CN102938871A - Piezoelectric electret microphone and piezoelectric electret film thereof - Google Patents

Piezoelectric electret microphone and piezoelectric electret film thereof Download PDF

Info

Publication number
CN102938871A
CN102938871A CN2012104283960A CN201210428396A CN102938871A CN 102938871 A CN102938871 A CN 102938871A CN 2012104283960 A CN2012104283960 A CN 2012104283960A CN 201210428396 A CN201210428396 A CN 201210428396A CN 102938871 A CN102938871 A CN 102938871A
Authority
CN
China
Prior art keywords
piezo
housing
circuit board
electric electret
thin film
Prior art date
Application number
CN2012104283960A
Other languages
Chinese (zh)
Inventor
梁海
朱彪
Original Assignee
深圳市豪恩声学股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市豪恩声学股份有限公司 filed Critical 深圳市豪恩声学股份有限公司
Priority to CN2012104283960A priority Critical patent/CN102938871A/en
Publication of CN102938871A publication Critical patent/CN102938871A/en

Links

Abstract

A piezoelectric electret film comprises an input layer, a base material layer and a grounding layer, wherein the input layer is made of metal materials and used for feeding electrodes; the base material layer is made of porous polymer materials and treated in the electret mode, and charges are arranged in the base material layer; the grounding layer is made of metal materials and used for grounding; and the input layer, the base material layer and the grounding layer are laminated sequentially. When the piezoelectric electret film is applied to a microphone, the base material layer containing charges is not arranged on the surface of the piezoelectric electret film, so that even when the surface of the piezoelectric electret film is wet, the base material layer cannot be contacted with water directly, and the charges on the piezoelectric electret film can be effectively prevented from being lost. Simultaneously even when the surface of the base material layer is wet, the charges are stored in the base material layer, so that the charges cannot be directly contacted with the water, and further the charges can be prevented from being lost. The invention further provides a piezoelectric electret microphone using the piezoelectric electret film.

