CN102866109B - The bonding force method of testing of self-binding enamel wire - Google Patents
The bonding force method of testing of self-binding enamel wire Download PDFInfo
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- CN102866109B CN102866109B CN201210372443.4A CN201210372443A CN102866109B CN 102866109 B CN102866109 B CN 102866109B CN 201210372443 A CN201210372443 A CN 201210372443A CN 102866109 B CN102866109 B CN 102866109B
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Abstract
The bonding force method of testing that the invention discloses a kind of ultra micro self-binding enamel wire, comprises the following steps: the ultra micro self-binding enamel wire of getting the lopping of certain length nature is for subsequent use as sample wire; The doubling of sample thief line, is twisted into the line pair of (125 ± 5) mm; Be on negative electrode Copper Foil by the line after twisting to being mounted on side by side thickness; By the line mounting to toasting rear taking-up; By the line taking out in baking oven to cooling; Until line, to after cooling, the right one end that cuts off line does not become the part of twisting, and the right other end that opens line does not become the part of twisting, make it be the two ends pin of 180 °, wherein one end pin is fixed, and other end pin is hung counterweight, the increase of counterweight is progressively increased according to 0.01N, until first twisting is unclamped; Get the counterweight weight of first twisting while unclamping and count M1, M1 deducts 0.01N and counts M2; Calculate the twisting resistance M3 of this wire gauge, the value that M2 deducts M3 is the bonding force of this specification ultra micro self-binding enamel wire.
Description
Technical field
The present invention relates to enamel-covered wire technical field of measurement and test, the bonding force that particularly relates to a kind of ultra micro self-binding enamel wire is surveyedMethod for testing.
Background technology
Fine self-binding enamel wire, refers to by adding at the skin of insulation paint film again and applies that one deck self-adhesion paint film formsThe diameter with self-adhesion is 0.10mm and with lower wire. In the general world, domestic authoritative standards system, as: GB/T4074.3-2008: National Standard of the People's Republic of China's winding wire test method, JISC3003-1999 Japanese Industrial StandardsEnamel-covered wire test method, MW1000:2008NEMA(national electrical manufacturers association) standard, diameter is 0.05mm and followingThe bonding force method of testing that fine tack enamelling cuprum round line specification lacks. Manufacturer often tests fine tack by rule of thumbThe bonding force of enamel-covered wire judges product quality. Along with developing rapidly of electronic information technology and new component, to product matterAmount requires higher. In enamel-covered wire industry, not yet there is a kind of scientific and effective method to test the bonding of fine self-binding enamel wirePower.
Summary of the invention
Based on this, for the problems referred to above, the present invention proposes a kind of bonding force method of testing of ultra micro self-binding enamel wire, canWith the bonding force of scientific and effective test ultra micro self-binding enamel wire, make self-binding enamel wire obtain good bond properties.
Technical scheme of the present invention is: a kind of bonding force method of testing of ultra micro self-binding enamel wire, comprises the following steps:A, the ultra micro self-binding enamel wire of getting the lopping of certain length nature are for subsequent use as sample wire; B, the doubling of sample thief line, by its twistingBecome the line pair of (125 ± 5) mm; C, by the line after twisting to be mounted on side by side the moon that thickness is 0.05mm according to the spacing of every 2mmOn utmost point Copper Foil; D, the line mounting is toasted after 30-60 minutes and taken out putting into baking oven that temperature is (120 ± 0.5) DEG C;E, by the line taking out in baking oven to being cooling under 15 DEG C-35 DEG C, the relative humidity environment that is 45%-75% in temperature; F, treat lineAfter cooling, the right one end that cuts off line does not become the part of twisting, and the right other end that opens line does not become the part of twisting, and it isThe two ends pin of 180 °, wherein one end pin is fixed, and other end pin is hung counterweight, and the increase of counterweight is progressively increased according to 0.01N, until firstTwisting is unclamped; G, get the counterweight weight of first twisting while unclamping and count M1, M1 deducts 0.01N and counts M2; H, calculate this line pairTwisting resistance M3, the value that M2 deducts M3 is the bonding force of this ultra micro self-binding enamel wire.
