CN102941416A - Alloy brazing filler metal of brazing-flux-free brazing foamed aluminum core veneer and preparation method thereof - Google Patents
Alloy brazing filler metal of brazing-flux-free brazing foamed aluminum core veneer and preparation method thereof Download PDFInfo
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- CN102941416A CN102941416A CN2012104355969A CN201210435596A CN102941416A CN 102941416 A CN102941416 A CN 102941416A CN 2012104355969 A CN2012104355969 A CN 2012104355969A CN 201210435596 A CN201210435596 A CN 201210435596A CN 102941416 A CN102941416 A CN 102941416A
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- 239000000956 alloy Substances 0.000 title claims abstract description 43
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 34
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 28
- 239000002184 metal Substances 0.000 title claims abstract description 28
- 238000002360 preparation method Methods 0.000 title claims abstract description 20
- 238000005219 brazing Methods 0.000 title abstract description 16
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 title abstract description 3
- 239000000945 filler Substances 0.000 title abstract 7
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 73
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 62
- 229910052802 copper Inorganic materials 0.000 claims abstract description 24
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 19
- 238000002844 melting Methods 0.000 claims abstract description 15
- 230000008018 melting Effects 0.000 claims abstract description 14
- 229910000679 solder Inorganic materials 0.000 claims description 59
- 239000004411 aluminium Substances 0.000 claims description 57
- 239000000203 mixture Substances 0.000 claims description 49
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 24
- 229910000838 Al alloy Inorganic materials 0.000 claims description 16
- 229910017818 Cu—Mg Inorganic materials 0.000 claims description 16
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 13
- 229910052786 argon Inorganic materials 0.000 claims description 12
- 239000007789 gas Substances 0.000 claims description 12
- 238000003756 stirring Methods 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000005303 weighing Methods 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 claims description 4
- 238000003556 assay Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 239000012467 final product Substances 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 24
- 238000000034 method Methods 0.000 abstract description 21
- 230000004907 flux Effects 0.000 abstract description 6
- 230000003647 oxidation Effects 0.000 abstract description 6
- 238000007254 oxidation reaction Methods 0.000 abstract description 6
- 239000007790 solid phase Substances 0.000 abstract description 3
- 238000010297 mechanical methods and process Methods 0.000 abstract description 2
- 238000000053 physical method Methods 0.000 abstract description 2
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 abstract 1
- 239000010953 base metal Substances 0.000 abstract 1
- 235000010210 aluminium Nutrition 0.000 description 56
- 239000006260 foam Substances 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 239000011148 porous material Substances 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 210000002421 cell wall Anatomy 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 244000075850 Avena orientalis Species 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 230000002929 anti-fatigue Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 210000004027 cell Anatomy 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 230000009967 tasteless effect Effects 0.000 description 1
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- Manufacture And Refinement Of Metals (AREA)
Abstract
The invention discloses an alloy brazing filler metal of a brazing-flux-free brazing foamed aluminum core veneer and a preparation method of the alloy brazing filler metal, wherein the alloy brazing filler metal is an alloy material whose range of melting point is from 450 DEG C to 600 DEG C. Elements of Cu and Mg are added in an aluminum-silicon-based brazing flux to prepare the alloy material with better flowability and appropriate melting point as a brazing filler metal, the alloy brazing filler metal is good in flowability and low in melting point, the elements of Cu and Mg in a brazing filler metal body are dispersed towards a solid phase foamed aluminum end in the welding process and are wetted and spread out on the surface of a base metal to implement the connection of parts, no brazing flux is used in a matched way in the welding process, no vacuum or protection atmosphere condition is needed, a compact oxidation film is removed by using a mechanical/physical method in a matched way, and a compact welding line is formed during the welding to implement the high-strength welding of the foamed aluminum.
Description
Technical field
The present invention relates to the foamed aluminium material manufacture field, exactly is solder alloy of a kind of solder without soldering acid foamed aluminium central layer and preparation method thereof.
Background technology
Foamed aluminium material is a kind of high-tech new material of developing out in recent years, it has many premium properties such as sound absorption, sound insulation, heat insulation, electromagnetic shielding, vibration reduction and cushioning, also has simultaneously the intrinsic fire prevention of metallic aluminium, protection against the tide, the performance such as nontoxic, tasteless, anti-corrosion, anti-aging.
Owing to adopting a small amount of metal to realize the structural material multifunction, opened up the new way that solves Problems Existing in numerous high-tech sectors, foamed aluminium has demonstrated wide application prospect, become U.S., day, English, in, the forward position focus material of the state such as moral 21 century.External comparatively deep to the research of foamed aluminium at present, now successfully be applied to the fields such as automobile, building, packing, lathe.
