CN102876191A - Epoxy putty - Google Patents
Epoxy putty Download PDFInfo
- Publication number
- CN102876191A CN102876191A CN 201210314105 CN201210314105A CN102876191A CN 102876191 A CN102876191 A CN 102876191A CN 201210314105 CN201210314105 CN 201210314105 CN 201210314105 A CN201210314105 A CN 201210314105A CN 102876191 A CN102876191 A CN 102876191A
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- CN
- China
- Prior art keywords
- epoxy
- epoxy putty
- filler
- dimethylbenzene
- putty
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention discloses epoxy putty, which is characterized by comprising a low-molecule resin, dimethylbenzene, reactive diluent, a filler and a curing agent in a mass part ratio of (40-50):(10-20):(5-15):(20-40):(10-30). By the mode, the epoxy putty is high in physical and mechanical performance and chemical stability, cement floor is reinforced and fully permeated, and the evenness and compressive strength of the floor are enhanced.
Description
Technical field
The present invention relates to the coating material production technical field, particularly relate to a kind of epoxy putty.
Background technology
Polymer cement putty main species has neoprene amine breast, polyacrylate dispersion, ethene-acetic acid, ethylene copolymer, polyurethane, epoxy emulsion etc. on the domestic market.Wherein, the most outstanding with water-base epoxy base polymer sand-cement slurry and putty integrated performance index.Aqueous epoxy emulsion adopts mechanical process, on the contrary forwarding and three kinds of method productions of chemical acid process usually.
Resins, epoxy is difficult to form stable emulsion by machinery emulsification.Kinds of surfactants for the preparation of epoxy emulsion is few, more suitable emulsifying agent is the aniorfic surfactant of selecting to contain certain-length ethylene oxide chain link, this method simple process, dosage of surfactant are few, shortcoming is that the particle diameter of Resins, epoxy is larger in the emulsion, particle shape is irregular, resulting aqueous epoxy emulsion poor stability.
The emulsification of opposite forwarding preparation water-base epoxy is under the high speed shear effect outer adding tensio-active agent and Resins, epoxy to be mixed, and then slowly adds deionized water, system progressively to water colour by oil-colored water do not change, and forms uniform and stable water-dilutable system.The shortcoming of this method is to have more tensio-active agent, and the hardness of glued membrane, water tolerance, chemical resistant properties etc. are relatively poor after the film forming, and working life is short.
The chemistry acid process is by to the acid of epoxy water molecules, and ionic group or polar group are introduced on the non-utmost point chain of epoxy molecule, makes it to become the amphipathic nature polyalcohol of hydrophilic and oleophilic.This method has non-ionic acid method and anionic acid process, cationic acid process.
Because Resins, epoxy is the hot solids resin of linear structure, must add solidifying agent and could transmit biochemical reaction, change originally can deeply fusible character and become the reticulated structure that does not deeply melt, and demonstrates the performance of excellence.If there being very big-difference aspect wetting ability and the hydrophobicity, will cause not being complementary on solution parameter between Resins, epoxy and the solidifying agent, can have a negative impact to filming, final because resin and solidifying agent skewness namely affect performance.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of epoxy putty, and is can physical and mechanical property good, chemical-resistant stability is high, reinforced cementitious ground, and fully infiltration increases ground flat degree and compressive strength.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of epoxy putty is provided, it comprises low-molecular-weight resin, dimethylbenzene, reactive diluent, filler and solidifying agent, and the mass parts ratio of described low-molecular-weight resin, dimethylbenzene, reactive diluent, filler and solidifying agent is 40～50,10～20,5～15,20～40 and 10～30.
Preferably, described low-molecular-weight resin is 128 resins.
Preferably, described filler is the heavy carbon soda acid.
The invention has the beneficial effects as follows: a kind of epoxy putty of the present invention, can physical and mechanical property good, chemical-resistant stability is high, reinforced cementitious ground, fully infiltration increases ground flat degree and compressive strength.
Embodiment
The below is described in detail preferred embodiment of the present invention, thereby so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that protection scope of the present invention is made more explicit defining.
The embodiment of the invention comprises:
A kind of epoxy putty, it comprises 128 resins, dimethylbenzene, reactive diluent, heavy carbon soda acid and solidifying agent, and the mass parts ratio of described 128 resins, dimethylbenzene, reactive diluent, heavy carbon soda acid and solidifying agent is 40～50,10～20,5～15,20～40 and 10～30.
A kind of epoxy putty of the present invention, can physical and mechanical property good, chemical-resistant stability is high, reinforced cementitious ground, fully infiltration increases ground flat degree and compressive strength.
The above only is embodiments of the invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes description of the present invention to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (3)
1. epoxy putty, it is characterized in that: it comprises low-molecular-weight resin, dimethylbenzene, reactive diluent, filler and solidifying agent, and the mass parts ratio of described low-molecular-weight resin, dimethylbenzene, reactive diluent, filler and solidifying agent is 40～50,10～20,5～15,20～40 and 10～30.
2. epoxy putty according to claim 1, it is characterized in that: described low-molecular-weight resin is 128 resins.
3. epoxy putty according to claim 1, it is characterized in that: described filler is the heavy carbon soda acid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210314105 CN102876191A (en) | 2012-08-30 | 2012-08-30 | Epoxy putty |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210314105 CN102876191A (en) | 2012-08-30 | 2012-08-30 | Epoxy putty |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102876191A true CN102876191A (en) | 2013-01-16 |
Family
ID=47477723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201210314105 Pending CN102876191A (en) | 2012-08-30 | 2012-08-30 | Epoxy putty |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102876191A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106978004A (en) * | 2017-06-06 | 2017-07-25 | 合肥月煌新型装饰材料有限公司 | A kind of building decoration engineering inner wall putty and preparation method thereof |
| CN114854242A (en) * | 2022-05-30 | 2022-08-05 | 上海橡树装饰工程有限公司 | Waterproof putty powder with strong seam filling capacity, and preparation method and painting process thereof |
-
2012
- 2012-08-30 CN CN 201210314105 patent/CN102876191A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106978004A (en) * | 2017-06-06 | 2017-07-25 | 合肥月煌新型装饰材料有限公司 | A kind of building decoration engineering inner wall putty and preparation method thereof |
| CN114854242A (en) * | 2022-05-30 | 2022-08-05 | 上海橡树装饰工程有限公司 | Waterproof putty powder with strong seam filling capacity, and preparation method and painting process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130116 |