CN102989654A - Thermal transfer and acoustic matching layers for ultrasound transducer - Google Patents
Thermal transfer and acoustic matching layers for ultrasound transducer Download PDFInfo
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- CN102989654A CN102989654A CN2012103393338A CN201210339333A CN102989654A CN 102989654 A CN102989654 A CN 102989654A CN 2012103393338 A CN2012103393338 A CN 2012103393338A CN 201210339333 A CN201210339333 A CN 201210339333A CN 102989654 A CN102989654 A CN 102989654A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
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- G—PHYSICS
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- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/004—Mounting transducers, e.g. provided with mechanical moving or orienting device
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
Abstract
The present invention relates to 'thermal transfer and acoustic matching layers for a ultrasound transducer'. An ultrasound transducer (900) includes a piezoelectric element (910) defining a front side (912) and a back side (914). The ultrasound transducer (900) includes a lens (908) connected to the front side (912) of the piezoelectric element (910), a heat sink (924) connected to the back side (914) of the piezoelectric element (910), and a backside matching layer (920) disposed between the piezoelectric element (910) and the heat sink (924). The backside matching layer (920) is thermally connected to the piezoelectric element (910) and the heat sink (924), and the backside matching layer (920) is configured to conduct heat from the piezoelectric element (910) to the heat sink (924).
Description
Related application
The application is the U.S. Patent application No. 12/833,101 that is filed on July 9th, 2010, the part continuation application, and required its priority, disclosing of this U.S. Patent application is incorporated herein by reference.
The research of federal funding or exploitation
[inapplicable]
Fiche/copyright reference
[inapplicable].
Technical field
The embodiment of present technique relates generally to and is configured to provide the ultrasonic transducer that improves thermal characteristics.
Background technology
As in Fig. 1, describing, Conventional Ultrasound transducer 100 can be by the various layers that comprise lens 102, impedance matching layer 104 and 106, piezoelectric element 108, liner 110 and the electric device that is used for being connected to ultrasonic system consist of.
In order to increase from the energy of transducer 100 outputs, impedance matching layer 104,106 is arranged between piezoelectric element 108 and the lens 102.Conventionally, best impedance matching thought when matching layer 104,106 with piezoelectric element 108 and lens 102 separate apart from x be hyperacoustic expectation wavelength of sending with resonant frequency about 1/4 to 1/2 and reach.Conventional view is that such configuration can be left matching layer 104 at ultrasonic wave, remain on the ultrasonic wave homophase of matching layer 104,106 internal reflections at 106 o'clock.
The ultrasonic wave that sends from transducer 100 can add thermal lens 102.Yet contact patient's transducer has about 40 degrees centigrade maximized surface temperature in order to avoid patient's discomfort and observe the control temperature extremes.Thereby the lens temperature can be the limiting factor of ripple transmitted power and transducer performance.
Many known thermal management technologies concentrate on the back side of transducer in order to minimize ultrasonic energy towards the reflection of lens.But, need to have and have the improvement ultrasonic transducer that improves thermal characteristics.
Summary of the invention
The embodiment of present technique relates generally to ultrasonic transducer and makes the method for ultrasonic transducer.
In one embodiment, ultrasonic transducer comprises the piezoelectric element that has defined front and the back side, and piezoelectric element is configured to convert the electrical signal to the ultrasonic wave that sends facing to target in the past, and the ultrasonic wave that piezoelectric element is configured to receive converts the signal of telecommunication to.This ultrasonic transducer comprises the lens of the front that is connected to piezoelectric element, is connected to the radiator at the back side of piezoelectric element, and is arranged on the back side matching layer between piezoelectric element and the radiator.Back side matching layer is thermally connected to piezoelectric element and radiator.Back side matching layer is configured to heat is transmitted to radiator from piezoelectric element.
In one embodiment, ultrasonic transducer comprises the piezoelectric element that has defined front and the back side.Piezoelectric element is configured to convert the electrical signal to the ultrasonic wave that sends facing to target in the past.The ultrasonic wave that piezoelectric element is configured to receive converts the signal of telecommunication to.Ultrasonic transducer comprises the lens of the front that is connected to piezoelectric element, is connected to the radiator at the back side of piezoelectric element, and the back side matching layer that is connected to piezoelectric element and radiator.Back side matching layer comprises and is configured to extend beyond the end of piezoelectric element to the wing plate of radiator.Back side matching layer is configured to heat is transmitted to radiator from piezoelectric element.
In one embodiment, a kind of method of making ultrasonic transducer comprises the front that matching layer is attached to piezoelectric element, back side matching layer is attached to the back side of piezoelectric element, and back side matching layer is connected to radiator, wherein radiator is towards the back side of piezoelectric element.
Description of drawings
Fig. 1 describes the cross section of the layer of prior art ultrasonic transducer.
Fig. 2 A describes the cross section according to the layer of the ultrasonic transducer of the embodiment use of present technique.
Fig. 2 B is the matching layer attribute list according to the ultrasonic transducer of the embodiment use of present technique.
Fig. 3 describes the cross section according to the layer of the ultrasonic transducer of the embodiment use of present technique.
Fig. 4 describes the cross section according to the layer of the ultrasonic transducer of the embodiment use of present technique.
Fig. 5 describes the cross section according to the layer of the ultrasonic transducer of the embodiment use of present technique.
Fig. 6 describes the perspective view according to the layer of the ultrasonic transducer of the embodiment use of present technique.
Fig. 7 describes the Computer simulation results according to the ultrasonic transducer of the embodiment use of present technique.
Fig. 8 describes conventional transducer and the chart of the thermometric result of the test at the lens surface place of the transducer built according to the embodiment of present technique.
Fig. 9 describes the cross section according to the layer of the ultrasonic transducer of the embodiment use of present technique.
Figure 10 describes the perspective view according to the ultrasonic transducer of the embodiment use of present technique.
Figure 11 describes the cross section according to the layer of the ultrasonic transducer of the embodiment use of present technique.
Figure 12 describes the chart of display simulation data.
Figure 13 describes the chart of display simulation data.
The following detailed description of the summary of the invention of front and some embodiment will better be understood when reading when being combined with accompanying drawing.For purpose of the present invention is described, some embodiment illustrates in the drawings.Yet, should be appreciated that the setting shown in the accompanying drawing and the instrument of the invention is not restricted to.
The specific embodiment
The embodiment of present technique relates generally to and is configured to provide the ultrasonic transducer that improves thermal characteristics.In the drawings, similarly element identifies with similar identifier.
Fig. 1 describes the cross section of the layer of prior art ultrasonic transducer 100.Transducer 100 is described in background technology, and comprises two matching layers 104,106 that are arranged between lens 102 and the piezoelectric element 108.Matching layer 104,106 provides the combined distance x between lens 102 and the piezoelectric element 108, and this is about 1/4 to 1/2 of hyperacoustic expectation wavelength of sending with resonant frequency apart from x.
Fig. 2 A describes the cross section according to the layer of the ultrasonic transducer 200 of the embodiment use of present technique.Transducer 200 comprises lens 102, impedance matching layer 203-206, piezoelectric element 108, liner 110 and is used for being connected to the electric device of ultrasonic system.Liner 110 comprises radiator (heat sink) and heat management.In certain embodiments, matching layer 203-206, piezoelectric element 108 and lens 102 can use epoxy resin or the adhesive material that hardens is bonded together under the pressure that is provided by for example technological equipment and/or press.
As utilize Conventional Ultrasound transducer, piezoelectric element 108 can convert the electrical signal to ultrasonic wave to send towards target and also can convert the ultrasonic wave that receives to the signal of telecommunication.Ultrasonic wave that arrow 112 is described to send from transducer 200 and that receive at transducer 200.The ultrasonic wave of this reception can be used to form by ultrasonic system the image of target.
In order to increase from the energy of transducer 100 outputs, impedance matching layer 203-206 is arranged between piezoelectric element 108 and the lens 102.Matching layer 203-206 is piezoelectric element 108 and lens 102 distance of separation y, and it can be less than or greater than apart from x (this distance be hyperacoustic expectation wavelength of sending with resonant frequency about 1/4 to 1/2).
As describing in Fig. 1, conventional transducer generally comprises two matching layers 104,106.Such matching layer generally comprises epoxy resin and filler.Have been found that and comprise that near piezoelectric element the matching layer with relatively high acoustic impedance and relatively high thermal conductivity can improve thermal characteristics and/or sound attribute.Embodiment shown in this paper describes to have the invention transducer of three or four matching layers.But embodiment can comprise for example few to two matching layers with greater than four matching layers, for example five or six matching layers.
Fig. 2 B is the attribute list of matching layer 203-206 of the embodiment of invention ultrasonic transducer.Be arranged on that matching layer 206 between piezoelectric element 108 and the matching layer 205 can comprise acoustic impedance with about 10-20MRayl and greater than the about material of the thermal conductivity of 30W/mK.Matching layer 206 can have the thickness less than about 0.22 λ, and wherein λ is the hyperacoustic expectation wavelength that sends with resonant frequency.In certain embodiments, matching layer 206 can comprise for example metal, such as copper, copper alloy, the copper with embedding graphite pattern wherein, magnesium, magnesium alloy, semi-conducting material, aluminium (plate or rod) and/or aluminium alloy etc. such as silicon.Metal can have relatively high acoustic impedance so that ultrasonic wave propagates through this layer with higher speed, needs thus thicker matching layer to reach the sound characteristics of expectation.
Be arranged on matching layer 205 between matching layer 206 and the matching layer 204 and can comprise acoustic impedance with about 5-15MRayl and the about material of the thermal conductivity of 1-300W/mK.Matching layer 205 can have the thickness less than about 0.25 λ.In certain embodiments, matching layer 205 can comprise for example metal, such as epoxy resin, glass ceramics, composite ceramics and/or the macor (glass ceramics) etc. of copper, copper alloy, the copper with embedding graphite pattern wherein, magnesium, magnesium alloy, aluminium (plate or rod), aluminium alloy, filling.
Be arranged on matching layer 204 between matching layer 205 and the matching layer 203 and can comprise acoustic impedance with about 2-8MRayl and the about material of the thermal conductivity of 0.5-50W/mK.Matching layer 204 can have the thickness less than about 0.25 λ.In certain embodiments, matching layer 204 can comprise for example nonmetal, such as epoxy resin with filler (such as silica filled thing etc.) etc.In certain embodiments, matching layer 204 can comprise for example graphite mould material.Can have relatively low acoustic impedance so that ultrasonic wave propagates through this layer with lower speed such as epoxy resin with filler etc. is nonmetal, need thus thinner matching layer to reach the sound characteristics of expectation.
Be arranged on matching layer 203 between matching layer 204 and the lens 102 and can comprise acoustic impedance with about 1.5-3MRayl and the about material of the thermal conductivity of 0.5-50W/mK.Matching layer 203 can have the thickness less than about 0.25 λ.In certain embodiments, matching layer 203 can comprise for example nonmetal, such as plastics and/or have epoxy resin of filler (such as silica filled thing etc.) etc.
