CN103014409A - Cu-Ni-Si base copper alloy having excellent projection welding property, and manufacturing method thereof - Google Patents
Cu-Ni-Si base copper alloy having excellent projection welding property, and manufacturing method thereof Download PDFInfo
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- CN103014409A CN103014409A CN2011102821470A CN201110282147A CN103014409A CN 103014409 A CN103014409 A CN 103014409A CN 2011102821470 A CN2011102821470 A CN 2011102821470A CN 201110282147 A CN201110282147 A CN 201110282147A CN 103014409 A CN103014409 A CN 103014409A
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Abstract
The present invention provides a Cu-Ni-Si base copper alloy having an excellent projection welding property, and a manufacturing method thereof, wherein the Cu-Ni-Si base copper alloy is used for vehicle-mounted drive circuits or circuit boards and the like inside engine devices. The copper alloy comprises 1.0-4.0 wt% of Ni, 0.1-1.0 wt% of Si, 0.3-0.7 wt% of Zn, 0.4-0.8 wt% of Sn, and the balance of Cu and unavoidable impurities. According to the present invention, a GOS average value of all the grains is 2.5-5.0 DEG, and a ratio (Lsigma/L) of the total special grain boundary length Lsigma measured by using an EBSD method to the total grain boundary length L of the grain boundary is 15-30%, wherein GOS in the crystal structure is measured by using the EBSD method.
Description
Technical field
The present invention relates to the Cu-Ni-Si series copper alloy of projection welding excellent, particularly relate to Cu-Ni-Si series copper alloy and manufacture method thereof for the driving circuit of vehicle mounted or the circuit substrate of engine installation inside etc.
Background technology
Projection welding is a kind of of resistance welding, because concentrating at salient, electric current flows, so can carry out good welding, be used for recently in the employed copper of circuit substrate or the connection terminal of copper alloy parts and the welding of lead terminal etc. of the driving circuit of vehicle mounted or engine installation inside.
The driving circuit device of patent documentation 1 record and possessing in its engine installation carries out projection welding to the end that connects terminal and the end of lead terminal.Connect terminal and use fine copper, phosphor bronze etc.Extend the connection terminal 22 that arranges from circuit substrate 36 and connecting terminal bending part 22A bending, extending the lead terminal 18 that arranges with self-acting control IC44 extends upward, and then, the end that connects terminal 22 and the end of lead terminal 18 engage by electric welding at weld 16, connection terminal 22 at point of inflection 22B to leave the mode bending of lead terminal 18.Therefore, when electric welding, can suppress electric current and beyond weld 16, flow and shunt, thereby can suppress the inhomogeneous of welding strength.
In the rectifier of the vehicle-mounted dlternator of patent documentation 2 records, splicing ear 37 branches of circuit board assemblies 32 also expose at interior all sides and the outer circumferential side of resinite 36, the lead-in wire 33d of+side diode 33 from outer circumferential side by exposed division 37b integrated engage of projection welding with the outer circumferential side of splicing ear 43 branches, and then-the lead-in wire 34d of side diode 34 from interior all sides by exposed division 37a integrated engage of projection welding with interior all sides of splicing ear 37 branches.This lead-in wire is formed by copper.
Patent documentation 1: Japanese Patent Publication 2009-123359 communique
Patent documentation 2: Japanese Patent Publication becomes the 11-252877 communique
Brass or the phosphor bronze parts of the uses such as circuit substrate that need projection welding in the past have problems in erosion resistance.Therefore, as these parts, studying the use of the copper nisiloy series copper alloy (Cu-Ni-Si series copper alloy) of erosion resistance, excellent heat resistance, but projection welding characteristic existent defect solves countermeasure so expect it.
Summary of the invention
The present invention makes in view of these problems, is provided for especially Cu-Ni-Si series copper alloy and the manufacture method thereof of the projection welding excellent of the driving circuit of vehicle mounted or the circuit substrate of engine installation inside etc.
What the inventor etc. scrutinized found that, make copper nisiloy series copper alloy contain the Zn of optimum quantity, make poor (the Grain Orientation Spread of grain orientation that measures with Electron Back-Scattered Diffraction (EBSD) method in the crystal structure, the mean value of whole crystal grain GOS) is 2.5 °～5.0 °, (L σ/when L) being 15～30%, the leap of projection welding characteristic improves total special grain boundary length L σ of the special grain boundary of measuring with the EBSD method with respect to the ratio of total crystal boundary length L of crystal boundary.
