CN102887282A - Patch package - Google Patents
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- CN102887282A CN102887282A CN 201110208073 CN201110208073A CN102887282A CN 102887282 A CN102887282 A CN 102887282A CN 201110208073 CN201110208073 CN 201110208073 CN 201110208073 A CN201110208073 A CN 201110208073A CN 102887282 A CN102887282 A CN 102887282A
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- heat seal
- seal section
- flat heat
- paster
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Abstract
The invention discloses a patch package. The patch package comprises a patch and a packaging film for clamping the patch, wherein the packaging film is firmly sealed in two or a plurality of flat heat sealing parts; and each adjacent flat heat sealing parts in the two or the plurality of flat heat sealing parts are separated from each other by spanning the unsealed parts.
Description
Technical field
The present invention relates to a kind of smt package, wherein utilize packaging film that paster is packed.More particularly, the present invention relates to a kind of smt package, the packaging film of facing that wherein will stride across paster is sealed in the flat heat seal section.
Background technology
In recent years, developed multiple paster with the protection and the treatment on application on human skin wound, pressure sore, thermal burn ulcer, peel off wound (peel off-wound) etc.In addition, as the means to the health administration medicine, developed a kind of method, described method comprises that the paster that will contain medicine adheres on the health so that absorb the drug through skin.This paster (hereinafter sometimes being called patch formulation) that contains medicine comprises: the carrier of being made by plastic film such as polyester, polyethylene etc. or nonwoven fabrics, the adhesive phase that contains the medicine that can absorb through skin, and the clad material that covers the exposed surface of described adhesive phase, wherein described adhesive phase is laminated on the surface of described carrier.Usually; paster and patch formulation can be packed separately (secure seal) in the packing of being made by packaging film with the protection paster, thereby stop comprise the volatilization of medicine and/or avoid moisture, oxygen etc. on the impact (decomposition, oxidation etc.) of medicine etc.
Usually, utilize wrapping machine around paster, packaging film to be carried out heat seal and process, thereby paster is packed separately (secure seal).Yet according to the kind of packaging film and packing method, heat seal is processed may be insufficient, and this causes the problem that sometimes produces pin hole in the part (hereinafter sometimes being called heat seal section) that stands the heat seal processing.
In order to address the above problem, for example, JP-A-2006-44793 has proposed a kind of smt package, and wherein the embossing heat seal section in the packaging film and flat heat seal section are around the periphery of paster, as shown in Figure 6A and 6B.Yet when the sealed width of flat heat seal section in the generation that attempt to reduce pin hole and when improving air-tightness increased, the possibility that produces air bubble in flat heat seal section became large, thereby may make its degraded appearance.
Summary of the invention
The objective of the invention is to address the above problem and provide a kind of and do not contain pin hole, air-tightness is excellent and smt package with good flat heat seal section outward appearance.
The inventor has carried out careful research and discovery for the problems referred to above, compare with the sealed width that only increases flat heat seal section, by at least two flat heat seal sections are provided in the pattern around the paster in clamping the packaging film of paster, and between adjacent flat heat seal section, provide unsealing section, can obtain to improve bubble-tight special-effect.In addition, they find, the outlet that bubble serves as in unsealing section to be to be reduced in the seal defect in the flat heat seal section, can access thus the flat heat seal section of the excellence of bubbles not, and described bubble may produce during the formation of flat heat seal section.Finished the present invention based on these discoveries.
Therefore, the invention provides following content.
[1] a kind of smt package, described smt package comprises paster and clamps the packaging film of described paster, wherein said packaging film is securely sealed in the two or more flat heat seal section, and each adjacent flat heat seal section strides across unsealing section and separates in the described two or more flat heat seal section.
[2] smt package of above-mentioned [1] also comprises embossing heat seal section, the outside of the outmost flat heat seal section of described embossing heat seal section in described two or more flat heat seal section.
[3] smt package of above-mentioned [2], wherein said outmost flat heat seal section and described embossing heat seal section stride across unsealing section and separate.
[4] each smt package in above-mentioned [1]～[3], wherein said two or more flat heat seal section, or described two or more flat heat seal section and described embossing heat seal section form pattern around described paster.
[5] each smt package in above-mentioned [1]～[4], wherein said paster is clipped between two packaging films, and described two or more flat heat seal section, or described two or more flat heat seal section and described embossing heat seal section form pattern at the whole peripheral of described paster.
[6] each smt package in above-mentioned [1]～[4], wherein clamp described paster with the packaging film of twofold, and in the curve of described packaging film, do not form described two or more flat heat seal section, or described two or more flat heat seal section and described embossing heat seal section.
[7] each smt package in above-mentioned [1]～[6], each one in the wherein said two or more flat heat seal section has belt like shape.
[8] smt package of above-mentioned [7], the flat heat seal of wherein said band shape section has the bandwidth of 0.4mm～1.0mm.
[9] each smt package in above-mentioned [1]～[8], wherein said unsealing section has belt like shape, and has the bandwidth of 1.5mm～10mm.
[10] each smt package in above-mentioned [1]～[9] has three flat heat seal sections, or has three flat heat seal sections and embossing heat seal section.
[11] each smt package in above-mentioned [1]～[10], wherein said paster is the patch formulation that contains medicine
Smt package of the present invention does not contain pin hole, and air-tightness is excellent, and has good flat heat seal section outward appearance.In addition, described smt package provides the effect that highly suppresses oxidation of drug and decomposition, and described medicine is easy to decompose because of oxygen or steam.
In addition, in smt package of the present invention, can under even sealed width, specifically form each flat heat seal section.Therefore, in the industry of smt package was made, it provided the effect of the flat thermosealed fraction defective of obvious minimizing.
And in smt package of the present invention, even when producing pin hole etc. for one in the two or more flat heat seal section, remaining flat heat seal section still can guarantee enough air-tightness.Therefore, in the industry of smt package is made, provide the effect of fraction defective in the flat heat seal of obvious minimizing.
Description of drawings
Figure 1A is the planar view that shows embodiment of the present invention 1.
Figure 1B is the section drawing along I-I line among Figure 1A.
