CN102867624A - Inductor packaging structure - Google Patents
Inductor packaging structure Download PDFInfo
- Publication number
- CN102867624A CN102867624A CN2012103734402A CN201210373440A CN102867624A CN 102867624 A CN102867624 A CN 102867624A CN 2012103734402 A CN2012103734402 A CN 2012103734402A CN 201210373440 A CN201210373440 A CN 201210373440A CN 102867624 A CN102867624 A CN 102867624A
- Authority
- CN
- China
- Prior art keywords
- inductance
- pin bores
- pin
- inductor
- winding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Coils Or Transformers For Communication (AREA)
Abstract
The invention discloses an inductor packaging structure and belongs to the technical field of inductor packaging. The inductor packaging structure comprises an inductor and a printed circuit board (PCB) which is packaged together with the inductor, wherein the PCB comprises a board body, a stitch hole and a pin hole, and the stitch hole and the pin hole are arranged on the board body. The inductor comprises a magnetic core and a winding, wherein the winding is formed by twisting a plurality of conductors and is twisted on the magnetic core, a pin forms at the end portion of the winding, the pin hole is prolate, the width of the pin hole is matched with one conductor, the pin penetrates through the pin hole in a parallel mode through a plurality of conductors and is welded on the pin hole, and the parallel distribution direction of the pin is the length direction of the pin hole. The inductor packaging structure adopts the winding which has the same wire diameter and different strand number, and the pin adopts the structure that a plurality of conductors are led out in parallel mode. Therefore, in tin furnace passing, the inductor packaging structure is good in welding and high in product yield rate, and saves the cost of packaging design and mold opening of the PCB.
Description
Technical field
The application relates to inductance encapsulation technology field, specifically, relates to a kind of encapsulating structure of inductance.
Background technology
At present, in the power electronics relevant industries, most of inductance all are by after the certain number of turn of some strands of copper cash coiling outside magnetic core, are fixed on the PCB, and reserve the two ends of several stitch and copper cash at PCB.Exterior contour size and the size at these stitch and copper cash two ends and the encapsulation that relative position has just consisted of inductance of inductance.Usually, different inductance also can be selected identical magnetic core, the number of turn of the wire diameter, number of share of stock and the coiling that are wound in the outer copper cash of magnetic core that difference often only is to select.
In the prior art, the inductance strand copper wire is usually with the outlet of twisted wire mode, so usually adopt circular hole on the used pcb board of encapsulation.So just be unfavorable in the encapsulation that shares inductance with a PCB.Because the circular hole that the more inductance of wire diameter and number of share of stock uses is larger, if such encapsulation changes a wire diameter and the less inductance of number of share of stock into, just easily when crossing the tin stove, produce empty weldering or emit the phenomenon such as tin, increase the fraction defective of product.
Make three inductance as example to use same specification magnetic core, if a inductance, b inductance and c inductance use respectively a strand, two strands and the compenzine of identical wire diameter to wind the line, then when outlet is carried out in the twisted wire mode, encapsulation such as Fig. 1 that these three inductance are proper, Fig. 2, shown in Figure 3.Sharing these 3 inductance if want this moment with a PCB, can only be with the package design of Fig. 3, using a like this, b two inductance and the encapsulation of this pcb board, and during with the outlet of twisted wire mode, shown in Fig. 4, Fig. 5 structure, the slit is excessive between wire and the pin bores, therefore, easy outlet rosin joint or emit the phenomenon such as tin just when crossing the tin stove.
Summary of the invention
The application's purpose is to provide a kind of encapsulating structure of inductance, the inductance that it adopts the different number of share of stock wires of identical wire diameter to wind the line, adopt the pcb board of same specification to encapsulate, when crossing the tin stove, can not produce empty weldering or emit the phenomenon such as tin, have the save design cost, finished product yield high.
Purpose of the present invention is achieved through the following technical solutions:
A kind of encapsulating structure of inductance comprises inductance and the pcb board that is packaged together with described inductance,
Described pcb board comprises plate body and the stitch hole and the pin bores that are opened on the described plate body;
Described inductance comprises magnetic core, winding, described winding is formed by some strands of wire strandings, described winding is wound on the described magnetic core, the end of described winding forms pin, described pin bores is the pin bores of prolate shape, and the width of described pin bores matches with one wire, and described pin adopts some strands of wires to pass described pin bores with form arranged side by side, and be welded in described pin bores, the arragement direction arranged side by side of described pin is the length direction of pin bores.
Further, the length of pin bores is 2.8mm～5.0mm.
Further, the length of pin bores is 3.0mm～4.8mm.
Further, the width of pin bores is 1.2mm～2.0mm.
Further, the width of pin bores is 1.6mm.
Further, the quantity of pin bores is at least two.
Beneficial effect of the present invention:
The encapsulating structure of a kind of inductance of the present invention, adopt the pin of the winding of the different number of share of stocks of identical wire diameter to adopt some bursts of wire outlet structures arranged side by side, and the pin bores of passing the prolate type of the same specification on the pcb board, the wire number of share of stock is different but width is identical, therefore when crossing the tin stove, welding is good, and product yield is high, has saved the cost of package design and pcb board die sinking.