In an embodiment, the acoustic impedance of matching layer 203-206 reduces when the distance of matching layer 203-206 tripping electric device 108 increases.That is, matching layer 206 can have the acoustic impedance higher than matching layer 205, and matching layer 205 can have the acoustic impedance higher than matching layer 204, and matching layer 204 can have the acoustic impedance higher than matching layer 203.Having been found that to provide to have adopts the three or more matching layers of the acoustic impedance that this mode reduces that for example improved sound attribute, such as the sensitivity that increases and/or the edge bandwidth of increase etc. can be provided.For example, improved like this sound attribute can improve the detection such as the structure in the targets such as human body.
In an embodiment, matching layer 205,206 thermal conductivity are greater than matching layer 203,204 thermal conductivity.Have been found that the matching layer (for example matching layer 205 and/or 206) with relative high heat conductance is set can provide improved thermal characteristics near piezoelectric element 108.For example, such matching layer can ratio such as the heat that more easily dissipates and produced by piezoelectric element 108 than the matching layer of lower thermal conductivity such as matching layer 203 and 204.
Fig. 3 describes the cross section according to the layer of the ultrasonic transducer 300 of the embodiment use of present technique.Transducer 300 comprises the first impedance matching layer 303, the second impedance matching layer 304, the 3rd impedance matching layer 305, piezoelectric element 308 and liner 310.This layer of describing comprises larger otch 312 and less otch 314.Larger otch 312 extends through matching layer 303-305, by piezoelectric element 308 and enter liner 310.Larger otch 312 can provide the electricity between the part of piezoelectric element 308 to separate.Less otch 314 extends through matching layer 303-305 and part is passed through piezoelectric element 308.Less otch not exclusively extends through piezoelectric element 308, and does not extend into liner 310.Less otch 314 does not provide the electricity between the part of piezoelectric element 308 to separate.Less otch 314 for example can improve acoustic performance by the horizontal vibration between the neighbouring part of this layer of damping.In certain embodiments, otch can provide about 30 to 1 notch depth and kerf width ratio.In certain embodiments, larger otch can provide about 1.282 millimeters notch depth and less otch can provide about 1.085 millimeters notch depth, and the otch of two types all provides for example about 0.045 millimeter kerf width.In certain embodiments, otch can provide for example about 0.02 to 0.045 millimeter kerf width.Have been found that the thickness with matching layer 203-206 minimizes and can provide improved acoustic performance by the scribing (dicing) of permission as the transducer layer of describing in Fig. 3.Finding also that thickness with matching layer 203-206 minimizes can become possibility so that adopt less than 30 to 1 notch depth and the scribing of kerf width ratio.Use current scribing technology, such as the scribing of using scribing machine etc., be difficult to obtain notch depth and kerf width ratio greater than 30 to 1.For example, can use laser or other known methods in transducer layer, to make otch.
Fig. 4 describes the cross section according to the layer of the ultrasonic transducer 400 of the embodiment use of present technique.Transducer 400 configurations are similar to the transducer 200 of describing in Fig. 2 A.Yet transducer 400 comprises that matching layer 401 replaces matching layer 206.Matching layer 401 is arranged between piezoelectric element 108 and the matching layer 205, and can comprise material and the thickness similar to the matching layer 206 of describing in Fig. 2 A.Matching layer 401 comprises that the end that extends beyond piezoelectric element 108 extends to the wing plate 402 of liner 110.
Can so that extending beyond bringing in of piezoelectric element 108, it form wing plate 402 by matching layer 401 is provided.A plurality of cuttings 403 can be provided in the surface of matching layer 401, and matching layer 401 extend beyond piezoelectric element 108 end part can folding so that cutting 403 be arranged on as shown in Figure 4 around the outer elbow of bending and/or its away from cutting 403 towards piezoelectric element 108 and liner 110.In case when wing plate 402 was provided near the end of piezoelectric element 108 and liner 110, this folding operation can be finished.
Fig. 5 describes the cross section according to the layer of the ultrasonic transducer 500 of the embodiment use of present technique.Transducer 500 configurations are similar to the transducer 200 of describing in Fig. 2 A.Yet transducer 500 comprises that matching layer 501 replaces matching layer 206.Matching layer 501 is arranged between piezoelectric element 108 and the matching layer 205, and can comprise material and the thickness similar to the matching layer 206 of describing in Fig. 2 A.Matching layer 501 extends beyond the end of piezoelectric element 108.For example, in an embodiment, matching layer 501 can extend beyond about one millimeter or still less of the end of piezoelectric element 108.Be attached to matching layer 501 the extension plate 502 extend through piezoelectric elements 108 end and extend to liner 110.Plate 502 can use heat-conduction epoxy resin to be attached to matching layer 501.Plate 502 for example comprises the relatively material of high heat conductance, such as material, graphite and/or the heat-conduction epoxy resin etc. identical with matching layer 501.Plate 502 is configured to conduct heat to radiator and/or heat management at liner 110 from piezoelectric element 108.The relative high thermal conductivity of matching layer 501 and plate 502 can be assisted towards the liner 110 of transducer 500 and away from the expectation heat of lens 102 and be transmitted.
