CN102901011A - Buffer structure for positioning light guide plate and backlight module - Google Patents
Buffer structure for positioning light guide plate and backlight module Download PDFInfo
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- CN102901011A CN102901011A CN 201210406164 CN201210406164A CN102901011A CN 102901011 A CN102901011 A CN 102901011A CN 201210406164 CN201210406164 CN 201210406164 CN 201210406164 A CN201210406164 A CN 201210406164A CN 102901011 A CN102901011 A CN 102901011A
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- buffer structure
- lgp
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- light guide
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Abstract
The invention provides a buffer structure for positioning a light guide plate and a backlight module. The backlight module comprises a back plate, a light guide plate which is positioned above the back plate, and a buffer structure, wherein the buffer structure is made of elastic materials and comprises two boundary layers and an intermediate layer which is clamped between the boundary layers; each boundary layer has first hardness; the intermediate layer has second hardness; and the second hardness is less than the first hardness. Due to the adoption of the buffer structure, the buffer structure such as foam materials is inlayed between the back plate and the light guide plate, so that the light guide plate can be positioned reliably by the buffer structure. Besides, the foam material can be of a single-layer hollow structure or a multi-layer composite structure; and by regulating the hardness parameters of the foam materials, poor positioning of the light guide plate caused by soft foam materials is avoided, the phenomenon of warpage caused by hard foam materials is avoided, and the reliability and the stability of the light guide plate for positioning the backlight module are improved.
Description
Technical field
The present invention relates to the design of backlight module technology in the liquid crystal display, relate in particular to a kind of buffer structure and backlight module thereof for the location LGP.
Background technology
Current, liquid crystal display (such as Thin Film Transistor-LCD, TFT-LCD) owing to having the advantages such as low power consumption and low radiation, has been widely used in display device now.Along with the continuous progress of liquid crystal industry technology, the large scale of liquid crystal display and slimming more and more become the mainstream demand in market.Particularly, liquid crystal display comprises Polarizer, liquid crystal panel, lower Polarizer and backlight module successively, wherein, liquid crystal panel comprises thin-film transistor array base-plate, colored filter glass substrate and liquid crystal layer at least, backlight module comprises backboard, glue frame, backlight, LGP and blooming piece at least, and the structure of backlight module has determined large scale and the slimming amplitude of whole equipment to a great extent.Therefore, the narrow frame design of backlight module also is subject to research staff's favor as compared with the past more.
A kind of narrow frame of the prior art is dissolved certainly, and scheme is to be, the location technology that adopts alignment pin location or alignment pin location to combine with other auxiliary positioners, (Lighting Guide Panel, LGP) positions to the LGP in the backlight module.Yet because alignment pin is positioned at and does not have advantage on the structure space, the design of being located without alignment pin gradually substitutes.Another kind of traditional solution is to be, employing (for example fixes LGP without the alignment pin location, the foaming kind product), but, there are the following problems when these foaming kind products used: when simple flexible foamed series products was located, the elastic shrinkage amount was too large, and the directionality of expanded material and LGP engagement edge is bad, easily rock, cause the LGP location bad; And during simple hard foamed series products location, because the elastic shrinkage amount is less, LGP can cause the bad situations such as warpage when suffering thermal expansion or extruding, affects the optical property of LGP.
In view of this, how to design a kind of technical scheme based on locate LGP without the alignment pin locate mode, the location that had both overcome above-mentioned flexible foamed material is bad, can eliminate again the less caused warpage situation of hard foam elastic shrinkage amount, LGP is fixedly attached to backboard, be a problem needing to be resolved hurrily of person skilled in the industry reliable and stablely.
Summary of the invention
For the existing defects when locating of the LGP in the backlight module of prior art, the invention provides a kind of buffer structure for the location LGP and the backlight module that comprises this buffer structure.
