CN102867624B - A kind of encapsulating structure of inductance - Google Patents
A kind of encapsulating structure of inductance Download PDFInfo
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- CN102867624B CN102867624B CN201210373440.2A CN201210373440A CN102867624B CN 102867624 B CN102867624 B CN 102867624B CN 201210373440 A CN201210373440 A CN 201210373440A CN 102867624 B CN102867624 B CN 102867624B
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Abstract
The invention discloses a kind of encapsulating structure of inductance, it belongs to inductance encapsulation technology field, the pcb board comprising inductance and be packaged together with inductance, and pcb board comprises plate body and the stitch hole be opened on plate body and pin bores; Inductance comprises magnetic core, winding, winding is formed by some strands of wire strandings, winding is wound on magnetic core, the end of winding forms pin, pin bores is the pin bores of prolate shape, and the width of pin bores matches with one wire, and pin adopts some strands of wires with form arranged side by side through pin bores, and be welded in pin bores, the laid out in parallel direction of pin is the length direction of pin bores.The present invention adopts the pin of the winding of the different number of share of stock of identical wire diameter to adopt some bursts of wire outlet structures arranged side by side, and pass the pin bores of the prolate type of the same specification on pcb board, wire number of share of stock is different but width is identical, therefore when crossing tin stove, welding is good, product yield is high, has saved the cost of package design and pcb board die sinking.
Description
Technical field
The application relates to inductance encapsulation technology field, specifically, relates to a kind of encapsulating structure of inductance.
Background technology
At present, in power electronics relevant industries, most of inductance is all by after the some strands of copper cash number of turn that coiling is certain outside magnetic core, is fixed on one piece of PCB, and on PCB, reserves the two ends of several stitch and copper cash.The exterior contour size of inductance and the size at these stitch and copper cash two ends and relative position just constitute the encapsulation of inductance.Usually, different inductance also can select identical magnetic core, the number of turn of the wire diameter being wound in the copper cash outside magnetic core that difference is often only to select, number of share of stock and coiling.
In prior art, inductance strand copper wire usually with the outlet of twisted wire mode, so usually adopt circular hole on encapsulation pcb board used.So just be unfavorable in the encapsulation with inductance shared on a PCB.Because the circular hole that wire diameter and the more inductance of number of share of stock use is comparatively large, if such encapsulation changes a wire diameter and the less inductance of number of share of stock into, just easily produce missing solder when crossing tin stove or emit the phenomenons such as tin, increasing the fraction defective of product.
Three sections of inductance are made to use same specification magnetic core, if a inductance, b inductance and c inductance use a strand of identical wire diameter, two strands and compenzine to carry out coiling respectively, then when outlet is carried out in twisted wire mode, the proper encapsulation of these three inductance is as Fig. 1, shown in Fig. 2, Fig. 3.These 3 inductance are being shared with on a PCB if now want, can only with the package design of Fig. 3, like this at use a, b two inductance and this pcb board encapsulate, and during with the outlet of twisted wire mode, as shown in Fig. 4, Fig. 5 structure, between wire and pin bores, gap is excessive, therefore, the just easy outlet rosin joint or emit the phenomenons such as tin when crossing tin stove.
Summary of the invention
The object of the application is, provides a kind of encapsulating structure of inductance, and it adopts the different number of share of stock wire of identical wire diameter to carry out the inductance of coiling, the pcb board of same specification is adopted to encapsulate, missing solder can not be produced when crossing tin stove or emit the phenomenons such as tin, there is saving design cost, finished product yield high.
Object of the present invention is achieved through the following technical solutions:
An encapsulating structure for inductance, the pcb board comprising inductance and be packaged together with described inductance,
Described pcb board comprises plate body and the stitch hole be opened on described plate body and pin bores;
Described inductance comprises magnetic core, winding, described winding is formed by some strands of wire strandings, described winding is wound on described magnetic core, the end of described winding forms pin, described pin bores is the pin bores of prolate shape, and the width of described pin bores matches with one wire, and described pin adopts some strands of wires with form arranged side by side through described pin bores, and be welded in described pin bores, the laid out in parallel direction of described pin is the length direction of pin bores.
