种植体愈合过程中可以稳定地紧固在牙科种植体表面,避免在治疗过程中愈合装置移位。In the micro-electric field stimulated healing device according to the present invention, the healing device is fixed to the upper surface of the dental implant through the retaining
作为固位螺栓使用金属制固位螺栓,对于金属并没有特别限制,不过优选使用钛或钛合金制固位螺栓,以提高生物相容性。Metal retaining bolts are used as the retaining bolts, and the metal is not particularly limited, but titanium or titanium alloy retaining bolts are preferably used in order to enhance biocompatibility.
固位螺栓除了起到固定愈合装置的作用以外,还起到导电的作用,由于固位螺栓与牙科种植体和阴极(阴电极)都接触,可以进一步将阴电极输出的电信号导入到牙科种植体中,特别是当阴电极与牙科种植体接触不良时,如图4中所示。In addition to the role of fixing the healing device, the retaining bolt also plays the role of conducting electricity. Since the retaining bolt is in contact with both the dental implant and the cathode (cathode), the electrical signal output by the cathode can be further introduced into the dental implant. body, especially when the negative electrode is in poor contact with the dental implant, as shown in Figure 4.
在本发明中,牙科树脂防止口腔内唾液等物质侵蚀固位螺栓。In the present invention, the dental resin prevents substances such as saliva in the oral cavity from corroding the retaining bolt.
在根据本发明的优选实施方式中,牙科树脂7上表面与愈合装置其余部分的上表面高度相同,从而防止对患者口腔造成损伤。In a preferred embodiment according to the present invention, the upper surface of the
在本发明的微电场刺激愈合装置中,绝缘保护层3可以由瓷、树脂、塑料或其他高分子绝缘材料制作而成,设置于愈合装置表面,保护和隔绝电路模块免于口腔内唾液、软组织等的干扰。In the micro-electric field stimulation healing device of the present invention, the insulating
在根据本发明的微电场刺激愈合装置的优选实施方式中,伸出接触部具有横向伸出部分以及纵向接触部分,如图2、3和4中所示。其中,横向伸出部分使得微型牙科种植体微电场刺激愈合装置的阳极与种植体间保留一定的间隙,该间隙可以便于清洁时通过间隙刷洗或便于种植体清洁线通过,以便于清洗。In a preferred embodiment of the microelectric field stimulating healing device according to the present invention, the protruding contact portion has a lateral protruding portion and a longitudinal contact portion, as shown in FIGS. 2 , 3 and 4 . Wherein, the lateral protruding part keeps a certain gap between the anode of the micro-electric field stimulation healing device of the micro-dental implant and the implant.
特别地,阳电极5设置于接触部的底端,使得阳电极5容易地与口腔内的软组织等接触。In particular, the anode electrode 5 is provided at the bottom end of the contact portion, so that the anode electrode 5 can easily contact the soft tissue in the oral cavity or the like.
在本发明中,作为电源,使用微型电池,如纽扣电池等。微型电池体积小,节省空间,使用方便。微型电池可以为微型原电池也可以为微型蓄电池,微型原电池可以在每次治疗之前更换,微型蓄电池可以在每次应用之后进行充电,优选微型原电池,一次性使用,有利于卫生。In the present invention, as a power source, a micro battery such as a button battery or the like is used. The micro battery is small in size, saves space and is easy to use. The micro-battery can be a micro-primary battery or a micro-accumulator. The micro-primary battery can be replaced before each treatment, and the micro-accumulator can be charged after each application. The micro-primary battery is preferred for one-time use and is conducive to hygiene.
对于电池种类并没有特别限制,可以使用常见的电源,如银锌电池、锂电池等。There is no particular limitation on the battery type, and common power sources such as silver-zinc batteries and lithium batteries can be used.
在根据本发明的微电场刺激愈合装置的优选实施方式中,微电压恒压电路模块提供5V以下电压;微电流恒流电路模块提供500μA以下电流。进一步优选地,微电压恒压电路模块提供1-3V电压;微电流恒流电路模块提供10-200μA电流。In a preferred embodiment of the micro-electric field stimulation healing device according to the present invention, the micro-voltage constant-voltage circuit module provides a voltage below 5V; the micro-current constant-current circuit module provides a current below 500μA. Further preferably, the micro-voltage constant-voltage circuit module provides a voltage of 1-3V; the micro-current constant-current circuit module provides a current of 10-200μA.
