CN102911479A - High heat conduction epoxy resin composition applicable to fully wrapped devices and preparation method - Google Patents
High heat conduction epoxy resin composition applicable to fully wrapped devices and preparation method Download PDFInfo
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Abstract
An epoxy resin composition applicable to fully wrapped devices is composed of an epoxy resin, a phenolic resin, an inorganic filling agent, a heat conduction filler and an additive. The epoxy resin is represented as a formula (1) and/or a formula (2), and the mass content of the epoxy resin is 2-7% of the total mass of the composition; the phenolic resin is represented as a formula (3) and/or a formula (4), and the mass content of the phenolic resin is 2-7% of the total mass of the composition; and the heat conduction filler is a crystallized silicon dioxide powder, an aluminum oxide powder or a silicon nitride powder. The invention further discloses a preparation method of the epoxy resin composition. The epoxy resin composition has the advantages of being wide in applicability, high in filling, few in pores and high in reliability. According to the preparation method, open mixing rollers are added between an extruder and a fluted roller in traditional epoxy resin composition production processes for open milling and mixing, and a thread groove is added onto a grooved roller with low temperatures, so that the preparation method has the advantages of being high in conveying capacity and large in shear cutting force.
Description
Technical field
The present invention relates to a kind of composition epoxy resin, particularly a kind of high-thermal-conductivity epoxy resin composition that is applicable to the total incapsulation device; The invention still further relates to the preparation method of this composition epoxy resin.
Background technology
The total incapsulation device mainly is be used to requiring the electronic product that electric current is large, power is high, and its back side thickness is generally 0.9-1.0mm, and such thickness has affected the thermal diffusivity of total incapsulation device greatly.Dispel the heat when bad, the temperature of electronic product can reach more than 70 ℃ when work, and high like this temperature will produce greatly impact to the job stability of triode, thereby to the performance generation great effect of whole electronic product.Therefore, in order to improve thermal diffusivity, guarantee the working reliability of electronic product, the back side thickness of total incapsulation device is to slim development at present, and its back side thickness is reduced to 0.7mm gradually from 0.9-1.0mm, 0.5mm, and the thinnest back side thickness is 0.43mm in the market.It is original over half that back side thickness has reduced to.After back side thickness reduced, because backside space is narrow and small, this device was when sealing, the resistance difference increases during mobile in its positive and back side of plastic cement, thereby cause flow velocity difference also to become greatly, easily cause and form overleaf pore, perhaps cause and fill the discontented plastic package process defective that waits.
Mill mainly is to rely on two relatively rotating rollers that material is produced extruding, shearing action in mixing process, through repeatedly kneading, and the chemical action of following in the kneading process, the macromolecular chain of material inside is interrupted, make the various composition blendings of material inside evenly, and reach at last mixing purpose.And that this traditional mode is accompanied by insolubles often is many, the characteristics such as melting effect is poor.
Summary of the invention
Technical problem to be solved by this invention is for the deficiencies in the prior art, provide a kind of formulation ratio rationally, can satisfy simultaneously the back side less than the high-thermal-conductivity epoxy resin composition that is applicable to the total incapsulation device of the total incapsulation device needs of 0.9mm.
Another technical problem to be solved by this invention has provided a kind of preparation method of aforesaid composition epoxy resin.The method can reduce the bubble of composition epoxy resin effectively, improves the performance of sealing of product.
Technical problem to be solved by this invention is to realize by following technical scheme.The present invention is a kind of composition epoxy resin that is suitable for the total incapsulation device, is characterized in: said composition is comprised of Resins, epoxy, resol, inorganic filler, heat-conducting filler and additive;
Described Resins, epoxy is the Resins, epoxy shown in general formula [1] and the general formula [2]; What the content of Resins, epoxy accounted for the composition total mass is 2 ~ 7%;
【1】
【2】
Described resol is the resol shown in general formula [3] and the general formula [4], and the content of resol accounts for 2 ~ 7% of composition total mass;
【3】
【4】
In various: n=0-5; M=1-5;
Described heat-conducting filler is one or several in ground silica end, alumina powder or the alpha-silicon nitride powders; The content of described heat-conducting filler is 5 ~ 20% of composition total mass;
The content of described mineral filler is 65 ~ 80% of total composition quality; And the summation of the content of mineral filler and heat-conducting filler is 70 ~ 90% of total group quality;
Described additive is curing catalyst, releasing agent, coupling agent, tinting material, fire retardant, stress relief agent and ion capturing agent, and the content of every kind of additive is 0.1 ~ 1% of composition total content.