According to one aspect of the present invention, a kind of backlight module is provided, comprise a backlight, wherein, this backlight module also comprises:
One backboard;
One LGP is positioned at the top of this backboard, is converted into uniform light in order to the light with this backlight outgoing; And
One buffer structure, be embedded between this backboard and this LGP, wherein, this buffer structure is made of elastic material, elastic shrinkage by this buffer structure is located LGP, and described buffer structure comprises two boundary layers and be clipped in intermediate layer between the described boundary layer, and described boundary layer has one first hardness, described intermediate layer has one second hardness, and described the second hardness is less than described the first hardness.
Preferably, this buffer structure adopts expanded material to make.
Preferably, this buffer structure comprises a plurality of hollow-out parts that the interval arranges.Further, the geometry that surrounds of rounded, the quadrangle in the cross section of this hollow-out parts, ellipse, multi-section circular arc or above-mentioned circle, quadrangle, ellipse and the multi-section circular arc any combination that surrounds geometry.
According to another aspect of the present invention, a kind of buffer structure for the location LGP is provided, wherein, this buffer structure is embedded between a backboard and the LGP, buffer structure is made of elastic material, locate this LGP by its elastic shrinkage, described buffer structure comprises a plurality of hollow-out parts that the interval arranges.
Preferably, this buffer structure adopts expanded material to make.
Preferably, this buffer structure comprises two boundary layers and is clipped in intermediate layer between the boundary layer, and this boundary layer has one first hardness, and this intermediate layer has one second hardness, and the second hardness is less than the first hardness.
Preferably, the geometry that surrounds of rounded, the quadrangle in the cross section of this hollow-out parts, ellipse, multi-section circular arc or above-mentioned circle, quadrangle, ellipse and the multi-section circular arc any combination that surrounds geometry.
Adopt buffer structure and the backlight module thereof for the location LGP of the present invention, one buffer structure is embedded between backboard and the LGP, the elastic material of employing such as expanded material consists of this buffer structure, thereby can reliably locate LGP by this buffer structure.In addition, above-mentioned expanded material both can adopt the individual layer engraved structure, can adopt multi-layer compound structure again, by adjusting the hardness parameter of expanded material, both overcome the LGP location that simple flexible foamed material causes bad, can improve the warping phenomenon that simple hard foam causes again, promote the reliability and stability of the LGP of location backlight module.
Description of drawings
The reader will become apparent various aspects of the present invention after the reference accompanying drawing has been read the specific embodiment of the present invention.Wherein,
Fig. 1 illustrates the schematic cross-section according to the backlight module of an embodiment of the present invention;
Fig. 2 illustrates the schematic cross-section according to the backlight module of another embodiment of the present invention; And
Fig. 3 (a) illustrates respectively in the backlight module of Fig. 2 to Fig. 3 (e), is used for the geometry schematic diagram of hollow-out parts of the buffer structure of location LGP.
The specific embodiment
For technology contents that the application is disclosed is more detailed and complete, can be with reference to accompanying drawing and following various specific embodiments of the present invention, identical mark represents same or analogous assembly in the accompanying drawing.Yet those of ordinary skill in the art should be appreciated that the embodiment that hereinafter provides limits the scope that the present invention is contained.In addition, accompanying drawing only is used for schematically being illustrated, and does not draw according to its life size.
As previously mentioned, in current backlight module, although also there are a lot of employings to be seen in the crowd without the structure that the alignment pin locate mode fixes LGP, but, can there be some problems in existing foaming kind product in use: when simple flexible foamed series products was located, the elastic shrinkage amount was too large, and the directionality of expanded material and LGP engagement edge is bad, easily rock, cause the LGP location bad; When simple hard foamed series products was located, the elastic shrinkage amount was less, and LGP can cause the bad situations such as warpage when suffering thermal expansion or extruding, affected the optical property of LGP.Thereby, no matter be flexible foamed material or hard foam, when satisfying the narrow frame design requirement of backlight module, but still can't reliably locate LGP.
In order to address the aforementioned drawbacks or deficiency, the present invention proposes buffer structure a kind of novelty, that be used for the location LGP.Fig. 1 illustrates the schematic cross-section according to the backlight module of an embodiment of the present invention.