在根据本发明的微电场刺激愈合装置中,对于微电压恒压电路模块和微电流恒流电路模块并没有特殊要求,可以使用常见的恒压电路模块和恒流电路模块。In the micro-electric field stimulation healing device according to the present invention, there is no special requirement for the micro-voltage constant-voltage circuit module and the micro-current constant-current circuit module, and common constant-voltage circuit modules and constant-current circuit modules can be used.
在一个实施方式中,所述微电压恒压电路模块包括供电模块和恒压控制模块,供电模块为微电压恒压电路模块提供稳定的电源,恒压控制模块用于将供电模块提供的电源转换成恒压输出到电极。In one embodiment, the microvoltage constant voltage circuit module includes a power supply module and a constant voltage control module, the power supply module provides a stable power supply for the microvoltage constant voltage circuit module, and the constant voltage control module is used to convert the power provided by the power supply module into a constant voltage output to the electrode.
在一个实施方式中,所述微电流恒流电路模块包括供电模块和恒流控制模块,供电模块为微电流恒流电路模块提供稳定的电源,恒流控制模块用于将供电模块提供的电源转换成恒流输出到电极。In one embodiment, the micro-current constant-current circuit module includes a power supply module and a constant-current control module, the power supply module provides a stable power supply for the micro-current constant-current circuit module, and the constant-current control module is used to convert the power provided by the power supply module into a constant current output to the electrode.
以下仅对恒压控制模块进行进一步描述。Only the constant voltage control module is further described below.
如图5、6和7所示,在一个实施方式中,恒压控制模块包括:As shown in Figures 5, 6 and 7, in one embodiment, the constant voltage control module includes:
控制器,通过接受运算放大器组输出的信号并向运算放大器组输入信号的方式控制运算放大器组,使得运算放大器组可以输出恒压电路,The controller controls the operational amplifier group by receiving the signal output by the operational amplifier group and inputting the signal to the operational amplifier group, so that the operational amplifier group can output a constant voltage circuit,
运算放大器组,用于产生恒压电路并将恒压输入到电极。Bank of operational amplifiers for generating a constant voltage circuit and inputting constant voltage to the electrodes.
其中,直流电转换器21将微型电池4的电压转换成固定电压输入到运算放大器组,Wherein, the
直流电转换器22,将微型电池4的电压转换成固定电压输入到控制器。The
其中,供电模块的连接关系如图5,微型电池4分别与直流电转换器21和直流电转换器22相连,直流电转换器21和直流电转换器22的输出端为供电模块的输出端。Wherein, the connection relation of the power supply module is shown in Fig. 5 , the
其中,供电模块与恒压控制模块的连接关系如图5,直流电转换器21与运算放大器组24相连,直流电转换器22与控制器23相连。Wherein, the connection relationship between the power supply module and the constant voltage control module is shown in FIG. 5 , the
其中,运算放大器组包括:Among them, the operational amplifier group includes:
运算放大器24a,将控制器输入的信号(Vin)变成等比例的电压信号并将电压信号输入电阻24c和运算放大器24b,The operational amplifier 24a converts the signal (Vin) input by the controller into a proportional voltage signal and inputs the voltage signal into the resistor 24c and the operational amplifier 24b,
运算放大器24b,接收来自电阻和运算放大器24a的信号,并输出信号送入运算放大器24a和控制器,通过闭环反馈实现恒流输出,The operational amplifier 24b receives the signal from the resistor and the operational amplifier 24a, and the output signal is sent to the operational amplifier 24a and the controller to realize constant current output through closed-loop feedback,
其中,运算放大器24a与运算放大器24b均接收来自直流电转换器21的电压。Wherein, both the operational amplifier 24 a and the operational amplifier 24 b receive the voltage from the
在恒压控制模块中,控制器通过向运算放大器组输入信号并接受运算放大器组信号的方式控制运算放大器组,使得运算放大器组可以输出恒压电信号。In the constant voltage control module, the controller controls the operational amplifier group by inputting signals to the operational amplifier group and receiving signals from the operational amplifier group, so that the operational amplifier group can output constant voltage electrical signals.