Improving on the projection welding characteristic, the welding easiness with metal of electroconductibility is important prerequisite with the processibility that can form the protuberance with excellent in shape, and the result that the inventor etc. scrutinize draws following viewpoint.
(1) Zn usually contains it in order to improve resistance to migration as the interpolation component of copper alloy, also helps the easiness of welding, but is low melting point, if exceed optimum quantity, then usually evaporates when projection welding and makes conversely the weldability variation.
(2) (L σ/L) helps to be used to form the pull and stretch processibility of protuberance widely with respect to the ratio of total crystal boundary length L of crystal boundary for the mean value in whole crystal grain of the GOS that measures with the EBSD method in the copper alloy tissue, total special grain boundary length L σ of special grain boundary, if exceed optimum value, pull and stretch processibility variation, becoming is difficult to form the protuberance with excellent in shape.
That is (the copper nisiloy class copper alloy of L σ/L) can be brought into play fabulous projection welding with respect to the ratio of total crystal boundary length L of crystal boundary, to have total special grain boundary length L σ of mean value in whole crystal grain of best Zn content, best GOS, special grain boundary.
In addition, common copper nisiloy series copper alloy is by the sheet material of following process manufacturing as the final thickness of slab of target: wait proper method making ingot bar with continuous casting, this ingot bar is heated to carries out homogenizing annealing about 850～950 ℃, after the hot rolling, suppress separating out of Ni-Si compound with water cooling, then to this hot rolling material implement (1) cold rolling → (2) solution treatment → (3) ageing treatment → (4) cold rolling and thermal treatment.In addition, after (4) cold rolling, sometimes also carry out eliminating stress or straightening is the processing such as short period of time heating, tension leveling of purpose.In particular for obtaining appropriate characteristics, need to select suitable condition in the solution treatment of (2) and the ageing treatment of (3).
The inventor etc. draw following viewpoint, in order to make the copper nisiloy series copper alloy of the pull and stretch processibility with suitable projection welding, do not make compound particles separate out and exist very important with solid solution condition in the copper alloy tissue as far as possible.
Namely, do not carry out required solution treatment and the ageing treatment that compound particles is separated out of manufacturing of copper nisiloy class copper alloy in the past, by hot rolling, process annealing and low-temperature annealing are selected top condition, can make the copper nisiloy class copper alloy of projection welding excellence, thereby on cost, also can cheaply make.
Copper alloy of the present invention is characterised in that, have Si, the Zn of 0.3～0.7 % by weight, the Sn of 0.4～0.8 % by weight by the Ni that contains 1.0～4.0 % by weight, 0.1～1.0 % by weight, residue is the composition of Cu and inevitable impurity formation, mean value in whole crystal grain of the GOS that measures with the EBSD method in the crystal structure is 2.5 °～5.0 °, and (L σ/L) is 15～30% with respect to the ratio of total crystal boundary length L of crystal boundary with total special grain boundary length L σ of the special grain boundary of EBSD method mensuration.
The content of Zn is unfavorable for improving the projection welding characteristic during less than 0.3 % by weight, if exceed 0.7 % by weight, and evaporation and make conversely the weldability variation when projection welding.
Mean value in whole crystal grain of GOS is during less than 2.5 °, and the anisotropy grow of crystal structure causes processibility to reduce, if exceed 5.0 °, the fracture that is caused by grain-boundary crack occurs easily.
L σ/L is less than 15% the time, and rolling processibility variation if exceed 30%, the fracture that is caused by grain-boundary crack occurs easily.
In addition, copper alloy of the present invention can contain at least a in the element that is comprised of Zr and Cr of 0.01～0.3 % by weight.
At least a by in the element that is comprised of Zr and Cr that contains 0.01～0.3 % by weight, projection welding further improves.
In addition, copper alloy of the present invention can contain the Mg of 0.001～0.2 % by weight.
By containing the Mg of 0.001～0.2 % by weight, the resistant to mold wear during punch process improves.
