CN102912869B - Composite phenolic aldehyde fireproofing insulation board - Google Patents
Composite phenolic aldehyde fireproofing insulation board Download PDFInfo
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- CN102912869B CN102912869B CN201210407716.4A CN201210407716A CN102912869B CN 102912869 B CN102912869 B CN 102912869B CN 201210407716 A CN201210407716 A CN 201210407716A CN 102912869 B CN102912869 B CN 102912869B
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Abstract
The invention discloses a composite phenolic aldehyde fireproofing insulation board, comprising a phenolic aldehyde board, an upper inorganic mortar layer and a lower inorganic mortar layer, wherein the upper surface and/or the lower surface of the phenolic aldehyde board is provided with a groove, the upper inorganic mortar layer covers the upper surface of the phenolic aldehyde board, and the lower inorganic mortar layer covers the lower surface of the phenolic aldehyde board. The composite phenolic aldehyde fireproofing boardinsulation board has the advantage that the adhesion force between the inorganic mortar layers and the phenolic aldehyde board is large, so the inorganic mortar layers and the phenolic aldehyde board are hardly peeled off or fall off.
Description
Technical field
The present invention relates to a kind of medicine equipment, particularly a kind of composite phenol formaldehyde fireproof heated board.
Background technology
In the prior art, skin heat insulating material is generally pure organic materials, although heat insulation effect reaches the relevant criterion of country, fireproof performance lower grade, easy breaking out of fire.Such as: Shanghai " 1115 " fire to ignite polyurethane foam heat insulation material because two electric welders implement electric welding fields in violation of rules and regulations; Ignite when " CCTV's big fire " is owing to setting off fireworks extruded polystyrene warming plate.
Phenolic board is made up of phenolic foam material, the laudatory title that phenol formaldehyde foam have " king of heat insulating material ", is novel heat insulation fire-proof sound insulation material.It has light weight, fire prevention, chance naked light do not burn, smokeless, nontoxic, without drippage.It, as a kind of safe, green novel energy-saving construction material, has obtained the accreditation of construction department and public security fire-fighting department personage.It is applied to large die built-in system, fireproof heat insulating system, construction wall heat preservation decoration integrative system, labeled door interlayer and sandwich panel room etc. in building heat preservation engineering.
Phenolic board, as warming plate widely used in prior art, in order to improve its fireproof performance grade, can cover inorganic screed, improving the fire-protection rating of phenolic board with this on the surface of phenolic board.But because the adhesive power between phenolic board and inorganic screed is less, when Product transport and construction, inorganic screed is very easily peeled off with phenolic board, come off, the inorganic screed that can adhere to is thinner, and fireproof performance grade is low.
Summary of the invention
For the deficiencies in the prior art, the object of the present invention is to provide the composite phenol formaldehyde fireproof heated board that a kind of inorganic screed and phenolic board adhesive power greatly, are not easily peeled off or come off.
Technical scheme of the present invention is achieved in that composite phenol formaldehyde fireproof heated board, comprise phenolic board, upper inorganic screed and lower inorganic screed, the upper surface of described phenolic board and/or soffit offer groove, described inorganic screed covers on the upper surface, and described lower inorganic screed covers on described soffit.
Above-mentioned composite phenol formaldehyde fireproof heated board, the degree of depth of described groove is 2 ~ 3.5 millimeters.
Above-mentioned composite phenol formaldehyde fireproof heated board, the width of described groove is 4 ~ 7 millimeters.
Above-mentioned composite phenol formaldehyde fireproof heated board, the spacing of adjacent described groove is 30 ~ 80 millimeters.
Above-mentioned composite phenol formaldehyde fireproof heated board, the thickness of described phenolic board is 40 ~ 50 millimeters; The degree of depth of described groove is 2 ~ 2.5 millimeters, and width is 5 ~ 6 millimeters; The spacing of adjacent described groove is 50 ~ 60 millimeters.
Above-mentioned composite phenol formaldehyde fireproof heated board, the thickness of described phenolic board is 60 ~ 80 millimeters; The degree of depth of described groove is 2.5 ~ 3 millimeters, and width is 5 ~ 6 millimeters; The spacing of adjacent described groove is 50 ~ 60 millimeters.
Above-mentioned composite phenol formaldehyde fireproof heated board, each described groove is arranged along the length direction of described phenolic board, and adjacent described groove arranges along the width of described phenolic board.
Above-mentioned composite phenol formaldehyde fireproof heated board, described composite phenol formaldehyde fireproof heated board also comprises the inorganic screed of reinforcement, the inorganic screed of lower reinforcement, upper fiberglass gridding cloth layer and lower-glass fiber mesh layer of cloth, described upper fiberglass gridding cloth layer upper inorganic screed and on strengthen between inorganic screed, described lower-glass fiber mesh layer of cloth is between described lower inorganic screed and the inorganic screed of described lower reinforcement.
The invention has the beneficial effects as follows: upper inorganic screed or the tensile bond strength between lower inorganic screed and phenolic board reach as high as 0.112MPa, the strong adhesion between inorganic screed and phenolic board, can not occur to peel off or come off; The thickness that on upper surface or soffit, (i.e. one side) can adhere to inorganic screed is in actual applications 1.5 ~ 4 millimeters, and fireproof performance grade significantly improves.
Accompanying drawing explanation
Fig. 1 is the structural representation of the phenolic board of composite phenol formaldehyde fireproof heated board of the present invention;
Fig. 2 is the sectional drawing of composite phenol formaldehyde fireproof heated board of the present invention;
Fig. 3 is the sectional view of the phenolic board of composite phenol formaldehyde fireproof heated board of the present invention shown in Fig. 1.
In figure: 1-phenolic board, 101-upper surface, 102-soffit, the upper inorganic screed of 2-, inorganic screed under 3-, 4-groove, the inorganic screed of the upper reinforcement of 5-, strengthens inorganic screed under 6-, the upper fiberglass gridding cloth layer of 7-, 8-lower-glass fiber mesh layer of cloth.
Detailed description of the invention
The present invention is described further by reference to the accompanying drawings:
Embodiment 1
As shown in Figure 1 to Figure 3, the composite phenol formaldehyde fireproof heated board of the present embodiment comprises phenolic board 1, upper inorganic screed 2 and lower inorganic screed 3, the upper surface 101 of described phenolic board 1 and/or soffit 102 offer groove 4, each described groove 4 is arranged along the length direction of described phenolic board 1, and adjacent described groove 4 arranges along the width of described phenolic board 1.Described inorganic screed 2 covers on described upper surface 101, and described lower inorganic screed 3 covers on described soffit 102.
The composite phenol formaldehyde fireproof heated board of the present embodiment also comprises the inorganic screed of reinforcement 5, the inorganic screed of lower reinforcement 6, upper fiberglass gridding cloth layer 7 and lower-glass fiber mesh layer of cloth 8, described upper fiberglass gridding cloth layer 7 upper inorganic screed 2 and on strengthen between inorganic screed 5, described lower-glass fiber mesh layer of cloth 8 is between described lower inorganic screed 3 and the inorganic screed 6 of described lower reinforcement.
In the present embodiment, the thickness of described phenolic board 1 is 40 millimeters; The degree of depth of described groove 4 is 2 millimeters, and width is 5 millimeters; The spacing of adjacent described groove 4 is 50 millimeters.
Upper inorganic screed or the tensile bond strength between lower inorganic screed and phenolic board are 0.101MPa, the strong adhesion between inorganic screed and phenolic board, can not occur to peel off or come off; The thickness that on upper surface or soffit, (i.e. one side) can adhere to inorganic screed is in actual applications 1.5 ~ 4 millimeters, and fireproof performance grade significantly improves.
Embodiment 2
The difference of the present embodiment and embodiment 1 is: the thickness of described phenolic board 1 is 50 millimeters; The degree of depth of described groove 4 is 2.6 millimeters, and width is 5.3 millimeters; The spacing of adjacent described groove 4 is 53 millimeters.
Upper inorganic screed or the tensile bond strength between lower inorganic screed and phenolic board are 0.096MPa, the strong adhesion between inorganic screed and phenolic board, can not occur to peel off or come off; The thickness that on upper surface or soffit, (i.e. one side) can adhere to inorganic screed is in actual applications 1.5 ~ 4 millimeters, and fireproof performance grade significantly improves.
Embodiment 3
The difference of the present embodiment and embodiment 1 is: the thickness of described phenolic board 1 is 60 millimeters; The degree of depth of described groove 4 is 2.7 millimeters, and width is 5.5 millimeters; The spacing of adjacent described groove 4 is 60 millimeters.
Upper inorganic screed or the tensile bond strength between lower inorganic screed and phenolic board are 0.109MPa, the strong adhesion between inorganic screed and phenolic board, can not occur to peel off or come off; The thickness that on upper surface or soffit, (i.e. one side) can adhere to inorganic screed is in actual applications 1.5 ~ 4 millimeters, and fireproof performance grade significantly improves.
Embodiment 4
The difference of the present embodiment and embodiment 1 is: the thickness of described phenolic board 1 is 80 millimeters; The degree of depth of described groove 4 is 3 millimeters, and width is 6 millimeters; The spacing of adjacent described groove 4 is 55 millimeters.
Upper inorganic screed or the tensile bond strength between lower inorganic screed and phenolic board are 0.112MPa, the strong adhesion between inorganic screed and phenolic board, can not occur to peel off or come off; The thickness that on upper surface or soffit, (i.e. one side) can adhere to inorganic screed is in actual applications 1.5 ~ 4 millimeters, and fireproof performance grade significantly improves.
Above-described embodiment is only for the invention example is clearly described, and the restriction not to the invention detailed description of the invention.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all embodiments.And thus the apparent change of extending out or variation be still among the protection domain of the invention claim.
Claims (2)
1. composite phenol formaldehyde fireproof heated board, it is characterized in that, comprise phenolic board (1), upper inorganic screed (2) and lower inorganic screed (3), the upper surface (101) of described phenolic board (1) and/or soffit (102) offer groove (4), described inorganic screed (2) covers on described upper surface (101), and described lower inorganic screed (3) covers on described soffit (102); Described composite phenol formaldehyde fireproof heated board also comprises the inorganic screed of reinforcement (5), the inorganic screed of lower reinforcement (6), upper fiberglass gridding cloth layer (7) and lower-glass fiber mesh layer of cloth (8), described upper fiberglass gridding cloth layer (7) is positioned between inorganic screed (2) and the inorganic screed of upper reinforcement (5), and described lower-glass fiber mesh layer of cloth (8) is positioned between described lower inorganic screed (3) and the inorganic screed of described lower reinforcement (6); The thickness of described phenolic board (1) is 40 ~ 50 millimeters, the degree of depth of described groove (4) is 2 ~ 2.5 millimeters, width is 5 ~ 6 millimeters, the spacing of adjacent described groove (4) is the thickness of 50 ~ 60 millimeters or described phenolic board (1) is 60 ~ 80 millimeters, the degree of depth of described groove (4) is 2.5 ~ 3 millimeters, width is 5 ~ 6 millimeters, and the spacing of adjacent described groove (4) is 50 ~ 60 millimeters; Described groove is square trench.
2. composite phenol formaldehyde fireproof heated board according to claim 1, it is characterized in that, each described groove (4) is arranged along the length direction of described phenolic board (1), and adjacent described groove (4) arranges along the width of described phenolic board (1).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201210407716.4A CN102912869B (en) | 2012-10-23 | 2012-10-23 | Composite phenolic aldehyde fireproofing insulation board |
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CN201210407716.4A CN102912869B (en) | 2012-10-23 | 2012-10-23 | Composite phenolic aldehyde fireproofing insulation board |
Publications (2)
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CN102912869A CN102912869A (en) | 2013-02-06 |
CN102912869B true CN102912869B (en) | 2015-04-22 |
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CN201210407716.4A Expired - Fee Related CN102912869B (en) | 2012-10-23 | 2012-10-23 | Composite phenolic aldehyde fireproofing insulation board |
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Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2404948Y (en) * | 1999-11-11 | 2000-11-08 | 上海雄美建筑工艺制品有限公司 | Thermal insulation and water-proof composite slab |
CN1690325A (en) * | 2004-04-28 | 2005-11-02 | 杨怀君 | Wall insulating blocks |
KR100704012B1 (en) * | 2004-10-14 | 2007-04-04 | 박말용 | Method for manufacture of adiabatic tile for interior outside a structure |
CN201106233Y (en) * | 2007-07-20 | 2008-08-27 | 赤峰全合建材厂 | Double leaf exterior wall of polyphenyl composite thermal insulation wallboard |
CN200999434Y (en) * | 2007-08-08 | 2008-01-02 | 任照宇 | Inside and outside wall insulation decorative plate |
CN201276807Y (en) * | 2008-09-11 | 2009-07-22 | 张吉庆 | Longitude and latitude large-belly type groove XPS plate |
CN201762986U (en) * | 2010-06-10 | 2011-03-16 | 王春山 | Permanent cast-in-situ concrete composite heat-insulating formwork with heat-insulating transition layer |
CN201924471U (en) * | 2011-01-19 | 2011-08-10 | 北京索利特新型建筑材料有限公司 | Composite heat insulation board of inorganic fireproof coil materials and foamable phenolic resin |
CN202047589U (en) * | 2011-08-01 | 2011-11-23 | 山东汇星科技开发有限公司 | Isolation-type fireproof composite heat-insulating template for cast-in-place concrete |
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