Fig. 2 A is the planar view that shows embodiment of the present invention 2.
Fig. 2 B is the section drawing along II-II line among Fig. 2 A.
Fig. 3 is the planar view that shows embodiment of the present invention 3.
Fig. 4 is the planar view that shows embodiment of the present invention 4.
Fig. 5 A is the planar view that shows embodiment of the present invention 5.
Fig. 5 B is the section drawing along IV-IV line among Fig. 5 A.
Fig. 6 A is the planar view that shows the packaging structure of conventional smt package.
Fig. 6 B is the section drawing along III-III line among Fig. 6 A.
Fig. 7 has shown the Keeping life of paster and the relation between the liquid water content, and described paster is securely sealed in the smt package of embodiment and comparative example.
In described figure, the 1st, packing, the 2nd, paster, 3 is first flat heat seal sections, 4 is second flat heat seal sections, and 5 is the 3rd flat heat seal sections, and 6 is first unsealing sections, and 7 is second unsealing sections, 8 is the 3rd unsealing sections, the 9th, and embossing heat seal section, and 10 are packaging films.
The specific embodiment
Below the present invention is described in detail.
Smt package of the present invention comprises paster and clamp the packaging film of described paster, and has packaging film is securely sealed in structure in the two or more flat heat seal section.On two packaging films with roughly the same shape can being placed on mutually and paster can be inserted between described two packaging films.Perhaps, a packaging film can be carried out doubling also can insert paster therebetween.In the present invention, described flat heat seal section is with the place of the flat heat seal of packaging film around paster, and described flat heat seal section forms pattern usually around paster.For example, when by paster being clipped between two packaging films when described paster packed, described flat heat seal section forms pattern at the whole peripheral of described paster.Especially, in the time will obtaining to have the packing of square plane shape, on four sides of paster periphery, in two packaging films, form flat heat seal section (four side seals).In addition, when clamping paster and described packing by the twofold packaging film when having square plane shape, form flat heat seal sections (three side seals) in three sides of the described packaging film except the curve of described film.Described four side seals are favourable, because can control the insertion position of paster when being clipped in paster between the packaging film.
From being easy to manufacture view, smt package of the present invention has at least two flat heat seal sections usually, preferred 2～5 flat heat seal sections, the particularly preferably flat heat seal of 2 or 3 section.Although the shape of described flat heat seal section (when watching packing in planar view, the shape of flat in the plane heat seal section) is not subjected to particular restriction, preferably belt like shape.In described situation, the width (bandwidth) of flat heat seal section is generally 0.4mm～1.0mm, preferred 0.4mm～0.6mm.When described width (bandwidth) during less than 0.4mm, stop the effect step-down that forms pin hole.When width surpassed 1.0mm, the pressure during heat seal is processed during the formation of flat heat seal section disperseed and described heat seal is processed and become incomplete.As a result, may produce pin hole, and air bubble is easy to enter into flat heat seal section, this is not preferred for its outward appearance.Although the width of banded flat heat seal section can be consistent or different, it is preferably consistent.In addition, in the flat heat seal of two or more band shapes section, width (bandwidth) and the pattern of described flat heat seal section can be identical or different, and they are preferably identical.
Smt package of the present invention has two or more flat heat seal section, and each adjacent flat heat seal section strides across unsealing section and separates.The unsealing section of utilization between adjacent flat heat seal section can be released into the air bubble that produces in the unsealing section when forming flat heat seal section, and can ideally form flat heat seal section.Although the shape of unsealing section (when in planar view packing being watched, in the plane the shape of unsealing section) is not subjected to particular restriction, it is preferably belt like shape.In this case, the width (bandwidth) of described unsealing section is generally 1.5mm～10mm, preferred 2.0mm～10mm.When the width (bandwidth) of described unsealing section when being not less than 1.5mm, the paster that comprises in packing has the retention of raising.In addition, when width is no more than 10mm, can access the packing with good handling property, described packing has been saved the consumption of packaging film.When having two or more unsealing section, the width of each unsealing section (bandwidth) and pattern can be identical or different, and preferably identical.
Packaging structure of the present invention can have the embossing heat seal section at packing periphery (circumference).That is, it can have a kind of structure, wherein has embossing heat seal section in the outside of the outmost flat heat seal section flat heat seal section of paster highest distance position place (that is, apart from) in clamping the packaging film of packing.Described embossing heat seal section is a kind of heat seal section recessed and projection that has.The example of the female and projection comprises pattern such as common straw mattress pattern, grid pattern, straight-line pattern, wave pattern, dot pattern etc.In order to obtain suitable sealing intensity, the combination of preferred straw mattress pattern and straight-line pattern.In the situation of for example straw mattress pattern, with the spacing setting of above-mentioned pattern in the scope of 0.2mm～2mm, preferred 0.4mm～0.8mm.When the spacing of straw mattress pattern is narrower than 0.2mm, be used to form the shaping difficult of the use heat block metal die of embossing heat seal section.When spacing is wider than 2mm, be easy to produce pin hole and the outward appearance of the packaging structure that makes not attractive in appearance.In addition, embossing heat seal section forms pattern usually around paster.When for example by paster being clipped in when coming between two packaging films paster packed, the outside in outmost flat heat seal section, described embossing heat seal section also forms pattern at the whole peripheral of paster.
When above-mentioned embossing heat seal section exists, can between outmost flat heat seal section and embossing heat seal section, exist unsealing section so that it is separated.Although the shape of unsealing section is not subjected to particular restriction, be preferably belt like shape.In this case, the width (bandwidth) of described unsealing section is generally 1.5mm～10mm, preferred 2.0mm～10mm.When the width of described unsealing section was not less than 1.5mm, for the paster that comprises in the packing, packing had the retention of raising.In addition, when width is no more than 10mm, can access the packing with good handling property, described packing has been saved the consumption of packaging film.
Preferably in the periphery (outer periphery) of packing embossing heat seal section is set.
The shape of smt package of the present invention (aspect) is not subjected to particular restriction, can be such as square (square, rectangle etc.), polygon (triangle, hexagon etc.), circle, ellipse, other figures etc.The shape (aspect) of the shape of smt package (aspect) and paster to be packaged can be identical or different, and can suitably select, as long as can keep the secure seal performance of packing.
Be elaborated below by the preferred embodiment to smt package of the present invention with reference to the accompanying drawings.Yet following explanation only is exemplary, and the present invention, it uses and uses thereof and to be not limited to this.In the accompanying drawings, the size of all parts, the size between all parts compare etc. not necessarily with those of physical unit and are complementary among the figure.
An embodiment of smt package of the present invention is shown among Figure 1A and Figure 1B.Paster 2 is clipped between two packaging films 10, with described two packaging film 10 flat sealed around described paster 2 to surround described paster 2, form thus flat heat seal section of the first flat heat seal section 3 and second 4.In other words, paster 2 is packaged in the packing 1 of utilizing two flat heat seal section secure seal.Forming flat heat seal section of the described first flat heat seal section 3 and second 4 to determining deviation, and between the described first flat heat seal section 3 and the described second flat heat seal section 4, the first unsealing section 6 is set herein.That is, the described first flat heat seal section 3 strides across described the first unsealing section 6 with the described second flat heat seal section 4 and separates.
Another embodiment of smt package of the present invention is shown among Fig. 2 A and the 2B.The packing 1 of this embodiment also has the embossing heat seal section 9 in described packing periphery.That is, the difference of the smt package shown in described packing and Figure 1A and Figure 1B is, the outside of its flat heat seal section at distance paster 2 highest distance position places (first flat heat seal section) has embossing heat seal section 9.Between the described first flat heat seal section 3 and described embossing heat seal section 9, there is not unsealing section, and forms continuously the described first flat heat seal section 3 and described embossing heat seal section 9.In the smt package of this embodiment, because the periphery of described packing is embossing heat seal section 9, so can easily described packing be opened by enough hands by the periphery of tearing described packing.In addition, described embossing heat seal section 9 can have pattern (straw mattress pattern, grid pattern, straight-line pattern, wave pattern, dot pattern etc.), and described pattern is so that the outward appearance of packing is more attractive in appearance.
Another embodiment of smt package of the present invention is shown among Fig. 3.The packing 1 of this embodiment is with the difference of the smt package shown in Fig. 2 A and Fig. 2 B, and it also has in the 3rd flat heat seal section 5 on the package centre section side of the second flat heat seal section 4 and the second unsealing section 7 between flat heat seal section of the second flat heat seal section the 4 and the 3rd 5.That is, peripheral successively form flat heat seal section of embossing heat seal section 9, first 3, the first unsealing section 6, the second flat heat seal section 4, the second unsealing section 7 and the 3rd flat heat seal section 5 to central part from packing.In the smt package of this embodiment, retention as the paster 2 of content can be improved, because carried out secure seal by three flat heat seal sections (flat heat seal section of flat heat seal section of the first flat heat seal section 3, second the 4 and the 3rd 5) and 9 pairs of described packings of embossing heat seal section.
Another embodiment of smt package of the present invention is shown among Fig. 4.The packing 1 of this embodiment is with the difference of the smt package shown in Fig. 2 A and Fig. 2 B, and it has the unsealing section (the 3rd unsealing section 8) between the first flat heat seal section 3 and embossing heat seal section 9.That is, peripheral successively form embossing heat seal section 9, the 3rd unsealing section 8, the first flat heat seal section 3, the first unsealing section 6 and the second flat heat seal section 4 to central part from packing.In the smt package of this embodiment, by two flat heat seal sections packing is carried out secure seal, and the flat heat seal section of embossing heat seal section 9 and first 3 that will pack in the periphery by the existence of the 3rd unsealing section 8 separates.Utilize the 3rd unsealing section 8, can form the first flat heat seal section 3 and do not affect embossing heat seal 9.As a result, the first flat heat seal section 3 can guarantee more firmly to seal.In addition, because air bubble can be easily emits from the first flat heat seal section 3, so can finish described packing more attractive in appearancely.
Another embodiment of smt package of the present invention is shown among Fig. 5 A and Fig. 5 B.The packing 1 of this embodiment is made of the packaging film 10 of twofold, and on three sides except the side of the curve that forms packaging film 10, successively form flat heat seal section of embossing heat seal section 9, first 3, the first unsealing section 6 and the second flat heat seal section 4 from the periphery of packing 1 to central part.Except pending thermosealed end, the curve of twofold packaging film 10 can have circularity, as shown in Fig. 5 B.In this embodiment, by curve and two flat heat seal sections and embossing heat seal section the packing 1 of packing paster 2 is carried out secure seal, wherein in packaging film 10, around the described paster 2 except described curve, form described two flat heat seal sections and embossing heat seal section.
In the present invention, the method that heat seal is processed is not subjected to particular restriction, and can use known method.According to the movement of main shaft, the method for usually heat seal being processed is divided into rotary process, the case method of movement and correct Sealing Method.
Can make the smt package of the present invention with square plane shape by using four common side seal wrapping machine.
To process to make the example of method of smt package as follows by implementing heat seal with four common side seal wrapping machine according to rotary process.At first, place two long packaging films in opposed facing mode, and paster is inserted between these packaging films in vertical direction paster is clamped.Then, by heat block the double casing film vertically on two ends are heated.It is bonding that the flat roller that utilization has given width and do not contain recessed and projection is implemented pressurization, and heat seal is carried out at the two ends that are heated, thereby form flat heat seal section.By utilizing same flat roller to implement the bonding outside a little heat seal processing of flat heat seal section that forms of pressurization, can form the second flat heat seal section.By repeating similar operation, can form three, four or more flat heat seal section.And, by changing the width of the roller that uses, can change the width of flat heat seal section.In addition, utilize to have and implement the bonding a little outside to the outmost heat seal section that forms of pressurization such as the roller of the pattern of straw mattress pattern etc. and carry out heat seal, thereby form embossing heat seal section (all finishing thus heat seal section at two ends).Thereafter, by the metal die rod bonding heat seal of implementing that pressurizes being processed on the direction longitudinally perpendicular to packaging film, so that form flat heat seal section in inside and externally form embossing heat seal section, form simultaneously thus flat heat seal section and embossing heat seal section (namely forming the heat seal section perpendicular to above-mentioned two ends), wherein said metal die rod integrally has the flat heat seal treatment surface that does not contain recessed and projection and has flat heat seal treatment surface such as the pattern of straw mattress pattern etc., described packaging film cut, so that each packing all contains a paster to finish four side seals packing thereafter.
