CN102903515A

CN102903515A - Lead component holder and electronic device

Info

Publication number: CN102903515A
Application number: CN2012102088450A
Authority: CN
Inventors: 笹原健太; 水元纯也; 堺雅史
Original assignee: Yaskawa Electric Corp
Current assignee: Yaskawa Electric Corp
Priority date: 2011-07-26
Filing date: 2012-06-19
Publication date: 2013-01-30
Also published as: EP2563106A2; JP4947228B1; CN202662455U; EP2563106A3; US20130025924A1; JP2013026610A

Abstract

Provided is a lead component holder and an electronic device capable of improving vibration resistance performance. A lead component holder includes a plurality of supporting portions each supporting one of lead components at a position distant from a component mounting surface of a substrate, and at least one of coupling members respectively coupling the adjacent supporting portions and at a position distant from the component mounting surface. An electronic device includes the substrate, the lead component holder, and an electronic component mounted to the substrate located below the coupling members.

Description

Lead member retainer and electronic equipment

Technical field

The present invention relates to a kind of lead member retainer and electronic equipment.

Background technology

TOHKEMY 2000-243656 communique has been described a kind of electronic unit.This electronic unit comprises: with receiver member the bottom tube-like housing arranged; Closure member, this closure member seals the opening of described housing; And terminal, this terminal has attaching section.Described terminal links to each other with the electrode lead-out part of described element in being attached to the housing of closure member.And, described attaching section be formed on described terminal from the outstanding end of the outer surface of closure member, and described attaching section is attached to printed circuit board (PCB).In addition, electronic unit comprises the gap forming portion of predetermined length.This gap forming portion is formed between the composition surface and the attachment in end of described terminal and closure member joint.

Summary of the invention

The purpose of present disclosure provides a kind of lead member retainer and electronic equipment that can improve vibration resistance.

To achieve these goals, comprise according to the lead member retainer of the first aspect of present disclosure: a plurality of supports, each support in described a plurality of supports is bearing in position away from the parts installed surface of substrate with lead member; And at least one coupling member, described coupling member makes adjacent described support link in the position away from described parts installed surface.Described support all also comprises: base component, described base component are attached to described parts installed surface and have the hole, and the lead-in wire of described lead member inserts in the described hole; And scaffold, described scaffold is arranged on the described base component, and described lead member is inserted in the described scaffold.

To achieve these goals, the electronic equipment according to the second aspect of present disclosure comprises: substrate; The lead member retainer, this lead member retainer has a plurality of supports and at least one coupling member, each support in described a plurality of support is bearing in position away from the parts installed surface of substrate with lead member, and described coupling member makes adjacent described support link in the position away from described parts installed surface; Electronic unit, described electronic unit is mounted to described substrate below described coupling member.Each support includes: base component, described base component are attached to described parts installed surface and have the hole, and the lead-in wire of described lead member inserts in the described hole; And scaffold, described scaffold is arranged on the described base component, and described lead member is inserted in the described scaffold.

Effect of the present invention

According to the present invention, compare with the housing that does not adopt structure of the present invention, may improve vibration resistance.

Description of drawings

Fig. 1 is the cut-away view that is equipped with according to the inverter of the printed circuit board (PCB) of the lead member retainer of an execution mode according to holding;

Fig. 2 is the enlarged drawing that is fixed to the lead member retainer of printed circuit board (PCB);

Fig. 3 A is the stereogram of lead member retainer;

Fig. 3 B is the stereogram from the lead member retainer of the angle observation different from Fig. 3 A;

Fig. 3 C is the stereogram from the lead member retainer of the angle observation different with Fig. 3 B from Fig. 3 A;

Fig. 4 A is the plane graph of lead member retainer;

Fig. 4 B is the front view of lead member retainer;

Fig. 5 is the stereogram that the lead member retainer when using is shown;

Fig. 6 is the plane graph that the variation of lead member retainer is shown;

Fig. 7 A is the key diagram that insulation distance when not using the lead member retainer is shown;

Fig. 7 B is the key diagram that insulation distance when using the lead member retainer is shown; And

Fig. 8 is the exploded view of electrolytic capacitor, lead member retainer and printed circuit board (PCB).

Embodiment

Execution mode is described with reference to the accompanying drawings, to understand better present disclosure.In each accompanying drawing, some parts irrelevant with this specification may not described.

