CN102976323A - Recovery technology of waste mortar used for solar silicon wafer cutting - Google Patents
Recovery technology of waste mortar used for solar silicon wafer cutting Download PDFInfo
- Publication number
- CN102976323A CN102976323A CN2012104628701A CN201210462870A CN102976323A CN 102976323 A CN102976323 A CN 102976323A CN 2012104628701 A CN2012104628701 A CN 2012104628701A CN 201210462870 A CN201210462870 A CN 201210462870A CN 102976323 A CN102976323 A CN 102976323A
- Authority
- CN
- China
- Prior art keywords
- waste mortar
- rotating speed
- silicon carbide
- content
- solar silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Silicon Compounds (AREA)
- Centrifugal Separators (AREA)
Abstract
The invention discloses a recovery technology of waste mortar used for solar silicon wafer cutting. Steps of water wash and centrifuge wash are added after a step of centrifuge wash after alkali wash, and therefore content of Na2SiO3 in silicon carbide is lowered effectively. In the step of water wash, Na2SiO3 is dissolved in water. Na2SiO3 and the silicon carbide are separated in the step of centrifuge wash. Therefore, the content of Na2SiO3 in the silicon carbide is reduced, and content of SiC in recycling sand is improved.
Description
Technical field
The present invention relates to a kind of recovery technique of the waste mortar for solar silicon wafers cutting, belong to the photovoltaic field.
Background technology
In the photovoltaic industry, mortar is larger consumptive material in the silicon chip cutting, and the composition of mortar is mainly silicon carbide and (is commonly called as silicon carbide, SiC) with a small amount of silicon, will causes the very large wasting of resources and environmental pollution if use once just to discard.After carrying mortar and carry out silicon chip cutting by steel wire, be mixed with a large amount of silica flours in the mortar, and the wearing and tearing of the silicon carbide of part are broken, the effect of effective cutting can't recur, sneak into foreign matter such as broken silicon wafers etc. in the cutting process simultaneously so that the necessary regular replacing of mortar, but comprise still that wherein a large amount of performances there is no SiC particle and the suspension of large change, therefore reclaim the trend that mortar becomes the PV industry.The content of the silicon carbide of the explained hereafter of existing recovery sand is about 96% substantially, can not satisfy the quality requirements that reclaims sand.
Summary of the invention
The object of the invention provides a kind of recovery technique of the waste mortar for solar silicon wafers cutting, adds the step of washing and eccentric cleaning after the eccentric cleaning step after the alkali cleaning, can effectively reduce Na in the silicon carbide
2SiO
3Content; In the step of washing, Na
2SiO
3Soluble in water, the step of eccentric cleaning is with Na
2SiO
3Separate with silicon carbide, thereby reduce Na
2SiO
3Content in silicon carbide improves the content that reclaims SiC in the sand.
A kind of recovery technique of the waste mortar for solar silicon wafers cutting, with the NaOH solution alkali cleaning 4.5-5.5h of waste mortar with the 5-7% of 4-6 times of weight, eccentric cleaning 0.5h, rotating speed 60-70r/min, washing 1.8-2.2h, continue eccentric cleaning 0.5h, rotating speed 60-70r/min is with the H of the 1.5-2.5% of 4-6 times of waste mortar weight
2SO
4Solution pickling 4.5-5.5h, rinsing 1h, centrifuge dripping 0.5h, rotating speed 70-80r/min.
The chemical reaction that mainly occurs during the mortar alkali cleaning is: Si+2NaOH+H
2O=Na
2SiO
3+ 2H
2↑; Because Na
2SiO
3Have very large viscosity, also have part to be attached to silicon carbide after the eccentric cleaning, flowing into reacts in the pickling tub generates indissoluble solution material orthosilicic acid (Na
2SiO
3+ H
2SO
4+ H
2O=Na
2SO
4+ H
4SiO4 ↓) because the orthosilicic acid that generates is the same with silicon carbide, all be the indissoluble material, follow-up rinsing can only be removed part Fe
2O
3, metal ion and uncombined carbon, little to removing the orthosilicic acid effect, cause carborundum content on the low side.
The present invention adds the step of washing and eccentric cleaning after the eccentric cleaning step after the alkali cleaning, can effectively reduce Na in the silicon carbide
2SiO
3Content.In the step of washing, Na
2SiO
3Soluble in water, the step of eccentric cleaning is with Na
2SiO
3Separate with silicon carbide, thereby reduce Na
2SiO
3Content in silicon carbide makes the content that reclaims SiC in the sand more than 98%.
Embodiment:
Embodiment 1:
A kind of recovery technique of the waste mortar for solar silicon wafers cutting is with 5% the NaOH solution alkali cleaning 4.5h of waste mortar with 4 times of weight, eccentric cleaning 0.5h, rotating speed 60r/min, washing 1.8h continues eccentric cleaning 0.5h, rotating speed 60r/min is with 1.5% H of 4 times of waste mortar weight
2SO
4Solution pickling 4.5h, rinsing 1h, centrifuge dripping 0.5h, rotating speed 70r/min.The content that finally is recycled silicon carbide in the sand is 98.2%.