Description

Piezo-electric electret microphone and piezo-electric electret thin film thereof
Technical field
The present invention relates to microphone equipment, particularly relate to a kind of piezo-electric electret microphone and piezo-electric electret thin film thereof.
Background technology
Electret capacitor microphone has been widely used in each large field, such as mobile phone, notebook, panel computer, digital camera, video camera, game machine, mp3 and mp4 etc.In traditional electret capacitor microphone structure, comprise a utmost point of the electric capacity that is formed by becket and thin membrane-bound diaphragm, reach another utmost point of the electric capacity that is formed by the metal backplane with electret film.The metal backplane is connected with wiring board by copper ring, to form rear cavity configuration.Adopt at last the crimping mode to carry out sealed package, stick at outer casing bottom tone-entering hole place that screen cloth prevents dust, waterproof.
Because in traditional electret capacitor microphone, the electret film that forms electric capacity is in the surface, and is electrically charged on the electret film behind the electret, if the direct contact wetting in electret film surface, electric charge just is easy to lose, thereby causes microphone to lose efficacy.
Summary of the invention
Based on this, be necessary to provide a kind of piezo-electric electret thin film that can prevent that electric charge from losing.
A kind of piezo-electric electret thin film comprises:
Input layer is made by metal material, is used for as input electrode;
Substrate layer is made by porous polymer material, and described substrate layer is through the electret processing, and it is interior with electric charge;
Ground plane is made by metal material, is used for ground connection, and described input layer, described substrate layer and described ground plane stack gradually.
When above-mentioned piezo-electric electret thin film is applied on the microphone, because charged substrate layer is not in the surface of piezo-electric electret thin film, even the piezo-electric electret thin film surface gets wet, substrate layer can directly not contact with water yet, effectively prevents losing of electric charge on the piezo-electric electret thin film.Even simultaneously the substrate layer surface gets wet, because charge storage is inner in substrate layer, still can directly not contact with water, prevent that further electric charge from losing.
Also be necessary to provide the piezo-electric electret microphone that uses above-mentioned piezo-electric electret thin film.
A kind of piezo-electric electret microphone comprises:
Housing is the tubular structure of an end opening, and described housing comprises diapire and sidewall, and described diapire is offered tone-entering hole;
Circuit board is arranged at the opening part of described housing, and with the opening sealing of described housing, described housing and described circuit board form host cavity jointly;
Above-mentioned piezo-electric electret thin film is contained in the described host cavity, and described ground plane and described inside bottom wall fit, and described tone-entering hole is covered;
Sheet metal is contained in the described host cavity, and fits with described input layer; And
Becket is contained in the described host cavity, and described becket one side is connected with described sheet metal, and opposite side is connected with described circuit board.
Among embodiment, also comprise dead ring therein, made by elastomeric material, described dead ring is contained in the described host cavity, and is arranged between the sidewall of described copper ring and described housing, makes the insulation of described copper ring and described housing.
Therein among embodiment, the edge of described piezo-electric electret thin film is to a lateral buckling, and between described copper ring and described sidewall, makes the insulation of described copper ring and described housing.
A kind of piezo-electric electret microphone comprises:
Housing is the tubular structure of an end opening;
Circuit board is arranged at the opening part of described housing, and with the opening sealing of described housing, described housing and described circuit board form host cavity jointly, offer tone-entering hole on the described circuit board; And
Above-mentioned piezo-electric electret thin film, described piezo-electric electret thin film is contained in the described host cavity, and fits with described circuit board, and described piezo-electric electret thin film covers described tone-entering hole.
Among embodiment, described tone-entering hole is bending hole therein.
Among embodiment, also comprise metalwork therein; Described ground plane and described circuit board fit, and described tone-entering hole is covered, and described input layer is electrically connected with described circuit board by described metalwork.