As the foamed aluminium material purposes the most extensively product be the foam aluminium sandwich plate, be a kind of high porosity, grand hole porous material, and light, firm, heat-resisting, attractive in appearance.Be mainly used in sound-absorbing, sound insulation, damping, fire prevention, buffering, energy absorption, electromagnetic shielding, increase gas-liquid contact face, filtration etc.Foam aluminium sandwich plate application prospect is extensive, unless but possess practical interconnection technique, otherwise be impossible realize the production in enormous quantities of foam aluminium sandwich board member and application.More existing well-known techniques can be used for producing foamed aluminium central layer composite, such as gluing, rolling-coating, welding etc., but all have some problems.It is relatively poor with corrosion resistance that the foam aluminium sandwich plate that adhesion process is produced is high temperature resistant, and the environment for use of product has certain limitation.Powder metallurgy foaming is rolling-and coat on the Foamed aluminium component size of preparation larger restriction is arranged, and this method is mainly used in the sandwich hole-closing structure that is, is rarely used in the preparation of open celled foam aluminum sandwich panel.The solder technology of at present relevant foamed aluminium is still immature, Hafer etc. and Pogibenko have studied the fusion welding method that adopts Laser Welding after inserting the AlSi12 solder between the foamed aluminium mother metal end face to be welded, under the high energy Source, the foam aluminum pore structure is caved in a large number and is caused molten bath and appearance of weld difficulty.In addition, thickness of slab requires also comparatively responsive to laser power.Have low diffusion welding (DW) of restraining condition, and during supersonic welding, its welding joint mechanical property is relatively poor, does not still possess practical condition.
Compare with the soldering of entity aluminium, the existence of a large amount of holes in foam aluminium sandwich plate surface is solder wettings and spread bad main cause in the foamed aluminium soldering, and the diversified pore structure of foamed aluminium (aperture, hole shape and porosity etc.) produces a very large impact welding process and property of welded joint.In addition, dense oxidation film in brazing process in the foam aluminum pore structure also is the key factor that causes welding performance poor, the existence of oxide layer hinders the combination of parent metal and solder, the method of traditional removal pellumina is to use in the fluoride flux fused salt to flood, the corrosion failure dense oxidation film, must clean behind the dip brazing and heat, remove the residual salt of corrosivity, but for this loose structure of foamed aluminium central layer, cleaning is difficult to carry out, and causes the heavy corrosion of foamed aluminium central layer after the soldering.
On choice of solder, when low-melting tinbase and zinc-base soldering, the foamed aluminum-core surface is comprised of thinner cell edge and cell wall, and welding point stretching and shear strength are lower.The silica-based scolder of the aluminium that fusing point is high easily causes again the foam aluminum pore structure to be caved in a large number and causes molten bath and appearance of weld difficulty or lack of fusion.After using in addition the brazing fluxes such as fluoride to process, because of the existence of foamed aluminum-core loose structure, easy cleaning not causes the heavy corrosion of foamed aluminium central layer.All there are problems in the aspects such as the existing method for welding of foamed aluminium and scolder are anti-corrosion at joint, antifatigue, appearance of weld and joint mechanical property, this has greatly limited the preparation of foam aluminium sandwich plate large scale and foamed aluminium in the application of high-tech and civil area, therefore, research is fit to the scolder of the solder without soldering acid of foamed aluminum-core loose structure, has great importance.
Summary of the invention
Technical problem to be solved by this invention is to provide for above-mentioned prior art not need to be used in conjunction with brazing flux; need not vacuum or protective atmosphere condition, can realize the solder alloy and preparation method thereof of solder without soldering acid foamed aluminium central layer of the high-intensity welding of foamed aluminium.
Above-mentioned purpose realizes by following scheme:
The invention provides prescription and the production technology thereof of the solder alloy that uses in the preparation foamed aluminium welding process.
The present invention solves the problems of the technologies described above the technical scheme that adopts:Design by alloy composition, in the silica-based scolder of aluminium, add Cu, the Mg element, preparation has mobile preferably, the alloy material of suitable fusing point is as solder, this solder alloy utilizes the Cu in the solder melt in welding process, the Mg alloying element spreads to solid-phase foam aluminium end, interaction with Al element in the mother metal, these processes cause near solder and the molten of mother metal the linkage interface to fall, promote the wetting of surface alumina oxide, make partial oxidation aluminium film destroy, the melt of solder liquefaction and mother metal is spread owing to capillary effect acts under the foamed aluminium cell wall skin covering of the surface, and film density floats on the surface less than the solder melt, the accelerated oxidation film is broken and be removed in subsequently scraping and extrusion process, and liquid solder is at the mother metal moistened surface simultaneously, sprawl the connection that realizes between part.
Beneficial effect of the present invention: in the silica-based scolder of aluminium, add Cu; the Mg element; preparation has mobile preferably; the alloy material of suitable fusing point is as solder; this solder alloy fusing point is low; good fluidity; in welding process, utilize the Cu in the solder melt; the Mg alloying element spreads to solid-phase foam aluminium end; at the mother metal moistened surface; sprawl the connection that realizes between part; do not need to be used in conjunction with brazing flux in this welding process; need not vacuum or protective atmosphere condition; remove dense oxidation film by cooperative mechanical/physical method; and when welding, form fine and close weld seam, realize the high-intensity welding of foamed aluminium.
The specific embodiment
Embodiment 1:
A kind of polynary aluminum alloy materials, it is the Al-Si-Cu-Mg alloy, wherein the quality percentage composition of Si is that the quality percentage composition of 8%, Cu is that the quality percentage composition of 10%, Mg is that the quality percentage composition of 10%, Al is 72%; 450-600 ℃ of melting temperature scope.Batching will be used highly purified metal.(Al purity is not less than the silicon metal that 99.00%, Si uses 4mm, and the purity of Mg is not less than 99.50%, Cu purity and is not less than 99.70%).In the appended claims
The preparation of above-mentioned Al-Si-Cu-Mg solder alloy:
1). photosensitive assay balance is adopted in the weighing of solder, and precision is not less than 0.001 gram.In order to guarantee the accuracy of solder composition, the control Aggregate Feeding Error is below 0.005 gram during use, and every stove preparation solder gross weight is 500 grams.Wherein the quality 40 of Si restrains, and the quality percentage composition of Cu is 50 grams, and the quality percentage composition of Mg is 50 grams, and the quality percentage composition of Al is 360 grams.
2). shove charge: with high-purity CaO matter crucible; Vaccum sensitive stove cold conditions final vacuum≤10-2Pa.Process is, fills 360 gram metallic aluminiums in CaO matter crucible, and Si, Cu, Mg are placed feeder; Vacuumize, vacuum will reach 10-2Pa in the stove: logical argon gas makes furnace pressure be not less than 0.05 Mpa.
3). melting: open electric furnace, the heating labor and materials to its more than melting range (850 ℃); Treat that aluminium liquefaction is clear, add Si and Cu, Mg stirs aluminium liquid; Treat that aluminium alloy liquefies clearly, stir aluminum alloy melt and vacuumize to make furnace pressure be not more than 0.009 MPa; Logical argon gas makes furnace pressure be not less than 0.05 MPa, stirs titanium-aluminium alloy liquid; Treat that molten metal is molten clear.
4). solidify: cooling has a power failure; Logical argon gas makes furnace pressure be not less than 0.08 MPa, opens electric furnace, and molten metal is poured in the metal mold, then carries out water-cooled, obtains block solder.
It is qualified that the present invention can produce chemical analysis, and impurity content is low, and the solder during a kind of foamed aluminium material solder without soldering acid of superior in quality conduct is applied to the welding moulding of large scale foamed aluminium board.
Embodiment 2:
A kind of polynary aluminum alloy materials, it is the Al-Si-Cu-Mg alloy, the Al-Si-Cu-Mg alloy, wherein the quality percentage composition of Si is that the quality percentage composition of 8%, Cu is that the quality percentage composition of 15%, Mg is that the quality percentage composition of 10%, Al is 62%; 450-600 ℃ of melting temperature scope.Batching will be used highly purified metal.(Al purity is not less than the silicon metal that 99.00%, Si uses 4mm, and the purity of Mg is not less than 99.50%, Cu purity and is not less than 99.70%).
The preparation of above-mentioned Al-Si-Cu-Mg solder alloy:
1). photosensitive assay balance is adopted in the weighing of solder, and precision is not less than 0.001 gram.In order to guarantee the accuracy of solder composition, the control Aggregate Feeding Error is below 0.005 gram during use, and every stove preparation solder gross weight is 500 grams.Wherein the quality 40 of Si restrains, and the quality percentage composition of Cu is 75 grams, and the quality percentage composition of Mg is 50 grams, and the quality percentage composition of Al is 345 grams.