Further, the length of pin bores is 2.8mm ~ 5.0mm.
Further, the length of pin bores is 3.0mm ~ 4.8mm.
Further, the width of pin bores is 1.2mm ~ 2.0mm.
Further, the width of pin bores is 1.6mm.
Further, the quantity of pin bores is at least two.
Beneficial effect of the present invention:
The encapsulating structure of a kind of inductance of the present invention, the pin of the winding of the different number of share of stock of identical wire diameter is adopted to adopt some bursts of wire outlet structures arranged side by side, and pass the pin bores of the prolate type of the same specification on pcb board, wire number of share of stock is different but width is identical, therefore when crossing tin stove, welding is good, and product yield is high, has saved the cost of package design and pcb board die sinking.
Accompanying drawing explanation
The present invention will be further described to utilize accompanying drawing, but the content in accompanying drawing does not form any limitation of the invention.
Fig. 1 is the structural representation of the inductance encapsulation of one wire-wound line of prior art;
Fig. 2 is the structural representation that the inductance of two strand coilings of prior art wire diameter identical with Fig. 1 encapsulates;
Fig. 3 is the structural representation that the inductance of the compenzine coiling of prior art wire diameter identical with Fig. 1 encapsulates;
Fig. 4 is that the inductance encapsulation of one wire-wound line of prior art adopts the structural representation that in Fig. 3, pcb board encapsulates;
Fig. 5 is that the inductance encapsulation of prior art two strand coiling adopts the structural representation that in Fig. 3, pcb board encapsulates;
Fig. 6 is the structural representation of the encapsulating structure of a kind of inductance of the present invention;
Fig. 7 is another structural representation of the encapsulating structure of a kind of inductance of the present invention.
Include in Fig. 1 to Fig. 7:
Plate body 1,
Stitch hole 2,
Pin bores 3,
Pin 4.
Embodiment
The invention will be further described with the following Examples.
An encapsulating structure for inductance, the pcb board comprising inductance and be packaged together with inductance,
Pcb board comprises plate body 1 and the stitch hole 2 be opened on plate body 1 and pin bores 3, and pin bores 3 is prolate shape pin bores 3;
Inductance comprises magnetic core, winding, and winding is formed by some strands of wire strandings, and winding is wound on magnetic core, and the end of winding forms pin 4, and the form that pin 4 adopts some strands of wires arranged side by side through pin bores 3, and is welded in pin bores 3.
Concrete, to use same specification magnetic core to make three sections of inductance, if a inductance uses Φ 1.3 1 strand, b inductance uses Φ 1.3 liang of strands, and c inductance uses Φ 1.3 compenzine.If use the mode of outlet arranged side by side to encapsulate this three inductance, the structure as shown in Fig. 6, Fig. 7 can be used.Fig. 6 can be suitable for inductance a, and b, Fig. 7 can be suitable for inductance a, b, c.And due to the width of perforate on pcb board less, when using Fig. 7 to encapsulate the inductance a of a strand, also there will not be rosin joint or emit the phenomenon of tin, encapsulating products yield is high.
The length of pin bores is 2.8mm ~ 5.0mm.
More preferred, the length of pin bores 3 is 3.0mm ~ 4.8mm.The inductance encapsulation of this length range applicable Φ 1.3 1 strand, two strands and compenzine.
The width of pin bores is 1.2mm ~ 2.0mm.Preferably, the width of pin bores 3 is 1.6mm.The pin bores of this width is suitable for the width of existing most of inductance encapsulation wire.
The quantity of pin bores 3 is at least two.