To process to make the example of method of smt package as follows by implementing heat seal with four common side seal wrapping machine according to correct Sealing Method.At first, place two packaging films in opposed facing mode, and paster is inserted between these packaging films in vertical direction paster is clamped.Then, by to can (having and not contain flat heat seal treatment surface recessed and projection against 4 sides of packaging film, with the heat seal treatment surface that has such as the pattern of straw mattress pattern etc.) on form simultaneously heat seal section the heat block metal die heat and the bonding heat seal of implementing that pressurizes is processed, form simultaneously thus embossing heat seal section and flat heat seal section.In this case, have the heat block metal die of a plurality of (more than 2) flat heat seal treatment surface by use, can form simultaneously two or more flat heat seal section.When successively forming flat heat seal section and embossing heat seal section, use each to have the heat block metal die of the heat seal treatment surface corresponding with each flat heat seal section or embossing heat seal section.In this case, the width of each heat seal section and shape can be according to the shapes of heat seal treatment surface and free setting.In addition, when making a plurality of packing simultaneously, can form at the heat block metal die treatment surface of the number corresponding with the packing number that will make.Utilize punching sword (punching edge) packaging film carried out punching to finish four side seals packing thereafter.
In the case method of movement, when transmitting packaging film continuously, the heat seal of implementing in the above-mentioned correct Sealing Method is processed.
In order to make smt package of the present invention, preferably use correct Sealing Method or the case method of movement to suppress as much as possible the formation of pin hole.When smt package had square plane shape, the heat seal that most preferably forms simultaneously heat seal section on four sides was processed.
In the manufacturing of smt package of the present invention, can form simultaneously or successively form two or more flat heat seal section.Yet, when it forms simultaneously because the dispersive pressure during heat seal is processed and so that heat seal process and tend to not exclusively, thereby the possibility that causes producing pin hole is higher.Therefore, preferred successively formation.When successively forming two or more flat heat seal section, the formation order is not subjected to particular restriction.Yet, preferably from the peripheral side of packing to the formation of central part side.
The condition of bonding temp, pressurization bonding pressure, bonding time of pressurization etc. with the formation of packaging film (for example although pressurize during above-mentioned heat seal is processed, the thickness of packaging film, consist of the kind etc. of the thermal adhesive resin of thermal adhesive resin layer) etc. and change, but can the bandwidth that obtain to expect and the sealing intensity of expectation suitably be set to it.Described pressurization bonding temp is usually in 100 ℃～250 ℃ scope.When pressurization bonding temp when being lower than 100 ℃, the thermal adhesive resin layer can not be realized hot sticky attached, when the pressurization bonding temp surpasses 250 ℃, because of the base material film that consists of packaging film produce fold and bubble, distortion and deteriorated etc. so that the outward appearance of gained packing tend to poor.The pressurization bonding pressure is generally 0.2MPa～2MPa, preferred 0.3MPa～1.5MPa.When the pressurization bonding pressure is lower than 0.2MPa, is easy to produce pin hole, and tends to be difficult to obtain suitable sealing intensity.In addition, when the pressurization bonding pressure surpassed 2MPa, packaging film was easy to deteriorated.
Packaging film
The packaging film of packaging structure of the present invention is not subjected to particular restriction, can form heat seal section and can carry out secure seal to paster as long as it is processed by heat seal.Preferably, it has base material rete and the thermal adhesive resin layer that is laminated on side of described base material rete.Described packaging film is optional to have the dried lamination adhesive layer between described base material film and thermal adhesive resin layer so that it is mutually bonding.When attachedly base material film and thermal adhesive resin layer being carried out abundant when bonding by hot sticky, can there be described dried lamination adhesive layer.
As the base material rete, can use in machinery, physics, chemistry and other properties excellence, particularly have sufficient brightness and intensity and resistance to effect of heat, and the resin molding of diaphaneity excellence or sheet.Particularly, for example, can mention the film or the sheet that are selected from one or more following resins: alkide resin; Amide resin; The Nomex resin; Polyolefin resin such as polyethylene, polypropylene etc.; Polystyrene resin; Polyacrylic and polymethacrylic acid resin; Polycarbonate resin; Poly-acetal resin; Fluorocarbon resin; Polyacrylonitrile resin; Polyvinyl alcohol resin etc.As this film or the sheet of above-mentioned resin, can use the film that stretches in vertical or horizontal single shaft direction.The example of drawing process comprises known method such as horizontal sheet process (flat method) and inflation method etc., and its draft ratio is approximately 2～10 times.The thickness of described film is generally 5 μ m～100 μ m, preferred 10 μ m～50 μ m.The forward printing of picture that in the present invention, can be by common printing process utilization expectation printing such as word, figure, symbol, picture, pattern etc. or reverse printed etc. are coated with above-mentioned resin molding.
As dried lamination adhesive layer, can use conventional dried laminating adhesive, preferably use the bi-component curing adhesive.Especially, more preferably polyester-polyurethane polyalcohol/aromatic polyisocyanate adhesives, polyether-polyurethane/epoxy adhesive, polyether-polyurethane polyalcohol/aliphatic polymeric isocyanate adhesives, polyester/aliphatic isocyanate adhesives, polyester/aromatic isocyanate adhesives, also more preferably polyester-polyurethane polyalcohol/aromatic polyisocyanate adhesives.In order to make packaging film painted, can be to doing any pigment or the dyestuff that adds appropriate amount in the lamination adhesive layer.