Fig. 6 describes the perspective view according to the layer of the ultrasonic transducer 600 of the embodiment use of present technique.Transducer 600 comprises impedance matching layer 401, piezoelectric element 308 and the liner 310 with wing plate 402.Other impedance matching layers and lens are not described in Fig. 6.The layer of describing comprises larger otch 312 and less otch 314, and these otch are haply perpendicular to azimuth direction (a) and be parallel to haply vertical direction (e).Larger otch 312 extends through matching layer, by piezoelectric element 308 and enter liner 310.Less otch 314 extends through matching layer and part is passed through piezoelectric element 308.Less otch not exclusively extends through piezoelectric element 308, and does not extend into liner 310.Wing plate 402 is arranged near four limits of transducer 600 and will can conducts heat to radiator and/or heat management at liner 110 from piezoelectric element 308 towards the folding so that wing plate 402 of piezoelectric element 308 and liner 310.In other embodiments, wing plate 402 can be provided at transducer one, two, three or four limit near.For example, in certain embodiments, wing plate 402 can be only provides along two opposite side of transducer, so that wing plate is arranged to haply perpendicular to otch 312 and 314.In such embodiments, wing plate 402 extends (e) along azimuth direction (a) rather than vertical direction.
Fig. 7 describes the Computer simulation results according to the ultrasonic transducer of the embodiment use of present technique.Fig. 7 describes to have the result of analog study of the 3.5MHz one-dimensional linear array energy transducer of three matching layers.The matching layer (the first matching layer) of close piezoelectric element comprises the aluminium bar of the acoustic impedance with 13.9MRayl.The second matching layer comprises the epoxy resin of the filling of the acoustic impedance with 6.127MRayl.The 3rd matching layer comprises the not restriction material (its can such as being plastics and/or the epoxy resin with filler (such as silica filled thing etc.)) of the acoustic impedance with 2.499MRayl.Consider these acoustic impedances, simulation has indicated these layers can have the respective thickness of 0.2540 millimeter (aluminium bar), 0.1400 millimeter (epoxy resin of filling), 0.1145 millimeter (not limiting material).This computer simulation shows matching layer can be than thinner at the matching layer in the conventional transducer (for example describing among Fig. 1, it can have about 1/4 matching layer thickness of hyperacoustic expectation wavelength of sending with resonant frequency) to the distance of outside matching layer (such as from as in the distance y of the matching layer 206 to 203 of describing Fig. 2 etc.) internally.Such simulation can use for example KLM model, Mason model and/or finite element modelling to determine the characteristic of expectation.
The analog study of acoustic performance can be used for Optimized Matching layer characteristic so that have the acoustic impedance of expectation and the matching layer of thermal conductivity provides minimum thickness, allows thus cutting operation more effectively to carry out.
Fig. 8 is depicted in conventional transducer and the chart 800 of the thermometric result of the test of the lens surface of the transducer built according to the embodiment of present technique.This chart is marked and drawed the relation at the temperature and time of lens surface.The temperature survey of the transducer that the temperature survey of conventional transducer is built by line 802 indications and according to the embodiment of present technique is by line 804 indications.At duration of test, two transducers are connected to ultrasonic system under the same terms and setting value.During 40 minutes period, keep than cold about 3 to the 4 degrees centigrade lens surface temperature of conventional transducer according to the transducer that the embodiment of present technique builds.
Fig. 9 describes the cross section of the layer of ultrasonic transducer 900.Transducer 900 comprises three matching layers 902,904 and 906 that are arranged between lens 908 and the piezoelectric element 910.Other embodiment may comprise the matching layer of varying number.For example, some embodiment may comprise only two matching layers, and other embodiment may comprise four or more matching layers.Piezoelectric element 910 can convert the electrical signal to target-bound ultrasonic wave, can also convert the ultrasonic wave that receives to the signal of telecommunication.Piezoelectric element is shaped to definition front 912 and the back side 914.For the purpose of this disclosure, front 912 is defined as and comprises the face of therefrom launching hyperacoustic piezoelectric element 910 towards lens 908.The back side 914 is defined as and comprises relative with front 912 and towards the face away from the piezoelectric element 910 of lens 908.Ultrasonic transducer 900 comprises the solution matching layer 916 at the back side 914 that is connected to piezoelectric element 910, and is attached to the contraction flow region (flex) 918 of separating matching layer 916.Piezoelectric element 910 can be piezoelectric, as lead zirconate titanate (PZT) or PZT composite.According to other embodiment, piezoelectric can also comprise monocrystalline, for example PMN-PT.Ultrasonic transducer 910 also comprises back side matching layer 920, heating pad 922 and radiator 924.
In certain embodiments, matching layer 902,904 and 906, piezoelectric element 910 and lens 908 other jointing material that can use epoxy resin or solidify (for example, being applied by the tool equipment that comprises press) under pressure is bonded together.Arrow 927 is described the ultrasonic wave by ultrasonic transducer 900 transmissions and reception.The ultrasonic wave that receives can be used to produce by ultrasonic system the image of target.
Matching layer 902,904 and 906 is arranged between piezoelectric element 910 and the lens 908, to increase from the energy of the ripple of ultrasonic transducer 900 transmissions.Matching layer 902,904 with 906 each can be formed with one or more different fillers by epoxy resin.Filler can be used for regulating matching layer 902 according to present embodiment, 904 and 906 each acoustic impedance.Embodiment shown in Figure 10 comprises three matching layers, but other embodiment can have or still less or extra matching layer.For example, other embodiment can have single matching layer, and two matching layers, or a plurality of three matching layers substitute matching layer shown in Figure 9 902,904 and 906.