In the composition technical scheme of the present invention: described heat-conducting filler is preferably type ground silica end, obtuse angle or ball-aluminium oxide powder.
Technical problem to be solved by this invention can also further realize by following technical scheme.The invention also discloses a kind of preparation method of as the described composition of above technical scheme, be characterized in, its step is as follows:
Resol in the composition epoxy resin and additive except liquid type joined carried out ball milling in the ball mill 1 ~ 2 hour, again in proportion with composition in other materials in agitator, stir after, extrude through forcing machine, extrude by open the refining mixing roller open the refining mixing, again through the stack calendering in flakes, after the cooling zone cooling, pulverize, get resin combination;
The described mixing roller of refining of opening comprises two cylindrical roller that are set up in parallel, and one of them is ganoid smooth roll, and another is provided with the grooved roller of thread groove for the surface; Open refining when mixing smooth roll and grooved roller rotate in opposite directions, and the rotating ratio of the two is 1 ~ 1.5:1; Open refining when mixing the temperature of smooth roll be 50 ~ 150 ℃, the temperature of grooved roller is 0-50 ℃.
In preparation method's technical scheme of the present invention, further preferred technical scheme is:
1. the preferred rotating ratio of smooth roll and grooved roller is 1.1 ~ 1.2:1; Open refining when mixing the temperature of smooth roll be preferably 70 ~ 100 ℃, the temperature of grooved roller is preferably 0-25 ℃.
2. the diameter of described grooved roller and smooth roll is preferably 150 ~ 800mm, and length is preferably 300 ~ 2500mm.
3. the thread groove width of described grooved roller is preferably 2 ~ 20mm, and groove depth is preferably 1 ~ 10mm.
4. the thread groove of described grooved roller and grooved roller axis acutangulate and are preferably 30 ~ 65 °, more preferably 35 ~ 55 °.
In the present composition: Resins, epoxy shown in general formula [1] and [2], can use separately, also can two kinds of mixing use, be preferably two kinds and mix use.General formula [1] preferably accounts for 10 ~ 60% of Resins, epoxy quality when mix using, and further preferred formula [2] is higher by approximately 10 ~ 20% than the content of general formula [1].Resol shown in general formula [3], [4] can be used alone, but also also mix together.Be preferably two kinds and mix use.Mix when using, general formula [3] accounts for 10 ~ 40% of resol quality.The equivalence ratio of Resins, epoxy and resol, namely the ratio of the hydroxyl value in the epoxy radix/resol in the Resins, epoxy is preferably 0.5 ~ 1.2, and more preferably 0.9 ~ 1.0.Described inorganic filler is the fused silica powder, can be spherical, also can be dihedral.Described heat-conducting filler is the ground silica end, also can be alumina powder.The ground silica end can be medium-sized, also can be the obtuse angle.Alumina powder can be spherical, also can be dihedral.Be preferably type ground silica end, obtuse angle or ball-aluminium oxide powder.Curing catalyst among the present invention has no particular limits, and that can enumerate has triphenylphosphine, DBU, imidazoles and azoles azole derivative and its esters and other curing catalysts.Consider from speed of response and shelf lives angle, preferably triphenylphosphine, DBU and imidazole derivative.The required various additives of other various epoxy plastic cements that the present invention also uses include but not limited to that releasing agent, coupling agent, tinting material, stress relief agent and ion catch short agent etc.Releasing agent comprises lipid acid, montanic acid, palmitinic acid, oxidized form or Non-oxidized polyethylene wax etc., and the resin after these releasing agents can guarantee to solidify can take out from the mould of metastasis model device.Coupling agent comprises the siloxanes commonly used such as epoxy silane, aminosilane, hydrosulphonyl silane.Tinting material mainly is carbon black.The stress relief agent can cooperate with silicone oil or polysiloxane rubber powder etc.Ion capturing agent has no particular limits, and can use known anion ion exchange body, such as hydrotalcite or contain hydrous oxide of the element of selecting etc. from magnesium, aluminium, titanium, zirconium, bismuth.They may be used singly or in combination of two or more.