By intaglio plate coating, roller coat, scraper for coating, spraying, intaghlio printing, flexographic printing, screen printing, hectographic printing or other common printing process or coating process, the solution of dried laminating adhesive is printed or applied on the surface of base material rete or thermal adhesive resin layer, and to the printing or the coating film carry out drying, can form dried lamination adhesive layer.The thickness of described dried lamination adhesive layer is generally 1.0g/m
2～30g/m
2, preferred 2.0g/m
2～20g/m
2
As the resin that consists of the thermal adhesive resin layer, but can use melted by heat and mutual bonding resin.Particularly, for example, can use Low Density Polyethylene, medium density polyethylene, high density polyethylene (HDPE), linear low density polyethylene, polypropylene, vinyl-vinyl acetate copolymer, ionomer resin, ethylene-acrylic acid copolymer, ethylene-ethyl acrylate copolymer, ethylene-methacrylic acid copolymer, the ethylene-methyl methacrylate methyl terpolymer, ethylene-propylene copolymer, methyl pentene polymer, polybutylene polymer, the polyolefin resin of acid modification (utilizes unsaturated carboxylic acid such as acrylic acid, methyl acrylic acid, maleic acid, fumaric acid, the polyolefin resin of the modifications such as maleic anhydride such as polyethylene, polypropylene etc.), vinylite, poly-(methyl) acrylic resin, Vinyl chloride resin, polystyrene resin, acrylonitrile polyester (for example, acrylonitritrile-styrene resin (AS resin), acrylonitrile-butadiene-styrene copolymer (ABS resin) etc.), heat adhesive pet resin etc.The thermal adhesive resin that most preferably is used for the present invention comprises polyolefin resin and acrylonitrile resin such as Low Density Polyethylene, medium density polyethylene, high density polyethylene (HDPE), linear low density polyethylene, polypropylene etc.Film or the sheet of being made by above-mentioned resin or contain above-mentioned resin and can consist of the thermal adhesive resin layer as filming of the resin combination of main component etc.Its thickness is generally 1 μ m～50 μ m.When being applied to the paster that contains medicine, it is preferably 3 μ m～40 μ m, more preferably 5 μ m～30 μ m.When the thickness of thermal adhesive resin layer during less than 1 μ m, heat seal hydraulic performance decline and so that be easy to produce pin hole, when it was thicker than 50 μ m, the medicine in the paster was to change over to more at high proportion or to be inhaled in the thermal adhesive resin layer.
In case of necessity, packaging film of the present invention can have middle substrate layer.Consist of described in the middle of the example of base material of substrate layer comprise the material that can not see through aqueous vapor, water, gas etc. etc., it can be single base material or the composite base material of being made by the combination of two or more base materials.Particularly, for example, can use the resin molding of the vapor-deposited film with inorganic oxide such as silicon dioxide, aluminium oxide etc., it shows gas barrier to aqueous vapor, gas etc.; Film or the sheet of resin such as Low Density Polyethylene, medium density polyethylene, high density polyethylene (HDPE), linear low density polyethylene, polypropylene, ethylene-propylene copolymer etc., it shows gas barrier to aqueous vapor, water etc.; Film or the sheet of the saponification resultant of resin such as polyvinylidene chloride, polyvinyl alcohol, vinyl-vinyl acetate copolymer etc., it shows gas barrier property; Resin molding with vapor-deposited film of aluminium; Aluminium foil etc.Although the thickness of above-mentioned film or sheet can suitably be set, it typically is 5 μ m～300 μ m, preferred 10 μ m～100 μ m.The thickness of the vapor-deposited film of above-mentioned inorganic oxide is preferably 10nm～300nm, and the thickness of above-mentioned aluminium vapor-deposited film is preferably approximately 10nm～40nm.The example of the resin molding of the above-mentioned vapor-deposited film of load comprises the saponification resultant film of polyester film, polyamide membrane, polyolefin film, polychloroethylene film, polycarbonate membrane, polyvinylidene chloride film, polyvinyl alcohol film, vinyl-vinyl acetate copolymer etc.The thickness of described aluminium foil is preferably 3 μ m～30 μ m, more preferably 5 μ m～10 μ m.
For the smt package that uses the packaging film made by aluminium vapor-deposited film or aluminium foil as middle substrate layer, can not clearly identify paster from its outside.Therefore can not easily test the paster in the packing, and can not easily confirm in flat heat seal section, whether have pin hole by visual inspection or image detection.About being difficult to use in the packing of outward appearance test, guarantee that heat seal during manufacture is more importantly.In this sense, smt package of the present invention is favourable.
Packaging film in the smt package of the present invention is preferably transparent, because help from the paster of outside identification packing and help to confirm whether have pin hole flat heat seal section.In addition, it is preferably transparent, because can be easily heat seal section and other parts of packaging film be differentiated (during heat seal is processed, the formation state of can be easily visual judgement heat seal section) based on light transmission and specific refractivity.Flat heat seal section has the diaphaneity higher than other parts, because do not have the gap and can suppress scattering of light between the film of the film on top and bottom.Thus, when under the condition that does not contain pin hole, forming flat heat seal section, think that flat heat seal section can extend continuously.In addition, by packaging structure being taken a picture and image is processed (binaryzation) automatic checking whether to have pin hole.
The acrylonitrile resin layer
When packaging film of the present invention to the paster (i.e. " patch formulation ") that contains medicine when packing, described thermal adhesive resin layer is preferably vinyl cyanide resin film layer (hereinafter sometimes being called the vinyl cyanide resin bed), this be because the absorption of medicine and by less and content can preserve well.The acrylonitrile resin that is used for the present invention's vinyl cyanide resin bed is not subjected to particular restriction, as long as the 50wt% that is no less than of total weight resin is made of the acrylonitrile composition.Therefore, the example of acrylonitrile resin comprises that (i) polyacrylinitrile, (ii) polyacrylinitrile and other resin blend things or polymer alloy, (iii) contain acrylonitrile as at least two kinds the composite etc. of combination among copolymer, (iv) above-mentioned (i)～(iii) of keystone configuration unit.Wherein, consider as smt package material suitable flexibility and hardness and heat seal, preferably any one in above-mentioned (ii)～(iv).Herein, " as the acrylonitrile of keystone configuration unit " refers to that the 50wt% that is no less than of whole copolymer weight is acrylonitrile.