Description of drawings
The present invention will be further described to utilize accompanying drawing, but the content in the accompanying drawing does not consist of any limitation of the invention.
Fig. 1 is the structural representation of the inductance encapsulation of one wire-wound line of prior art;
Fig. 2 is prior art and the structural representation of the inductance encapsulation of two strands of the identical wire diameter of Fig. 1 coiling;
Fig. 3 is prior art and the structural representation of the inductance encapsulation of the compenzine of the identical wire diameter of Fig. 1 coiling;
Fig. 4 is the structural representation that pcb board encapsulation among Fig. 3 is adopted in the inductance encapsulation of one wire-wound line of prior art;
Fig. 5 is the structural representation that pcb board encapsulation among Fig. 3 is adopted in the inductance encapsulation of prior art two strands coiling;
Fig. 6 is the structural representation of the encapsulating structure of a kind of inductance of the present invention;
Fig. 7 is another structural representation of the encapsulating structure of a kind of inductance of the present invention.
In Fig. 1 to Fig. 7, include:
Stitch hole 2,
Pin bores 3,
Embodiment
The invention will be further described with the following Examples.
A kind of encapsulating structure of inductance comprises inductance and the pcb board that is packaged together with inductance,
Pcb board comprises plate body 1 and the stitch hole 2 and the pin bores 3 that are opened on the plate body 1, and pin bores 3 is prolate shape pin bores 3;
Inductance comprises magnetic core, winding, and winding is formed by some strands of wire strandings, and winding is wound on the magnetic core, and the end of winding forms pin 4, and pin 4 adopts some bursts of wire forms arranged side by side to pass pin bores 3, and is welded in pin bores 3.
Concrete, make three inductance as example to use same specification magnetic core, if a inductance uses Φ 1.3 1 strands, the b inductance uses 1.3 liang of strands of Φ, the c inductance uses Φ 1.3 compenzines.If the mode with outlet arranged side by side encapsulates this three inductance, can use such as Fig. 6 structure shown in Figure 7.Fig. 6 can be suitable for inductance a, b, and Fig. 7 can be suitable for inductance a, b, c.And because the width of perforate is less on the pcb board, when using Fig. 7 to encapsulate the inductance a of a strand, rosin joint also can occur or emit the phenomenon of tin, the encapsulating products yield is high.
The length of pin bores is 2.8mm～5.0mm.
More preferred, the length of pin bores 3 is 3.0mm～4.8mm.The inductance encapsulation of applicable Φ 1.3 1 strands of this length range, two strands and compenzine.
The width of pin bores is 1.2mm～2.0mm.Preferably, the width of pin bores 3 is 1.6mm.The pin bores of this width is suitable for the width that wire is used in existing most of inductance encapsulation.
The quantity of pin bores 3 is at least two.
It should be noted that at last: above only is the preferred embodiments of the present invention, be not limited to the present invention, although with reference to embodiment the present invention is had been described in detail, for a person skilled in the art, it still can be made amendment to the technical scheme that aforementioned each embodiment puts down in writing, and perhaps part technical characterictic wherein is equal to replacement.Within the spirit and principles in the present invention all, any modification of doing, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (6)
1. the encapsulating structure of an inductance comprises inductance and the pcb board that is packaged together with described inductance,
Described pcb board comprises plate body and the stitch hole and the pin bores that are opened on the described plate body;
Described inductance comprises magnetic core, winding, described winding is formed by some strands of wire strandings, described winding is wound on the described magnetic core, the end of described winding forms pin, it is characterized in that: described pin bores is the pin bores of prolate shape, and the width of described pin bores matches with one wire, and described pin adopts some strands of wires to pass described pin bores with form arranged side by side, and be welded in described pin bores, the arragement direction arranged side by side of described pin is the length direction of pin bores.
2. the encapsulating structure of a kind of inductance according to claim 1 is characterized in that, the length of described pin bores is 2.8mm～5.0mm.
3. the encapsulating structure of a kind of inductance according to claim 1 is characterized in that, the length of described pin bores is 3.0mm～4.8mm.
4. the encapsulating structure of a kind of inductance according to claim 1 is characterized in that, the width of described pin bores is 1.2mm～2.0mm.
5. the encapsulating structure of a kind of inductance according to claim 1 is characterized in that, the width of described pin bores is 1.6mm.