2). shove charge: with high-purity CaO matter crucible; Vaccum sensitive stove cold conditions final vacuum≤10-2Pa.Process is, fills 360 gram metallic aluminiums in CaO matter crucible, and Si, Cu, Mg are placed feeder; Vacuumize, vacuum will reach 10 in the stove
-2Pa: logical argon gas makes furnace pressure be not less than 0.05 Mpa.
3). melting: open electric furnace, the heating labor and materials to its more than melting range (850); Treat that aluminium liquefaction is clear, add Si and Cu, Mg stirs aluminium liquid; Treat that aluminium alloy liquefies clearly, stir aluminum alloy melt and vacuumize to make furnace pressure be not more than 0.009 MPa; Logical argon gas makes furnace pressure be not less than 0.05 MPa, stirs titanium-aluminium alloy liquid; Treat that molten metal is molten clear.
4). solidify: cooling has a power failure; Logical argon gas makes furnace pressure be not less than 0.08 MPa, opens electric furnace, pours in the metal mold, then carries out water-cooled, obtains block solder.
It is qualified that the present invention can produce chemical analysis, and impurity content is low, and the solder during a kind of foamed aluminium material solder without soldering acid of superior in quality conduct is applied to the welding moulding of large scale foamed aluminium board.
Embodiment 3:
A kind of polynary aluminum alloy materials, it is the Al-Si-Cu-Mg alloy, the Al-Si-Cu-Mg alloy, the Al-Si-Cu-Mg alloy, wherein the quality percentage composition of Si is that the quality percentage composition of 10%, Cu is 10%, the quality percentage composition of Mg is that the quality percentage composition of 10%, Al is 70%; 450-600 ℃ of melting temperature scope.Batching will be used highly purified metal.(Al purity is not less than the silicon metal that 99.00%, Si uses 4mm, and the purity of Mg is not less than 99.50%, Cu purity and is not less than 99.70%).
The preparation of above-mentioned Al-Si-Cu-Mg solder alloy:
1). photosensitive assay balance is adopted in the weighing of solder, and precision is not less than 0.001 gram.In order to guarantee the accuracy of solder composition, the control Aggregate Feeding Error is below 0.005 gram during use, and every stove preparation solder gross weight is 500 grams.Wherein the quality 50 of Si restrains, and the quality percentage composition of Cu is 50 grams, and the quality percentage composition of Mg is 50 grams, and the quality percentage composition of Al is 350 grams.
2). shove charge: with high-purity CaO matter crucible; Vaccum sensitive stove cold conditions final vacuum≤10-2Pa.Process is, fills 360 gram metallic aluminiums in CaO matter crucible, and Si, Cu, Mg are placed feeder; Vacuumize, vacuum will reach 10 in the stove
-2Pa: logical argon gas makes furnace pressure be not less than 0.05 Mpa.
3). melting: open electric furnace, the heating labor and materials to its more than melting range (850); Treat that aluminium liquefaction is clear, add Si and Cu, Mg stirs aluminium liquid; Treat that aluminium alloy liquefies clearly, stir aluminum alloy melt and vacuumize to make furnace pressure be not more than 0.009 MPa; Logical argon gas makes furnace pressure be not less than 0.05 MPa, stirs titanium-aluminium alloy liquid; Treat that molten metal is molten clear.
4). solidify: cooling has a power failure; Logical argon gas makes furnace pressure be not less than 0.08 MPa, opens electric furnace, pours in the metal mold, then carries out water-cooled, obtains block solder.
It is qualified that the present invention can produce chemical analysis, and impurity content is low, and the solder during a kind of foamed aluminium material solder without soldering acid of superior in quality conduct is applied to the welding moulding of large scale foamed aluminium board.
Claims (7)
1. the solder alloy of a solder without soldering acid foamed aluminium central layer is characterized in that: it is melting range at 450-600 ℃ aluminum alloy materials.
2. the solder alloy of a kind of solder without soldering acid foamed aluminium central layer according to claim 1 is characterized in that: it is melting range at 450-600 ℃ Al-Si-Cu-Mg alloy material.