Acrylonitrile provides not absorptive character and gas barrier property to the vinyl cyanide resin bed, and increase hardness is easy to tear resistance to give.Therefore, the vinyl cyanide resin can be made of the acrylonitrile composition by 100wt%.Yet, for the elasticity of the expectation that realizes packing, Dent resistance, pulling strengrth etc., preferably contain the acrylonitrile composition that (methyl) alkyl acrylate that rubber constituent such as butadidenne etc. and/or alkyl have 1～6 carbon number becomes to grade and be no less than 50wt%.Described rubber constituent provides impact absorbency and suitable flexibility to the vinyl cyanide resin, and (methyl) alkyl acrylate composition has reduced the fusing point of vinyl cyanide resin bed to improve heat seal.Have in (methyl) alkyl acrylate of 1～6 carbon number at alkyl, alkyl can be straight chain or branching, and can use its one or more.Preferably, for example, can mention methyl acrylate, methyl methacrylate, ethyl acrylate, EMA, (1-or 2-) propyl group acrylate, (1-or 2-) propyl methyl acid esters, (1-or 2-) butylacrylic acid ester, (1-or 2-) butyl methyl acrylate etc.Wherein, methyl acrylate particularly preferably is because it has widely effectiveness and can easily give flexibility for the packing of paster.
Described vinyl cyanide resin is preferably and comprises acrylonitrile as the copolymer of keystone configuration unit, and this is because it provides the consistent performance of vinyl cyanide resin bed.As structural unit, described copolymer preferably contain at least acrylonitrile, rubber constituent such as butadidenne etc. and/or wherein alkyl have (methyl) alkyl acrylate of 1～6 carbon number.Described copolymer preferably has the acrylonitrile content of 50～90wt%, and particularly preferably the copolymer compositions wherein alkyl that contains the rubber constituent of acrylonitrile, 2～12wt% of 50～90wt% such as butadidenne etc. and 8～38wt% has (methyl) alkyl acrylate of 1～6 carbon number.In addition, the copolymerized form of described copolymer is not subjected to particular restriction, and it can be random copolymerization, block copolymerization or graft copolymerization.Wherein, preferred graft copolymerization is because it can provide following two specific characters effectively: the characteristic of the characteristic of non-absorbent polyacrylinitrile of the physiologically active ingredient that demonstration is excellent and the rubber constituent with excellent impact absorbency.As long as described characteristic is not suppressed, can suitably add random copolymerization and block copolymerization.
By following method the resinoid composition of acrylonitrile among the present invention is analyzed.
Acrylonitrile content
From packing cuttings vinyl cyanide resin bed, sample is carried out the CHN ultimate analysis and calculates the content of acrylonitrile according to nitrogen content, can obtain thus the content of acrylonitrile.In addition, according to
1H-NMR and
13The spectrum ratio of C-NMR (in the DMSO of deuterate, 80 ℃) has determined that rubber constituent and alkyl wherein have molecular structure and the weight ratio of (methyl) alkyl acrylate composition of 1～6 carbon number, and has determined the weight ratio of 3 kinds of compositions.
The thickness of vinyl cyanide resin bed
Thickness and described thickness that the vinyl cyanide resin bed can suitably be set according to type of paster etc. are not subjected to particular restriction.In order to ensure the impermeability of the physiologically active ingredient in the paster and not absorptivity and described layer as the moisture peretrability of smt package material, suitable flexibility and hardness, described thickness is preferably 10 μ m～100 μ m, more preferably 10 μ m～80 μ m, most preferably 10 μ m～50 μ m.
Paster
Although the paster among the present invention is not subjected to particular restriction, preferably it is adhered on skin or the mucous membrane with treatment or prevent disease.More preferably, it has adhesive phase, is laminated to lip-deep carrier of described adhesive phase and is laminated to another lip-deep release treatment liner of described adhesive phase.Described adhesive phase can contain can be through the medicine of skin absorption.
As the adhesives that consists of adhesive phase, can use to adhere on skin or the mucous membrane and continue the adhesives in specified time cycle under at normal state, to show adhering adhesives; Under wetting conditions, show adhering adhesives; Under heating, show adhering adhesives etc.Particularly, can use the water-soluble binder substrate that mainly contains polyvinyl alcohol, polyvinyl pyrrolidone, poly-N-vinyl acetamide, polyethylene oxide, polyacrylamide, polyacrylate, agar, xanthans etc.; The water-swellable adhesives substrate that mainly contains crosslinked water-soluble polymer, ethyl cellulose, hydroxypropyl cellulose, alginate esters etc.; And the water insoluble adhesive substrate that mainly contains acrylic polymer, rubber polymer, organosilicon polymer, vinylic-ether polymer, vinyl ester polymer etc.As required, these adhesivess and adhesives substrate can contain known additive such as tackifier (such as rosin, modified rosin, petroleum resin, polyterpene resin, polystyrene resin, polybutene resin, liquid polyisobutene, glycerine etc.), plasticizer (for example, liquid paraffin, fatty acid ester etc.), sorbefacient, inhibiter, filler and water etc. to improve adhesiveness.
The thickness of described adhesive phase is generally 10 μ m～200 μ m, preferred 15 μ m～150 μ m.
When obtaining in adhesive phase, containing the patch formulation of medicine, described medicine is not subjected to particular restriction, as long as it can be included in adhesives or the adhesives substrate and described adhesives or adhesives substrate maintenance adhesiveness with dissolved state, super-saturated crystalline state or disperse state.For example, can mention corticosteroid, analgesic antiphlogistic medicine, hypnotic sedative agent, tranquillizer, antihypertensive, low pressure diuretic, microbiotic, anesthetic,general, antiseptic, antifungal agent, vitamin, coronary vasodilator, antihistaminic, pectoral, sex hormone, antidepressant, brain circulation accelerator, antiemetic, anticarcinogen, bio-pharmaceutical etc.
Although the content of adhesive phase Chinese traditional medicine can suitably be set according to the kind of medicine, it typically is 1wt%～80wt%, preferred approximately 2wt%～70wt%.When content during less than 1wt%, can not expect to discharge medicine for treatment or prevention actv. amount.When it surpassed 80wt%, adhesiveness descended and stops fully bondingly, and this can limit treatment or preventive effect, and is disadvantageous economically.
Described carrier layer is not subjected to particular restriction, as long as it can not produce strange sense.Particularly, can mention monofilm or the laminated film (solid film) of making by being selected from one or more following synthetic resin: the polyvinylchloride of polyester, polyolefin (polyethylene, polypropylene etc.), polyvinylchloride, plasticizing, the vinyl acetate-vinyl chloride copolymer of plasticizing, polyvinylidene chloride, vinyl-vinyl acetate copolymer, acetyl group cellulose, ethyl cellulose, ethylene-ethyl acrylate copolymer, polytetrafluoroethylene, polyurethane, ionomer resin etc.In addition, can mention the porous membrane made by rubber, above-mentioned synthetic resin, polyester (such as polyethylene terephthalate etc.), polyamide (nylon etc.) or sheet, nonwoven fabrics, woven fabric etc.In addition, can mention layered product (complex film) in the monofilm of being made by above-mentioned synthetic resin or these porous membranes on the laminated film or sheet, nonwoven fabrics, woven fabric etc.The thickness of described carrier layer is generally 1 μ m～1000 μ m.In the situation of the monofilm of being made by above-mentioned synthetic resin or laminated film, described thickness is preferably 1 μ m～100 μ m, and in the situation of above-mentioned complex film, thickness is preferably 100 μ m～1000 μ m.The material that consists of carrier layer among the present invention is not limited to above-mentioned water-insoluble material, also can use water-soluble material such as polyvinyl alcohol, polyvinyl pyrrolidone, poly-N-vinyl acetamide, polyethylene oxide, polyacrylamide, polyacrylate, agar, xanthans etc., as long as it is nontoxic.
Expectation utilizes release liner that the exposed surface of the adhesive phase of paster of the present invention is covered and protects; until just before being adhered on the skin surface; thereby prevent that adhesive phase is adhered on instrument, the container etc. during manufacture; prevent that adhesive phase is adhered on the packaging film between transportation or storage life, and prevent the degraded of paster.When using, release liner is separated to expose the surface of adhesive phase, then it is adhered to the target location for administration.Release liner is not subjected to particular restriction, as long as it can easily be separated from adhesive phase in use.For example, can use the film of polyester, polyvinylchloride, polyvinylidene chloride, polyethylene terephthalate etc.; Paper such as high-quality paper, glass paper etc., or the laminated film of high-quality paper or glass paper etc.; And carried out polyolefin of separating processing etc. by silicone resin, fluorocarbon resin etc. being applied to the surface that contacts with adhesive phase.The thickness of described release liner is generally 10 μ m～200 μ m, preferred 50 μ m～100 μ m.
The manufacture method of paster is not subjected to particular restriction, for example, can mention and comprise following method: with dissolvings such as medicine, adhesivess or be dispersed in the solvent, on the surface that the solution that obtains or dispersion liquid are applied to carrier, carrier is carried out drying to form adhesive phase at carrier surface, lamination release liner etc. on adhesive phase.In addition, by mentioned solution or dispersion liquid are applied on the protectiveness release liner, release liner is carried out drying to form adhesive phase thereon and carrier is adhered on the adhesive phase, can make paster.
The gross thickness of paster to be packaged is generally 50 μ m～2000 μ m, preferred 100 μ m～1000 μ m.When the thickness of paster during less than 50 μ m, even make the generation that smt package also can suppress pin hole by routine techniques.Therefore, when paster thickness was not less than 50 μ m, the present invention was particularly useful.When paster thickness surpasses 2000 μ m, in flat heat seal section, can not suppress the packaging film distortion that causes because of thickness, and be easy to produce pin hole.
Embodiment
The present invention is described in detail below by reference example and comparative example, but described embodiment and comparative example can not to be interpreted as be restrictive.Hereinafter, " part " and " % " refers to respectively " weight portion " and " wt% ".
The preparation sample
Under inert gas atmosphere, in 60 ℃ ethyl acetate, the acrylic acid-2-ethyl caproite (75 parts) in the adhesive solids content (100 weight portion), NVP (22 parts), acrylic acid (3 parts) and azodiisobutyronitrile (0.2 part) are carried out solution polymerization so that the solution (solids content of adhesives: 28%) of acrylic adhesives in ethyl acetate to be provided.Then, solution and the 27.8kg isopropyl myristate of 80.3kg acrylic adhesives in ethyl acetate mixed, and utilize ethyl acetate to regulate to provide coating solution to viscosity.The coating solution that obtains is applied on polyethylene terephthalate (hereinafter the being called PET) release liner, so that the thickness after drying is 150 μ m, and carries out drying to form the adhesives rete in release liner.The adhesive phase of release liner is adhered on the PET nonwoven surface of the pet vector that the laminated film by PET nonwoven fabrics and PET film consists of, products therefrom 70 ℃ of lower preservations 48 hours, had PET film/adhesive phase/organic coated textiles of PET nonwoven fabrics/4 layers of structure of PET film thereby provide.The fabric of original coating is cut into the square (all angles all have circularity (radius is 6mm)) of 63.5mm * 63.5mm so that paster to be provided.
As packaging film, use the laminated film of transparent polyethylene terephthalate film (thickness: approximately 12 μ m)/aluminium foil (thickness: approximately 15 μ m)/vinyl cyanide resin molding (copolymer of acrylonitrile, butadidenne and methyl acrylate, thickness: about 30 μ m).Paster is included in the described packaging film, and implement under the condition shown in following table 1 (common process condition) and the table 2 (separately treatment conditions) that flat heat seal is processed and the processing of embossing heat seal with the secure seal packaging film, obtain thus the smt package of embodiment 1 and 2, comparative example 1～3.
With belt like shape, flat heat seal section and embossing heat seal section are formed pattern at the whole peripheral of paster.The smt package that obtains is of a size of the square (all angles all have circularity (radius is 5mm)) of 94mm * 94mm.