6. the encapsulating structure of a kind of inductance according to claim 1 is characterized in that, the quantity of described pin bores is at least two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210373440.2A CN102867624B (en) | 2012-09-27 | 2012-09-27 | A kind of encapsulating structure of inductance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210373440.2A CN102867624B (en) | 2012-09-27 | 2012-09-27 | A kind of encapsulating structure of inductance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102867624A true CN102867624A (en) | 2013-01-09 |
| CN102867624B CN102867624B (en) | 2015-12-02 |
Family
ID=47446422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210373440.2A Active CN102867624B (en) | 2012-09-27 | 2012-09-27 | A kind of encapsulating structure of inductance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102867624B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107449518A (en) * | 2017-08-30 | 2017-12-08 | 东风汽车电子有限公司 | A kind of commercial car environment temperature sensor |
| WO2018068350A1 (en) * | 2016-10-13 | 2018-04-19 | 雅博思（深圳）电子有限公司 | Network transformer |
| CN110417235A (en) * | 2018-04-28 | 2019-11-05 | 台达电子企业管理（上海）有限公司 | Inductance and power module applied to power module |
| CN117612838A (en) * | 2024-01-23 | 2024-02-27 | 格力电器(赣州)有限公司 | Encapsulation structure of inductor and inductor |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4029666A1 (en) * | 1990-09-19 | 1992-03-26 | Klaus Lorenzen | Partly casing electrical component - by standing lower part of component, e.g. coil, vertically in trough, encapsulating in cast resin and cooling resin to set |
| CN2411575Y (en) * | 2000-03-11 | 2000-12-20 | 周水军 | Universal crystal oscillating cover of optimized designed |
| CN201194446Y (en) * | 2008-03-28 | 2009-02-11 | 艾默生网络能源有限公司 | PCB circuit board |
| CN101836516A (en) * | 2007-10-25 | 2010-09-15 | 奥斯兰姆有限公司 | A method of soldering components on circuit boards and corresponding circuit board |
| CN201904198U (en) * | 2010-10-22 | 2011-07-20 | 爱华特(广州)通讯有限公司 | High isolation transformer |
| CN202796371U (en) * | 2012-09-27 | 2013-03-13 | 广东易事特电源股份有限公司 | Inductor packaging structure |
-
2012
- 2012-09-27 CN CN201210373440.2A patent/CN102867624B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4029666A1 (en) * | 1990-09-19 | 1992-03-26 | Klaus Lorenzen | Partly casing electrical component - by standing lower part of component, e.g. coil, vertically in trough, encapsulating in cast resin and cooling resin to set |
| CN2411575Y (en) * | 2000-03-11 | 2000-12-20 | 周水军 | Universal crystal oscillating cover of optimized designed |
| CN101836516A (en) * | 2007-10-25 | 2010-09-15 | 奥斯兰姆有限公司 | A method of soldering components on circuit boards and corresponding circuit board |
| CN201194446Y (en) * | 2008-03-28 | 2009-02-11 | 艾默生网络能源有限公司 | PCB circuit board |
| CN201904198U (en) * | 2010-10-22 | 2011-07-20 | 爱华特(广州)通讯有限公司 | High isolation transformer |
| CN202796371U (en) * | 2012-09-27 | 2013-03-13 | 广东易事特电源股份有限公司 | Inductor packaging structure |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018068350A1 (en) * | 2016-10-13 | 2018-04-19 | 雅博思（深圳）电子有限公司 | Network transformer |
| CN107449518A (en) * | 2017-08-30 | 2017-12-08 | 东风汽车电子有限公司 | A kind of commercial car environment temperature sensor |
| CN110417235A (en) * | 2018-04-28 | 2019-11-05 | 台达电子企业管理（上海）有限公司 | Inductance and power module applied to power module |
| CN110417235B (en) * | 2018-04-28 | 2023-08-29 | 台达电子企业管理（上海）有限公司 | Inductance applied to power module and power module |
| CN117612838A (en) * | 2024-01-23 | 2024-02-27 | 格力电器(赣州)有限公司 | Encapsulation structure of inductor and inductor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102867624B (en) | 2015-12-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102867624A (en) | Inductor packaging structure | |
| CN202796371U (en) | Inductor packaging structure | |
| CN205122314U (en) | No pin wire resistor ware | |
| CN208225643U (en) | A kind of high current flat wire common mode inductance | |
| CN101673609A (en) | Electric connector and inductance coil on same | |
| CN202150292U (en) | Wire with screw thread strips | |
| CN205751811U (en) | Transformator and there is the electric connector of transformator | |
| CN206134459U (en) | Many windings high -frequency transformer | |
| CN204332585U (en) | A kind of U-shaped PFC inductance | |
| CN206602012U (en) | The I-shaped inducer of embedded coiling | |
| CN202695052U (en) | Hollow inductor | |
| CN103500626A (en) | Inductor | |
| CN202771856U (en) | Wire passing plate for cable production | |
| CN201859735U (en) | Encapsulation type inductor element | |
| CN202601384U (en) | Novel transformer skeleton | |
| CN206098076U (en) | Coil for solenoid valve | |
| CN201402639Y (en) | High definition multimedia connecting wire | |
| CN206961540U (en) | A kind of flat cable for passing through slit | |
| CN201820610U (en) | Welding structure for lead outlet terminals of dry type air core reactor | |
| CN214410819U (en) | High-stability interweaved and twisted self-adhesive covered wire | |
| CN205028710U (en) | Strip cable is annotated to new construction spiral | |
| CN201348886Y (en) | Transposition combined conducting wire with insulated core wire | |
| CN202405020U (en) | Lead pin of fuse resistor | |
| CN204155728U (en) | A kind of inductor with binding post reinforcement of weld | |
| CN203760123U (en) | Flexible conducting wire |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |