CN102946689A - Metal lead framework integrated structure for assembling components by wave soldering and manufacture method of metal lead framework integrated structure - Google Patents
Metal lead framework integrated structure for assembling components by wave soldering and manufacture method of metal lead framework integrated structure Download PDFInfo
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- CN102946689A CN102946689A CN2012104622495A CN201210462249A CN102946689A CN 102946689 A CN102946689 A CN 102946689A CN 2012104622495 A CN2012104622495 A CN 2012104622495A CN 201210462249 A CN201210462249 A CN 201210462249A CN 102946689 A CN102946689 A CN 102946689A
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- metal lead
- lead wire
- circuit board
- wire frame
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Abstract
The invention discloses a metal lead framework integrated structure for assembling components by wave soldering and a manufacture method of the metal lead framework integrated structure. A PCB (printed circuit board) single-side circuit board is provided with through holes for lead pins of a metal lead framework and tube pins of electronic components to penetrate through, the peripheral sides of the through holes of the PCB single-side circuit board are provided with welding discs, the metal lead framework is clamped between a plastic base and the PCB single-side circuit board, in addition, the metal lead framework, the plastic base and the PCB single-side circuit board are fixed together, and the lead pins of the metal lead framework extend out from the through holes of the PCB single-side circuit board. The metal lead framework integrated structure and the manufacture method maintain the advantages of high current and high performance of the traditional metal lead framework, the defect that the metal lead framework adopting the traditional embedding element injection molding process and the electronic components can be assembled only through TIG (tungsten inert gas) welding is also overcome, and the metal lead framework and the electronic components can be connected only through a mature wave soldering process, so the assembly reliability can be ensured, existing reflow soldering equipment can also be multiplexed, the investment on new equipment is not needed, and the production efficiency and the economy are greatly improved.
Description
Technical field
The present invention is relevant with metal lead wire frame, specifically belongs to a kind of metal lead wire frame integrated morphology of wave-soldering technique assembling electronic devices and components and manufacture method of this integrated morphology of adopting.
Background technology
At automobile ECU (Electronic Control Unit, electronic controller) in, more than 100 amperes in addition the situation of the large current lead-through up to 180 amperes more and more, traditional PCB(Print Circuit Board at this time, be printed circuit board (PCB)) can not meet the demands, therefore needs use metal lead wire frame carries out the electrical connection between the plug-in unit electronic devices and components.At present, traditional metal lead wire frame adopts the mold insert Shooting Technique, metal lead wire frame 1 is processed into a moulding, as shown in Figure 1, metal lead wire frame 1 is arranged in injection molded layers 2 and stretches out outside the injection molded layers 2, and this injection molded layers 2 leaves the through hole 3 that inserts for components and parts pin 4 at metal lead wire frame 1 pin place.
This metal lead wire frame injection structure is when the assembling electronic devices and components, at first the pin 4 with electronic devices and components inserts in the corresponding through hole 3, as shown in Figure 2, because metal lead wire frame 1 and injection molded layers 2 are by the as a whole moulding of two-sided mold insert Shooting Technique injection moulding, do not have pad structure on this moulding, therefore traditional wave-soldering can't use, can only use TIG(Tungsten Inert Gas, be argon arc welding) will stretch out the metal lead wire frame 1 of injection molded layers 2 and the pin 4 of corresponding electronic devices and components welds together, as shown in Figure 3, the structure after welding is finished as shown in Figure 4.
The TIG welding needs the special-purpose TIG welding equipment of buying, and this apparatus expensive, complex process and production efficiency are low, is keeping being difficult to satisfy the requirement of producing in enormous quantities under the low prerequisite of production cost.
Summary of the invention
Technical problem to be solved by this invention provides a kind of metal lead wire frame integrated morphology and manufacture method with wave-soldering assembling components and parts, can simplify the assembling process of metal lead wire frame and electronic devices and components, reduces production costs.
For solving the problems of the technologies described above, metal lead wire frame integrated morphology with wave-soldering assembling components and parts provided by the invention, comprise metal lead wire frame, plastic feet and PCB single-sided circuit board, described PCB single-sided circuit board leaves the through hole that the pin for the pin of metal lead wire frame and electronic devices and components passes, the through hole week side of PCB single-sided circuit board is provided with pad, described metal lead wire frame is clipped between plastic feet and the PCB single-sided circuit board and the three is fixed together, and the pin of metal lead wire frame stretches out from the through hole of PCB single-sided circuit board.