The manufacture method of copper alloy of the present invention is characterised in that, comprise successively hot rolling, first cold rolling, process annealing, the second cold rolling and low-temperature annealing, process velocity during hot rolling on thickness direction is 13.0～28.0 mm/min, cooling beginning temperature is 500～700 ℃, 500～700 ℃ of lower enforcement process annealings 20～60 seconds, under 400～500 ℃, implemented low-temperature annealings 20～60 seconds.
Namely, the copper alloy of projection welding excellent of the present invention can by the manufacturing of not carrying out common copper nisiloy series copper alloy solution treatment and ageing treatment required, that compound particles is separated out, be made the selected top condition of hot rolling, process annealing and low-temperature annealing.
Process velocity during hot rolling on thickness direction is during less than 13.0 mm/min, tissue becomes inhomogeneous, also generate thick precipitate, rolling processibility worsens, when process velocity was larger, tissue became evenly, can suppress the growth of thick precipitate, but when exceeding 28.0 mm/min, on equipment, can't implement.
Cooling beginning temperature is during less than 500 ℃, and tissue becomes inhomogeneous, also generates thick precipitate, and rolling processibility worsens, and cooling beginning temperature is higher, and tissue becomes more even, but the energy waste that exceeds 700 ℃ setting becomes large, uneconomical.
Temperature during process annealing is less than 500 ℃, and L σ/L rose and produced easily grain-boundary crack during less than 20 seconds the time, and rolling processibility worsens, productivity losing.In addition, separate out timeliness and occur, electric conductivity rises, and weldability reduces.
Temperature during process annealing exceeds 700 ℃, and the time is organized solid solution when exceeding 60 seconds, and electric conductivity reduces, but the mean value in whole crystal grain of GOS reduces the anisotropy grow of micro organization, processibility reduction.
Temperature during low-temperature annealing is less than 400 ℃, and L σ/L rose and produced easily grain-boundary crack, thereby processibility reduces during less than 20 seconds the time.
Temperature during low-temperature annealing exceeds 500 ℃, and the time, the mean value in whole crystal grain of GOS reduced, thereby the anisotropy grow when exceeding 60 seconds, and processibility reduces.
According to the present invention, can obtain being applicable to the Cu-Ni-Si series copper alloy of the projection welding excellent of the driving circuit of vehicle mounted or the circuit substrate of engine installation inside etc.
Embodiment
Below, embodiments of the present invention are described.
The copper alloy of present embodiment has by the Zn of the Si of the Ni that contains 1.0～4.0 % by weight, 0.1～1.0 % by weight, 0.3～0.7 % by weight, the Sn of 0.4～0.8 % by weight, remains the composition into Cu and inevitable impurity formation.
The electric conductivity of not making that has Ni and Si significantly reduces and puies forward high-intensity effect.Ni is less than 1.0 % by weight or Si during less than 0.1 % by weight, and without this effect, when Ni exceeded 4.0 % by weight or Si and exceeds 1.0 % by weight, hot workability significantly reduced.
Zn is unfavorable for improving the projection welding characteristic during less than 0.3 % by weight, if exceed 0.7 % by weight, and evaporation and weldability is worsened when projection welding.
The component of Sn for intensity is improved, during less than 0.4 % by weight, this effect is insufficient, and when exceeding 0.8 % by weight, when this effect was saturated, hot workability and cold-workability were deteriorated.
In addition, this copper alloy can contain at least a in the element that is comprised of Zr and Cr of 0.01～0.3 % by weight, and at least a by in these elements that contain 0.01～0.3 % by weight helps the further raising of projection welding.
In addition, this copper alloy can contain the Mg of 0.001～0.2 % by weight, by containing the Mg of 0.001～0.2 % by weight, the resistant to mold wear when helping punch process.
And then, mean value in whole crystal grain of the GOS that this copper alloy is measured with the EBSD method in crystal structure is 2.5 °～5.0 °, and (L σ/L) is more than 15～30% with respect to the ratio of total crystal boundary length L of crystal boundary with total special grain boundary length L σ of the special grain boundary of EBSD method mensuration.
Mean value in whole crystal grain of GOS is during less than 2.5 °, and the anisotropy grow of crystal structure causes processibility to reduce, if exceed 5.0 °, the fracture that is caused by grain-boundary crack occurs easily.
L σ/L is less than 15% the time, and rolling processibility variation if exceed 30%, the fracture that is caused by grain-boundary crack occurs easily.