Among embodiment, described tone-entering hole is provided with the metal screen cloth therein, is used for the shielding external disturbance; Described input layer and described circuit board fit, and described tone-entering hole is covered, and described ground plane is electrically connected with described housing.
A kind of piezo-electric electret microphone comprises:
Housing is the tubular structure of an end opening;
Circuit board is arranged at the opening part of described housing, and with the opening sealing of described housing, described housing and described circuit board form host cavity jointly, and described circuit board is provided with stitch; And
Above-mentioned piezo-electric electret thin film, its described input layer fit in described circuit board away from a side of described host cavity, and described ground plane is electrically connected with described housing, offers through hole on the described piezo-electric electret thin film, and described stitch wears described through hole.
A kind of piezo-electric electret microphone is characterized in that, comprising:
A plurality of housings, described housing are the tubular structure of an end opening;
Circuit board, described a plurality of housings are arranged on the described circuit board independently of each other, and described circuit board is with the opening sealing of described housing; And
Above-mentioned piezo-electric electret thin film together is arranged at the same side of described circuit board with described housing, and described input layer and described circuit board fit;
Wherein, the equal pressure holding of a plurality of described housings is in the ground plane of described piezo-electric electret thin film, the a plurality of host cavities of the common formation of described piezo-electric electret thin film and a plurality of described housing and described circuit board, described a plurality of housings space forms the entering tone space jointly, and described piezo-electric electret thin film is positioned at bottom, described entering tone space.
In above-mentioned piezo-electric electret microphone, adopt the elements such as piezo-electric electret thin film and circuit board, housing is sealed, prevent that effectively moisture from carrying out in the housing, effectively protected the important devices of piezo-electric electret microphone inside.
Description of drawings
Fig. 1 is the structure chart of the piezo-electric electret thin film of an embodiment;
Fig. 2 is the structure chart of the piezo-electric electret microphone of an embodiment;
Fig. 3 is the structure chart of the piezo-electric electret microphone of another embodiment;
Fig. 4 is the structure chart of the piezo-electric electret microphone of an again embodiment;
Fig. 5 is the structure chart of the piezo-electric electret microphone of an again embodiment;
Fig. 6 is the structure chart of the piezo-electric electret microphone of an again embodiment;
Fig. 7 is the structure chart of the piezo-electric electret microphone of an again embodiment.
Embodiment
For the ease of understanding the present invention, the below is described more fully the present invention with reference to relevant drawings.Provided better embodiment of the present invention in the accompanying drawing.But the present invention can realize with many different forms, be not limited to execution mode described herein.On the contrary, provide the purpose of these execution modes be make to disclosure of the present invention understand more comprehensively thorough.
Need to prove, when element is called as " being fixed in " another element, can directly can there be element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be to be directly connected to another element or may to have simultaneously centering elements.Term as used herein " vertical ", " level ", " left side ", " right side " and similar statement do not represent it is unique execution mode just for illustrative purposes.
Unless otherwise defined, the employed all technology of this paper are identical with the implication that belongs to the common understanding of those skilled in the art of the present invention with scientific terminology.Employed term is not intended to be restriction the present invention just in order to describe the purpose of concrete execution mode in specification of the present invention herein.Term as used herein " and/or " comprise one or more relevant Listed Items arbitrarily with all combinations.
See also Fig. 1, the piezo-electric electret thin film 100 of the present embodiment comprises input layer 110, substrate layer 120 and ground plane 130.Input layer 110, substrate layer 120 and ground plane 130 stack gradually, and form layer structure.Input layer 110 is made by metal material, is used for the input electrode as piezo-electric electret thin film 100.Ground plane 130 is also made by metal material, is used for the earth terminal as piezo-electric electret thin film 100.Substrate layer 120 is made by porous polymer material, and through the electret processing, substrate layer 120 deposits respectively positive and negative charge in its hole upper and lower surface, forms electric dipole.
When above-mentioned piezo-electric electret thin film 100 is applied on the microphone, because charged substrate layer 120 is not in the surface of piezo-electric electret thin film 100, even piezo-electric electret thin film 100 surfaces get wet, substrate layer 120 can directly not contact with water yet, effectively prevents losing of electric charge on the piezo-electric electret thin film 100.Even simultaneously substrate layer 120 surfaces get wet, because charge storage in substrate layer 120 inside, still can directly not contact with water, prevent that further electric charge from losing.
The piezo-electric electret that uses above-mentioned piezo-electric electret thin film microphone also is provided.See also Fig. 2, the piezo-electric electret microphone 20 of the present embodiment comprises piezo-electric electret thin film 100, housing 210, circuit board 220, sheet metal 230 and becket 240.
Housing 210 is the tubular structure of an end opening, and it is specially and is cylindrical structure, square cartridge structure etc.Housing 210 comprises diapire 212 and sidewall 214, offers tone-entering hole 216 on the diapire 212.Circuit board 220 is arranged at the opening part of housing 210, and the opening of housing 210 is sealed, housing 210 and the circuit board 220 common host cavities 290 that form.Electronic component 222 is set on the circuit board 220, and such as IC and filter element etc., electronic component 222 is contained in the host cavity 290.
Piezo-electric electret thin film 100 also is contained in the host cavity 290, and ground plane 130 fits with diapire 212 inboards, and tone-entering hole 216 is covered.Sheet metal 230 and becket 240 all are contained in the host cavity 290, and sheet metal 230 fits with input layer 110.Becket 240 1 sides are connected with sheet metal 230, and opposite side is connected with circuit board 220.
Above-mentioned piezo-electric electret microphone 20; the opening of housing 210 seals by circuit board 220; simultaneously; piezo-electric electret thin film 100 fits with diapire 210; tone-entering hole 216 on the housing 210 is covered by piezo-electric electret thin film 100; can prevent effectively that moisture from entering in the host cavity 290, effectively protect to be contained in host cavity 290 interior important devices such as electronic component 222 grades.
Housing 210 is generally made by metal material, and the ground plane 130 of piezo-electric electret thin film 100 fits with the diapire of housing 210, makes piezo-electric electret thin film 100 by housing 210 ground connection.Simultaneously the edge of piezo-electric electret thin film 100 is to a lateral buckling, and between copper ring 240 and sidewall 214, makes between copper ring 240 and the housing 214 and insulate.
It should be noted that to see also Fig. 3, piezo-electric electret microphone 20 also can comprise dead ring 250, and dead ring 250 is made by having flexible insulating material.Dead ring 250 is contained in the host cavity 290, and is arranged between copper ring 240 and the sidewall 214.Dead ring 250 makes copper ring 240 and housing 210 insulation.At this moment, piezo-electric electret thin film 100 does not need to a lateral buckling, so that it is between copper ring 240 and sidewall 214.Simultaneously, dead ring 250 is held in the periphery of piezo-electric electret thin film 100, makes the tightr of piezo-electric electret thin film 100 and housing 210 applyings by elastic force, and is better to the sealing effectiveness of tone-entering hole 216.
See also Fig. 4, the piezo-electric electret microphone 40 of another embodiment comprises piezo-electric electret thin film 100, housing 410, circuit board 420, support ring 430 and metalwork 440.
Housing 410 is the tubular structure of an end opening, and it is specially cylindrical structure, square cartridge structure etc.Circuit board 420 is arranged at the opening part of housing 410, and the opening of housing 410 is sealed, housing 410 and the circuit board 420 common host cavities 490 that form.Electronic component 424 is set on the circuit board 420, and such as IC and filter element etc., electronic component 424 is contained in the host cavity 490.Offer tone-entering hole 422 on the circuit board 420.
Piezo-electric electret thin film 100 is contained in the host cavity 490, and fits with circuit board 420, and piezo-electric electret thin film 100 covers tone-entering hole 422.430 pairs of piezo-electric electret thin films 100 of support ring play a supportive role.In the present embodiment, ground plane 130 and the circuit board 420 of piezo-electric electret thin film 100 fit, and tone-entering hole 422 is covered, and input layer 110 is electrically connected with circuit board 420 by metalwork 440.Metalwork 440 can be shell fragment, copper ring, copper post etc.
Be appreciated that and the input layer 110 of piezo-electric electret thin film 100 directly can be fitted on the circuit board 420, input layer 110 directly is electrically connected with circuit board 420, and this moment, metalwork 440 just can save.Simultaneously, because input layer 110 directly covers tone-entering hole 422, need be provided with the metal screen cloth on the tone-entering hole 422, the metal screen cloth is used for the shielding external disturbance.Ground plane 130 can be electrically connected with housing 410 by electric conductors such as copper rings, so that piezo-electric electret thin film 100 is by housing 410 ground connection.
Above-mentioned piezo-electric electret microphone 40; the opening of housing 410 seals by circuit board 420; simultaneously; piezo-electric electret thin film 100 fits with circuit board 420; tone-entering hole 422 on the circuit board 420 is covered by piezo-electric electret thin film 100; can prevent effectively that moisture from entering in the host cavity 490, effectively protect the important devices that is contained in the host cavity 490.
It is pointed out that to see also Fig. 5, tone-entering hole 422 can be bending hole, makes piezo-electric electret microphone 40 when having good water resistance, increases the size of tone-entering hole 422.
See also Fig. 6, the piezo-electric electret microphone 60 of an embodiment comprises piezo-electric electret thin film 100, housing 610, circuit board 620 and support ring 630 again.
Housing 610 is the tubular structure of an end opening, and it is specially cylindrical structure, square cartridge structure etc.Circuit board 620 is arranged at the opening part of housing 610, and the opening of housing 610 is sealed, housing 610 and the circuit board 620 common host cavities 690 that form.
Piezo-electric electret thin film 100 is arranged on the circuit board 620, and input layer 110 fits in circuit board 620 away from a side of host cavity 690, and input layer 110 is electrically connected with circuit board 620.Ground plane 130 and housing 610 are electrically connected by edge sealing, so that piezo-electric electret thin film 100 ground connection.Offer through hole 140 on the piezo-electric electret thin film 100.Circuit board 620 is provided with stitch 622, and stitch 622 wears through hole 140.Circuit board 620 communicates with the outside by stitch 622 and is connected.
Above-mentioned piezo-electric electret microphone 60, the opening of housing 610 seals by circuit board 620, prevents that effectively moisture from entering in the host cavity 690, has effectively protected the important electronic component that is contained in the host cavity 690.
See also Fig. 7, the piezo-electric electret microphone 70 of an embodiment comprises piezo-electric electret thin film 100, a plurality of housing 710 and circuit board 720 again.
Housing 710 is the tubular structure of an end opening, and a plurality of housing 710 is arranged on the circuit board 720 independently of each other, and circuit board 720 is with the opening sealing of housing 710.Electronic component 722 is set, such as IC and filter element etc. on the circuit board 720.
Piezo-electric electret thin film 100 and housing 710 together are arranged at the same side of circuit board 720, and input layer 110 fits with circuit board 720.Input layer 110 is electrically connected with electronic component 722 by the cabling 724 on the circuit board 720.
A plurality of housing 710 equal pressure holdings are in the ground plane 130 of piezo-electric electret thin film 100.And piezo-electric electret thin film 100 and circuit board 720 and a plurality of housing 710 common host cavities 790 that form ring-type.A plurality of housings 710 spaces form entering tone space 714 jointly, and piezo-electric electret thin film 100 is positioned at bottom, entering tone space, receive the outside sound that imports into by entering tone space 714.
The important devices such as electronic component 722 are contained in the host cavity 790.Housing 710 and electronic component 722 etc. all can pass through surface mounting technology (Surface Mounted Technology, SMT) and be arranged on the circuit board 720.Conductive tape can be posted in the two sides of piezo-electric electret thin film 100, and is arranged on the circuit board 720 by manual mounting method.
Above-mentioned piezo-electric electret microphone 70, the opening of housing 710 seals by circuit board 720.Simultaneously, pressure holding is in piezo-electric electret thin film 100 respectively for a plurality of housings 710, and piezo-electric electret thin film 100 can prevent effectively that with the sealing of the shell wall around the entering tone space 714 moisture from entering in the host cavity 790, has protected the important devices that is contained in the host cavity 790.
It should be noted that at above-mentioned piezo-electric electret microphone 70 and can specifically be applied in the client, such as mobile phone, notebook computer etc.Circuit board 720 can be the circuit board of client, and circuit board 720 also is provided with the electronic component 726 of the clients such as mobile phone, notebook computer.Be appreciated that housing 710 also can be the shell of the clients such as mobile phone, notebook computer.
The above embodiment has only expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.