Preferably, described PCB single-sided circuit board has corresponding rivet hole with metal lead wire frame, and the injection moulding base has in the corresponding position injection mo(u)lding fixedly uses plastic rivet.
Wherein, described metal lead wire frame and plastic feet leave the through hole of the pin insertion of supplied for electronic components and parts, and this through hole is corresponding with the lead to the hole site of PCB single-sided circuit board.
The present invention also provides the manufacture method of described metal lead wire frame integrated morphology with wave-soldering assembling components and parts, may further comprise the steps:
The metal lead wire frame that 1) will have a rivet hole is inserted on the plastic feet, injection mo(u)lding has the fixing plastic rivet of using on the described plastic feet, this fixture passes the rivet hole of metal lead wire frame, and described metal lead wire frame and plastic feet leave the through hole of the pin insertion of supplied for electronic components and parts;
2) plug-in mounting one PCB single-sided circuit board on metal lead wire frame, described PCB single-sided circuit board have the rivet hole that the confession fixture passes, and the through hole of the pin insertion of the pin of confession metal lead wire frame and electronic devices and components, and all sides of described through hole are provided with pad;
3) plastic rivet that stretches out the PCB single-sided circuit board is carried out rivet hot processing, PCB single-sided circuit board, metal lead wire frame and injection moulding base are fixed together.
The present invention has introduced the PCB single-sided circuit board with pad, adopt plastic feet, metal lead wire frame adds the combining form of PCB single-sided circuit board, this structure had both kept the high performance advantage of the large electric current of traditional metal lead frame, having overcome again traditional metal lead frame mold insert injection structure and electronic devices and components can only be by the shortcoming of TIG welding assembly, as long as adopt the ripe wave-soldering technique just can connection metal lead frame and electronic devices and components, so both can guarantee the reliability of assembling, again can multiplexing existing Reflow Soldering equipment, do not need to invest new equipment, so that production efficiency and economy improve greatly.
Description of drawings
Fig. 1 is the generalized section of existing metal lead wire frame mold insert injection structure;
Fig. 2 is the generalized section that existing metal lead wire frame mold insert injection structure is inserted with electronic devices and components;
Fig. 3 is the generalized section that existing metal lead wire frame mold insert injection structure and electronic devices and components weld;
Fig. 4 is that existing metal lead wire frame mold insert injection structure and electronic devices and components adopt the generalized section after the TIG welding is finished;
Fig. 5 is the decomposition generalized section of metal lead wire frame integrated morphology of the present invention;
Fig. 6 is loose generalized section after the metal lead wire frame assembling of the present invention;
Fig. 7 is the generalized section after metal lead wire frame integrated morphology of the present invention is fixed;
Fig. 8 is the generalized section that metal lead wire frame integrated morphology is inserted with electronic devices and components among the present invention;
Fig. 9 is that metal lead wire frame integrated morphology and electronic devices and components adopt generalized section after Wave crest Welding is finished among the present invention.
Wherein description of reference numerals is as follows:
1 is that metal lead wire frame 2 is injection molded layers
3 is that through hole 4 is pin
5 is that TIG soldering tip 6 is the PCB single-sided circuit board
7 is pad 8 rivet holes
9 rivets, 10 rivet hot heads
11 plastic feets
Embodiment
The present invention is further detailed explanation below in conjunction with accompanying drawing and embodiment.
The metal lead wire frame integrated morphology that adopts wave-soldering technique assembling electronic devices and components provided by the invention, as shown in Figure 7, comprise metal lead wire frame 1, plastic feet 11 and PCB single-sided circuit board 6, metal lead wire frame 1 is clipped between plastic feet 11 and the PCB single-sided circuit board 6, and from the through hole 3 of PCB single-sided circuit board 6, stretch out, the three is fixed together, and is fixing by plastic rivet 9 in the present embodiment.PCB single-sided circuit board 6 leaves the through hole 3 that supplies metal lead wire frame 1 pin and electronic devices and components pin 4 to pass, and all sides of this through hole 3 are provided with pad 7, and metal lead wire frame 1 and plastic feet 11 have the through hole 3 that supplied for electronic components and parts pin 4 passes.