As mentioned above, three matching layers 902,904 and 906 each thickness can be ultrasonic transducer 900 the resonant frequency place wavelength or still less.Yet, according to other embodiment, what matching layer 902,904 and 906 can be more than the wavelength at the resonant frequency place of ultrasonic transducer 900.For example, according to embodiment, matching layer one or more can be the resonant frequency place wavelength roughly.Can select each matching layer 902,904 and 906 acoustic impedance to reduce the mismatch of the acoustic impedance between piezoelectric element 910 and the lens 908.Matching layer 902,904 and 906 causes hyperacoustic emission and/or the refraction still less between piezoelectric element 910 and the lens 908.Lens 908 can have the roughly acoustic impedance of 1.5MRayl, and piezoelectric element 910 can have the acoustic impedance of 30 MRayl.According to other embodiment, lens 908 can have and are positioned at 1.2 MRayl to the acoustic impedance of any position of 1.6 MRayl scopes, and piezoelectric element 910 can have and is positioned at 20 MRayl to the acoustic impedance of any position of 40 MRayl scopes.The first matching layer 902 can have the acoustic impedance of 10-20 MRayl, and the second matching layer 904 can have the acoustic resistance of 5-15 MRayl, and the 3rd matching layer 906 can have the acoustic impedance of 2-8 MRayl.
Matching layer 902,904 and 906 each can be expectation wavelength roughly or still less, with minimize by by matching layer 902,904 and 906 each between the destructive interference that causes of the ripple of edge reflection.Matching layer 902,904 and 906 each can be by metal, copper for example, copper alloy has the copper of embedding graphite pattern wherein, magnesium, magnesium alloy, aluminium, aluminium alloy, the epoxy resin of filling, glass ceramics, composite ceramics, and/or macor.
In one embodiment, along with matching layer 902,904 and 906 and piezoelectric element 910 between the increase of distance, matching layer 902,904 and 906 acoustic impedance reduce.That is, the first matching layer 902 can have the acoustic impedance that is higher than the second matching layer 904, and second join layer and 904 the acoustic impedance that is higher than the 3rd matching layer 906 can be arranged.According to an embodiment, matching layer 902,904 with 906 each relative high thermal conductivity is arranged, for example be higher than 30W/mK.
Separate matching layer 916 and have the acoustic impedance that is higher than piezoelectric element 910, send to hyperacoustic power of lens 908 with increase.According to an embodiment, separating matching layer 916 can be made of metal, carbide alloy for example, and it has and has 40 MRayl to the acoustic impedance of 120 MRayl according to example embodiment.The acoustic impedance of separating matching layer 916 is relatively high, with on acoustics " pincers " firmly piezoelectric element so that most of acoustic energy is sent out the front 912 of piezoelectric element 910.Should recognize that other embodiment may use by different materials and make and/or have an acoustic impedance of selecting in the different range.In other embodiment, ultrasonic transducer can not have the solution matching layer.
Back side matching layer 920 is attached to contraction flow region 918.According to embodiment, back side matching layer 920 can be aluminium, but also can use other Heat Conduction Material, comprises aluminium alloy, copper, copper alloy and other metal.
Back side matching layer 920 is conciliate matching layer 916 indirect joints to piezoelectric element 910 via contraction flow region 918..For the purpose of this disclosure, term " indirect joint " is defined as and comprises via one or more supernumerary structures or interconnective two structures of assembly.According to an embodiment, piezoelectric element 910, solution matching layer 916 and contraction flow region 918 can be used Heat Conduction Material, and the epoxy resin that for example has the conductibility additive is bonded together.Heat is from piezoelectric element 910, and through separating matching layer 916, contraction flow region 918 is transmitted to the matching layer back side 920.According to embodiment, contraction flow region 918. can be relatively thin, for example about 100 μ m or still less.Although contraction flow region 918 can comprise the copper tracing wire (copper traces) with dielectric polyimide layer, but because thin (thinness) of contraction flow region 918, heat still can be transferred to back side matching layer 920 from separating matching layer 916 through contraction flow region 918 effectively.The additional detail of back side matching layer 920 can be described after this paper.
Although separate the major part that matching layer 916 has been eliminated the acoustic energy of launching from the back side of piezoelectric element 910, some acoustic energy still can send by separating matching layer 916, contraction flow region 918 and back side matching layer 920.For making the acoustic energy damping, ultrasonic transducer 900 comprises heating pad 922.Heating pad 922 is made by the material with relatively high acoustic attenuation, so it can weaken the ultrasonic wave from piezoelectric element 910.For example, heating pad 922 can be by the epoxy resin with filler of titanium dioxide for example and is made.Heating pad 922 can be that roughly 2 mm are thick.In other embodiments, heating pad 922 can be that 1 mm is to thick between 20 mm.Yet when heating pad 922 is when being made by the epoxy resin with filler, it tends to have relatively low thermal conductivity-for example, has the thermal conductivity of epoxy resin of titanium dioxide usually less than 10 W/m.K.
According to embodiment, described layer can comprise through matching layer 902,904 and 906 and a plurality of larger otch (not shown) of piezoelectric element 910, separate with the electricity between the part that piezoelectric element 910 is provided.In addition, described layer can comprise through matching layer 902,904 and 906 and a plurality of less otch of the part of piezoelectric element 910 with the effective damping horizontal vibrating.
Figure 10 is the perspective view of ultrasonic transducer 900 shown in Figure 9.With common reference number come assembly common between marked graph 9 and Figure 10.Figure 10 shows and is positioned at the wing plate 926 that they are folded to the extended position before contacting with radiator 924.The sectional view of Fig. 9 only shows two in 4 wing plates 926.In Figure 10, back side matching layer 920 comprises four wing plates 926 clearly.Also show reference axis 930 among Figure 10.Embodiment shown in Figure 10 is included in the wing plate 926 that following direction is extended: from positive x and the negative x direction of ultrasonic transducer 900, and from positive y and the negative y direction of ultrasonic transducer 900.
The back side matching layer of other embodiment can comprise and is less than four wing plates.For example, an embodiment (not shown) can comprise having the only matching layer of two wing plates.If embodiment has only two wing plates, what then have superiority is the substantially parallel wing plate that arranges of any otch that possible itself and scribing operating period are caused.That is, if the scribing otch in the y direction, then wing plate extends in positive and negative y direction and has superiority, so that the not scribing of piezoelectric element 910 partly provides from piezoelectric element 910 to wing plate 926 good hot path.
According to the embodiment with four wing plates 926, for example shown in Figure 10, any gap that scribing operating period produces can be by the heat conduction of for example RTV or epoxy resin but the material of electric insulation fill.By filling the otch of scribing operating period formation, heat can flow to radiator 924 through back side matching layer 920 from piezoelectric element 910.Those skilled in the art should recognize that the wing plate 926 shown in Figure 10 will be thermally connected to radiator 924 before ultrasonic transducer 900 uses.In addition, should recognize that other embodiment can have the substantially vertically disposed one or more wing plates 926 of any otch that cause with scribing operating period.
Figure 11 has described the cross section of ultrasonic transducer 950.The essentially identical assembly of assembly that uses common reference number to describe with the relative Fig. 9 of identification preamble.The assembly that preamble has been described will no longer be described in detail.Ultrasonic transducer 950 comprises back side matching layer 952, and it comprises two parts 954 of the end 955 that extends beyond piezoelectric element 910.Heat-conducting plate 956 is thermally connected to radiator 924 with each part 954.As about the embodiment shown in Fig. 9, back side matching layer 952 is configured to conduct heat to radiator 924.According to example embodiment, back side matching layer 952 can be aluminum or aluminum alloy.Heat-conducting plate 956 also can be aluminum or aluminum alloy.Heat-conducting plate 956 can be directly connected to back side matching layer or join back side matching layer 952 to by the material such as heat-conduction epoxy resin or scolder.
In certain embodiments, technology described herein can be together with one-dimensional linear array energy transducer, two-dimensional transducer and/or annular array transducer application.In certain embodiments, technology described herein can be together with the transducer application of any geometry.
Figure 12 has described to illustrate the chart of analogue data.Chart 970 shows for not with the conventional ultrasound transducer of back side matching layer with according to embodiment sending/receiving transfer function with the ultrasonic transducer of 200 μ m back side matching layers on the aluminium liner.The drawing of conventional ultrasound transducer represents by line, and represented by band line a bit with the drawing of the ultrasonic transducer of back side matching layer.For the part of two identical spectrums of drawing, it is visible that band line is a bit only arranged on chart 970.On most of frequencies, the sending/receiving transfer function is approximately uniform.The sending/receiving transfer function is distinguished to 4.5 MHz to some extent from 1.5 MHz to 2.8 MHz with from 3.2 MHz.For every other frequency, be indistinguishable according to the ultrasonic transducer of embodiment and the sending/receiving transfer function of conventional ultrasound transducer from chart 970.Show according to the acoustic performance of the acoustic performance of the ultrasonic transducer of embodiment and conventional ultrasound transducer very approaching according to the similitude between the sketch of the sending/receiving transfer function of the transducer of embodiment and conventional ultrasound transducer.This simulation has proved that adding back side matching layer does not hinder the acoustic performance according to the ultrasonic transducer of embodiment.
Figure 13 has described to illustrate the chart of analogue data.Chart 975 shows the conventional ultrasound transducer of not being with back side matching layer and according to embodiment pulse echo with the ultrasonic transducer of 200 μ m back side matching layers on the aluminium liner.The drawing of conventional ultrasound transducer represents by line, and the figure with ultrasonic transducer of back side matching layer is represented by band line a bit.For the part of two identical spectrums of drawing, it is visible that band line is a bit only arranged on chart 975.Conventional ultrasound transducer and be approximately uniform according to the pulse echo of the ultrasonic transducer of embodiment.Pulse echo at whenabouts 0.9s to time 1.1s and from being different shortly past time 1.2s to time proximity 1.8s.All that describe at chart 975 At All Other Times, based on chart 975, the pulse echo of conventional ultrasound transducer and be undistinguishable according to the pulse echo of the ultrasonic transducer of embodiment.This shows that the acoustic performance according to the ultrasonic transducer of present embodiment is very similar to conventional ultrasound transducer, and adding back side matching layer does not hinder the acoustic performance according to the ultrasonic transducer of embodiment.
According to first aspect, a kind of ultrasonic transducer is disclosed, comprise the piezoelectric element that has defined front and the back side, described piezoelectric element is configured to convert the electrical signal to the ultrasonic wave that sends from described front head for target, and the ultrasonic wave that described piezoelectric element is configured to receive converts the signal of telecommunication to; Be connected to the lens of the described front of described piezoelectric element; Be connected to the radiator at the described back side of described piezoelectric element; Be arranged on the back side matching layer between described piezoelectric element and the described radiator, described back side matching layer is thermally connected to described piezoelectric element and described radiator, and wherein said back side matching layer is configured to heat is transmitted to described radiator from described piezoelectric element.
