CN102896835B - A kind of preparation method of porous metamaterial substrate - Google Patents
A kind of preparation method of porous metamaterial substrate Download PDFInfo
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- CN102896835B CN102896835B CN201110216615.4A CN201110216615A CN102896835B CN 102896835 B CN102896835 B CN 102896835B CN 201110216615 A CN201110216615 A CN 201110216615A CN 102896835 B CN102896835 B CN 102896835B
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Abstract
The invention provides a kind of preparation method of porous metamaterial substrate, polysulfones solution is coated on metallic film, make the solvent of polysulfones solution all soluble in water after putting into water, water and exchange of solvent remove solvent, obtain the polysulfones substrate of porous, this substrate air replaces most of tangible media, reduces dielectric constant and the loss of substrate, meets the requirement of Meta Materials design.
Description
[technical field]
The present invention relates to Meta Materials field, particularly relate to the preparation of metamaterial substrate.
[background technology]
Meta Materials refers to some artificial composite structures with the extraordinary physical property not available for natural material or composite.By the structurally ordered design on the key physical yardstick of material, the restriction of some apparent natural law can be broken through, thus maybe must exceed the meta-materials function of the intrinsic common character of nature.The character of Meta Materials and function mainly come from the structure of its inside but not form their material, and be therefore design and synthesis Meta Materials, people have carried out a lot of research work.2000, the people such as the Smith of University of California pointed out that the metal wire of periodic arrangement and the composite construction of open loop resonator (SRR) can realize permittivity ε and magnetic conductivity μ is negative two negative material simultaneously, also claim LHM.They are again by achieving the two negative material of two dimension at printed circuit board (PCB) (PCB) upper making metal wire and SRR composite construction afterwards.The realization of current metamaterial structure is main or complete to make metal wire on pcb board, traditional PCB substrate dielectric constant is higher, loss is comparatively large, and the tetrafluoroethene substrate dielectric constant that on market, dielectric constant is minimum is general also higher than 2.5, cannot meet the requirement of part high request Meta Materials design.
[summary of the invention]
Technical problem to be solved by this invention is to provide a kind of preparation method of porous metamaterial substrate, replaces most of tangible media with air, thus obtains low-k, low-loss substrate.
The technical scheme that technical solution problem of the present invention adopts is a kind of preparation method of porous metamaterial substrate, it is characterized in that: described preparation method comprises the following steps:
1.1, in the surface of metallic film coating layer of adhesive, then dry;
1.2, by the method for knifing by polysulfones dissolution homogeneity be coated in scribble adhesive metallic film on form one deck polysulphone film;
1.3, the metallic film being coated with polysulfones solution is put into water to soak, water carries out exchange solvent, then takes out, dries and namely form porous substrate.
The mass ratio of the polysulfones solution in described step 1.2 is 10-50%.
The mass ratio of described polysulfones solution is preferably 20-40%.
The concentration of the polysulfones solution described in adjustment carrys out the pore size of control hole.
Described pore size is less along with the increase of the concentration of polysulfones solution.
Described metallic film is Copper Foil, goldleaf or silver foil.
Solvent in described polysulfones solution is water-soluble organic solvent.
Described organic solvent is dimethyl formamide, dimethylacetylamide or carrene.
Add coupling agent again after adhesive diluent dilution in described step 1.1 fully to mix.
Described adhesive is preferably epoxy glue.
What described coupling agent adopted is KH560 coupling agent.
Described diluent is preferably acetone, toluene or methyl alcohol.
Beneficial effect of the present invention is: be coated on metallic film by polysulfones solution, make the solvent of polysulfones solution all soluble in water after putting into water, water and exchange of solvent remove solvent, obtain porous polysulfones substrate, this substrate air replaces most of tangible media, considerably reduces dielectric constant and the loss of substrate; And the size in aperture can be regulated by the concentration of polysulfones solution, meet the requirement of Meta Materials design.
[detailed description of the invention]
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with embodiment, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
A preparation method for porous metamaterial substrate, described preparation method comprises the following steps:
1.1, in the surface of metallic film coating layer of adhesive, then dry, increase the viscosity of metallic film, add coupling agent after described adhesive diluent dilution and fully mix;
1.2, by the method for knifing by polysulfones dissolution homogeneity be coated in scribble adhesive metallic film on form one deck polysulphone film, the mass ratio of described polysulfones solution is 10-50%, is preferably 20-40%;
1.3, the metallic film being coated with polysulfones solution is put into water to soak, described solvent is water-soluble organic solvent, as dimethyl formamide, dimethylacetylamide or carrene, after organic solvent in polysulfones solution is all soluble in water, exchange the organic solvent eliminated in polysulfones solution, then take out, dry and namely define porous substrate.
Described metallic film adopts Copper Foil, goldleaf or silver foil, and what in the present embodiment, metallic film adopted is Copper Foil; The pore size in described hole can carry out regulable control by the concentration of described polysulfones solution, and more large aperture is less for the concentration of polysulfones solution; What in the present embodiment, adhesive adopted is epoxy glue, coupling agent adopts to be mass ratio be 1% KH560 coupling agent, described diluent can select acetone, toluene and methyl alcohol etc.