Claims (10)

1. a piezo-electric electret thin film is characterized in that, comprising:
Input layer is made by metal material, is used for as input electrode;
Substrate layer is made by porous polymer material, and described substrate layer is through the electret processing, and it is interior with electric charge; And
Ground plane is made by metal material, is used for ground connection, and described input layer, described substrate layer and described ground plane stack gradually.
2. a piezo-electric electret microphone is characterized in that, comprising:
Housing is the tubular structure of an end opening, and described housing comprises diapire and sidewall, and described diapire is offered tone-entering hole;
Circuit board is arranged at the opening part of described housing, and with the opening sealing of described housing, described housing and described circuit board form host cavity jointly;
Piezo-electric electret thin film as claimed in claim 1 is contained in the described host cavity, and described ground plane and described inside bottom wall fit, and described tone-entering hole is covered;
Sheet metal is contained in the described host cavity, and fits with described input layer; And
Becket is contained in the described host cavity, and described becket one side is connected with described sheet metal, and opposite side is connected with described circuit board.
3. piezo-electric electret microphone according to claim 2 is characterized in that, also comprises dead ring, made by elastomeric material, described dead ring is contained in the described host cavity, and is arranged between the sidewall of described copper ring and described housing, makes the insulation of described copper ring and described housing.
4. piezo-electric electret microphone according to claim 2 is characterized in that, the edge of described piezo-electric electret thin film is to a lateral buckling, and between described copper ring and described sidewall, makes the insulation of described copper ring and described housing.
5. a piezo-electric electret microphone is characterized in that, comprising:
Housing is the tubular structure of an end opening;
Circuit board is arranged at the opening part of described housing, and with the opening sealing of described housing, described housing and described circuit board form host cavity jointly, offer tone-entering hole on the described circuit board; And
Piezo-electric electret thin film as claimed in claim 1, described piezo-electric electret thin film is contained in the described host cavity, and fits with described circuit board, and described piezo-electric electret thin film covers described tone-entering hole.
6. piezo-electric electret microphone according to claim 5 is characterized in that, described tone-entering hole is bending hole.
7. piezo-electric electret microphone according to claim 5 is characterized in that, also comprises metalwork; Described ground plane and described circuit board fit, and described tone-entering hole is covered, and described input layer is electrically connected with described circuit board by described metalwork.
8. piezo-electric electret microphone according to claim 5 is characterized in that, described tone-entering hole is provided with the metal screen cloth, is used for the shielding external disturbance; Described input layer and described circuit board fit, and described tone-entering hole is covered, and described ground plane is electrically connected with described housing.
9. a piezo-electric electret microphone is characterized in that, comprising:
Housing is the tubular structure of an end opening;
Circuit board is arranged at the opening part of described housing, and with the opening sealing of described housing, described housing and described circuit board form host cavity jointly, and described circuit board is provided with stitch; And
Piezo-electric electret thin film as claimed in claim 1, its described input layer fit in described circuit board away from a side of described host cavity, and described ground plane is electrically connected with described housing, offers through hole on the described piezo-electric electret thin film, and described stitch wears described through hole.
10. a piezo-electric electret microphone is characterized in that, comprising:
A plurality of housings, described housing are the tubular structure of an end opening;
Circuit board, described a plurality of housings are arranged on the described circuit board independently of each other, and described circuit board is with the opening sealing of described housing; And
Piezo-electric electret thin film as claimed in claim 1 together is arranged at the same side of described circuit board with described housing, and described input layer and described circuit board fit;
Wherein, the equal pressure holding of a plurality of described housings is in the ground plane of described piezo-electric electret thin film, the a plurality of host cavities of the common formation of described piezo-electric electret thin film and a plurality of described housing and described circuit board, described a plurality of housings space forms the entering tone space jointly, and described piezo-electric electret thin film is positioned at bottom, described entering tone space.
CN2012104283960A 2012-10-31 2012-10-31 Piezoelectric electret microphone and piezoelectric electret film thereof CN102938871A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012104283960A CN102938871A (en) 2012-10-31 2012-10-31 Piezoelectric electret microphone and piezoelectric electret film thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012104283960A CN102938871A (en) 2012-10-31 2012-10-31 Piezoelectric electret microphone and piezoelectric electret film thereof

Publications (1)

Publication Number Publication Date
CN102938871A true CN102938871A (en) 2013-02-20

Family

ID=47697736

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012104283960A CN102938871A (en) 2012-10-31 2012-10-31 Piezoelectric electret microphone and piezoelectric electret film thereof

Country Status (1)

Country Link
CN (1) CN102938871A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103581812A (en) * 2013-09-27 2014-02-12 宁波鑫丰泰电器有限公司 Piezoelectric electret microphone
CN103826191A (en) * 2013-10-18 2014-05-28 杨仙君 Piezoelectric electret microphone
CN106042466A (en) * 2016-05-19 2016-10-26 上海驻极新材料科技有限公司 Superhydrophobic unipolar electret film and preparation method therefor

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1400846A (en) * 2001-07-31 2003-03-05 松下电器产业株式会社 Capacitor microphone and its making process
US20050025328A1 (en) * 2003-07-29 2005-02-03 Song Chung Dam Integrated base and electret condenser microphone using the same
CN201328182Y (en) * 2008-12-03 2009-10-14 歌尔声学股份有限公司 Microphone diaphragm and electret condenser microphone
CN102387456A (en) * 2011-11-02 2012-03-21 深圳市豪恩声学股份有限公司 Midget microphone and manufacturing method thereof
CN102723752A (en) * 2012-05-24 2012-10-10 深圳市豪恩声学股份有限公司 Piezoelectric charging type mobile terminal

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1400846A (en) * 2001-07-31 2003-03-05 松下电器产业株式会社 Capacitor microphone and its making process
US20050025328A1 (en) * 2003-07-29 2005-02-03 Song Chung Dam Integrated base and electret condenser microphone using the same
CN201328182Y (en) * 2008-12-03 2009-10-14 歌尔声学股份有限公司 Microphone diaphragm and electret condenser microphone
CN102387456A (en) * 2011-11-02 2012-03-21 深圳市豪恩声学股份有限公司 Midget microphone and manufacturing method thereof
CN102723752A (en) * 2012-05-24 2012-10-10 深圳市豪恩声学股份有限公司 Piezoelectric charging type mobile terminal

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103581812A (en) * 2013-09-27 2014-02-12 宁波鑫丰泰电器有限公司 Piezoelectric electret microphone
CN103581812B (en) * 2013-09-27 2017-02-22 宁波鑫丰泰电器有限公司 Piezoelectric electret microphone
CN103826191A (en) * 2013-10-18 2014-05-28 杨仙君 Piezoelectric electret microphone
CN103826191B (en) * 2013-10-18 2017-01-11 杨仙君 Piezoelectric electret microphone
CN106042466A (en) * 2016-05-19 2016-10-26 上海驻极新材料科技有限公司 Superhydrophobic unipolar electret film and preparation method therefor
CN106042466B (en) * 2016-05-19 2019-01-01 上海驻极新材料科技有限公司 A kind of super-hydrophobic unipolarity electret film and preparation method thereof

Similar Documents

Publication Publication Date Title
US8380258B2 (en) Mobile terminal
CN103959480B (en) Flexible battery group
US7260230B2 (en) High performance microphone and manufacturing method thereof
CN103154857B (en) For providing the device and method of tactile and audible feedback in the user interface of touch sensible
JP4880018B2 (en) Portable terminal device and case waterproof structure
EP2869596B1 (en) Complex device and electronic device having the same
CN101295848B (en) Electric connector and camera device with the same
US20160182114A1 (en) Protective cover and shell thereof
JP2010273213A (en) Mobile terminal device and electronic equipment
WO2018113157A1 (en) Support, functional device and terminal equipment
US20120268875A1 (en) Mounting structure of circuit board having thereon multi-layered ceramic capacitor, method thereof, land pattern of circuit board for the same, packing unit for multi-layered ceramic capacitor taped horizontally and aligning method thereof
US8243458B2 (en) Waterproof structure for portable electronic device
US8002564B2 (en) Housing of portable electronic device
TW200808091A (en) Microphone module and method for fabricating the same
US8358110B2 (en) Integration of supercapacitors within a flexible printed circuit and associated methods
KR20140137542A (en) Secondary Battery Pack Having Non-Protruded Connector
US9564275B2 (en) Supercapacitor structures
US8519279B2 (en) Portable electronic device with interface
US8144898B2 (en) High performance microphone and manufacturing method thereof
US20090268382A1 (en) Button structure
CN101803404A (en) condenser microphone
CN203747019U (en) Electronic equipment
US9699538B2 (en) MEMS microphone device
US9871273B2 (en) Surface mount battery and portable electronic device with integrated battery cell
US8662937B2 (en) Audio jack and electronic apparatus containing the same

Legal Events

Date Code Title Description
PB01 Publication
C06 Publication
SE01 Entry into force of request for substantive examination
C10 Entry into substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20130220

C12 Rejection of a patent application after its publication