3. the solder alloy of a kind of solder without soldering acid foamed aluminium central layer according to claim 1 is characterized in that: for one of following six kinds:
(1) Al-Si-Cu-Mg alloy, wherein the quality percentage composition of Si is that the quality percentage composition of 8%, Cu is that the quality percentage composition of 10%, Mg is that the quality percentage composition of 10%, Al is 72%;
(2) Al-Si-Cu-Mg alloy, wherein the quality percentage composition of Si is that the quality percentage composition of 8%, Cu is that the quality percentage composition of 12%, Mg is that the quality percentage composition of 10%, Al is 70%;
(3) Al-Si-Cu-Mg alloy, wherein the quality percentage composition of Si is that the quality percentage composition of 8%, Cu is that the quality percentage composition of 15%, Mg is that the quality percentage composition of 10%, Al is 62%;
(4) Al-Si-Cu-Mg alloy, wherein the quality percentage composition of Si is that the quality percentage composition of 10%, Cu is that the quality percentage composition of 10%, Mg is that the quality percentage composition of 10%, Al is 70%;
(5) Al-Si-Cu-Mg alloy, wherein the quality percentage composition of Si is that the quality percentage composition of 10%, Cu is that the quality percentage composition of 12%, Mg is that the quality percentage composition of 10%, Al is 68%;
(6) Al-Si-Cu-Mg alloy, wherein the quality percentage composition of Si is that the quality percentage composition of 10%, Cu is that the quality percentage composition of 15%, Mg is that the quality percentage composition of 10%, Al is 65%.
4. the solder alloy of a kind of solder without soldering acid foamed aluminium central layer according to claim 1 is characterized in that: Al purity is not less than the silicon metal that 99.00%, Si uses 4mm, and the purity of Mg is not less than 99.50%, Cu purity and is not less than 99.70%.
5. the preparation method of the solder alloy of a solder without soldering acid foamed aluminium central layer as claimed in claim 1 or 2 or 3 or 4 is characterized in that: may further comprise the steps:
(1) takes by weighing by mass percentage Al, Si, Cu, Mg;
(2) use vaccum sensitive stove, fill first Al in CaO matter crucible, Si, Cu, Mg are placed feeder, vacuumize, vacuum will reach 10 in the vaccum sensitive stove
-2Below the Pa, logical argon gas makes furnace pressure be not less than 0.05 Mpa;
(3) open electric furnace, heating Al material is to more than 850 ℃; Treat that aluminium liquefaction is clear, add Si and Cu, Mg, stir; Treat that aluminium alloy liquefies clearly, stir aluminum alloy melt and vacuumize to make furnace pressure be not more than 0.009 MPa; Logical argon gas makes furnace pressure be not less than 0.05 MPa, stirs titanium-aluminium alloy liquid; Treat that molten metal is molten clear;
(4) stopped heating, cooling, logical argon gas makes furnace pressure be not less than 0.08 MPa, opens electric furnace, and molten metal is poured in the metal mold, then carries out water-cooled, obtains block solder, gets final product.
6. the preparation method of the solder alloy of a kind of solder without soldering acid foamed aluminium central layer according to claim 5, it is characterized in that: photosensitive assay balance is adopted in taking by weighing of step (1) Raw, precision is not less than 0.001 gram, and the control Aggregate Feeding Error is below 0.005 gram during use.
7. the preparation method of the solder alloy of a kind of solder without soldering acid foamed aluminium central layer according to claim 5, it is characterized in that: described CaO matter crucible is the described vaccum sensitive stove cold conditions of high-purity CaO matter crucible final vacuum≤10
-2Pa.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107127468A (en) * | 2017-05-05 | 2017-09-05 | 哈尔滨工业大学深圳研究生院 | A kind of high temperature based on foam copper interconnects the preparation method of solder joint |
| CN110756938A (en) * | 2019-10-25 | 2020-02-07 | 安徽省新方尊自动化科技有限公司 | Rapid brazing compounding process based on iron-based material induction heating |
| CN111979440A (en) * | 2020-08-20 | 2020-11-24 | 安徽工业大学 | Aluminum alloy component for preparing foamed aluminum by powder metallurgy method and foaming method |
| CN112359238A (en) * | 2020-11-05 | 2021-02-12 | 佛山市飞成金属制品有限公司 | Porous aluminum alloy preparation process and aluminum alloy super-heat-conduction plate |
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Effective date of registration: 20190523 Address after: 334224 Room 304, 12 Blocks, Zhangjiali New District, Sizhou Town Copper Mine, Dexing City, Shangrao City, Jiangxi Province Patentee after: Wang Guichang Address before: 241070 No. 11 Workshop of Small and Medium-sized Enterprises Pioneer Park, South District of Wuhu High-tech Industrial Development Zone, Anhui Province Patentee before: Wuhu Vodolf New Materials Co., Ltd. |