With reference to Fig. 1, backlight module of the present invention comprises a backlight (not shown), a backboard 10, a LGP 20 and a buffer structure 30.Wherein, when backboard 10 was vertically placed down, LGP 20 was positioned at the top of backboard 10, and this LGP 20 is converted into uniform light in order to the light with the backlight outgoing.
More specifically, first side interlayer 302 is near backboard 10 1 sides, and Second Edge interlayer 306 is near LGP 20 1 sides.At this, term " boundary layer " and " intermediate layer " are for the position of buffer structure 30, when buffer structure 30 with backboard 10, when LGP 20 contacts, one surface of the buffer structure 30 that contacts with backboard 10 is a boundary layer, and another surface of the buffer structure 30 that contacts with LGP 20 is the another side interlayer.First side interlayer 302 and Second Edge interlayer 306 have one first hardness, and intermediate layer 304 has one second hardness, and this second hardness are set less than this first hardness, thereby make buffer structure 30 have different resiliences.In addition, when this buffer structure 30 of preparation, existing foaming raw material can be pressed into certain thickness multilayer foamed matrix in advance, wherein, the foaming substance that adds various dose between the different layers, and add more foaming substance at middle one deck, make the volume difference of air bubble content in number of bubbles that this foaming matrix produces in the unit volume or the unit volume in foaming process, to realize different resiliences.From the above, after adopting buffer structure 30, suitably adjust the parameter that affects boundary layer and intermediate layer hardness, can locate reliably LGP 20, and when the backlight module high temperature test, can utilize good elastic shrinkage effectively to cushion the thermal expansion deformation of LGP.
Fig. 2 illustrates the schematic cross-section according to the backlight module of another embodiment of the present invention.Fig. 3 (a) illustrates respectively the geometry schematic diagram of the hollow-out parts of the buffer structure among Fig. 2 to Fig. 3 (e).Be similar to Fig. 1, in the embodiment shown in Figure 2, backlight module of the present invention comprises a backlight (not shown), a backboard 10, a LGP 20 and a buffer structure 40.Buffer structure 40 is embedded between backboard 10 and the LGP 20.
Fig. 2 and Fig. 1 are compared, and the buffer structure 30 of Fig. 1 is multi-layer compound structure, that is, be made of first side interlayer 302, Second Edge interlayer 306 and intermediate layer 304.Yet the buffer structure 40 of Fig. 2 also can be a single layer structure except being the multi-layer compound structure, and buffer structure 40 also is made of elastic material, and backlight module is located LGP 20 by the elastic shrinkage of this buffer structure 40.With regard to buffer structure 40 particularly, it comprises a buffering body 402 and a plurality of hollow-out parts 404 that arrange at this buffering body 402, and these hollow-out parts 404 intervals arrange, and have certain spacing distance between two adjacent hollow-out parts 404.Easily learn, this buffer structure 40 (such as expanded material) utilizes these hollow-out parts 404 can change neatly himself resilience, many defectives of the too small caused LGP warpage of elastic shrinkage amount during bad and simple hard foamed series products location, elastic shrinkage amount excessive caused LGP location when solving simple flexible foamed series products location.
In one embodiment, the cross section of this hollow-out parts 404 is a circle, shown in Fig. 3 (a).In one embodiment, the cross section of this hollow-out parts 404 is a quadrangle, shown in Fig. 3 (b).At Fig. 3 (c) to Fig. 3 (e), geometry, circle and tetragonal combination that the cross section of this hollow-out parts 404 surrounds for being set to respectively ellipse, multi-section circular arc.The cross-sectional geometry that it will be understood by those of skill in the art that above-mentioned hollow-out parts 404 is only for for example, but buffer structure of the present invention 40 has more than and is confined to this.In other some embodiment, the hollow-out parts of other geometry also can be set, can change and adjust equally the resilience of buffer structure 40, for example, triangle, regular hexagon etc.
Adopt buffer structure and the backlight module thereof for the location LGP of the present invention, one buffer structure is embedded between backboard and the LGP, the elastic material of employing such as expanded material consists of this buffer structure, thereby can reliably locate LGP by this buffer structure.In addition, above-mentioned expanded material both can adopt the individual layer engraved structure, can adopt multi-layer compound structure again, by adjusting the hardness parameter of expanded material, both overcome the LGP location that simple flexible foamed material causes bad, can improve the warping phenomenon that simple hard foam causes again, promote the reliability and stability of the LGP of location backlight module.
Above, describe the specific embodiment of the present invention with reference to the accompanying drawings.But those skilled in the art can understand, in the situation that without departing from the spirit and scope of the present invention, can also do various changes and replacement to the specific embodiment of the present invention.These changes and replacement all drop in claims limited range of the present invention.
Claims (8)
1. a backlight module comprises a backlight, it is characterized in that, described backlight module also comprises:
One backboard;
One LGP is positioned at the top of described backboard, is converted into uniform light in order to the light with described backlight outgoing; And
One buffer structure, be embedded between described backboard and the described LGP, wherein, described buffer structure is made of elastic material, locate described LGP by the elastic shrinkage of described buffer structure, described buffer structure comprises two boundary layers and is clipped in intermediate layer between the described boundary layer, and described boundary layer has one first hardness, described intermediate layer has one second hardness, and described the second hardness is less than described the first hardness.
2. backlight module according to claim 1 is characterized in that, described buffer structure adopts expanded material to make.
3. backlight module according to claim 1 is characterized in that, described buffer structure comprises a plurality of hollow-out parts that the interval arranges.
4. backlight module according to claim 3, it is characterized in that any combination that the geometry that the cross section of described hollow-out parts is rounded, quadrangle, ellipse, multi-section circular arc surround or above-mentioned circle, quadrangle, ellipse and multi-section circular arc surround geometry.
5. a buffer structure that is used for the location LGP is characterized in that,
Described buffer structure is embedded between a backboard and the described LGP, and wherein, described buffer structure is made of elastic material, locates described LGP by the elastic shrinkage of described buffer structure, and described buffer structure comprises a plurality of hollow-out parts that the interval arranges.
6. buffer structure according to claim 5 is characterized in that, described buffer structure adopts expanded material to make.
7. buffer structure according to claim 5, it is characterized in that, described buffer structure comprises two boundary layers and is clipped in intermediate layer between the described boundary layer, described boundary layer has one first hardness, described intermediate layer has one second hardness, and described the second hardness is less than described the first hardness.
8. buffer structure according to claim 5, it is characterized in that any combination that the geometry that the cross section of described hollow-out parts is rounded, quadrangle, ellipse, multi-section circular arc surround or above-mentioned circle, quadrangle, ellipse and multi-section circular arc surround geometry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210406164 CN102901011A (en) | 2012-10-23 | 2012-10-23 | Buffer structure for positioning light guide plate and backlight module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210406164 CN102901011A (en) | 2012-10-23 | 2012-10-23 | Buffer structure for positioning light guide plate and backlight module |
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| CN102901011A true CN102901011A (en) | 2013-01-30 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112431881A (en) * | 2020-11-24 | 2021-03-02 | 北京小米移动软件有限公司 | Buffer device and manufacturing method thereof, display device and manufacturing method thereof |
| CN113867034A (en) * | 2021-09-15 | 2021-12-31 | 惠科股份有限公司 | Display module and display device |
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2012
- 2012-10-23 CN CN 201210406164 patent/CN102901011A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112431881A (en) * | 2020-11-24 | 2021-03-02 | 北京小米移动软件有限公司 | Buffer device and manufacturing method thereof, display device and manufacturing method thereof |
| CN113867034A (en) * | 2021-09-15 | 2021-12-31 | 惠科股份有限公司 | Display module and display device |
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Application publication date: 20130130 |