其中,控制器包括:Among them, the controller includes:
数字模拟转换器23b,用于输出与设定恒压值成比例的控制电压作为输入信号(Vin)送入运算放大器24a,The digital-to-analog converter 23b is used to output a control voltage proportional to the set constant voltage value as an input signal (Vin) and send it to the operational amplifier 24a,
模数转换器23a,用于接收运算放大器24b的信号。The analog-to-digital converter 23a is used to receive the signal from the operational amplifier 24b.
其中,控制器与运算放大器组的连接关系如图6所示,数字模拟转换器23b向运算放大器24a输入信号,运算放大器24b向模数转换器23a输入信号。Wherein, the connection relationship between the controller and the operational amplifier group is shown in FIG. 6 , the digital-to-analog converter 23b inputs signals to the operational amplifier 24a, and the operational amplifier 24b inputs signals to the analog-to-digital converter 23a.
临床试验Clinical Trials
对于接受牙科种植体的10例临床患者,安装根据本发明提供的微型牙科种植体微电场刺激愈合装置,观察牙科种植体愈合周期均为1-2个月,而未安装微型牙科种植体微电场刺激愈合装置的患者,临床观察愈合周期为3-4个月。For 10 clinical patients who received dental implants, the miniature dental implant micro-electric field stimulation healing device provided by the present invention was installed, and the healing period of the dental implant was observed to be 1-2 months, while the micro-electric field of the miniature dental implant was not installed. For patients who stimulate the healing device, the clinical observation period of healing is 3-4 months.
由此表明,根据本发明提供的微型牙科种植体微电场刺激愈合装置能有效促进牙科种植体快速愈合,缩短愈合周期。It is thus shown that the micro electric field stimulation healing device for the miniature dental implant provided by the present invention can effectively promote the rapid healing of the dental implant and shorten the healing period.
以上结合具体实施方式和范例性实例对本发明进行了详细说明,不过这些说明并不能理解为对本发明的限制。本领域技术人员理解,在不偏离本发明精神和范围的情况下,可以对本发明技术方案及其实施方式进行多种等价替换、修饰或改进,这些均落入本发明的范围内。本发明的保护范围以所附权利要求为准。The present invention has been described in detail above in conjunction with specific implementations and exemplary examples, but these descriptions should not be construed as limiting the present invention. Those skilled in the art understand that without departing from the spirit and scope of the present invention, various equivalent replacements, modifications or improvements can be made to the technical solutions and implementations of the present invention, all of which fall within the scope of the present invention. The protection scope of the present invention shall be determined by the appended claims.
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105209080A (en) * | 2013-02-05 | 2015-12-30 | 马库斯·舒立 | Treatment systems for cleaning biofilm-contaminated components, especially implant parts |
CN107106265A (en) * | 2014-08-15 | 2017-08-29 | 赛福马有限责任公司 | System for clean-in-place tooth-implanting |
CN110037814A (en) * | 2019-04-29 | 2019-07-23 | 广州市伟迈医疗设备有限公司 | A kind of electromagnetic type cover screw fixture cover and method |
CN110680527A (en) * | 2019-09-24 | 2020-01-14 | 西安交通大学 | Implant system, microelectrode module, and dielectrophoresis method |
CN111372534A (en) * | 2017-10-26 | 2020-07-03 | 米尼翁大学 | Dental implant with electrical stimulation system and method for producing the same |
WO2020161704A1 (en) | 2019-02-05 | 2020-08-13 | Rafael Sirkis | Novel system and methods for speeding up the healing of dental implants |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5738521A (en) * | 1996-07-19 | 1998-04-14 | Biolectron, Inc. | Method for accelerating osseointegration of metal bone implants using electrical stimulation |
JP2004097591A (en) * | 2002-09-11 | 2004-04-02 | Hitachi Metals Ltd | Magnetic attachment for dentures |
WO2006043748A1 (en) * | 2004-10-21 | 2006-04-27 | Sung-Won Park | Apparatus for accelerating osseointergration |
KR100862710B1 (en) * | 2007-05-18 | 2008-10-13 | 김성준 | Abutments for dental implants with ideal current stimulators |
US20100143871A1 (en) * | 2007-04-11 | 2010-06-10 | Berger J Lee | Electrical dental screw implant |
WO2011150480A1 (en) * | 2010-06-02 | 2011-12-08 | Bianchini Marco Aurelio | Device for electrically stimulating osteogenesis |
CN202185066U (en) * | 2011-06-15 | 2012-04-11 | 长沙海凭医疗设备有限公司 | Computerized bone injury healing instrument |
US20120276501A1 (en) * | 2004-01-29 | 2012-11-01 | Cellectric Medical Ltd. | Disposable osteogenesis and osseointegration promotion and maintenance device for endosseous implants |
CN203195781U (en) * | 2012-12-31 | 2013-09-18 | 中国人民解放军总医院 | Healing device for micro dental implant by micro electric field simulation |
-
2012
- 2012-12-31 CN CN201210593417.4A patent/CN103027757B/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5738521A (en) * | 1996-07-19 | 1998-04-14 | Biolectron, Inc. | Method for accelerating osseointegration of metal bone implants using electrical stimulation |
JP2004097591A (en) * | 2002-09-11 | 2004-04-02 | Hitachi Metals Ltd | Magnetic attachment for dentures |
US20120276501A1 (en) * | 2004-01-29 | 2012-11-01 | Cellectric Medical Ltd. | Disposable osteogenesis and osseointegration promotion and maintenance device for endosseous implants |
WO2006043748A1 (en) * | 2004-10-21 | 2006-04-27 | Sung-Won Park | Apparatus for accelerating osseointergration |
US20100143871A1 (en) * | 2007-04-11 | 2010-06-10 | Berger J Lee | Electrical dental screw implant |
KR100862710B1 (en) * | 2007-05-18 | 2008-10-13 | 김성준 | Abutments for dental implants with ideal current stimulators |
WO2011150480A1 (en) * | 2010-06-02 | 2011-12-08 | Bianchini Marco Aurelio | Device for electrically stimulating osteogenesis |
CN202185066U (en) * | 2011-06-15 | 2012-04-11 | 长沙海凭医疗设备有限公司 | Computerized bone injury healing instrument |
CN203195781U (en) * | 2012-12-31 | 2013-09-18 | 中国人民解放军总医院 | Healing device for micro dental implant by micro electric field simulation |
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CN105209080B (en) * | 2013-02-05 | 2019-02-15 | 赛福马有限责任公司 | For cleaning by the processing unit of the component of Biofilm contamination especially implant part |
US10568979B2 (en) | 2013-02-05 | 2020-02-25 | Zyfoma Gmbh | Treatment system for cleaning a component, in particular an implant part, contaminated with a biofilm |
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JP2021500185A (en) * | 2017-10-26 | 2021-01-07 | ユニベルズィダード ドゥ ミンホUniversidade Do Minho | Dental implant with electrical stimulation system and its manufacturing method |
JP7202023B2 (en) | 2017-10-26 | 2023-01-11 | ユニベルズィダード ドゥ ミンホ | Dental implant with electrical stimulation system and manufacturing method thereof |
CN111372534B (en) * | 2017-10-26 | 2022-06-21 | 米尼翁大学 | Dental implant with electrical stimulation system and method for producing the same |
CN111372534A (en) * | 2017-10-26 | 2020-07-03 | 米尼翁大学 | Dental implant with electrical stimulation system and method for producing the same |
EP3920835A4 (en) * | 2019-02-05 | 2022-03-30 | Rafael Sirkis | NEW SYSTEM AND PROCEDURE TO ACCELERATE THE HEALING OF DENTAL IMPLANTS |
CN113412096A (en) * | 2019-02-05 | 2021-09-17 | 拉斐尔·瑟吉斯 | Novel systems and methods for accelerating dental implant healing |
WO2020161704A1 (en) | 2019-02-05 | 2020-08-13 | Rafael Sirkis | Novel system and methods for speeding up the healing of dental implants |
US20220117702A1 (en) * | 2019-02-05 | 2022-04-21 | Rafael SIRKIS | Novel system and methods for speeding up the healing of dental implants |
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US12171637B2 (en) * | 2019-02-05 | 2024-12-24 | Rafael SIRKIS | System and methods for speeding up the healing of dental implants |
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