Embodiment 2:
A kind of recovery technique of the waste mortar for solar silicon wafers cutting is with 6% the NaOH solution alkali cleaning 5.0h of waste mortar with 5 times of weight, eccentric cleaning 0.5h, rotating speed 65r/min, washing 2.0h continues eccentric cleaning 0.5h, rotating speed 65r/min is with 2.0% H of 5 times of waste mortar weight
2SO
4Solution pickling 5.0h, rinsing 1h, centrifuge dripping 0.5h, rotating speed 75r/min.The content that finally is recycled silicon carbide in the sand is 98.9%.
Embodiment 3:
A kind of recovery technique of the waste mortar for solar silicon wafers cutting is with 7% the NaOH solution alkali cleaning 5.5h of waste mortar with 6 times of weight, eccentric cleaning 0.5h, rotating speed 70r/min, washing 2.2h continues eccentric cleaning 0.5h, rotating speed 70r/min is with 2.5% H of 6 times of waste mortar weight
2SO
4Solution pickling 5.5h, rinsing 1h, centrifuge dripping 0.5h, rotating speed 80r/min.The content that finally is recycled silicon carbide in the sand is 98.6%.
Embodiment 4:
A kind of recovery technique of the waste mortar for solar silicon wafers cutting is with 4% the NaOH solution alkali cleaning 4.0h of waste mortar with 3 times of weight, eccentric cleaning 0.5h, rotating speed 50r/min, washing 1.5h continues eccentric cleaning 0.5h, rotating speed 50r/min is with 1.0% H of 3 times of waste mortar weight
2SO
4Solution pickling 4.0h, rinsing 1h, centrifuge dripping 0.5h, rotating speed 65r/min.The content that finally is recycled silicon carbide in the sand is 97.0%.
Embodiment 5:
A kind of recovery technique of the waste mortar for solar silicon wafers cutting is with 8% the NaOH solution alkali cleaning 6.0h of waste mortar with 7 times of weight, eccentric cleaning 0.5h, rotating speed 75r/min, washing 2.5h continues eccentric cleaning 0.5h, rotating speed 75r/min is with 3.0% H of 7 times of waste mortar weight
2SO
4Solution pickling 6.0h, rinsing 1h, centrifuge dripping 0.5h, rotating speed 85r/min.The content that finally is recycled silicon carbide in the sand is 97.4%.
Comparative Examples 1:
Usually the recovery technique of the waste mortar of solar silicon wafers cutting, with 6% the NaOH solution alkali cleaning 5.0h of waste mortar with 5 times of weight, eccentric cleaning 0.5h, rotating speed 65r/min is with 2.0% H of 5 times of waste mortar weight
2SO
4Solution pickling 5.0h, rinsing 1h, centrifuge dripping 0.5h, rotating speed 75r/min.The content that finally is recycled silicon carbide in the sand is 96.7%.
Claims (2)
1. recovery technique that is used for the waste mortar of solar silicon wafers cutting, it is characterized in that: with the NaOH solution alkali cleaning 4.5-5.5h of waste mortar with the 5-7% of 4-6 times of weight, eccentric cleaning 0.5h, rotating speed 60-70r/min, washing 1.8-2.2h, continue eccentric cleaning 0.5h, rotating speed 60-70r/min is with the H of the 1.5-2.5% of 4-6 times of waste mortar weight
2SO
4Solution pickling 4.5-5.5h, rinsing 1h, centrifuge dripping 0.5h, rotating speed 70-80r/min.
2. the recovery technique of a kind of waste mortar for solar silicon wafers cutting as claimed in claim 1, it is characterized in that: a kind of recovery technique of the waste mortar for solar silicon wafers cutting, with 6% the NaOH solution alkali cleaning 5.0h of waste mortar with 5 times of weight, eccentric cleaning 0.5h, rotating speed 65r/min, washing 2.0h continues eccentric cleaning 0.5h, rotating speed 65r/min is with 2.0% H of 5 times of waste mortar weight
2SO
4Solution pickling 5.0h, rinsing 1h, centrifuge dripping 0.5h, rotating speed 75r/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104628701A CN102976323A (en) | 2012-11-16 | 2012-11-16 | Recovery technology of waste mortar used for solar silicon wafer cutting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104628701A CN102976323A (en) | 2012-11-16 | 2012-11-16 | Recovery technology of waste mortar used for solar silicon wafer cutting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102976323A true CN102976323A (en) | 2013-03-20 |
Family
ID=47850743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012104628701A Pending CN102976323A (en) | 2012-11-16 | 2012-11-16 | Recovery technology of waste mortar used for solar silicon wafer cutting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102976323A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104528904A (en) * | 2014-12-26 | 2015-04-22 | 江南大学 | Composite iron silicate activated carbon flocculant and preparation method thereof |
| CN105858602A (en) * | 2016-04-08 | 2016-08-17 | 北京科技大学 | Polycrystalline silicon cutting waste material treatment method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101474511A (en) * | 2008-12-17 | 2009-07-08 | 西安交通大学 | Process for recovering polyethylene glycol and silicon carbide in waste mortar from silicon wafer wire cutting |
| US20100284885A1 (en) * | 2009-05-11 | 2010-11-11 | National Taiwan University | Recovery Of Silicon And Silicon Carbide Powder From Kerf Loss Slurry Using Particle Phase-Transfer Method |
| CN102031193A (en) * | 2010-11-02 | 2011-04-27 | 薛荣秀 | Method for recovering silicon carbide and polyglycol cutting solution from silicon slice cutting waste mortar |
| CN101817526B (en) * | 2010-04-08 | 2012-06-20 | 浙江源盛硅晶材料有限公司 | Method for recovering polyethylene glycol and silicon carbide from silicon crystal cutting waste liquid |
-
2012
- 2012-11-16 CN CN2012104628701A patent/CN102976323A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101474511A (en) * | 2008-12-17 | 2009-07-08 | 西安交通大学 | Process for recovering polyethylene glycol and silicon carbide in waste mortar from silicon wafer wire cutting |
| US20100284885A1 (en) * | 2009-05-11 | 2010-11-11 | National Taiwan University | Recovery Of Silicon And Silicon Carbide Powder From Kerf Loss Slurry Using Particle Phase-Transfer Method |
| CN101817526B (en) * | 2010-04-08 | 2012-06-20 | 浙江源盛硅晶材料有限公司 | Method for recovering polyethylene glycol and silicon carbide from silicon crystal cutting waste liquid |
| CN102031193A (en) * | 2010-11-02 | 2011-04-27 | 薛荣秀 | Method for recovering silicon carbide and polyglycol cutting solution from silicon slice cutting waste mortar |
Non-Patent Citations (1)
| Title |
|---|
| 曹春梅等: "线切割废砂浆资源化利用研究技术", 《化工进展》, vol. 31, 31 July 2012 (2012-07-31), pages 496 - 500 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104528904A (en) * | 2014-12-26 | 2015-04-22 | 江南大学 | Composite iron silicate activated carbon flocculant and preparation method thereof |
| CN105858602A (en) * | 2016-04-08 | 2016-08-17 | 北京科技大学 | Polycrystalline silicon cutting waste material treatment method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104176737B (en) | Method for recovering silicon powder from cut mortar waste | |
| CN100528488C (en) | Method for recycling silica powder and carborundum powder from cut waste mortar | |
| CN110510620B (en) | Purification method of high-purity quartz sand tailings | |
| CN107473231B (en) | A kind of processing purifying technique of pair of glass sand tailing | |
| CN101474511B (en) | Process for recovering polyethylene glycol and silicon carbide from silicon wafer wire cutting waste mortar | |
| CN107185708B (en) | A method of high-purity quartz is prepared with tailing | |
| CN103522431B (en) | A kind of silicon chip cutting technique | |
| CN101817526B (en) | Method for recovering polyethylene glycol and silicon carbide from silicon crystal cutting waste liquid | |
| WO2017113755A1 (en) | Method for recycling crystalline silicon solar cell assemblies | |
| CN102851110B (en) | Method for separating cutting fluid, silicon carbide and silicon powder from wafer cutting mortar | |
| CN103785525A (en) | Low-grade potassium sodium feldspar quarry floatation and purification process | |
| CN107661810A (en) | A kind of method that arkose quartzite prepares glass sand | |
| CN105000565A (en) | Compounding-based quartz sand purification technology | |
| CN105154268A (en) | Cleaning fluid capable of reducing thickness of damaged layer of surface of silicon wafer and cleaning method | |
| CN101905938A (en) | Method for recycling silicon chip cutting waste fluid | |
| CN102659111A (en) | Method for recovering silicon and silicon carbide from silicon wafer cutting waste mortar | |
| CN102849737A (en) | Preparation method for silicon carbide micropowder | |
| CN102962903B (en) | Method for recovering silicon particles in silicon ingot wire saw cutting process | |
| CN107188185A (en) | A kind of utilization quartz sand tailings purifies the production method of high crystobalite sand | |
| CN102976323A (en) | Recovery technology of waste mortar used for solar silicon wafer cutting | |
| CN110526578A (en) | A method of photovoltaic glass silica sand is produced using quartzy glutenite | |
| CN106629743A (en) | Method for producing quartz sand for ceramic glaze by using quartz tailing | |
| CN109127152A (en) | A kind of preparation method of high whiteness feldspar in powder | |
| CN105132687A (en) | Recovery method of zircon-based amorphous alloy | |
| CN102730704B (en) | Depth purification method for preparing silica powder by using quartz tailings |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130320 |