Preferably, described lens indirect joint is to described piezoelectric element.Further, also comprise the first matching layer that is arranged between described lens and the described piezoelectric element, described the first matching layer has the first sound impedance and greater than the thermal conductivity of 30 W/mK.
Preferably, described back side matching layer indirect joint is to described piezoelectric element.Further, described back side matching layer indirect joint is to described radiator.Further, also comprise the second matching layer between the described lens that are attached to described the first matching layer and are arranged on described the first matching layer, described the second matching layer has the rising tone impedance that is lower than described first sound impedance.
Preferably, described back side matching layer is directly connected to described radiator.
Ultrasonic transducer according to first aspect preferably also comprises: be arranged on the heating pad between described piezoelectric element and the described radiator, wherein said heating pad has the thermal conductivity that is lower than 10 W/m.K.
Ultrasonic transducer according to first aspect preferably also comprises: be attached to the heat-conducting plate of described piezoelectric element and described radiator, wherein said heat-conducting plate is configured to heat is transmitted to described radiator from described piezoelectric element.
According to second aspect, a kind of ultrasonic transducer is disclosed, comprise the piezoelectric element that has defined front and the back side, described piezoelectric element is configured to convert the electrical signal to the ultrasonic wave that sends from described front head for target, and the ultrasonic wave that described piezoelectric element is configured to receive converts the signal of telecommunication to; Be connected to the lens of the described front of described piezoelectric element; Be connected to the radiator at the described back side of described piezoelectric element; Be connected to the back side matching layer of described piezoelectric element and described radiator, described back side matching layer comprises the end that is configured to extend beyond described piezoelectric element to the wing plate of described radiator, and wherein said back side matching layer is configured to heat is transmitted to described radiator from described piezoelectric element.
Ultrasonic transducer according to second aspect preferably also comprises: be arranged on the heating pad between described back side matching layer and the described radiator, the wherein said heating pad ultrasonic wave from described piezoelectric element that is configured to decay.
Ultrasonic transducer according to second aspect preferably also comprises: the heat-conducting plate that is attached to described wing plate and described radiator.Further, described heat-conducting plate is attached to described wing plate and described radiator by epoxy resin.
According to the third aspect, a kind of method of making ultrasonic transducer is disclosed, comprising: the front that matching layer is attached to piezoelectric element; Back side matching layer is attached to the back side of described piezoelectric element; And described back side matching layer is connected to radiator, wherein said radiator is towards the described back side of described piezoelectric element.
Preferably, described back side matching layer comprises the wing plate of the end that is configured to extend beyond described piezoelectric element; Described method further comprises described wing plate folding, so that described wing plate extends beyond the described end of described piezoelectric element to described radiator.
Method according to the third aspect preferably also comprises: cut a plurality of cuttings on the surface of described wing plate before described folding described wing plate, and wherein said folding described wing plate comprises with described wing plate folding away from described cutting.
Preferably, wherein said back side matching layer comprises the part of the end that is configured to extend beyond described piezoelectric element, and described method comprises further that the described part with described back side matching layer is connected to and is configured to the heat-conducting plate that extends to described radiator.
Preferably, use epoxy resin that described matching layer, described back side matching layer and described radiator is attached.
Method according to the third aspect preferably also comprises: the front that lens is attached to described piezoelectric element.
Method according to the third aspect preferably also comprises: the second matching layer is attached to described matching layer, and described the second matching layer has the rising tone impedance that is lower than described first sound impedance.
The technology of using this paper can provide the technique effect of improvement sound attribute and/or thermal characteristics.For example, can allow transducer to use with the power level that increases away from transducer lens the heat guiding, improve thus signal quality and picture quality.
The present invention described herein not only stretches and transducer described herein, and also stretches and make the method for such transducer.
Although the present invention describes with reference to embodiment, those skilled in that art will understand and can make various changes and replaceable equivalent and do not depart from scope of the present invention.In addition, can make many modifications so that particular case or material are adapted to instruction of the present invention and do not depart from their scope.Therefore, regulation the invention is not restricted to disclosed specific embodiment, and the present invention will comprise all embodiment in the scope that falls into the claim of enclosing.
List of parts
Claims (13)
1. a ultrasonic transducer (900) comprising:
Defined the piezoelectric element (910) of front (912) and the back side (914), described piezoelectric element (910) is configured to convert the electrical signal to the ultrasonic wave that sends from described front (912) head for target, and the ultrasonic wave that described piezoelectric element (910) is configured to receive converts the signal of telecommunication to;
Be connected to the lens (908) of the described front (912) of described piezoelectric element (910);
Be connected to the radiator (924) at the described back side (914) of described piezoelectric element (910);
Be arranged on the back side matching layer (920) between described piezoelectric element (910) and the described radiator (924), described back side matching layer (920) is thermally connected to described piezoelectric element (910) and described radiator (924), and wherein said back side matching layer (920) is configured to heat is transmitted to described radiator (924) from described piezoelectric element (910).
2. ultrasonic transducer as claimed in claim 1 (900), wherein said lens (908) indirect joint is to described piezoelectric element (910).
3. ultrasonic transducer as claimed in claim 1 (900), wherein said back side matching layer (920) indirect joint is to described piezoelectric element (910).
4. ultrasonic transducer as claimed in claim 3 (900), wherein said back side matching layer (920) indirect joint is to described radiator (924).
5. ultrasonic transducer as claimed in claim 1 (900), wherein said back side matching layer (920) is directly connected to described radiator (924).
