CN103021659A - High-power electric power electronic capacitor with firm welding spots - Google Patents
High-power electric power electronic capacitor with firm welding spots Download PDFInfo
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- CN103021659A CN103021659A CN2012105317292A CN201210531729A CN103021659A CN 103021659 A CN103021659 A CN 103021659A CN 2012105317292 A CN2012105317292 A CN 2012105317292A CN 201210531729 A CN201210531729 A CN 201210531729A CN 103021659 A CN103021659 A CN 103021659A
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Abstract
The invention relates to a high-power electric power electronic capacitor with firm welding spots. The high-power electric power electronic capacitor with firm welding spots comprises a cover plate assembly, a casing and core groups fixed in the casing. Each group of the core groups are composed of a row of capacitor cores or two rows of capacitor cores arranged side by side, a lead-out copper strip is respectively arranged on metal sprayed surfaces of two sides of each core group, a metal sprayed surface of each capacitor core on each core group is electrically connected with the lead-out copper strip at the corresponding end through a wire, and length of the wire between the two electrically connected welding spots is longer than straight-line distance between the two welding spots. The lead-out copper strips are in flexible connection with the metal sprayed surfaces of the core groups through wires, displacement of the core groups cannot strain the welding spots on the core groups and the lead-out copper strips, and loosening or dropping of the welding spots can be effectively avoided.
Description
Technical field
The present invention relates to a kind of oil immersed type high-power electric and electronic capacitor that adopts the cylindrical capacitor fuse, specifically a kind of solder joint high-power electric and electronic capacitor firmly.
Background technology
The oil immersed type high-power electric and electronic capacitor of the employing cylindrical capacitor fuse that generally uses in the market, one or more groups core group is set in the shell, every core assembly group is arranged side by side by row or two column capacitance device fuses, every column capacitance device fuse is formed by stacking up and down by a plurality of capacitor bodies, the wire that welding is electrically connected with terminal on the cover plate assembly on the both sides metal spraying face of each capacitor body.The capacitor of this structure is because number of conductors is many, in the capacitor assembling process, will inevitably tie up and wire is connected with terminal and brings inconvenience to the core group, causes production efficiency low.Simultaneously, consider the conveyance capacity of wire, usually each capacitor body need adopt the thicker solid conductor of wire diameter or multiple conducting wires, and dual mode will certainly further increase the difficulty that the core group is tied up and wire is connected with terminal equally, causes production efficiency lower.Also there is another defective in this conductor connecting structure: after core group and wire bonds are finished, need to be banded in core group outer surface with the insulating tape winding and form insulating barrier all around, because looser between the capacitor body, core group after tying up is very easily pullled wire in the assembling process and is caused solder joint loosening or come off in carrying, cause the capacitor transiting performance impaired, increase the disqualification rate of product.
Consider the problems referred to above, also have to adopt and draw copper strips and capacitor body electric connection mode.Namely draw copper strips each core group both sides metal spraying face setting, draw the copper strips both sides and be electrically connected by solder joint at metal spraying face place with each capacitor body respectively, drawing the copper strips upper end has bending to form extraction electrode.The advantage of this structure is not need multiple conducting wires, and draws copper strips and be positioned at core group both sides, ties up rear formation skeleton, easy damaged solder joint not during carrying was assembled.Yet, because the capacitor core quantum count is more, draw on the copper strips solder joint densely distributed, electric current by drawing copper strips is larger, consider its overcurrent performance, drawing copper strips, general to cross the face cross section larger, is example such as the power electronic capacitor that is used on STATCOM/SVG dynamic passive compensation and the harmonic treating apparatus, draw the width of copper strips at 20～200mm, thickness is at 0.25～1.0mm.Therefore, when welding, draw on the copper strips solder joint densely distributed, draw copper strips and can cause distortion because of welding stress, and because core group volume is large, weight is heavier, being subject in capacitor transportation, installation and use procedure vibrated the displacement that can cause inevitably the core group, this displacement is very likely pulled and is drawn the rigidity solder joint that is electrically connected between copper strips and the metal spraying face, cause draw copper strips solder joint particularly welding stress concentrate the solder joint at place loosening or come off, cause its overcurrent performance impaired, can increase equally the disqualification rate of product.
Summary of the invention
The purpose of this invention is to provide firmly high-power electric and electronic capacitor of a kind of solder joint, can guarantee on the overcurrent capability basis of capacitor, avoid solder joint to be become flexible because capacitor is vibrated or come off.
The present invention is achieved in that and comprises cover plate assembly, shell and be fixed on shell inner core group; The two column capacitance device fuses that every core assembly group is listed as or is arranged side by side by one form, and every column capacitance device fuse is formed by stacking up and down by a plurality of capacitor bodies; Be respectively equipped with on each core group both sides metal spraying face and draw copper strips; The metal spraying face place of each capacitor body on each core group is electrically connected by wire respectively with drawing between the copper strips of respective end, and the length of wire between two electrical connection solder joints is greater than the air line distance between two solder joints.
Owing to flexibly connecting by wire between the metal spraying face of drawing copper strips and core group, metal spraying face and electric connection point on drawing copper strips are respectively two different solder joints, wire can move thereupon during the displacement of core group, can and not draw solder joint on the copper strips and cause and pull the core group, can effectively prevent the loosening of solder joint or come off.
The metal spraying face place of each capacitor body on each core group increases between the copper strips and can be electrically connected by two section leads with drawing of respective end.This structure both can satisfy the overcurrent performance of wire, can reduce again the wire diameter of used wire, improved wire flexible, can protect better solder joint not to be damaged.
The present invention can adopt a wire to realize above-mentioned capacitor body metal spraying face place and draw copper strips two section lead connected modes.Every core assembly group by the molecular situation of a column capacitance device core under, each core group one end metal spraying face is electrically connected with the corresponding copper strips of drawing by a wire; This wire one end from bottom to top/from top to bottom according to draw copper strips, ground floor capacitor body, draw copper strips, the order of second layer capacitor body successively up/down extend and arrange so that two section leads that formation is used for being electrically connected between the copper strips of drawing of the metal spraying face place of each capacitor body and respective end.The advantage of this connected mode is few be used to the solder joint of drawing on the copper strips, not only can reduce welding heat to the impact of capacitor body and draw welding stress on the copper strips, also can improve the capacitor packaging efficiency.
Every core assembly group by the molecular situation of two column capacitance device cores under, each core group one end metal spraying face is electrically connected with the corresponding copper strips of drawing by a wire; This wire is according to the capacitor body layered arrangement, wire one end from bottom to top/from top to bottom according to draw copper strips, ground floor one side capacitors fuse, draw copper strips, ground floor opposite side capacitor body, draw copper strips, the second layer one side capacitors fuse, draw copper strips, second layer opposite side capacitor body order successively up/down extend and arrange so that two section leads that formation is used for being electrically connected between the copper strips of drawing of the metal spraying face of each capacitor body and respective end.
Every core assembly group by the molecular situation of two column capacitance device cores under, this wire is also arranged according to the capacitor body apportion, wire one end by a column capacitance device fuse from top to bottom/from bottom to top according to draw copper strips, ground floor capacitor body, draw copper strips, the order of second layer capacitor body arranges to lower/upper extension successively, be transitioned into again the end/top layer of to another column capacitance device fuse from bottom to top/from top to down oppositely extends layout, so that two section leads that formation is used for being electrically connected between the copper strips of drawing of the metal spraying face of each capacitor body and respective end.The advantage of this layout is simple, and being distributed symmetrically property of circuit is good, be difficult for during assembling makeing mistakes, but the solder joint of drawing on the copper strips increases packaging efficiency decline.
As shown from the above technical solution, the metal spraying face that the present invention will draw copper strips and core group flexibly connects by wire, so that metal spraying face and electric connection point on drawing copper strips are respectively two different solder joints, wire can move thereupon during the displacement of core group, can and not draw solder joint on the copper strips and cause and pull the core group, can effectively prevent the loosening of solder joint or come off, guarantee that the capacitor overcurrent capability is not damaged, and can improve the qualification rate of product.
Description of drawings
Fig. 1 is structural representation of the present invention;
Fig. 2 is the right view of Fig. 1;
Fig. 3 is another embodiment of the present invention core group conductor arrangement and bond pad locations schematic diagram;
Fig. 4 is the present invention's single-row core group conductor arrangement and bond pad locations schematic diagram.
Embodiment
The power electronic capacitor that following examples are used on STATCOM/SVG dynamic passive compensation and the harmonic treating apparatus is example.
As shown in Figure 1 and Figure 2, the present invention includes cover plate assembly 2, shell 1, core group 3; Core group 3 has three groups, and each core group 3 is arranged side by side by two column capacitance device fuses, and every column capacitance device fuse is formed by stacking up and down by a plurality of capacitor bodies 31; Be respectively equipped with on each core group 3 both sides metal spraying face and draw copper strips 5, drawing copper strips 5 upper ends has bending to form the extraction electrode 51 that is used for welding the wire 8 that links to each other with cover plate assembly 2 leading-out terminals 21; The metal spraying face place of each capacitor body 31 on each core group 3 is electrically connected by metallic copper wire 6 respectively with drawing between the copper strips 5 of respective end, and the length of wire 6 between two electrical connection solder joints 71,72 is greater than the air line distance between two solder joints 71,72.
The metal spraying face of each capacitor body 31 on the core group 3 is formed by a wire curved arrangement with the wire 6 that is connected of drawing between the copper strips 5 of respective end.Wire 6 shown in Figure 1 connects according to capacitor body 31 layered arrangement, extend according to the order of drawing copper strips 5, ground floor left side capacitor body, drawing copper strips 5, ground floor right side capacitor body successively up/down from bottom to top/from top to bottom and arrange, so that two section leads 61,62 that formation is used for being electrically connected between the copper strips 5 of drawing of the metal spraying face of each capacitor body 31 and respective end can improve its overcurrent performance.The advantage of this connected mode is few be used to the solder joint 71 of drawing on the copper strips 5, helps to reduce welding heat to the impact of capacitor body and draws the impact of the welding stress butt welding point on the copper strips, can also improve the capacitor packaging efficiency.
Equally, wire 6 connected modes can be according to shown in Figure 3, arrange according to capacitor body 31 apportions, by a column capacitance device fuse from top to bottom according to draw copper strips 5, ground floor capacitor body, draw copper strips 5, the order of second layer capacitor body arranges downwards successively, be transitioned into again another column capacitance device fuse to the bottom and oppositely extend from bottom to top again and arrange.Certainly, also arrangement shown in Figure 3 can be inverted, can by a column capacitance device fuse from bottom to top, be transitioned into again another column capacitance device fuse from top to down and oppositely extend layout.This two kinds of connected modes all can be so that two section leads 61,62 that formation is used for being electrically connected between the copper strips 5 of drawing of the metal spraying face of each capacitor body 31 and respective end.The advantage of this layout is simple, and being distributed symmetrically property of circuit is good, is difficult for during assembling makeing mistakes.
Figure 4 shows that single-row core group conductor arrangement and bond pad locations schematic diagram.Every core assembly group 3 is comprised of a column capacitance device fuse, and each core group 3 one end metal spraying face is electrically connected with the corresponding copper strips 5 of drawing by a wire 6; These wire 6 one ends from bottom to top/from top to bottom according to draw copper strips 5, ground floor capacitor body, draw copper strips, the order of second layer capacitor body successively up/down extend and arrange so that two section leads 61,62 that formation is used for being electrically connected between the copper strips 5 of drawing of the metal spraying face place of each capacitor body 31 and respective end.
Owing to flexibly connecting by wire 6 between the metal spraying face of drawing copper strips 5 and core group 3, two different solder joints 72,71 on the solder joint 7 at wire 6 two ends is respectively and is welded on the metal spraying face and draws copper strips 5, can move by wire 6 during 3 displacement of core group thereupon, can and not draw solder joint 72,71 on the copper strips 5 and cause and pull core group 3, can effectively prevent the loosening of each solder joint 7 or come off.
Core group of the present invention can be one or more groups, and every core assembly group can be two column capacitance device fuses that are listed as or are arranged side by side.
Claims (5)
1. solder joint high-power electric and electronic capacitor firmly comprises cover plate assembly (2), shell (1) and is fixed on shell (1) inner core group (3); The two column capacitance device fuses that every core assembly group (3) is listed as or is arranged side by side by one form, and every column capacitance device fuse is formed by stacking up and down by a plurality of capacitor bodies (31); Be respectively equipped with on each core group (3) both sides metal spraying face and draw copper strips (5); It is characterized in that: the metal spraying face place of each capacitor body (31) on each core group (3) is electrically connected by wire respectively with drawing between the copper strips (5) of respective end, and the length of wire between two electrical connection solder joints (71,72) is greater than the air line distance between two solder joints (71,72).
2. solder joint according to claim 1 high-power electric and electronic capacitor firmly, it is characterized in that: the metal spraying face place of each capacitor body (31) on each core group (3) is electrically connected by two section leads (61,62) respectively with drawing between the copper strips (5) of respective end.
3. solder joint according to claim 2 high-power electric and electronic capacitor firmly, it is characterized in that: each core group (3) is comprised of a column capacitance device fuse; Each core group (3) one end metal spraying face is electrically connected with the corresponding copper strips (5) of drawing by a wire (6); These wire (6) one ends extend according to the order of drawing copper strips (5), ground floor capacitor body, drawing copper strips (5), second layer capacitor body successively up/down from bottom to top/from top to bottom to be arranged, so that two section leads (61,62) that formation is used for being electrically connected between the copper strips (5) of drawing of the metal spraying face place of each capacitor body (31) and respective end.
4. solder joint according to claim 2 high-power electric and electronic capacitor firmly, it is characterized in that: each core group (3) is comprised of two column capacitance device fuses; Each core group (3) one end metal spraying face is electrically connected with the corresponding copper strips (5) of drawing by a wire (6); This wire (6) is according to the capacitor body layered arrangement, wire (6) one ends are from bottom to top/from top to bottom according to drawing copper strips (5), ground floor one side capacitors fuse, draw copper strips (5), ground floor opposite side capacitor body, draw copper strips (5), the second layer one side capacitors fuse, draw copper strips (5), the order of second layer opposite side capacitor body successively up/down extend to arrange, so that two section leads (61 that formation is used for being electrically connected between the copper strips (5) of drawing of the metal spraying face of each capacitor body (31) and respective end, 62).
5. solder joint according to claim 2 high-power electric and electronic capacitor firmly, it is characterized in that: each core group (3) is comprised of two column capacitance device fuses; Each core group (3) one end metal spraying face is electrically connected with the corresponding copper strips (5) of drawing by a wire (6); This wire (6) is arranged according to the capacitor body apportion, wire (6) one ends by a column capacitance device fuse from top to bottom/from bottom to top according to drawing copper strips (5), the ground floor capacitor body, draw copper strips (5), the order of second layer capacitor body is arranged to lower/upper extension successively, be transitioned into again the end/top layer of to another column capacitance device fuse from bottom to top/from top to down oppositely extends layout, so that two section leads (61 that formation is used for being electrically connected between the copper strips (5) of drawing of the metal spraying face of each capacitor body (31) and respective end, 62).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105317292A CN103021659A (en) | 2012-12-11 | 2012-12-11 | High-power electric power electronic capacitor with firm welding spots |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105317292A CN103021659A (en) | 2012-12-11 | 2012-12-11 | High-power electric power electronic capacitor with firm welding spots |
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| CN103021659A true CN103021659A (en) | 2013-04-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012105317292A Pending CN103021659A (en) | 2012-12-11 | 2012-12-11 | High-power electric power electronic capacitor with firm welding spots |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104465081A (en) * | 2014-11-21 | 2015-03-25 | 安徽铜峰电子股份有限公司 | High frequency power capacitor |
Citations (6)
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|---|---|---|---|---|
| JPH10135075A (en) * | 1996-09-03 | 1998-05-22 | Shizuki Denki Seisakusho:Kk | Capacitor and its external connecting terminal |
| JP2001076967A (en) * | 1999-09-01 | 2001-03-23 | Marcon Electronics Co Ltd | Low inductance capacitor |
| CN101997343A (en) * | 2009-08-12 | 2011-03-30 | 铜陵亿亨达电子有限责任公司 | Novel pulse power accumulator with high specific volume and large current |
| JP2011096916A (en) * | 2009-10-30 | 2011-05-12 | Denso Corp | Capacitor and power converter |
| JP2011155138A (en) * | 2010-01-27 | 2011-08-11 | Shizuki Electric Co Inc | Capacitor |
| CN202977171U (en) * | 2012-12-11 | 2013-06-05 | 安徽铜峰电子股份有限公司 | High-power power electronic capacitor with firm welding spots |
-
2012
- 2012-12-11 CN CN2012105317292A patent/CN103021659A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10135075A (en) * | 1996-09-03 | 1998-05-22 | Shizuki Denki Seisakusho:Kk | Capacitor and its external connecting terminal |
| JP2001076967A (en) * | 1999-09-01 | 2001-03-23 | Marcon Electronics Co Ltd | Low inductance capacitor |
| CN101997343A (en) * | 2009-08-12 | 2011-03-30 | 铜陵亿亨达电子有限责任公司 | Novel pulse power accumulator with high specific volume and large current |
| JP2011096916A (en) * | 2009-10-30 | 2011-05-12 | Denso Corp | Capacitor and power converter |
| JP2011155138A (en) * | 2010-01-27 | 2011-08-11 | Shizuki Electric Co Inc | Capacitor |
| CN202977171U (en) * | 2012-12-11 | 2013-06-05 | 安徽铜峰电子股份有限公司 | High-power power electronic capacitor with firm welding spots |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104465081A (en) * | 2014-11-21 | 2015-03-25 | 安徽铜峰电子股份有限公司 | High frequency power capacitor |
| CN104465081B (en) * | 2014-11-21 | 2017-08-25 | 安徽铜峰电子股份有限公司 | RF power capacitor |
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Application publication date: 20130403 |