Embodiment one:
Add appropriate solvent dimethylformamide after getting certain abundant drying of polysulfones powder and be mixed with the polysulfones solution that mass ratio is 20%, fully dissolve and stir until solution becomes homogeneous transparent, then vacuum defoamation 1 hour;
By add again after epoxy glue acetone diluted five times mass ratio be 1% KH560 coupling agent fully mix;
Copper Foil is set level, evenly applies the dilution epoxy glue that one deck has prepared, put into 50 DEG C, baking oven and dry 8 minutes, remove whole solvents, then surface is lain on clean glass plate through the Copper Foil of epoxy glue process, by the mass ratio prepared be 20% polysulfones solution be coated on Copper Foil, film liquid evenly strikes off and forms one deck polysulphone film by rapid glass bar, put into water to soak 24 hours, make solvent dimethylformamide all soluble in water, water and solvent dimethylformamide exchange the solvent dimethylformamide removed in polysulfones solution, take out, put into baking oven 100 DEG C of oven dry and can obtain porous polysulfones epoxy copper-clad base plate, this substrate air replaces most of tangible media, reduce dielectric constant and the loss of substrate, meet the requirement of Meta Materials design.
Embodiment two:
Add appropriate dimethylacetamide solvent after getting certain abundant drying of polysulfones powder and be mixed with the polysulfones solution that mass ratio is 30%, fully dissolve and stir until solution becomes homogeneous transparent, then vacuum defoamation 1.2 hours;
By add again after epoxy glue acetone diluted five times mass ratio be 1% KH560 coupling agent fully mix;
Copper Foil is set level, evenly applies the dilution epoxy glue that one deck has prepared, put into baking oven and dry, remove whole solvents, then surface is lain on clean glass plate through the Copper Foil of epoxy glue process, by the mass ratio prepared be 30% polysulfones solution be coated on Copper Foil, film liquid evenly strikes off and forms one deck polysulphone film by rapid glass bar, put into water to soak 25 hours, make dimethylacetamide solvent all soluble in water, water and dimethylacetamide solvent exchange the dimethylacetamide solvent removed in polysulfones solution, take out, put into baking oven 85 DEG C of oven dry and can obtain porous polysulfones epoxy copper-clad base plate, this substrate air replaces most of tangible media, reduce dielectric constant and the loss of substrate, meet the requirement of Meta Materials design.
Embodiment three:
Add appropriate dichloromethane solvent after getting certain abundant drying of polysulfones powder and be mixed with the polysulfones solution that mass ratio is 40%, fully dissolve and stir until solution becomes homogeneous transparent, then vacuum defoamation 1.5 hours;
By add again after epoxy glue acetone diluted five times mass ratio be 1% KH560 coupling agent fully mix;
Copper Foil is set level, evenly applies the dilution epoxy glue that one deck has prepared, put into baking oven and dry, remove whole solvents, then surface is lain on clean glass plate through the Copper Foil of epoxy glue process, by the mass ratio prepared be 40% polysulfones solution be coated on Copper Foil, film liquid evenly strikes off and forms one deck polysulphone film by rapid glass bar, put into water to soak 23 hours, make dichloromethane solvent all soluble in water, water and dichloromethane solvent exchange the dichloromethane solvent removed in polysulfones solution, take out, put into baking oven 90 DEG C of oven dry and can obtain porous polysulfones epoxy copper-clad base plate, this substrate air replaces most of tangible media, reduce dielectric constant and the loss of substrate, meet the requirement of Meta Materials design.
In the above-described embodiments, only to invention has been exemplary description, but those skilled in the art can carry out various amendment to the present invention without departing from the spirit and scope of the present invention after reading present patent application.
Claims (4)
1. a preparation method for porous metamaterial substrate, is characterized in that: described preparation method comprises the following steps:
1.1, in the surface of metallic film coating layer of adhesive, then dry, wherein, described metallic film is Copper Foil, goldleaf or silver foil, described adhesive be epoxy glue and add again after diluting five times with diluent mass ratio be 1% KH560 coupling agent fully mix, described diluent is acetone, toluene or methyl alcohol;
1.2, by the method for knifing by polysulfones dissolution homogeneity be coated in scribble adhesive metallic film on form one deck polysulphone film, wherein, solvent in described polysulfones solution is water-soluble organic solvent, described organic solvent is dimethyl formamide, dimethylacetylamide or carrene, and the mass ratio of described polysulfones solution is 10-50%;
1.3, the metallic film being coated with polysulfones solution is put into water to soak, water carries out exchanging solvent to remove the solvent in polysulfones solution, then takes out, dries and namely form porous substrate.
2. the preparation method of porous metamaterial substrate according to claim 1, is characterized in that: the mass ratio of described polysulfones solution is preferably 20-40%.
3. the preparation method of porous metamaterial substrate according to claim 1 and 2, is characterized in that: the concentration of the polysulfones solution described in adjustment carrys out the pore size of control hole.
4. the preparation method of porous metamaterial substrate according to claim 3, is characterized in that: described pore size is less along with the increase of the concentration of polysulfones solution.
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| CN201110216615.4A CN102896835B (en) | 2011-07-29 | 2011-07-29 | A kind of preparation method of porous metamaterial substrate |
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| CN201110216615.4A CN102896835B (en) | 2011-07-29 | 2011-07-29 | A kind of preparation method of porous metamaterial substrate |
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| CN102896835B true CN102896835B (en) | 2016-03-09 |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101720257A (en) * | 2007-05-26 | 2010-06-02 | 斯托尼布鲁克水净化公司 | High flux fluid separation membranes comprising a cellulose or cellulose derivative layer |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101720257A (en) * | 2007-05-26 | 2010-06-02 | 斯托尼布鲁克水净化公司 | High flux fluid separation membranes comprising a cellulose or cellulose derivative layer |
Non-Patent Citations (1)
| Title |
|---|
| 《聚砜超滤膜的制备及其表征》;刘金盾;《郑州大学学报（工学版）》;20020930;第23卷(第3期);第1-5页 * |
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