The manufacturing process of metal lead wire frame integrated morphology of the present invention comprises:
The metal lead wire frame 1 that 1) will have a rivet hole 8 is inserted on the plastic feet 11, the fixing rivet hole 8 that passes metal lead wire frame 1 with plastic rivet on the plastic feet 11;
2) plug-in mounting PCB single-sided circuit board 6 on metal lead wire frame 1, plastic rivet passes the rivet hole 8 of PCB single-sided circuit board 6, and PCB single-sided circuit board 6 has through hole 3, and its all side is provided with pad 7, as shown in Figure 5;
3) utilize rivet hot 10 pairs of plastic rivets that stretch out PCB single-sided circuit board 6 to carry out rivet hot processing, as shown in Figure 6, PCB single-sided circuit board 6, metal lead wire frame 1 and injection moulding base 11 are fixed together, as shown in Figure 7.
During metal lead wire frame integrated morphology assembling electronic devices and components of the present invention, at first the pin 4 with electronic devices and components inserts in the through hole 3 of plastic feet 11, metal lead wire frame 1 and PCB single-sided circuit board 6 correspondences, as shown in Figure 8, then the pin 4 that uses traditional wave-soldering technique will stretch out pad 7 metal lead wire frame 1 pin outward and corresponding electronic devices and components welds together, and the structure after welding is finished as shown in Figure 9.
Be different from traditional mold insert injection moulding die-attach area shelf structure, the present invention has introduced the PCB single-sided circuit board with pad, adopt plastic feet, metal lead wire frame adds that the combination of sets of PCB single-sided circuit board becomes form, this structure had both kept the high performance advantage of the large electric current of traditional metal lead frame, having overcome again traditional mold insert injection moulding die-attach area shelf structure and electronic devices and components can only be by the shortcoming of TIG welding assembly, as long as adopt the ripe wave-soldering technique just can connection metal lead frame and electronic devices and components, so both can guarantee the reliability of assembling, again can multiplexing existing Reflow Soldering equipment, do not need to invest new equipment, so that production efficiency and economy improve greatly.
More than by specific embodiment the present invention is had been described in detail, this embodiment only is preferred embodiment of the present invention, it is not to limit the invention.In the situation that does not break away from the principle of the invention, equivalent replacement and improvement that those skilled in the art makes the fixed form of metal lead wire frame integrated morphology and shape etc. all should be considered as in the technology category that the present invention protects.
Claims (4)
1. metal lead wire frame integrated morphology with wave-soldering assembling components and parts, it is characterized in that, comprise metal lead wire frame (1), plastic feet (11) and PCB single-sided circuit board (6), described PCB single-sided circuit board (6) leaves the through hole (3) that passes for the pin of metal lead wire frame (1) and the pin (4) of electronic devices and components, the all sides of through hole (3) of PCB single-sided circuit board (6) are provided with pad (7), described metal lead wire frame (1) is clipped between plastic feet (11) and the PCB single-sided circuit board (6) and the three is fixed together, and the pin of metal lead wire frame (1) stretches out from the through hole (3) of PCB single-sided circuit board (6).
2. the metal lead wire frame integrated morphology with wave-soldering assembling components and parts according to claim 1, it is characterized in that, described PCB single-sided circuit board (6) has corresponding rivet hole (8) with metal lead wire frame (1), and plastic feet (2) has in the corresponding position injection mo(u)lding fixedly uses plastic rivet.
3. the metal lead wire frame integrated morphology with wave-soldering assembling components and parts according to claim 1, it is characterized in that, described metal lead wire frame (1) and plastic feet (2) leave the through hole (3) of pin (4) insertion of supplied for electronic components and parts, and this through hole (3) is corresponding with through hole (3) position of PCB single-sided circuit board (6).
4. the manufacture method with the metal lead wire frame integrated morphology of wave-soldering assembling components and parts is characterized in that, may further comprise the steps:
The metal lead wire frame (1) that 1) will have rivet hole (8) is inserted on the plastic feet (11), the upper injection mo(u)lding of described plastic feet (11) has the fixing plastic rivet of using, this plastic rivet passes the rivet hole (8) of metal lead wire frame (1), and described metal lead wire frame (1) and plastic feet (11) leave the through hole (3) of pin (4) insertion of supplied for electronic components and parts;
2) at the upper plug-in mounting one PCB single-sided circuit board (6) of metal lead wire frame (1), described PCB single-sided circuit board (6) has the rivet hole (8) that passes for plastic rivet, and the through hole (3) of the pin (4) of the pin of confession metal lead wire frame (1) and electronic devices and components insertion, all sides of described through hole (3) are provided with pad (7);
3) plastic rivet that stretches out PCB single-sided circuit board (6) is carried out rivet hot processing, PCB single-sided circuit board (6), metal lead wire frame (1) and plastic feet (11) are fixed together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210462249.5A CN102946689B (en) | 2012-11-16 | 2012-11-16 | Metal lead framework integrated structure for assembling components by wave soldering and manufacture method of metal lead framework integrated structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210462249.5A CN102946689B (en) | 2012-11-16 | 2012-11-16 | Metal lead framework integrated structure for assembling components by wave soldering and manufacture method of metal lead framework integrated structure |
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| Publication Number | Publication Date |
|---|---|
| CN102946689A true CN102946689A (en) | 2013-02-27 |
| CN102946689B CN102946689B (en) | 2015-06-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210462249.5A Active CN102946689B (en) | 2012-11-16 | 2012-11-16 | Metal lead framework integrated structure for assembling components by wave soldering and manufacture method of metal lead framework integrated structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105798437A (en) * | 2014-12-30 | 2016-07-27 | 联创汽车电子有限公司 | Lead frame for TIG automatic welding and TIG automatic welding device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4357647A (en) * | 1979-12-06 | 1982-11-02 | Siemens Aktiengesellschaft | Printed circiuit board |
| JPH08204116A (en) * | 1994-09-21 | 1996-08-09 | Sun Microsyst Inc | Semiconductor assembly and its assembling method |
| CN2233150Y (en) * | 1995-07-25 | 1996-08-14 | 北京汇众实业总公司 | Circuit board inserted with large current conducting copper foil |
| CN102658410A (en) * | 2012-04-11 | 2012-09-12 | 深圳市天威达电子有限公司 | Printed circuit board (PCB) and via hole element soldering method and PCB soldered by the method |
-
2012
- 2012-11-16 CN CN201210462249.5A patent/CN102946689B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4357647A (en) * | 1979-12-06 | 1982-11-02 | Siemens Aktiengesellschaft | Printed circiuit board |
| JPH08204116A (en) * | 1994-09-21 | 1996-08-09 | Sun Microsyst Inc | Semiconductor assembly and its assembling method |
| CN2233150Y (en) * | 1995-07-25 | 1996-08-14 | 北京汇众实业总公司 | Circuit board inserted with large current conducting copper foil |
| CN102658410A (en) * | 2012-04-11 | 2012-09-12 | 深圳市天威达电子有限公司 | Printed circuit board (PCB) and via hole element soldering method and PCB soldered by the method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105798437A (en) * | 2014-12-30 | 2016-07-27 | 联创汽车电子有限公司 | Lead frame for TIG automatic welding and TIG automatic welding device |
| CN105798437B (en) * | 2014-12-30 | 2018-10-12 | 联创汽车电子有限公司 | TIG automatic soldering devices |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102946689B (en) | 2015-06-24 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| ASS | Succession or assignment of patent right |
Owner name: LIANCHUANG AUTO ELECTRONIC CO., LTD. Free format text: FORMER OWNER: SHANGHAI LIANSHENG AUTOMOTIVE ELECTRONIC CO., LTD. Effective date: 20130205 |
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| C41 | Transfer of patent application or patent right or utility model | ||
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Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201200 PUDONG NEW AREA, SHANGHAI |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20130205 Address after: 201200 Shanghai Pudong New Area Jinji Road 33 Lane No. 3-4 Applicant after: Lianchuang Auto Electronic Co., Ltd. Address before: 201206, Pudong New Area, Nanjing Bridge Road 615, 3, 4, Shanghai Applicant before: Shanghai Liansheng Automobile Electronic Co., Ltd. |
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |