CN102925069A - Rubber belt structure for sticking film to wafer, film sticking equipment and film sticking method - Google Patents
Rubber belt structure for sticking film to wafer, film sticking equipment and film sticking method Download PDFInfo
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- CN102925069A CN102925069A CN2012103782069A CN201210378206A CN102925069A CN 102925069 A CN102925069 A CN 102925069A CN 2012103782069 A CN2012103782069 A CN 2012103782069A CN 201210378206 A CN201210378206 A CN 201210378206A CN 102925069 A CN102925069 A CN 102925069A
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Abstract
The invention discloses a rubber belt structure for sticking a film to a wafer, film sticking equipment and a film sticking method. The rubber belt structure sequentially comprises a transparent base material layer, a transparent sticking layer and a transparent stripping piece, wherein the transparent sticking layer is provided with a first sticking surface and a second sticking surface, and the first sticking surface is stuck on the transparent base material layer; and the transparent stripping piece can be combined on the second sticking surface in a stripping way, the transparent stripping piece is provided with a plurality of shading parts at intervals, and the distance between every two adjoining shading parts is equal to the length required by sticking the film to the wafer once. Therefore, according to the invention, the cutting position of the length required by sticking the film to the wafer once by the transparent rubber belt for sticking the film can be detected or determined, so that the modification machine table, the artificial judgment used equipment, and the personnel cost can be saved.
Description
Technical field
The invention relates to a kind of wafer pad pasting with tape construction, wafer pad pasting with equipment and method for adhering film, particularly relevant for a kind of wafer that is applicable to Cutting Automation paste mould with tape construction, wafer pad pasting with equipment and method for adhering film.
Background technology
Semiconductor crystal wafer must carry out a wafer cutting step, wafer is cut into the chip of a plurality of general one-tenth diamond types through after the integrated circuit technology.The wafer current cutting is the cutting mode that can divide into diamond cutter cut mechanically and laser cutting, in diamond cutter cut mechanically mode, usually the cutter direction that enters of cutting is to be begun by the surface that described wafer has been formed with IC, cuts through the back side of wafer and a little dicing tape.In the laser cutting mode, mainly be divided into laser and do not penetrate adhesive tape cutting mode and laser penetration adhesive tape cutting mode in addition.When carrying out laser penetration adhesive tape cutting mode, in the past, before will being formed with the chip singualtion of circuit face, all pass through at the inboard of ring frame configuration wafer, paste in its surface the scotch tape that supporting wafer is used, and wafer is fixed on the inboard of ring frame, so that laser penetration adhesive tape cutting crystal wafer becomes several chips.Yet, because present scotch tape is fully transparent, therefore when the adhesive tape sticking crystal column surface carried out, length and the locating point that can cause adhesive tape to be involved in board can't by sensor detecting, cut off the time point of a wafer pad pasting desired length to such an extent as to can't judge cutter.
There is use to cut in advance (pre-cut) adhesive tape and interdict manually to cut to pass with present existing settling mode and answers the device dual mode.Using in advance, the dicing tape mode is to be pre-formed several circular cutting parts at the strip scotch tape in advance, when dicing tape is in advance sent on the board, only need adhesive tape with circular cutting part by after taking off on the stripping film, can be delivered directly in the wafer pad pasting district and use, therefore do not need to detect again the length of adhesive tape and carry out any cutting, yet the board that uses must in response to this special special adhesive bring the design its transfer mechanism, board repacking cost is too high in actual use, and this kind the material cost of dicing tape is also higher in advance.In addition, if detect dicing tape length with manually blocking cutting approach sensor, then be with after judging by artificial visual, utilize hand or object blocking sensor, allow the action of guiding adhesive tape temporarily stop, reaching the effect of detecting dicing tape length, yet described method not only has the worker of generation to pacify the doubt of event, for operating accuracy, applying output and human cost, all do not meet economic benefit.
Therefore, be necessary to provide a kind of wafer to paste mould and paste mould with equipment and method for adhering film, to solve the existing problem of prior art with tape construction, wafer.