Last it is noted that these are only the preferred embodiments of the present invention, be not limited to the present invention, although with reference to embodiment to invention has been detailed description, for a person skilled in the art, it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (4)
1. an encapsulating structure for inductance, the pcb board comprising inductance and be packaged together with described inductance,
Described pcb board comprises plate body and the stitch hole be opened on described plate body and pin bores;
Described inductance comprises magnetic core, winding, described winding is formed by some strands of wire strandings, described winding is wound on described magnetic core, the end of described winding forms pin, it is characterized in that: described pin bores is the pin bores of prolate shape, the width of described pin bores and the diameter compatible of one wire close, and described pin adopts some strands of wires with form arranged side by side through described pin bores, and be welded in described pin bores, the laid out in parallel direction of described pin is the length direction of pin bores; The length of described pin bores is 2.8mm ~ 5.0mm; The width of described pin bores is 1.2mm ~ 2.0mm.
2. the encapsulating structure of a kind of inductance according to claim 1, is characterized in that, the length of described pin bores is 3.0mm ~ 4.8mm.
3. the encapsulating structure of a kind of inductance according to claim 1, is characterized in that, the width of described pin bores is 1.6mm.
4. the encapsulating structure of a kind of inductance according to claim 1, is characterized in that, the quantity of described pin bores is at least two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210373440.2A CN102867624B (en) | 2012-09-27 | 2012-09-27 | A kind of encapsulating structure of inductance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210373440.2A CN102867624B (en) | 2012-09-27 | 2012-09-27 | A kind of encapsulating structure of inductance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102867624A CN102867624A (en) | 2013-01-09 |
| CN102867624B true CN102867624B (en) | 2015-12-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210373440.2A Active CN102867624B (en) | 2012-09-27 | 2012-09-27 | A kind of encapsulating structure of inductance |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206179639U (en) * | 2016-10-13 | 2017-05-17 | 雅博思（深圳）电子有限公司 | Network transformer |
| CN107449518A (en) * | 2017-08-30 | 2017-12-08 | 东风汽车电子有限公司 | A kind of commercial car environment temperature sensor |
| CN117095906A (en) * | 2018-04-28 | 2023-11-21 | 台达电子企业管理（上海）有限公司 | Inductance applied to power module and power module |
| CN117612838B (en) * | 2024-01-23 | 2024-07-23 | 格力电器(赣州)有限公司 | Encapsulation structure of inductor and inductor |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4029666A1 (en) * | 1990-09-19 | 1992-03-26 | Klaus Lorenzen | Partly casing electrical component - by standing lower part of component, e.g. coil, vertically in trough, encapsulating in cast resin and cooling resin to set |
| CN2411575Y (en) * | 2000-03-11 | 2000-12-20 | 周水军 | Universal crystal oscillating cover of optimized designed |
| CN201194446Y (en) * | 2008-03-28 | 2009-02-11 | 艾默生网络能源有限公司 | PCB circuit board |
| CN101836516A (en) * | 2007-10-25 | 2010-09-15 | 奥斯兰姆有限公司 | A method of soldering components on circuit boards and corresponding circuit board |
| CN201904198U (en) * | 2010-10-22 | 2011-07-20 | 爱华特(广州)通讯有限公司 | High isolation transformer |
| CN202796371U (en) * | 2012-09-27 | 2013-03-13 | 广东易事特电源股份有限公司 | Inductor packaging structure |
-
2012
- 2012-09-27 CN CN201210373440.2A patent/CN102867624B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4029666A1 (en) * | 1990-09-19 | 1992-03-26 | Klaus Lorenzen | Partly casing electrical component - by standing lower part of component, e.g. coil, vertically in trough, encapsulating in cast resin and cooling resin to set |
| CN2411575Y (en) * | 2000-03-11 | 2000-12-20 | 周水军 | Universal crystal oscillating cover of optimized designed |
| CN101836516A (en) * | 2007-10-25 | 2010-09-15 | 奥斯兰姆有限公司 | A method of soldering components on circuit boards and corresponding circuit board |
| CN201194446Y (en) * | 2008-03-28 | 2009-02-11 | 艾默生网络能源有限公司 | PCB circuit board |
| CN201904198U (en) * | 2010-10-22 | 2011-07-20 | 爱华特(广州)通讯有限公司 | High isolation transformer |
| CN202796371U (en) * | 2012-09-27 | 2013-03-13 | 广东易事特电源股份有限公司 | Inductor packaging structure |
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| CN102867624A (en) | 2013-01-09 |
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