Table 1
| Project | Setting value |
| Pressurization bonding temp (up/down) (℃) | 150/150 |
| Pressurize the bonding time [second] | 0.277 |
| Pressurization bonding pressure [MPa] | 0.33 |
| Embossing heat seal width [mm] | 45 |
| Straw mattress pattern-pitch [mm] | 0.6 |
| Straw mattress pattern height [mm] | 0.3 |
| The heat seal processing method | Correct Sealing Method |
| Wrapping machine | Four side seal wrapping machine |
Table 2
Air-tightness
The smt package of embodiment 1 and 2, comparative example 1～3 was being preserved 3 months under 40 ± 2 ℃ and under the relative humidity 75 ± 5%, and the liquid water content [ppm] to each paster is measured when beginning to preserve, after 1 month, after 2 months and after 3 months.The method of measurement of the liquid water content of paster is as follows.Packing is opened, paster is shifted out and removes to provide test piece with release liner, in water evaporation equipment to described test piece cast (cast).After unpacking, finish immediately above-mentioned processing.In water evaporation equipment, under 140 ℃, described test piece is heated, utilization is incorporated into consequent steam in the titration bottle as the nitrogen of carrier gas, by the liquid water content (ppm of Ka Er Fischer coulometric titration (Karl Fischer coulometric titration method) to test piece; The weight ratio of steam and test piece total weight) measures.
Show the result among table 3 and Fig. 7.
Table 3
(overall width of flat heat seal section: the liquid water content of the paster in smt package 1.0mm) is not only than being securely sealed in the conventional smt package (width of flat heat seal section: 0.5mm to be securely sealed in embodiment 1 and 2, the liquid water content of the paster comparative example 1) is low, and also lower than the liquid water content of the paster in the smt package that is securely sealed in comparative example 2, and be on the same level with the liquid water content of paster in the smt package that is securely sealed in comparative example 3, in comparative example 2, the width of flat heat seal section is 2 times (1.0mm) of conventional smt package width, in comparative example 3, the width of flat heat seal section is 4 times (2.0mm) of conventional smt package width.The result of table 3 shows, compare with the conventional packaging structure that only has thick (width is larger) flat heat seal section, packaging structure of the present invention with two thin flat heat seal sections is more excellent aspect leak tightness, because with the thin flat heat seal section of two of specific formation of consistent sealed width, so even one of them produces pin hole, another flat heat seal section still can suppress to reveal.Can be clear according to this result, packaging structure of the present invention can keep excellent air-tightness for a long time.
The outward appearance of flat heat seal section
Whether exist bubble to estimate in the flat heat seal section to the smt package of embodiment 1 and 2, comparative example 1～3.To whether existing bubble to carry out visual valuation.
Show the result in the table 4.
Table 4
The flat heat seal section of embodiment 1 and 2 smt package does not all show bubble in any one sample of 10 samples.On the contrary, the flat heat seal section of the smt package of comparative example 2 shown bubble in 2 samples of 10 samples, and the smt package of comparative example 3 has all shown bubble in whole 10 samples.The result of table 4 shows, is easy to produce pin hole and lost efficacy when flat thermosealed width is not less than 1mm.Therefore, when only forming a flat heat seal section with 1mm width, may not guarantee leak tightness.Can be clear according to this result, packaging structure of the present invention has solved the seal defect that is caused by pin hole, and can form attractive in appearance flat heat seal section.
Can be clear according to embodiment, it is excellent and have a good flat heat seal section outward appearance that smt package of the present invention does not contain pin hole, air-tightness.Especially, when paster contained the medicine that is easy to decompose because of oxygen or steam, described smt package was exceedingly useful, because it can highly suppress the oxidation and the decomposition that cause because of long preservation.
Claims (11)
1. smt package, described smt package comprises paster and clamps the packaging film of described paster, wherein said packaging film is securely sealed in the two or more flat heat seal section, and each adjacent flat heat seal section strides across unsealing section and separates in the described two or more flat heat seal section.
2. smt package as claimed in claim 1 also comprises embossing heat seal section, the outside of the outmost flat heat seal section of described embossing heat seal section in described two or more flat heat seal section.
3. smt package as claimed in claim 2, wherein said outmost flat heat seal section and described embossing heat seal section stride across unsealing section and separate.
4. such as each described smt package in the claim 1～3, wherein said two or more flat heat seal section, or described two or more flat heat seal section and described embossing heat seal section form pattern around described paster.
5. such as each described smt package in the claim 1～4, wherein said paster is clipped between two packaging films, and
Described two or more flat heat seal section, or described two or more flat heat seal section and described embossing heat seal section form pattern at the whole peripheral of described paster.
6. such as each described smt package in the claim 1～4, wherein clamp described paster with the packaging film of twofold, and
In the curve of described packaging film, do not form described two or more flat heat seal section, or described two or more flat heat seal section and described embossing heat seal section.
7. such as each described smt package in the claim 1～6, each one in the wherein said two or more flat heat seal section has belt like shape.
8. smt package as claimed in claim 7, the flat heat seal of wherein said band shape section has the bandwidth of 0.4mm～1.0mm.
9. such as each described smt package in the claim 1～8, wherein said unsealing section has belt like shape, and has the bandwidth of 1.5mm～10mm.
10. such as each described smt package in the claim 1～9, have three flat heat seal sections, or have three flat heat seal sections and embossing heat seal section.
11. such as each described smt package in the claim 1～10, wherein said paster is the patch formulation that contains medicine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110208073 CN102887282A (en) | 2011-07-20 | 2011-07-20 | Patch package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110208073 CN102887282A (en) | 2011-07-20 | 2011-07-20 | Patch package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102887282A true CN102887282A (en) | 2013-01-23 |
Family
ID=47530998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110208073 Pending CN102887282A (en) | 2011-07-20 | 2011-07-20 | Patch package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102887282A (en) |
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2011
- 2011-07-20 CN CN 201110208073 patent/CN102887282A/en active Pending
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Application publication date: 20130123 |