That is, by the mean value in whole crystal grain of GOS and the L σ/L numerical range in the best, can form the protuberance with excellent in shape by punch process.
GOS is for measuring system by the crystalline orientation that is installed on scanning electron microscope, measure the orientation of respectively measuring pixel, the misorientation of measuring between pixel is being considered as crystal boundary more than 15 °, calculate the interior a certain pixel of crystal grain and the mean value of the misorientation between remaining whole pixel, each crystal grain has value.Mean value in whole crystal grain of GOS is the mean value of calculating the GOS of the whole crystal grain in the measurement range.
(L σ/L) is the orientation analysis that is undertaken by Electron Back-Scattered Diffraction to total special grain boundary length L σ of the special grain boundary of measuring with the EBSD method in the crystal structure with respect to the ratio of total crystal boundary length L of crystal boundary, be as crystal boundary between measuring point more than 15 ° with the misorientation between the measuring point of adjacency, measure total crystal boundary length L of crystal boundary, determine that the interface of the crystal grain of adjacency consists of the crystal boundary position of special grain boundary, calculated by total crystal boundary length L of the crystal boundary of total special grain boundary length L σ of special grain boundary and mensuration.
Like this, the Zn content of the copper alloy of present embodiment is 0.3～0.7 % by weight, mean value in whole crystal grain of the GOS that measures with the EBSD method is 2.5 °～5.0 °, (L σ/L) is 15～30% to total special grain boundary length L σ of the special grain boundary of measuring with the EBSD method, has fabulous projection welding with respect to the ratio of total crystal boundary length L of crystal boundary.
Below, the embodiment of manufacture method of the present invention is described.
The manufacture method of the copper alloy of present embodiment, when comprising successively hot rolling, first cold rolling, process annealing, the second cold rolling and stress relief annealed operation manufactured copper alloy, process velocity when making hot rolling on thickness direction is 13.0～28.0 mm/min, cooling beginning temperature is 500～700 ℃, 500～700 ℃ of lower enforcement process annealings 20～60 seconds, make 400～500 ℃ of lower enforcement low-temperature annealings 20～60 seconds.
Common copper nisiloy series copper alloy is by the sheet material of following process manufacturing as the final thickness of slab of target: wait proper method making ingot bar with continuous casting, this ingot bar is heated to carries out homogenizing annealing about 850～950 ℃, after the hot rolling, suppress separating out of Ni-Si compound with water cooling, then this hot rolling material is implemented cold rolling → solution treatment → ageing treatment → cold rolling processing and thermal treatment.Relative therewith, the manufacture method of present embodiment can by solution treatment and the ageing treatment that compound particles is separated out, be made the selected top condition of hot rolling, process annealing and low-temperature annealing.
Hot rolling is 13.0～28.0 mm/min making the process velocity on the thickness direction, and cooling beginning temperature is 500～700 ℃ of lower enforcements.
Process velocity during hot rolling is during less than 13.0 mm/min, and tissue becomes inhomogeneous, also generates thick precipitate, rolling processibility worsens, and when process velocity was larger, tissue became even, can suppress the growth of thick precipitate, but when exceeding 28.0 mm/min, on equipment, can't implement.
Cooling beginning temperature is during less than 500 ℃, and tissue becomes inhomogeneous, also generates thick precipitate, and rolling processibility worsens, and cooling beginning temperature is higher, and tissue becomes more even, makes energy waste become large, uneconomical but exceed 700 ℃ setting.
Process annealing is 500～700 ℃ of lower enforcements 20～60 seconds.
Temperature during process annealing is less than 500 ℃, and L σ/L rose and produced easily grain-boundary crack during less than 20 seconds the time, and rolling processibility is deteriorated, productivity losing.In addition, separate out timeliness and occur, electric conductivity rises, and weldability reduces.
Temperature during process annealing exceeds 700 ℃, and the time is organized solid solution when exceeding 60 seconds, and electric conductivity reduces, but the mean value in whole crystal grain of GOS reduces the anisotropy grow of micro organization, processibility reduction.
Low-temperature annealing is 400～500 ℃ of lower enforcements 20～60 seconds.
Temperature during low-temperature annealing is less than 400 ℃, and L σ/L rose and produced easily grain-boundary crack, thereby processibility reduces during less than 20 seconds the time.
Temperature during low-temperature annealing exceeds 500 ℃, and the time, the mean value in whole crystal grain of GOS reduced when exceeding 60 seconds, the anisotropy grow, and processibility reduces.
Zn content according to the copper alloy of this manufacture method manufacturing is 0.3～0.7 % by weight, mean value in whole crystal grain of the GOS that measures with the EBSD method is 2.5 °～5.0 °, (L σ/L) is 15～30% to total special grain boundary length L σ of the special grain boundary of measuring with the EBSD method, has fabulous projection welding with respect to the ratio of total crystal boundary length L of crystal boundary.
[embodiment]
Below, to embodiments of the invention, comprise that comparative example is elaborated.
Dissolve the copper alloy (adding element component in addition is Cu and inevitable impurity) that forms shown in the following table 1 with electric furnace, make the ingot bar of thickness 175mm, width 500mm, length 4m.After this ingot bar is heated to 950 ℃, carry out hot rolling with the process velocity of the thickness direction of 13.6～27.2 mm/min, carry out rapidly water cooling from 500～700 ℃, obtain the rolled stock of thickness of slab 12mm.Then, with milling cutter its surperficial oxide film is carried out surfacing cut after, carry out first cold rolling, 500～700 ℃ of process annealings of carrying out 20～60 seconds.And then, carry out second cold rollingly, be refined to thickness 0.25mm, 400～500 ℃ of low-temperature annealings of carrying out 20～60 seconds, obtain the copper alloy thin plate shown in the embodiment 1～9 of table 1.In addition, changing component composition, hot-rolled condition, process annealing condition and low-temperature annealing condition at comparative example 1～9 makes.Low-temperature annealing is not implemented in low-temperature annealing hurdle "-" expression of comparative example 9.
[table 1]
Gather the test film that structure observation is used by the copper alloy thin plate that obtains, after carrying out mechanical mill and polishing, carry out ion milling (the Ha イ テ ク System of Hitachi Off ラ Star ト ミ リ Application グ: to 90 ° of the input angles of test portion, acceleration voltage 6kV, 10 minutes) the adjustment surface, use the SEM (model " S-3400N ") of the Ha イ テ of Hitachi Network company manufacturing and EBSD mensuration, the analytical system OIM (Orientation Imaging Micrograph) that TSL company makes, respectively measure the orientation of pixel in the zone of 300 μ m * 300 μ m with the measuring space of 0.5 μ m.Afterwards, the misorientation that the analysis software (software name " OIM Analysis ") of use same systems will be measured between pixel is being considered as crystal boundary more than 15 °, calculate the interior a certain pixel of crystal grain and the mean value of the misorientation between remaining whole pixel, obtain the GOS of whole crystal grain, calculate the mean value in whole crystal grain of GOS.
In addition, adjusted each test film on surface for carrying out ion milling, use above-mentioned machine, zone for 300 μ m * 300 μ m, be as crystal boundary between measuring point more than 15 ° with the misorientation between the measuring point of adjacency, total crystal boundary length L of measuring the crystal boundary in the zone is measured, determine that the interface of the crystal grain of adjacency consists of the crystal boundary position of special grain boundary, obtain simultaneously the crystal boundary Length Ratio L σ/L of total crystal boundary length L of the crystal boundary of total special grain boundary length L σ of special grain boundary and said determination.
What table 2 showed these copper alloy thin plate measures mean value and L σ/L in whole crystal grain of the GOS obtain based on EBSD.
In addition, table 2 shows deep drawing processibility, the electric conductivity of these test portions, the measurement result of weldability.
The trier that the deep drawing processibility uses エ リ Network セ Application company to make is that Φ 10mm, lubricant are to make cup under the condition of lubricating grease in punching hole diameter, observes outward appearance, and what outward appearance was good is expressed as zero, runs through ear, crack be expressed as *.
For electric conductivity, the rectangle test film of processing 25mm * 150mm is measured resistance with quadripolar mesh procedure, is calculated by the average cross section method.
For weldability, prepare the thin rectangle test film of two 25mm * 150mm, make two overlapping in the longitudinal direction 25mm, the welding source (NT-8A) that uses Japanese ア PVC オ ニ Network ス company to make, welding timer (NRW-25A) and soldering tip (NA-72), be chromium-copper by material, diameter 16mm, the electrode of front end flat pattern is with plus-pressure 294N (30kgf), energising amount 80%, under the condition of 60 circulations (1.2 seconds) to the center implementation spot welding of the lap of test film, what test film engaged is expressed as zero, and test film is unassembled to be expressed as *.
[table 2]
Inferred by table 2, compare with comparative example that the Cu-Ni-Si series copper alloy of the Zn that contains 0.3～0.7 % by weight of embodiment is owing to having excellent deep drawing processibility and weldability, so need the projection welding of two characteristics excellent.
In addition, for each embodiment, respectively tension test is carried out with the test film B that comprises weld part in the test film A that does not contain weld part of copper alloy plate, the tensile strength that obtains is obtained the ratio of (tensile strength of test film B)/(tensile strength of test film A), and acetonideexample 3 and 4 is near 90% ratio.Hence one can see that, particularly contains the Cu-Ni-Si series copper alloy of Zr, the Cr of specified amount, and welding property excellent is applicable to the driving circuit of vehicle mounted or the circuit substrate of engine installation inside etc.
More than, embodiments of the present invention are illustrated, but the invention is not restricted to this record, in the scope that does not break away from purport of the present invention, can apply various changes.
Claims (5)
1. an Albatra metal-, it is characterized in that, have Si, the Zn of 0.3～0.7 % by weight, the Sn of 0.4～0.8 % by weight by the Ni that contains 1.0～4.0 % by weight, 0.1～1.0 % by weight, residue is the composition of Cu and inevitable impurity formation, the mean value of whole crystal grain that the grain orientation of measuring with the Electron Back-Scattered Diffraction method in the crystal structure is poor is 2.5 °～5.0 °, is 15～30% with total special grain boundary length L σ of the special grain boundary of Electron Back-Scattered Diffraction method mensuration with respect to the ratio L σ/L of total crystal boundary length L of crystal boundary.
2. copper alloy according to claim 1 is characterized in that, contains at least a in the element that is comprised of Zr and Cr of 0.01～0.3 % by weight.
3. copper alloy according to claim 1 is characterized in that, contains the Mg of 0.001～0.2 % by weight.
4. copper alloy according to claim 2 is characterized in that, contains the Mg of 0.001～0.2 % by weight.
5. the manufacture method of an Albatra metal-, it is characterized in that, manufacture method for the described copper alloy of any one in the claim 1 to 4, comprise successively hot rolling, first cold rolling, process annealing, the second cold rolling and low-temperature annealing, process velocity during described hot rolling on thickness direction is 13.0～28.0 mm/min, cooling beginning temperature is 500～700 ℃, 500～700 ℃ of described process annealings of lower enforcement 20～60 seconds, implements described low-temperature annealing 20～60 seconds under 400～500 ℃.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104388751A (en) * | 2014-11-05 | 2015-03-04 | 无锡阳工机械制造有限公司 | Method for preparing brine corrosion resistant alloy |
| CN104388859A (en) * | 2014-11-18 | 2015-03-04 | 昆明理工大学 | Method for simultaneously improving strength and plasticity of copper aluminum alloy |
| CN104404278A (en) * | 2014-11-05 | 2015-03-11 | 无锡阳工机械制造有限公司 | Preparation method of brine corrosion resistant alloy |
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| JP2003138330A (en) * | 2001-10-31 | 2003-05-14 | Chuo Spring Co Ltd | Copper-base alloy and its manufacturing method |
| CN1600881A (en) * | 2003-07-31 | 2005-03-30 | 日矿金属加工株式会社 | Cu-Ni-Si alloy having good performance against fatigure |
| CN1841570A (en) * | 2005-03-29 | 2006-10-04 | 日矿金属加工株式会社 | Thermal resistant tinned Cu-Ni-Si-Zn-Sn sieries alloy bar with excellent stripping character and tinned bar |
| JP2008106356A (en) * | 2006-09-27 | 2008-05-08 | Dowa Metaltech Kk | Copper alloy sheet and its manufacturing method |
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| CN104388751A (en) * | 2014-11-05 | 2015-03-04 | 无锡阳工机械制造有限公司 | Method for preparing brine corrosion resistant alloy |
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| CN104388859A (en) * | 2014-11-18 | 2015-03-04 | 昆明理工大学 | Method for simultaneously improving strength and plasticity of copper aluminum alloy |
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| CN103014409B (en) | 2016-04-06 |
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