Summary of the invention
In view of this, the invention provides a kind of wafer and paste mould tape construction, wafer subsides mould with equipment and method for adhering film, to solve the existing the problems referred to above of prior art.
Main purpose of the present invention is to provide a kind of wafer to paste mould and pastes mould with equipment and method for adhering film with tape construction, wafer, it utilizes several light shielding parts on the transparent stripping film of a tape construction or utilizes a length of tape arrangement for detecting regularly to interdict induction light beam dual mode, detect or determine the pad pasting cutting position of a wafer pad pasting of scotch tape desired length, thereby save equipment and the personnel costs of repacking board and use artificial judgment.
For reaching aforementioned purpose of the present invention, one embodiment of the invention provides a kind of wafer pad pasting tape construction, and wherein said wafer pad pasting comprises with tape construction: a transparent substrate layer, a transparent bonding coat and a transparent stripping film.Described transparent bonding coat has one first gluing face and the second gluing face, and described the first gluing face is bonding on the described transparent substrate layer.Described transparent stripping film is strippable to be combined on described the second gluing face; Wherein said transparent stripping film is equally spaced several light shielding parts that arranges in addition, and the distance between each two adjacent described light shielding part equals the required length of wafer pad pasting one time.
In one embodiment of this invention, described light shielding part is to be strip or block equidistantly being distributed on the described transparent stripping film.
In one embodiment of this invention, on described transparent stripping film, a lateral length of described light shielding part is a lateral length that is equal to or less than described transparent stripping film, and a longitudinal length of described light shielding part is between 0.5 to 10 centimeter.
In one embodiment of this invention, on described transparent stripping film, the distance between each two adjacent described light shielding part is between 100 to 500 millimeters.
In one embodiment of this invention, on described transparent stripping film, the material of described light shielding part is laser absorption material or infrared absorbing material.
Moreover, the invention provides a kind of wafer pad pasting method for adhering film of adhesive tape, it comprises following steps: as mentioned above a wafer pad pasting tape construction is provided, it sequentially comprises: a transparent substrate layer, a transparent bonding coat and a transparent stripping film, and equally spaced several light shielding parts that arranges of described transparent stripping film, the distance between each two adjacent described light shielding part equals the required length of wafer pad pasting one time; Described transparent stripping film is separated from described transparent bonding coat and described transparent substrate layer, simultaneously described transparent bonding coat and described transparent substrate layer are directed to forward top, a wafer pad pasting district; And utilize length of tape arrangement for detecting detecting whether the described light shielding part of described transparent stripping film arrived a detecting position, if wherein described light shielding part not yet arrives described detecting position, then continue the described transparent bonding coat of guiding and described transparent substrate layer and advance; If described light shielding part has arrived described detecting position, then stop to guide described transparent bonding coat and described transparent substrate layer, and then described transparent bonding coat and the described transparent substrate layer that arrives described wafer pad pasting district cut.
In one embodiment of this invention, described length of tape arrangement for detecting comprises: a light beam generation unit, be positioned at a side of described transparent stripping film, and be used for sending an induction light beam; Reach a sensor, be positioned at the opposite side of described transparent stripping film, be used for receiving described induction light beam.
Moreover, another embodiment of the present invention provides another kind of wafer pad pasting equipment, wherein said wafer pad pasting comprises with equipment: an adhesive tape feeding unit, and to supply a wafer pad pasting tape construction, it sequentially comprises: a transparent substrate layer, a transparent bonding coat and a transparent stripping film; One tape stripping unit is to separate described transparent stripping film from described transparent bonding coat and described transparent substrate layer; One adhesive tape guide unit is directed to top, a wafer pad pasting district with described transparent bonding coat and the described transparent substrate layer of peeling off; It is characterized in that: described wafer pad pasting comprises in addition with equipment: a length of tape arrangement for detecting, and it comprises: a light beam generation unit is used for sending an induction light beam; One sensor is used for receiving described induction light beam; One shading baffle is in order to interdict described induction light beam; Reach a timing column spinner, combine with described shading baffle, and described timing rotation post namely turns to every a scheduled time and makes described shading baffle arrive a detecting position, interdicting described induction light beam, wherein said adhesive tape guide unit is guided the distance that the described transparent bonding coat peeled off and described transparent substrate layer advance and is equaled the required length of wafer pad pasting one time within the described scheduled time.
Moreover, the invention provides a kind of wafer pad pasting method for adhering film of equipment, it comprises following steps: utilize as mentioned above a wafer pad pasting to provide a wafer pad pasting tape construction with equipment, it sequentially comprises: a transparent substrate layer, a transparent bonding coat and a transparent stripping film; Described transparent stripping film is separated from described transparent bonding coat and described transparent substrate layer, simultaneously described transparent bonding coat and described transparent substrate layer are directed to forward top, a wafer pad pasting district; Utilize a length of tape arrangement for detecting to detect the length that described transparent bonding coat and described transparent substrate layer are advanced, wherein said length of tape arrangement for detecting, it comprises: a light beam generation unit, be positioned at a side of described transparent stripping film, and be used for sending an induction light beam; One sensor is positioned at the opposite side of described transparent stripping film, is used for receiving described induction light beam; One shading baffle is in order to interdict described induction light beam; Reach a timing column spinner, combine with described shading baffle, and described timing rotation post namely turns to every a scheduled time and makes described shading baffle arrive described detecting position, interdicting described induction light beam, what wherein said adhesive tape guide unit guided within the described scheduled time that the described transparent bonding coat peeled off and transparent substrate layer advance equals the required length of wafer pad pasting one time apart from length; And described transparent bonding coat and the described transparent substrate layer that arrives described wafer pad pasting district cut.
Compared with prior art, wafer pad pasting of the present invention not only can be simplified the also automatic operation process of precision laser penetration adhesive tape with tape construction, pad pasting with equipment and using method thereof, also can reduce equipment and personnel costs.
For foregoing of the present invention can be become apparent, preferred embodiment cited below particularly, Bing cooperate appended graphic, are described in detail below:
Description of drawings
Fig. 1 is the sectional view that one embodiment of the invention wafer pad pasting is used tape construction.
Fig. 2 A and 2B are the vertical views that one embodiment of the invention wafer pad pasting is used tape construction.
Fig. 3 is one embodiment of the invention wafer pad pasting uses equipment with adhesive tape stereographic map.
Fig. 4 is one embodiment of the invention wafer pad pasting uses equipment with adhesive tape sectional view.
Fig. 5 is the sectional view that another embodiment of the present invention pad pasting is used equipment.
Embodiment
Below the explanation of each embodiment be with reference to additional graphic, can be in order to the specific embodiment of implementing in order to illustration the present invention.Moreover, the direction term that the present invention mentions, such as " on ", D score, " top ", " end ", 'fornt', 'back', " left side ", " right side ", " interior ", " outward ", " side ", " on every side ", " central authorities ", " level ", " laterally ", " vertically ", " vertically ", " axially ", " radially ", " the superiors " or " orlop " etc., only be the direction with reference to annexed drawings.Therefore, the direction term of use is in order to explanation and understands the present invention, but not in order to limit the present invention.
Please refer to shown in Figure 1ly, the wafer pad pasting of one embodiment of the invention mainly comprises with tape construction 1: a transparent substrate layer 11, a transparent bonding coat 12 and a transparent stripping film 13.Described transparent bonding coat 12 has one first gluing face and the second gluing face, and described the first gluing face is bonding on the described transparent substrate layer ¨.Described transparent stripping film 13 strippable being combined on described the second gluing face; Described transparent stripping film 13 is equally spaced several light shielding parts 131 that arranges in addition, and the distance between each two adjacent described light shielding part 131 equals the required length of wafer pad pasting one time.What other did not contain shaded effect is the stripping film body 132 of described transparent stripping film 13, namely transparent stripping film part.
Please refer to shown in Fig. 2 A, described light shielding part 131 can be to be on the described transparent stripping film 13 of equidistantly being distributed in of strip, one lateral length of wherein said light shielding part 131 is lateral lengths that equal described transparent stripping film 13, and a longitudinal length of described light shielding part 131 is for example between 0.5 to 10 centimeter.Moreover the distance between each two adjacent described light shielding part 131 is for example between 100 to 500 millimeters; And the material of described light shielding part 131 for example can be the laser absorption material also or infrared absorbing material.
Please refer to shown in Fig. 2 B, the wafer pad pasting of one embodiment of the invention can also form other shapes with the described light shielding part 131 of tape construction 1, for example can be to be block equidistantly being distributed on the described transparent stripping film 13, a lateral length of described light shielding part 131 be the lateral lengths less than described transparent stripping film 13 at this moment.The advantage of above-mentioned feature is: the shape area of described light shielding part 131 can be designed to enough block induced light beam detectings and get final product, and therefore just can save the material of described light shielding part and the material cost that described pad pasting is used adhesive tape 1.
Referring again to shown in Figure 3, the wafer pad pasting of one embodiment of the invention can be applicable to wafer pad pasting equipment among Fig. 3 with tape construction 1, and described wafer pad pasting mainly comprises with equipment: a length of tape arrangement for detecting 2, an adhesive tape feeding unit 3, a tape stripping unit 4 and an adhesive tape guide unit 5.
Described length of tape arrangement for detecting 2 comprises a light beam generation unit 21 and a sensor 22, and described light beam generation unit 21 is positioned at a side of described transparent stripping film 13, is used for sending an induction light beam.Described sensor 22 is positioned at the opposite side of described transparent stripping film 13, is used for receiving described induction light beam.Described adhesive tape feeding unit 3 is in order to supply wafer pad pasting tape construction 1, and it sequentially comprises: a transparent substrate layer 11, a transparent bonding coat 12 and a transparent stripping film 13.Described adhesive tape feeding unit 3 can at least one swing roller structure or a robotic arm, be guided out described scotch tape 1 by rotation or pulling.
Moreover described tape stripping unit 4 is in order to separate described transparent stripping film 13 from described transparent bonding coat 12 and transparent substrate layer 11.Described adhesive tape feeding unit 3 can or also can be a robotic arm at least one swing roller, by the rotation or the pulling described transparent stripping film 13 is separated, and can with behind described transparent stripping film 13 scrolls to reclaim.Described adhesive tape guide unit 5 can be directed to 53 tops, a wafer pad pasting district by at least one guide roller 51 with described transparent bonding coat 12 and the described transparent substrate layer 11 of peeling off, and then a wafer 52 is placed on the described transparent bonding coat 12.
Referring again to shown in Figure 4, the wafer pad pasting of one embodiment of the invention mainly comprises the following step with the method for adhering film of adhesive tape 1:
At first, provide such as Fig. 1,2A and the described wafer pad pasting of 2B tape construction 1.
Then, wafer pad pasting among recycling Fig. 3 separates described transparent stripping film 13 with equipment from described transparent bonding coat 12 and transparent substrate layer 11, simultaneously described transparent bonding coat 12 and transparent substrate layer 11 are directed to forward in the wafer pad pasting district 53 (as shown in Figure 3).
Subsequently, sensor 22 detecting that the recycles a length of tape arrangement for detecting 2 whether described light shielding part 131 of described transparent stripping film 13 has arrived a detecting position, if wherein described light shielding part 131 not yet arrives described detecting position, then the induction light beam that sends of described light beam generation unit 21 is not interdicted, therefore therefore described sensor 22 does not send blocking information, described adhesive tape guide unit 5 continues 11 layers of the described transparent bonding coats 12 of guiding and transparent substrates and advances; Perhaps, if described light shielding part 131 has arrived described detecting position, then the induction light beam that sends of described light beam generation unit 21 will be by described light shielding part 131 blockings, therefore described sensor 22 will send blocking information to one controller (not illustrating), described controller will be sent a control information and cause described adhesive tape guide unit 5 to stop to guide described transparent bonding coat 12 and transparent substrate layer 11.Then wafer 52 is placed and is pasted on the described transparent bonding coat 12, then described transparent bonding coat 12 and the described transparent substrate layer 11 that arrives described wafer pad pasting district 53 cut.
Can obtain circular transparent bonding coat 12 and transparent substrate layer 11 after above-mentioned the cutting and stay on the described wafer 52, so that the follow-up cutting technique that described wafer 52 is carried out the laser penetration adhesive tape.As mentioned above, the present invention utilizes several light shielding parts 131 on the wafer pad pasting usefulness transparent stripping film 13 of tape construction 1, can make smoothly described sensor 22 detect whether described induction light beam is by described light shielding part 131 blockings, determining the cutting position of 1 wafer pad pastings of described tape construction desired length, thereby save the repacking board and use equipment and the personnel costs of artificial judgment.
On the other hand, please refer to shown in Figure 5, another embodiment of the present invention provides another kind of wafer pad pasting equipment, it then is to change into utilizing a length of tape arrangement for detecting 2 regularly to interdict the induction light beam, use the cutting position of 1 wafer pad pastings of tape construction desired length with detecting or decision wafer pad pasting, described wafer pad pasting mainly comprises with equipment: a length of tape arrangement for detecting 2, an adhesive tape feeding unit 3, a tape stripping unit 4 and an adhesive tape guide unit 5.
Described length of tape arrangement for detecting 2 comprises: a light beam generation unit 21, a sensor 22, a shading baffle 23 and be column spinner 24 regularly.Described light beam generation unit 21 is used for sending an induction light beam.The induction light beam of described light beam generation unit 21 can be laser beam or infrared light beam.Described sensor 22 is used for receiving described induction light beam.Described shading baffle 23 is in order to interdict described induction light beam.Described timing rotation post 24 combines with an end of described shading baffle 23, and described timing rotation post 24 namely turned to so that described shading baffle 23 arrives a detecting position, so that described shading baffle 23 interdicts described induction light beam every a scheduled time.
Described adhesive tape feeding unit 3 is in order to supply wafer pad pasting tape construction 1, and it sequentially comprises: a transparent substrate layer 11, a transparent bonding coat 12 and a transparent stripping film 13, but in the present embodiment, described transparent stripping film 13 does not have light shielding part 131.Described adhesive tape feeding unit 3 can at least one swing roller structure or a robotic arm, be guided out described scotch tape 1 by rotation or pulling.
Described tape stripping unit 4 is to separate described transparent stripping film 13 from described transparent bonding coat 12 and transparent substrate layer 11; Described adhesive tape feeding unit 3 can be a swing roller or a robotic arm, by the rotation or the pulling described transparent stripping film 13 is separated, and can with behind described transparent stripping film 13 scrolls to reclaim.
Described adhesive tape guide unit 5 can be directed to 53 tops, a wafer pad pasting district by at least one guide roller 51 with the above-mentioned transparent bonding coat 12 of peeling off and transparent substrate layer 11, and described wafer 52 can be placed on 53 tops, described wafer pad pasting district; Wherein namely turning to every a scheduled time at described timing rotation post 24 makes described shading baffle 23 arrive a detecting position when interdicting described induction light beam, described adhesive tape guide unit 5 is guided the distance that the above-mentioned transparent bonding coat 12 of peeling off and transparent substrate layer 11 advance within the described scheduled time be to be designed to equal the required length of wafer pad pasting one time, for example between 100 to 500 millimeters.
Referring again to shown in Figure 5, the wafer pad pasting of Fig. 5 embodiment of the present invention mainly comprises the following step with the method for adhering film of equipment:
At first, provide a scotch tape, it sequentially comprises: a transparent substrate layer 11, a transparent bonding coat 12 and a transparent stripping film 13, in the present embodiment, described transparent stripping film 13 does not have light shielding part 131.
Then, the wafer pad pasting of recycling Fig. 5 separates described transparent stripping film 13 with equipment from described transparent bonding coat 12 and transparent substrate layer 11, simultaneously described transparent bonding coat 12 and described transparent substrate layer 11 are directed to forward 53 tops, a wafer pad pasting district.
Subsequently, recycle the sensor 22 described transparent bonding coats 12 of detecting of described length of tape arrangement for detecting 2 and the length that described transparent substrate layer 11 is advanced, wherein said timing rotation post 24 every a scheduled time (such as 1 to 60 second) namely turn to make as described in shading baffle 23 arrive as described in the detecting position, to interdict described induction light beam, therefore described sensor 22 will send blocking information to one controller (not illustrating), described controller will be sent a control information and cause described adhesive tape guide unit 5 to stop to guide described transparent bonding coat 12 and transparent substrate layer 11, and wherein said adhesive tape guide unit 5 is guided the distance that the described transparent bonding coat 12 peeled off and described transparent substrate layer 11 advance and equaled the required length of wafer pad pasting one time within the described scheduled time.At last, a wafer 52 is placed and is pasted on the described clear adhesive 12, more described transparent bonding coat 12 and the described transparent substrate layer 11 that arrives described wafer pad pasting district 53 cut, it can cut with diamond cutter or laser.
Can obtain circular transparent bonding coat 12 and transparent substrate layer 11 after above-mentioned the cutting and stay on the described wafer 52, so that the follow-up cutting technique that described wafer 52 is carried out the laser penetration adhesive tape.As mentioned above, the present invention utilizes a length of tape arrangement for detecting 2 regularly to interdict the induction light beam, with detecting or the decision wafer pad pasting cutting position of 1 wafer pad pastings of tape construction desired length, thereby save equipment and the personnel costs of reequiping board and use artificial judgment.
The present invention is described by above-mentioned related embodiment, yet above-described embodiment is only for implementing example of the present invention.Must be pointed out that, published embodiment Bing does not limit the scope of the invention.On the contrary, being contained in the spirit of claims and modification and impartial setting of scope is included in the scope of the present invention.
Claims (10)
1. wafer pad pasting tape construction, described wafer pad pasting comprises with tape construction:
One transparent substrate layer;
One transparent bonding coat has one first gluing face and the second gluing face, and described the first gluing face is bonding on the described transparent substrate layer; And
One transparent stripping film, strippable being combined on described the second gluing face;
It is characterized in that: described transparent stripping film is equally spaced several light shielding parts that arranges in addition, and the distance between each two adjacent described light shielding part equals the required length of wafer pad pasting one time.
2. wafer pad pasting tape construction as claimed in claim 1 is characterized in that: described light shielding part is to be strip or block equidistantly being distributed on the described transparent stripping film.
3. wafer pad pasting tape construction as claimed in claim 1, it is characterized in that: on described transparent stripping film, one lateral length of described light shielding part is a lateral length that is equal to or less than described transparent stripping film, and a longitudinal length of described light shielding part is between 0.5 to 10 centimeter.
4. wafer pad pasting tape construction as claimed in claim 1 is characterized in that: on described transparent stripping film, the distance between each two adjacent described light shielding part is between 100 to 500 millimeters.
5. wafer pad pasting tape construction as claimed in claim 1, it is characterized in that: on described transparent stripping film, the material of described light shielding part is laser absorption material or infrared absorbing material.
6. a wafer pad pasting is with the method for adhering film of adhesive tape, and it is characterized in that: described method for adhering film comprises following steps:
One wafer pad pasting tape construction as claimed in claim 1 is provided;
Described transparent stripping film is separated from described transparent bonding coat and transparent substrate layer, simultaneously described transparent bonding coat and transparent substrate layer are directed to forward top, a wafer pad pasting district; And
Utilize length of tape arrangement for detecting detecting whether the light shielding part of described transparent stripping film arrived a detecting position, if wherein described light shielding part not yet arrives described detecting position, then continue the described transparent bonding coat of guiding and transparent substrate layer and advance; If described light shielding part has arrived described detecting position, then stop to guide described transparent bonding coat and transparent substrate layer, and then described transparent bonding coat and the transparent substrate layer that arrives described wafer pad pasting district cut.
7. wafer pad pasting as claimed in claim 6 is with the method for adhering film of adhesive tape, and it is characterized in that: described length of tape arrangement for detecting comprises:
One light beam generation unit is positioned at a side of described transparent stripping film, is used for sending an induction light beam; And
One sensor is positioned at the opposite side of described transparent stripping film, is used for receiving described induction light beam.
8. wafer pad pasting equipment, it comprises:
One adhesive tape feeding unit, to supply a wafer pad pasting tape construction, it sequentially comprises: a transparent substrate layer, a transparent bonding coat and a transparent stripping film;
One tape stripping unit is to separate described transparent stripping film from described transparent bonding coat and transparent substrate layer;
One adhesive tape guide unit is directed to top, a wafer pad pasting district with the above-mentioned transparent bonding coat of peeling off and transparent substrate layer;
It is characterized in that: described wafer pad pasting comprises in addition with equipment:
One length of tape arrangement for detecting, it comprises:
One light beam generation unit is used for sending an induction light beam;
One sensor is used for receiving described induction light beam;
One shading baffle is in order to interdict described induction light beam; And
One timing column spinner, combine with described shading baffle, and described timing rotation post namely turns to every a scheduled time and makes described shading baffle arrive a detecting position, interdicting described induction light beam, wherein said adhesive tape guide unit is guided the distance that the above-mentioned transparent bonding coat of peeling off and transparent substrate layer advance and is equaled the required length of wafer pad pasting one time within the described scheduled time.
9. wafer pad pasting equipment as claimed in claim 8, it is characterized in that: the induction light beam of described light beam generation unit is laser beam or infrared light beam.
10. a wafer pad pasting is with the method for adhering film of equipment, and it is characterized in that: described method for adhering film comprises following steps:
Utilize a wafer pad pasting as claimed in claim 8 to provide a wafer pad pasting tape construction with equipment, it sequentially comprises: a transparent substrate layer, a transparent bonding coat and a transparent stripping film;
Described transparent stripping film is separated from described transparent bonding coat and transparent substrate layer, simultaneously described transparent bonding coat and transparent substrate layer are directed to forward top, a wafer pad pasting district;
Utilize described length of tape arrangement for detecting to detect the length that described transparent bonding coat and transparent substrate layer are advanced, wherein said timing rotation post namely turns to every a scheduled time and makes described shading baffle arrive described detecting position, interdicting described induction light beam, and described adhesive tape guide unit is guided the distance that the above-mentioned transparent bonding coat of peeling off and transparent substrate layer advance and is equaled the required length of wafer pad pasting one time within the described scheduled time; And
Described transparent bonding coat and the described transparent substrate layer that arrives described wafer pad pasting district cut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103782069A CN102925069A (en) | 2012-10-08 | 2012-10-08 | Rubber belt structure for sticking film to wafer, film sticking equipment and film sticking method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103782069A CN102925069A (en) | 2012-10-08 | 2012-10-08 | Rubber belt structure for sticking film to wafer, film sticking equipment and film sticking method |
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|---|---|
| CN102925069A true CN102925069A (en) | 2013-02-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012103782069A Pending CN102925069A (en) | 2012-10-08 | 2012-10-08 | Rubber belt structure for sticking film to wafer, film sticking equipment and film sticking method |
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| CN104987842A (en) * | 2014-12-24 | 2015-10-21 | 麦格泰克株式会社 | Device for manufacturing tape |
| CN114132789A (en) * | 2021-11-10 | 2022-03-04 | 东莞市尼的科技股份有限公司 | Stripping device for stripping double-layer protective film into single-layer protective film |
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| WO2009011446A1 (en) * | 2007-07-19 | 2009-01-22 | Lintec Corporation | Light-blocking decorative sheet |
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| CN114132789A (en) * | 2021-11-10 | 2022-03-04 | 东莞市尼的科技股份有限公司 | Stripping device for stripping double-layer protective film into single-layer protective film |
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Application publication date: 20130213 |