The present composition has adopted new opening to refine mixing roller in the preparation, has changed mill tradition scraper knife type stirring pattern.The grooved roller of opening the mixing roller of refining adopts thread forms to carry out mixing, realize that the material in the roller gap is carried out spiral-push to be carried, owing to the difference of two roller surface speed and temperature is coated on the roller, return between two rollers, so repeatedly reciprocal, finish continuous kneading effect, it can reduce the wearing and tearing of mixing roller, effectively avoids the generation of material insolubles.
Total incapsulation high-thermal-conductivity epoxy resin composition of the present invention by content and the kind adjustment of the various components of this resin combination, cooperates with suitable mineral filler and heat-conducting filler.Further cooperate with the inventive method, common back side pore and fill the defectives such as discontented in the time of can solving the slim total incapsulation device in the back side and seal, and have very high reliability.Can reach the encapsulation back side less than packaging process requirement and the reliability requirement of the total incapsulation device of 0.9mm.
Preparation method of the present invention in traditional composition epoxy resin production technique forcing machine and stack between added open the refining mixing roller open the refining mixing.And the grooved roller lower in temperature added thread groove, has the grooved roller of thread groove to compare with the smooth roll that does not have thread groove, has carrying capacity strong, the characteristics that front shear force is strong.
It is extensive that composition epoxy resin of the present invention has suitability, and high filling, the characteristics that pore is few, reliability is high are specially adapted to be suitable for the total incapsulation device.
Description of drawings
Fig. 1 is out a kind of schematic diagram of the mixing roller of refining;
Fig. 2 is a kind of structural representation of grooved roller.
Embodiment
Referring to accompanying drawing, further describe concrete technology implementation scheme of the present invention, so that those skilled in the art further understand the present invention, but scope of the present invention is not limited by these embodiment.
Described Resins, epoxy is general formula [1] and the Resins, epoxy shown in the general formula [2]; The ratio of the two respectively is not less than 30% of amount of epoxy, and what the content of Resins, epoxy accounted for the composition total mass is 4%;
Described resol is general formula [3] and the resol shown in the general formula [4], and the ratio of the two respectively is not less than 10% of resol amount, and the content of resol accounts for 4% of composition total mass;
In various: n=0-5; M=1-5;
Described heat-conducting filler is one or several in ground silica end, alumina powder or the alpha-silicon nitride powders; The content of described heat-conducting filler is 5% of composition total mass;
The content of described mineral filler is 80% of total composition quality;
Described additive is curing catalyst, releasing agent, coupling agent, tinting material, fire retardant, stress relief agent and ion capturing agent, and the content of every kind of additive is 1% of composition total content.
Described Resins, epoxy is the Resins, epoxy shown in general formula [1] or the general formula [2]; What the content of Resins, epoxy accounted for the composition total mass is 3%;
Described resol is the resol shown in general formula [3] or the general formula [4], and the content of resol accounts for 2% of composition total mass;
In various: n=0-5; M=1-5;
Described heat-conducting filler is one or several in ground silica end, alumina powder or the alpha-silicon nitride powders; The content of described heat-conducting filler is 20% of composition total mass;
The content of described mineral filler is 70% of total composition quality;
Described additive is curing catalyst, releasing agent, coupling agent, tinting material, fire retardant, stress relief agent and ion capturing agent, and the content of every kind of additive is 0.1 ~ 1% of composition total content, and the total amount of additive is 5% of composition total content.
Described Resins, epoxy is general formula [1] and the Resins, epoxy shown in the general formula [2]; The ratio of the two respectively is not less than 10% of amount of epoxy, and what the content of Resins, epoxy accounted for the composition total mass is 7%;
Described resol is general formula [3] and the resol shown in the general formula [4], and the ratio of the two respectively is not less than 30% of resol amount, and the content of resol accounts for 6% of composition total mass;
In various: n=0-5; M=1-5;
Described heat-conducting filler is one or several in ground silica end, alumina powder or the alpha-silicon nitride powders; The content of described heat-conducting filler is 15% of composition total mass;
The content of described mineral filler is 65% of total composition quality;
Described additive is curing catalyst, releasing agent, coupling agent, tinting material, fire retardant, stress relief agent and ion capturing agent, and the content of every kind of additive is 1% of composition total content.
Embodiment 4, a kind of composition epoxy resin that is suitable for the total incapsulation device, and said composition is comprised of Resins, epoxy, resol, inorganic filler, heat-conducting filler and additive;
Described Resins, epoxy is general formula [1] and the Resins, epoxy shown in the general formula [2]; The ratio of the two respectively is not less than 40% of amount of epoxy, and what the content of Resins, epoxy accounted for the composition total mass is 2%;
Described resol is general formula [3] and the resol shown in the general formula [4], and the ratio of the two respectively is not less than 40% of resol amount, and the content of resol accounts for 3% of composition total mass;
In various: n=0-5; M=1-5;
Described heat-conducting filler is one or several in ground silica end, alumina powder or the alpha-silicon nitride powders; The content of described heat-conducting filler is 12% of composition total mass;
The content of described mineral filler is 78% of total composition quality; Described additive is curing catalyst, releasing agent, coupling agent, tinting material, fire retardant, stress relief agent and ion capturing agent, and the content of every kind of additive is 0.1 ~ 1% of composition total content, and the total amount of additive is 6% of composition total content.
Embodiment 5, a kind of composition epoxy resin that is suitable for the total incapsulation device, and said composition is comprised of Resins, epoxy, resol, inorganic filler, heat-conducting filler and additive;
Described Resins, epoxy is general formula [1] and the Resins, epoxy shown in the general formula [2]; The ratio of the two respectively is not less than 40% of amount of epoxy, and what the content of Resins, epoxy accounted for the composition total mass is 6%;
Described resol is general formula [3] and the resol shown in the general formula [4], and the ratio of the two respectively is not less than 20% of resol amount, and the content of resol accounts for 7% of composition total mass;
In various: n=0-5; M=1-5;
Described heat-conducting filler is one or several in ground silica end, alumina powder or the alpha-silicon nitride powders; The content of described heat-conducting filler is 8% of composition total mass;
The content of described mineral filler is 74% of total composition quality;
Described additive is curing catalyst, releasing agent, coupling agent, tinting material, fire retardant, stress relief agent and ion capturing agent, and the content of every kind of additive is 0.1 ~ 1% of composition total content, and the total amount of additive is 5% of composition total content.
Embodiment 6, and in any one described composition of embodiment 1-5: described heat-conducting filler is type ground silica end, obtuse angle or ball-aluminium oxide powder.
Embodiment 7, a kind of preparation method such as any one described composition among the embodiment 1-6, and its step is as follows:
Resol in the composition epoxy resin and additive except liquid type joined carried out ball milling in the ball mill 1 ~ 2 hour, again in proportion with composition in other materials in agitator, stir after, extrude through forcing machine, extrude by open the refining mixing roller open the refining mixing, again through the stack calendering in flakes, after the cooling zone cooling, pulverize, get resin combination;
The described mixing roller of refining of opening comprises two cylindrical roller that are set up in parallel, and one of them is ganoid smooth roll, and another is provided with the grooved roller of thread groove for the surface; Open refining when mixing smooth roll and grooved roller rotate in opposite directions, and the rotating ratio of the two is 1.2:1; Open refining when mixing the temperature of smooth roll be 100 ℃, the temperature of grooved roller is 25 ℃.
Embodiment 8, a kind of preparation method such as any one described composition among the embodiment 1-6, and its step is as follows:
Resol in the composition epoxy resin and additive except liquid type joined carried out ball milling in the ball mill 1 ~ 2 hour, again in proportion with composition in other materials in agitator, stir after, extrude through forcing machine, extrude by open the refining mixing roller open the refining mixing, again through the stack calendering in flakes, after the cooling zone cooling, pulverize, get resin combination;
The described mixing roller of refining of opening comprises two cylindrical roller that are set up in parallel, and one of them is ganoid smooth roll, and another is provided with the grooved roller of thread groove for the surface; Open refining when mixing smooth roll and grooved roller rotate in opposite directions, and the rotating ratio of the two is 1.1:1; Open refining when mixing the temperature of smooth roll be 80 ℃, the temperature of grooved roller is 25 ℃.
Embodiment 9, a kind of preparation method such as any one described composition among the embodiment 1-6, and its step is as follows:
Resol in the composition epoxy resin and additive except liquid type joined carried out ball milling in the ball mill 1 ~ 2 hour, again in proportion with composition in other materials in agitator, stir after, extrude through forcing machine, extrude by open the refining mixing roller open the refining mixing, again through the stack calendering in flakes, after the cooling zone cooling, pulverize, get resin combination;
The described mixing roller of refining of opening comprises two cylindrical roller that are set up in parallel, and one of them is ganoid smooth roll, and another is provided with the grooved roller of thread groove for the surface; Open refining when mixing smooth roll and grooved roller rotate in opposite directions, and the rotating ratio of the two is 1:1; Open refining when mixing the temperature of smooth roll be 50 ℃, the temperature of grooved roller is 0 ℃.
Embodiment 10, a kind of preparation method such as any one described composition among the embodiment 1-6, and its step is as follows:
Resol in the composition epoxy resin and additive except liquid type joined carried out ball milling in the ball mill 1 ~ 2 hour, again in proportion with composition in other materials in agitator, stir after, extrude through forcing machine, extrude by open the refining mixing roller open the refining mixing, again through the stack calendering in flakes, after the cooling zone cooling, pulverize, get resin combination;
The described mixing roller of refining of opening comprises two cylindrical roller that are set up in parallel, and one of them is ganoid smooth roll, and another is provided with the grooved roller of thread groove for the surface; Open refining when mixing smooth roll and grooved roller rotate in opposite directions, and the rotating ratio of the two is 1.4:1; Open refining when mixing the temperature of smooth roll be 70 ℃, the temperature of grooved roller is 10 ℃.
Embodiment 11, and among the embodiment 7-10 among any one described preparation method: the diameter of described grooved roller and smooth roll is 150 ~ 800mm, and length is 300 ~ 2500mm.
Embodiment 12, and among the embodiment 7-11 among any one described preparation method: the thread groove width of described grooved roller is 2 ~ 20mm, and groove depth is 1 ~ 10mm.
Embodiment 13, and among the embodiment 7-12 among any one described preparation method: it is 30 ~ 65 ° that the thread groove of described grooved roller and grooved roller axis acutangulate.
Embodiment 14, and among the embodiment 7-10 among any one described preparation method: it is 35 ~ 55 ° that the thread groove of described grooved roller and grooved roller axis acutangulate.
Embodiment 15, a kind of composition epoxy resin that is suitable for the total incapsulation device, and said composition is comprised of Resins, epoxy, resol, inorganic filler, heat-conducting filler and additive;
Described Resins, epoxy is general formula [1] and the Resins, epoxy shown in the general formula [2]; What the content of Resins, epoxy accounted for the composition total mass is 4%; Its formula of [1] respectively accounts for 40% and 60% of Resins, epoxy with general formula [2];
Described resol is general formula [3] and the resol shown in the general formula [4], and the content of resol accounts for 4% of composition total mass; General formula [3] respectively accounts for 50% of resol with general formula [4];
In various: n=0-5; M=1-5;
Described heat-conducting filler is type ground silica end, obtuse angle; The content of described heat-conducting filler is 11.5% of composition total mass; The content of described mineral filler is 77% of total composition quality;
Described additive is curing catalyst, releasing agent, coupling agent, tinting material, fire retardant, stress relief agent and ion capturing agent, and the content of every kind of additive is 0.5% of composition total content.
Preparation method's step is as follows:
Resol in the composition epoxy resin and additive except liquid type joined carried out ball milling in the ball mill 1 ~ 2 hour, again in proportion with composition in other materials in agitator, stir after, extrude through forcing machine, extrude by open the refining mixing roller open the refining mixing, again through the stack calendering in flakes, after the cooling zone cooling, pulverize, get resin combination;
The described mixing roller of refining of opening comprises two cylindrical roller that are set up in parallel, and one of them is ganoid smooth roll, and another is provided with the grooved roller of thread groove for the surface; Open refining when mixing smooth roll and grooved roller rotate in opposite directions, and the rotating ratio of the two is 1.2:1; Open refining when mixing the temperature of smooth roll be 75 ℃, the temperature of grooved roller is 15 ℃.
The diameter of described grooved roller and smooth roll is 500mm, and length is 1500mm.The thread groove width of described grooved roller is 10mm, and groove depth is 5mm.It is 45 ° that the thread groove of described grooved roller and grooved roller axis acutangulate.
Getting the present embodiment makes composition epoxy resin and carries out Experiment of correlation detection.
Test condition: utilize transfer moIding machine, 175 ℃ of die temperatures, forming pressure 5MPa, set time 120s condition under carry out.In addition, the after fixing condition is 175 ℃, 6 hours.
(1) gel time: the 5.3rd gelation time by SJ/T 11197-1999 epoxy molding plastic measured gelation time (s).
(2) length of flow: measure the distance (cm) that flows by the 5.2nd helicoidal flow length of SJ/T 11197-1999 epoxy molding plastic.
(3) flame retardant resistance: the 5.12nd flame retardant resistance of pressing SJ/T 11197-1999 epoxy molding plastic measured the flame retardant resistance of material.
(4) CTE and Tg: the 5.6th linear expansivity and second-order transition temperature by SJ/T 11197-1999 epoxy molding plastic are measured CTE and Tg.
(5) water-intake rate: the water-intake rate of measuring embodiment by the 5.11st water-intake rate of SJ/T 11197-1999 epoxy molding plastic.
Experimental result sees table.
Claims (8)
1. composition epoxy resin that is suitable for the total incapsulation device, it is characterized in that: said composition is comprised of Resins, epoxy, resol, inorganic filler, heat-conducting filler and additive;
Described Resins, epoxy is the Resins, epoxy shown in general formula [1] and the general formula [2]; What the content of Resins, epoxy accounted for the composition total mass is 2 ~ 7%;
【1】
【2】
Described resol is the resol shown in general formula [3] and the general formula [4], and the content of resol accounts for 2 ~ 7% of composition total mass;
【3】
【4】
In various: n=0-5; M=1-5;
Described heat-conducting filler is one or several in ground silica end, alumina powder or the alpha-silicon nitride powders; The content of described heat-conducting filler is 5 ~ 20% of composition total mass;
The content of described mineral filler is 65 ~ 80% of total composition quality; And the summation of the content of mineral filler and heat-conducting filler is 70 ~ 90% of total group quality;
Described additive is curing catalyst, releasing agent, coupling agent, tinting material, fire retardant, stress relief agent and ion capturing agent, and the content of every kind of additive is 0.1 ~ 1% of composition total content.
2. composition according to claim 1, it is characterized in that: described heat-conducting filler is type ground silica end, obtuse angle or ball-aluminium oxide powder.
3. the preparation method of a composition as claimed in claim 1 or 2 is characterized in that, its step is as follows:
Resol in the composition epoxy resin and additive except liquid type joined carried out ball milling in the ball mill 1 ~ 2 hour, again in proportion with composition in other materials in agitator, stir after, extrude through forcing machine, extrude by open the refining mixing roller open the refining mixing, again through the stack calendering in flakes, after the cooling zone cooling, pulverize, get resin combination;
The described mixing roller of refining of opening comprises two cylindrical roller that are set up in parallel, and one of them is ganoid smooth roll, and another is provided with the grooved roller of thread groove for the surface; Open refining when mixing smooth roll and grooved roller rotate in opposite directions, and the rotating ratio of the two is 1 ~ 1.5:1; Open refining when mixing the temperature of smooth roll be 50 ~ 150 ℃, the temperature of grooved roller is 0-50 ℃.
4. preparation method according to claim 3, it is characterized in that: the rotating ratio of smooth roll and grooved roller is 1.1 ~ 1.2:1; Open refining when mixing the temperature of smooth roll be 70 ~ 100 ℃, the temperature of grooved roller is 0-25 ℃.
5. according to claim 3 or 4 described preparation methods, it is characterized in that: the diameter of described grooved roller and smooth roll is 150 ~ 800mm, and length is 300 ~ 2500mm.
6. according to claim 3 or 4 described preparation methods, it is characterized in that: the thread groove width of described grooved roller is 2 ~ 20mm, and groove depth is 1 ~ 10mm.
7. according to claim 3 or 4 described preparation methods, it is characterized in that: it is 30 ~ 65 ° that the thread groove of described grooved roller and grooved roller axis acutangulate.
8. preparation method according to claim 7, it is characterized in that: it is 35 ~ 55 ° that the thread groove of described grooved roller and grooved roller axis acutangulate.
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| CN107141721A (en) * | 2017-06-02 | 2017-09-08 | 江苏华海诚科新材料股份有限公司 | A kind of high-k composition epoxy resin and preparation method thereof |
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| CN111073217B (en) * | 2019-12-23 | 2022-10-14 | 江苏科化新材料科技有限公司 | High-thermal-conductivity low-stress epoxy plastic packaging material for semiconductor packaging |
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