6. ultrasonic transducer as claimed in claim 2 (900), further comprise the first matching layer (902) that is arranged between described lens (908) and the described piezoelectric element (910), described the first matching layer (902) has the first sound impedance and greater than the thermal conductivity of 30 W/mK.
7. ultrasonic transducer as claimed in claim 3 (900), further comprise the second matching layer (904) between the described lens (908) that are attached to described the first matching layer (902) and are arranged on described the first matching layer (902), described the second matching layer (904) has the rising tone impedance that is lower than described first sound impedance.
8. ultrasonic transducer as claimed in claim 1 (900), further comprise the heating pad (922) that is arranged between described piezoelectric element (910) and the described radiator (924), wherein said heating pad (922) has the thermal conductivity that is lower than 10 W/m.K.
9. ultrasonic transducer as claimed in claim 1 (900), further comprise the heat-conducting plate (956) that is attached to described piezoelectric element (910) and described radiator (924), wherein said heat-conducting plate (956) is configured to heat is transmitted to described radiator (924) from described piezoelectric element (910).
10. a ultrasonic transducer (900) comprising:
Defined the piezoelectric element (910) of front (912) and the back side (914), described piezoelectric element (910) is configured to convert the electrical signal to the ultrasonic wave that sends from described front (912) head for target, and the ultrasonic wave that described piezoelectric element (910) is configured to receive converts the signal of telecommunication to;
Be connected to the lens (908) of the described front (912) of described piezoelectric element (910);
Be connected to the radiator (924) at the described back side (914) of described piezoelectric element (910);
Be connected to both back side matching layers (920) of described piezoelectric element (910) and described radiator (924), described back side matching layer (920) comprises the end that is configured to extend beyond described piezoelectric element (910) to the wing plate (926) of described radiator (924), and wherein said back side matching layer (920) is configured to heat is transmitted to described radiator (924) from described piezoelectric element (910).
11. ultrasonic transducer as claimed in claim 10 (900), further comprise the heating pad (922) that is arranged between described back side matching layer (920) and the described radiator (924), wherein said heating pad (922) is configured to decay from the ultrasonic wave of described piezoelectric element (910).
12. ultrasonic transducer as claimed in claim 10 (900) further comprises the heat-conducting plate (956) that is attached to described wing plate (926) and described radiator (924).
13. ultrasonic transducer as claimed in claim 12 (900), wherein said heat-conducting plate (956) is attached to described wing plate (926) and described radiator (924) by epoxy resin.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/234658 | 2011-09-16 | ||
| US13/234,658 US8378557B2 (en) | 2010-07-09 | 2011-09-16 | Thermal transfer and acoustic matching layers for ultrasound transducer |
| US13/234,658 | 2011-09-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102989654A true CN102989654A (en) | 2013-03-27 |
| CN102989654B CN102989654B (en) | 2017-07-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210339333.8A Active CN102989654B (en) | 2011-09-16 | 2012-09-14 | The heat transfer and acoustic matching layer of ultrasonic transducer |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6548201B2 (en) |
| KR (1) | KR20130030226A (en) |
| CN (1) | CN102989654B (en) |
| FR (1) | FR2980326A1 (en) |
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| CN106248802A (en) * | 2016-08-30 | 2016-12-21 | 河北奥索电子科技有限公司 | A kind of high-resolution TOFD detection ultrasound probe |
| CN107520110A (en) * | 2017-07-31 | 2017-12-29 | 瑞声科技(新加坡)有限公司 | Piezoelectric ultrasonic transducer and preparation method thereof |
| CN108445036A (en) * | 2018-01-17 | 2018-08-24 | 中国地质大学（武汉） | Experimental rig for testing refuse landfill composite pad thermophysical property |
| US10134973B2 (en) | 2015-03-02 | 2018-11-20 | Edan Instruments, Inc. | Ultrasonic transducer and manufacture method thereof |
| CN110662609A (en) * | 2017-05-29 | 2020-01-07 | 恩德斯+豪斯流量技术股份有限公司 | Ultrasonic transducer |
| WO2020062258A1 (en) * | 2018-09-30 | 2020-04-02 | 深圳迈瑞生物医疗电子股份有限公司 | Ultrasonic probe |
| WO2022048058A1 (en) * | 2020-09-04 | 2022-03-10 | 北京信息科技大学 | High-power high-frequency directional transmission underwater acoustic transducer and manufacturing method therefor |
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| KR20160096935A (en) * | 2015-02-06 | 2016-08-17 | 경북대학교 산학협력단 | Ultrasonic Transducer for Improving Accoustic and Heat Characteristic |
| EP3344147B1 (en) | 2015-09-03 | 2023-11-01 | Fujifilm Sonosite, Inc. | Ultrasound transducer assembly |
| JP6771279B2 (en) * | 2015-11-30 | 2020-10-21 | ジーイー・メディカル・システムズ・グローバル・テクノロジー・カンパニー・エルエルシー | Ultrasonic probe and ultrasonic image display device |
| CN112638264A (en) * | 2018-06-12 | 2021-04-09 | 深圳市理邦精密仪器股份有限公司 | Ultrasonic transducer, ultrasonic probe, and ultrasonic detection device |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6548201B2 (en) | 2019-07-24 |
| JP2013066177A (en) | 2013-04-11 |
| KR20130030226A (en) | 2013-03-26 |
| FR2980326A1 (en) | 2013-03-22 |
| CN102989654B (en) | 2017-07-18 |
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