CN102969294B - 一种引线框架结构节省耗材的方法 - Google Patents

一种引线框架结构节省耗材的方法 Download PDF

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CN102969294B
CN102969294B CN201210471251.9A CN201210471251A CN102969294B CN 102969294 B CN102969294 B CN 102969294B CN 201210471251 A CN201210471251 A CN 201210471251A CN 102969294 B CN102969294 B CN 102969294B
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pin
connect
lead frame
disconnect
disconnect structure
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CN102969294A (zh
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黄铁军
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Taizhou Yourun Electronic Technologies Co ltd
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WUXI WEIHAIDA MACHINERY MANUFACTURING Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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Abstract

一种引线框架结构节省耗材的方法，通过设置辅助的插拔结构，并且将引线框架的引脚设为分立的条状结构，并且引脚的长度略大于引脚切割后的长度，将条状结构的引脚插装在插拔结构上，在一个插拔结构上插装多个引脚，并且引脚之间的距离刚好等于引脚与引线框架的连接位置关系相对应，当利用插拔结构将引脚与引线框架结合在一起并且通过辅助的固定方法固定在一起以后，将插拔结构向外侧撤出，达到与引脚分离的效果。本发明通过设置插拔结构，并且将引脚设为长条状结构，可以实现插拔结构辅助引脚安装、固定的作用，引脚不需要做大余量的截断，并且也不需要设置截断带，所以可以节省大量的耗材，插拔结构可以重复利用。

Description

一种引线框架结构节省耗材的方法
技术领域
本发明涉及半导体分立器件封装设备，特别是节省耗材的引线框架结构节省耗材的方法。
背景技术
常用的引线框架结构节省耗材的方法，其切断面共具有3-4个，其中在散热片的部分具有2个现有的引线框架采用的标准都是国际通用标准，即三星标准，在散热片中部的切断面的面积为3mm*3mm，所以它的切断工序过程中经常需要较大的切力，而这也就导致了切断过程中的冲击震动而使芯片的欧姆接触增大。
针对该技术问题，无锡市玉祁红光电子有限公司于2011年8月31日申请了一种名称为：易切断的引线框架结构，申请号为：201120002290。该专利的技术方案公开了引线框架结构的主体结构，即其底部引脚需要截断。由于引线框架结构用量很大，截断下来的引脚就成为了废材，没有了使用价值，造成了材料伤的浪费。
发明内容
为了解决现有技术的引线框架结构的引脚需要截断，造成材料浪费的问题，本发明提供一种引线框架结构节省耗材的方法。
本发明的目的通过以下技术方案来具体实现：
一种引线框架结构节省耗材的方法，通过设置辅助的插拔结构，并且将引线框架的引脚设为分立的条状结构，并且引脚的长度略大于引脚切割后的长度，将条状结构的引脚插装在插拔结构上，在一个插拔结构上插装多个引脚，并且引脚之间的距离刚好等于引脚与引线框架的连接位置关系相对应，当利用插拔结构将引脚与引线框架结合在一起并且通过辅助的固定方法固定在一起以后，将插拔结构向外侧撤出，达到与引脚分离的效果。
本发明提供的引线框架结构节省耗材的方法，通过设置插拔结构，并且将引脚设为长条状结构，可以实现插拔结构辅助引脚安装、固定的作用，引脚不需要做大余量的截断，并且也不需要设置截断带，所以可以节省大量的耗材，插拔结构可以重复利用。
具体实施方式
本发明实施例所述的一种引线框架结构节省耗材的方法，通过设置辅助的插拔结构，并且将引线框架的引脚设为分立的条状结构，并且引脚的长度略大于引脚切割后的长度，将条状结构的引脚插装在插拔结构上，在一个插拔结构上插装多个引脚，并且引脚之间的距离刚好等于引脚与引线框架的连接位置关系相对应，当利用插拔结构将引脚与引线框架结合在一起并且通过辅助的固定方法固定在一起以后，将插拔结构向外侧撤出，达到与引脚分离的效果。
本发明提供的引线框架结构节省耗材的方法，通过设置插拔结构，并且将引脚设为长条状结构，可以实现插拔结构辅助引脚安装、固定的作用，引脚不需要做大余量的截断，并且也不需要设置截断带，所以可以节省大量的耗材，插拔结构可以重复利用。

Claims (1)

1.一种引线框架结构节省耗材的方法，通过设置辅助的插拔结构，并且将引线框架的引脚设为分立的条状结构，并且引脚的长度略大于引脚切割后的长度，将条状结构的引脚插装在插拔结构上，在一个插拔结构上插装多个引脚，并且引脚之间的距离刚好等于引脚与引线框架的连接位置之间的距离，当利用插拔结构将引脚与引线框架结合在一起并且通过辅助的固定方法固定在一起以后，将插拔结构向外侧撤出，达到与引脚分离的效果。
CN201210471251.9A 2012-11-20 2012-11-20 一种引线框架结构节省耗材的方法 Active CN102969294B (zh)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2344877Y (zh) * 1998-12-03 1999-10-20 新美化精机工厂股份有限公司 二极管素材的改良
CN102067296A (zh) * 2008-05-08 2011-05-18 武藏工业株式会社 引线框架的定位夹具
CN102543932A (zh) * 2012-02-06 2012-07-04 深圳市晶导电子有限公司 半导体器件封装结构

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK9700243U3 (da) * 1997-06-17 1997-07-25 Lars Krupsdahl Indretning til midlertidig fiksering af PEX-installationsrør
JP2002118039A (ja) * 2000-10-06 2002-04-19 Rohm Co Ltd 電子部品の保持部材
CN101661919A (zh) * 2008-08-29 2010-03-03 四川大雁微电子有限公司 大功率晶体管
JP5620769B2 (ja) * 2010-09-24 2014-11-05 新電元工業株式会社 樹脂封止型半導体装置の製造方法及び樹脂封止型半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2344877Y (zh) * 1998-12-03 1999-10-20 新美化精机工厂股份有限公司 二极管素材的改良
CN102067296A (zh) * 2008-05-08 2011-05-18 武藏工业株式会社 引线框架的定位夹具
CN102543932A (zh) * 2012-02-06 2012-07-04 深圳市晶导电子有限公司 半导体器件封装结构

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