In a preferred embodiment, in step a, take from right lopping ultra micro self-binding enamel wire length be 3m.
In a preferred embodiment, in step b, by strander according to set load and twist number by sample wire twistingBecome the line pair of (125 ± 5) mm.
In a preferred embodiment, be applied to the load of ultra micro self-binding enamel wire and twist number and conductor nominal diameterPass is:
。
In a preferred embodiment, in steps d, the time of the right baking of the line that mounts is 30 minutes.
The invention has the beneficial effects as follows: bonding force that can scientific and effective test ultra micro self-binding enamel wire, makes tackEnamel-covered wire obtains good bond properties, has made up the technology of the bonding force of enamel-covered wire industry build-in test ultra micro self-binding enamel wireBlank.
Detailed description of the invention
Below embodiments of the invention are elaborated.
Embodiment:
A bonding force method of testing for ultra micro self-binding enamel wire, comprises the following steps:
Step 1, sampling: the ultra micro self-binding enamel wire of getting the long natural lopping of 3m is for subsequent use as sample wire, that gets is superMicro-self-binding enamel wire is necessary for the product that Interventions Requested are qualified.
Step 2, sample preparation: sample thief line 400mm doubling,, turned round according to load and the twist number set by stranderBe twisted into the line pair of (125 ± 5) mm. Be applied to the relation of load and twist number and the conductor nominal diameter of ultra micro self-binding enamel wireFor:
。
Step 3, mounts: by the line after twisting to be mounted on side by side the negative electrode that thickness is 0.05mm according to the spacing of every 2mmOn Copper Foil.
Step 4, baking: the line mounting is toasted to 30-60 points to putting into the baking oven that temperature is (120 ± 0.5) DEG CAfter clock, take out, baking time is preferably 30 minutes.
Step 5, cooling: by the line taking out in baking oven to being that 15 DEG C-35 DEG C, relative humidity are 45%-75% in temperatureCooling under environment.
Step 6, measures: until line, to after cooling, the right one end that cuts off line does not become the part of twisting, opens right another of lineHold into the part of twisting, make it be the two ends pin of 180 °, wherein one end pin is fixed, and other end pin is hung counterweight, the increase of counterweightProgressively increase according to 0.01N, until first twisting is unclamped.
Step 7, value: get the counterweight weight of first twisting while unclamping and count M1, M1 deducts 0.01N and counts M2.
Step 8, calculates bonding force: calculate the right twisting resistance M3 of this line, the value that M2 deducts M3 is this ultra micro tack paintThe bonding force of envelope curve.
The above embodiment has only expressed the specific embodiment of the present invention, and it describes comparatively concrete and detailed, but alsoCan not therefore be interpreted as the restriction to the scope of the claims of the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to guarantor of the present inventionProtect scope.
Claims (5)
1. a bonding force method of testing for ultra micro self-binding enamel wire, is characterized in that, comprises the following steps:
A, the ultra micro self-binding enamel wire of getting the lopping of certain length nature are for subsequent use as sample wire;
B, the doubling of sample thief line, twisted into the line pair of (125 ± 5) mm;
C, by the line after twisting to being mounted on side by side according to the spacing of every 2mm on the negative electrode Copper Foil that thickness is 0.05mm;
D, the line mounting is toasted after 30-60 minutes and taken out putting into baking oven that temperature is (120 ± 0.5) DEG C;
E, by the line taking out in baking oven to being cooling under 15 DEG C-35 DEG C, the relative humidity environment that is 45%-75% in temperature;
F, until line to after cooling, the right one end that cuts off line does not become the part of twisting, the right other end that opens line does not become the portion of twistingPoint, make it be the two ends pin of 180 °, wherein one end pin is fixed, and other end pin is hung counterweight, and the increase of counterweight is progressively increased according to 0.01N,Until first twisting is unclamped;
G, get the counterweight weight of first twisting while unclamping and count M1, M1 deducts 0.01N and counts M2;
H, calculate the right twisting resistance M3 of this line, the value that M2 deducts M3 is the bonding force of this ultra micro self-binding enamel wire.
2. the bonding force method of testing of ultra micro self-binding enamel wire according to claim 1, is characterized in that, in step a,Take from right lopping ultra micro self-binding enamel wire length be 3m.
3. the bonding force method of testing of ultra micro self-binding enamel wire according to claim 1, is characterized in that, in step b,According to the load of setting and twist number, sample wire is twisted into the line pair of (125 ± 5) mm by strander.
4. the bonding force method of testing of ultra micro self-binding enamel wire according to claim 3, is characterized in that, is applied to superThe pass of the load of micro-self-binding enamel wire and twist number and conductor nominal diameter is:
。
5. the bonding force method of testing of ultra micro self-binding enamel wire according to claim 3, is characterized in that, in steps d,The time of the right baking of the line that mounts is 30 minutes.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210372443.4A CN102866109B (en) | 2012-09-29 | 2012-09-29 | The bonding force method of testing of self-binding enamel wire |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210372443.4A CN102866109B (en) | 2012-09-29 | 2012-09-29 | The bonding force method of testing of self-binding enamel wire |
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| CN102866109A CN102866109A (en) | 2013-01-09 |
| CN102866109B true CN102866109B (en) | 2016-05-18 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105651687B (en) * | 2014-11-14 | 2019-06-28 | 中国航空工业第六一八研究所 | A kind of shaped framework coil cohesive force test fixture and method |
| CN105333985B (en) * | 2015-12-07 | 2018-07-03 | 珠海格力电工有限公司 | A kind of cutting force tester |
| CN107505262B (en) * | 2017-09-30 | 2024-01-12 | 中国工程物理研究院电子工程研究所 | Bonding force testing tool and method for skeleton-free self-adhesive enameled wire |
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| US2372093A (en) * | 1942-12-03 | 1945-03-20 | Westinghouse Electric & Mfg Co | Apparatus for testing enameled wire |
| CN101216393A (en) * | 2007-12-28 | 2008-07-09 | 保定天威集团有限公司 | Self-adhering transposed conductor integral high-temperature bending strength experimental method and apparatus |
| CN201289456Y (en) * | 2008-11-05 | 2009-08-12 | 无锡统力电工有限公司 | Test device for adhesive strength of multi-set enamelling lenticular wire |
| CN102323208A (en) * | 2011-08-25 | 2012-01-18 | 江苏宝杰隆电磁线有限公司 | Method for testing adhesion stress of self-adhesive enameled lenticular wire |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2372093A (en) * | 1942-12-03 | 1945-03-20 | Westinghouse Electric & Mfg Co | Apparatus for testing enameled wire |
| CN101216393A (en) * | 2007-12-28 | 2008-07-09 | 保定天威集团有限公司 | Self-adhering transposed conductor integral high-temperature bending strength experimental method and apparatus |
| CN201289456Y (en) * | 2008-11-05 | 2009-08-12 | 无锡统力电工有限公司 | Test device for adhesive strength of multi-set enamelling lenticular wire |
| CN102323208A (en) * | 2011-08-25 | 2012-01-18 | 江苏宝杰隆电磁线有限公司 | Method for testing adhesion stress of self-adhesive enameled lenticular wire |
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| 新型自粘漆包线粘结性能探讨;郭丽萍;《东方电气评论》;19930930;第7卷(第3期);全文 * |
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Effective date of registration: 20190527 Address after: 529200 Wenhua Development Zone B, Shuibu Town, Taishan City, Jiangmen City, Guangdong Province Patentee after: MATSUDA ELECTRIC (TAISHAN) Co.,Ltd. Address before: 519055 No. 62 Hanqing Road, Pingsha, Jinwan District, Zhuhai City, Guangdong Province Patentee before: Zhuhai Suntek Wire Co.,Ltd. |
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Address after: 529200 Wenhua Development Zone B, Shuibu Town, Taishan City, Jiangmen City, Guangdong Province Patentee after: Guangdong Songtian Technology Co.,Ltd. Address before: 529200 Wenhua Development Zone B, Shuibu Town, Taishan City, Jiangmen City, Guangdong Province Patentee before: MATSUDA ELECTRIC (TAISHAN) Co.,Ltd. |