Lead member retainer 10 according to an execution mode is installed on the printed circuit board (PCB) (embodiment of substrate) 22 that is arranged in the inverter for example shown in Figure 1 (embodiment of electronic equipment) 12.

As shown in Figure 2, lead member retainer 10 can be at polarized capacitor (embodiment of lead member is hereinafter referred to as " the capacitor ") C away from the position supporting tubular of the parts installed surface of printed circuit board (PCB) 22.Capacitor C by 10 supportings of lead member retainer is electrically connected to printed circuit board (PCB) 22.

Lead member retainer 10 comprises a plurality of supports and at least one coupling member, and described coupling member connects adjacent support.

Particularly, shown in Fig. 3 A to Fig. 3 C, Fig. 4 A and Fig. 4 B, lead member retainer 10 comprises along the first support 30a, the second support 30b, the 3rd support 30c, the first coupling member 32a and the second coupling member 32b of a direction alignment.

The first support 30a, the second support 30b and the 3rd support 30c comprise respectively

base component

42a, 42b and 42c and are separately positioned on scaffold (embodiment of supporting member) 44a, 44b and 44c on

base component

42a, 42b and the 42c.

Base component

42a, 42b and 42c are attached to the parts installed surface of printed circuit board (PCB) 22.Each includes pair of holes H1a and

H1b base component

42a, 42b and 42c, so that the axial centre in these holes and parts installed surface intersect.The pair of lead wires of stretching out from the bottom surface of capacitor C is inserted respectively and is passed described hole to H1a and H1b.Described hole is arranged on the direction that the coupling direction with

coupling member

32a and 32b intersects H1a and H1b.The lead-in wire of capacitor C passes respectively hole H1a and H1b, and the through hole Ht(that is welded to the corresponding position that is arranged on the printed circuit board (PCB) 22 is referring to Fig. 8).

Each

base component

42a and 42c include alignment pin 50, and described alignment pin 50 is positioned on the opposition side of a side that supports capacitor C, that is, be positioned at (referring to Fig. 3 C and Fig. 4 B) on printed circuit board (PCB) 22 sides.Alignment pin 50 inserts respectively the hole H2(that is arranged in the printed circuit board (PCB) 22 referring to Fig. 8) in, and by polymer adhesive for example to printed circuit board (PCB) 22.

Alignment pin 50 only is arranged among the

base component

42a and 42c on the two ends that are positioned at lead member retainer 10.Alignment pin 50 only is arranged on the first support 30a and the 3rd support 30c on the two ends of being arranged among a plurality of

support

30a, 30b and the 30c.Therefore, the quantity for the hole of anchor leg component holder 10 can be reduced, and the packaging density of printed circuit board (PCB) 22 can be improved.

Each

scaffold

44a, 44b and 44c all can support the side of capacitor C.Each is the drum with

periphery otch scaffold

44a, 44b and 44c.Each inwall of

scaffold

44a, 44b and 44c includes three contact members 52, and these three contact members are outstanding and extend along the axis direction of capacitor C from inwall.Each of three contact members 52 all increases towards the direction of insertion of capacitor C from the outstanding overhang (that is, length) of inwall, that is, increase towards printed circuit board (PCB) 22.Therefore, contact member 52 contacts with the downside of capacitor C at least, and supporting capacitor C.

Each

scaffold

44a, 44b and 44c include the first otch 54.Particularly, the part of each

scaffold

44a, 44b and 44c is all along circumferentially cut, and forms the first otch 54.The first otch 54 is arranged on the coupling direction that

coupling member

32a and 32b be coupled to each other, but does not mutually face.

The first otch 54 is provided for respectively described

scaffold

44a, 44b and 44c.When inserting capacitor C in the corresponding framework,

scaffold

44a, 44b and 44c deflection, and the internal diameter of

scaffold

44a, 44b and 44c enlarges.In addition, as mentioned above, three contact members 52 increase towards the direction of insertion of capacitor C from the outstanding overhang of inwall, that is, increase towards printed circuit board (PCB) 22.Therefore, the capacitor C that inserts among

scaffold

44a, 44b and the 44c is supported in stable mode, and this further improves vibration resistance.

And, shown in Fig. 4 A, showing lead member retainer 10 with plane graph, this lead member retainer 10 is set to: the central point of (1) tubular scaffold 44a is a c; (2) outline of the formation lead member retainer 10 of base component 42a and the outer side edges that contacts with the interior week circle of tubular scaffold 44a are limit x; (3) distance from limit x to central point c is apart from d; (4) the periphery radius of a circle of tubular scaffold 44a is radius r, so the first otch 54 is arranged to the limit x next-door neighbour with the end place that is arranged in lead member retainer 10 of scaffold 44a, and apart from d less than radius r.Thereby, compare with the situation that does not have the first otch 54 (referring to the double dot dash line among Fig. 4 A), the outline of lead member retainer 10 reduces with the amount of the thickness of scaffold 44a (radius r and apart between the d poor), and the erection space that is used for installing lead member retainer 10 reduces.

Each

scaffold

44a, 44b and 44c include the second otch (embodiment of gauge point) 56, with the polarity position of indication capacitor C.

The second otch 56 for example is arranged on the upper end of each

scaffold

44a, 44b and 44c.In addition, the second otch 56 is along the direction setting different from the coupling direction that connects the first support 30a, the second support 30b and the 3rd support 30c.

Therefore, even as capacitor C during by lead member retainer 10 supporting, the second otch 56 also can be from the outside by visual confirmation, and is not stopped by capacitor C.

Here, each

base component

42a, 42b and 42c include a pair of hole H1a and H1b for the lead-in wire insertion.By changing the hole to the orientation (arranged direction) of H1a and H1b, the first otch 54 can be formed gauge point, thereby the second otch 56 is not set.

The first coupling member 32a is locating the first support 30a and the second support 30b are linked away from the position (height H shown in Fig. 4 B) of parts installed surface.The second coupling member 32b is locating the second support 30b and the 3rd support 30c are linked away from the position (height H) of parts installed surface.

Shown in Fig. 4 A, in plane graph (when from the unilateral observation of supporting capacitor C), each first coupling member 32a and the second coupling member 32b all be configured so that

coupling member

32a and 32b along the width W c of the direction that intersects with coupling direction less than the first support 30a, the second support 30b and the 3rd support 30c width Ws along the direction that intersects with coupling direction.

Because support 30a, 30b and 30c are connected by the first coupling member 32a and the second coupling member 32b, therefore improved vibration resistance.

In addition, as shown in Figure 5, owing to below the coupling member 32a of

lead member retainer

10 and 32b, be provided with the space, therefore, chip part (embodiment of electronic unit) p is installed below each

coupling member

32a and 32b, thereby reduces the erection space for mounting electronic parts.

And, when in plane graph, observing lead member retainer 10, be respectively arranged with gap g(referring to Fig. 4 A between adjacent support 30a and the 30b and between

adjacent support

30b and 30c).Therefore, can visual confirmation be arranged in installment state and the silk screen printing of the electronic unit of the first coupling member 32a and the second coupling member 32b below.

As shown in Figure 6, the gap g between the adjacent support can increase the base end part that reaches

scaffold

44a and 44b, thereby further is convenient to confirm installment state and the silk screen printing of electronic unit.

In the layout of capacitor C, shown in Fig. 7 A, usually chip part p need to be set like this, the distance of the central axis of described chip part and capacitor C is apart from a or larger, to guarantee insulation distance Di.

Yet, shown in Fig. 7 B, even in the situation of chip part p with the distance b placement shorter than distance a, also can guarantee insulation distance Di according to the lead member retainer 10 of present embodiment.

Now, description is assembled to lead member retainer 10 and capacitor C the method for printed circuit board (PCB) 22.

As mentioned above, printed circuit board (PCB) 22 comprises hole H2, and this hole H2 is used for inserting (referring to Fig. 8) for the alignment pin outstanding from the bottom surface of lead member retainer 10 50.In addition, printed circuit board (PCB) 22 comprises through hole Ht, and the lead-in wire of capacitor C is soldered to this through hole Ht.

For example, according to the following step lead member retainer 10 and capacitor C are assembled (installation) to printed circuit board (PCB) 22.

First step

In alignment pin 10 difference patchhole H2.

Second step

Lead member retainer 10 is bonded to printed circuit board (PCB) 22.

Third step

Capacitor C is inserted respectively among

support

30a, 30b and the 30c, thereby by the second otch 56 is complementary as the polarity orientation of gauge point with capacitor C.

The 4th step

The wire bonds of capacitor C is arrived through hole Ht.

Like this, by as gauge point the polarity orientation of capacitor C being complementary at the second otch 56, this can reduce assembly defect.

The order of these steps can change as required.For example, can assemble with the order of third step, first step, second step and the 4th step.

It will be understood by those skilled in the art that and to carry out various modification, combination, sub-portfolio and change based on designing requirement and other factors, as long as they fall in the scope of claims and equivalent thereof.

For example, lead member can be the lead member of the needs consideration insulation distance outside the capacitor.Other embodiment of lead member comprises fuse and resistor.In addition, single lead member retainer can support a plurality of different types of lead member.

And for the quantity of the support of lead member retainer, at least two may be enough.

Unnecessary with linear fashion configuration support.For example, support can be arranged so that coupling direction intersects each other.

Alternatively, coupling member can locate to connect support at various height.

In addition, the size of coupling member needn't be identical.

Needn't limit the quantity of alignment pin, and each support all can comprise alignment pin.

Except otch, gauge point can be the mark that coating forms.

Claims

1. lead member retainer, this lead member retainer comprises:

A plurality of supports, each support in described a plurality of supports is bearing in position away from the parts installed surface of substrate with lead member; And

At least one coupling member, described coupling member make adjacent described support link in the position away from described parts installed surface, described support all also comprises:

Base component, described base component have the hole and are attached to described parts installed surface, and the lead-in wire of wherein said lead member inserts in the described hole; And

Scaffold, described scaffold are arranged on the described base component, and wherein, described lead member is inserted in the described scaffold.

2. lead member retainer according to claim 1, wherein:

When supporting the unilateral observation of described lead member, each described coupling member along the width of the direction that intersects with its coupling direction less than each the described support that is connected by described coupling member along and the width of the crossing described direction of described coupling direction, and

Be formed with the gap between adjacent described support, described gap permission visual confirmation is arranged in the electronic unit between described coupling member and the described parts installed surface.

3. lead member retainer according to claim 2, wherein:

Described lead member is polarized capacitor, and

Described scaffold comprises a plurality of contact members, and described contact member is outstanding from the inwall of described scaffold, and described contact member contacts with described polarized capacitor, and described contact member is along the axis direction extension of described polarized capacitor.

4. lead member retainer according to claim 3, wherein:

Each contact member in described a plurality of contact member increases towards the direction of insertion of described polarized capacitor from the outstanding overhang of described inwall.

5. lead member retainer according to claim 4, wherein:

Described scaffold includes the first otch be used to the internal diameter that enlarges described scaffold, and described polarized capacitor inserts in the described scaffold.

6. lead member retainer according to claim 5, wherein:

Described the first otch is formed in the described scaffold of described a plurality of supports, and described the first cut sides is not faced mutually to single direction.

7. lead member retainer according to claim 6, wherein:

Described the first otch is formed in the described scaffold along the described coupling direction of described coupling member.

8. each described lead member retainer in 7 according to claim 5, wherein:

Described scaffold includes gauge point, and described gauge point is indicated the polarity position of described lead member.

9. lead member retainer according to claim 8, wherein:

Described gauge point is formed in the described support along the direction different from described coupling direction.

10. lead member retainer according to claim 9, wherein:

Described gauge point is second otch different from described the first otch.

11. lead member retainer according to claim 7, wherein:

Described a plurality of support aligns along a direction.

12. each described lead member retainer in 7 according to claim 1, wherein:

The support that is arranged in the place, two ends among described a plurality of support includes be used to the alignment pin that is fixed to described substrate.

13. an electronic equipment, this electronic equipment comprises:

Substrate;

The lead member retainer, this lead member retainer comprises:

A plurality of supports, each support in described a plurality of supports is bearing in position away from the parts installed surface of described substrate with lead member; And

At least one coupling member, described coupling member make adjacent described support link in the position away from described parts installed surface; And

Electronic unit, described electronic unit are mounted to described substrate below described coupling member, described support all also comprises:

14. electronic equipment according to claim 13, wherein:

Be formed with the gap between adjacent described support, described gap allows the visual confirmation electronic unit.