CN102856686A - Electronic circuit module - Google Patents
Electronic circuit module Download PDFInfo
- Publication number
- CN102856686A CN102856686A CN2012100457037A CN201210045703A CN102856686A CN 102856686 A CN102856686 A CN 102856686A CN 2012100457037 A CN2012100457037 A CN 2012100457037A CN 201210045703 A CN201210045703 A CN 201210045703A CN 102856686 A CN102856686 A CN 102856686A
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- Prior art keywords
- circuit substrate
- hole
- radome
- installation sheet
- pass
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- Combinations Of Printed Boards (AREA)
- Details Of Aerials (AREA)
Abstract
The invention provides an electronic circuit module in a longitudinal installation type and capable of avoiding poor installation relatively to a mother board. A high-frequency circuit component (3) arranged on a circuit substrate (2) of the electronic circuit module (1) is covered by a shielding cover (7). An external connection terminal group (5) is inserted in an end part (2b) of a side of the circuit substrate (2). When elastic installation sheets (11, 12) of the shielding cover (7) penetrate through clamping holes (15, 16) of the circuit substrate, the elastic installation sheets (11, 12) contact with peripheral parts of the clamping holes (15, 16) elastically in opposite directions on the back side of the circuit substrate (2). Therefore, the shielding cover (7) is fixed in determined position of the circuit substrate temporarily. Besides, an installation leg (8) of the shielding cover penetrates through an installation hole (22) of the mother board (20) and is brazed.
Description
Technical field
The present invention relates to be equipped with at the circuit substrate that is equipped with high frequency circuit components the electronic circuit module of radome, relate in particular to respect to motherboard to erect the electronic circuit module that mount type vertically is set of attitude configuration.
Background technology
When the electronic circuit module that circuit substrate is equipped with radome is installed on the motherboard, mostly with circuit substrate, radome along the motherboard configured in parallel, so, need to enlarge erection space to electronic circuit module.Therefore, when can't when motherboard be guaranteed roomy installation region, existing and use with respect to motherboard to erect the electronic circuit module that mount type vertically is set of attitude configuration.
In the past, as such electronic circuit module that mount type vertically is set, known (for example have following structure, with reference to patent documentation 1): soldering is in earthing conductor section by the passing the hole of correspondence that will pass at a plurality of tongue pieces that radome forms circuit substrate, thereby can make described radome and circuit substrate integrated, and when mounted the installation leg of radome is passed in the installing hole of correspondence of motherboard and can with the soldering of earthing conductor pattern.In described electronic circuit module in the past, the through hole that passes the correspondence of motherboard owing to the external connection terminals group that derives from the end, one side of circuit substrate carries out soldering, and therefore the installation leg of described external connection terminals group and radome is installed on the motherboard with the fixing state of machinery.So under the environment that is applied in vibration or impacts as car is indoor, the electronic circuit module that erects on the motherboard can not rock or topple over.In addition, in above-mentioned existing electronic circuit module, therefore the earthing conductor section conducting of the tongue piece of radome and circuit substrate, and the when mounted installation leg of radome and the earthing conductor pattern conducting of motherboard utilize the radome that is made of metallic plate can strengthen grounding function.
[formerly technical literature]
[patent documentation]
[patent documentation 1] TOHKEMY 2007-19426 communique
Yet, in above-mentioned existing electronic circuit module, pass by the tongue piece on a plurality of positions that are formed on radome circuit substrate correspondence pass the hole, thereby can roughly limit cover to the installation site of circuit substrate.Yet, to pass the hole and set for slightly larger than tongue piece owing to consider the workability of insertion, therefore passing before soldering produces between hole and the tongue piece and becomes flexible, thereby causes the possibility that in the situation that produces a little position skew radome is soldered on the circuit substrate large.Namely, in above-mentioned conventional example, radome departs from easy generation the in the installation site of circuit substrate, exist the installation leg of external connection terminals group and radome not set the possibility of the relative position relation of expectation for, be difficult to described external connection terminals and installation leg are passed respectively through hole and the installing hole of motherboard, thereby the installation that may cause electronic circuit module is bad.
Summary of the invention
The present invention makes in view of the actual conditions of above-mentioned such prior art, and its purpose is to provide a kind of electronic circuit module that mount type vertically be set bad to the installation of motherboard of avoiding easily.
In order to realize above-mentioned purpose, the invention provides a kind of electronic circuit module, it possesses: be equipped with high frequency circuit components and have a plurality of circuit substrates that pass the hole, the external connection terminals group that derives from the end, one side of this circuit substrate, be installed on the described circuit substrate and cover the radome of the sheet-metal of described high frequency circuit components, in described external connection terminals group, be provided with: the first terminal section that inserts the end, one side that is connected in described circuit substrate, second portion of terminal of passing the through hole of motherboard to the direction extension that is approximately perpendicular to this first terminal section, and, be provided with in that described radome is outstanding: the described a plurality of installation sheets that pass the hole that pass described circuit substrate, pass the installation leg of the installing hole of described motherboard with the extension of described the second portion of terminal almost parallel ground, described electronic circuit module is the electronic circuit module that mount type vertically is set that disposes with the attitude that erects with respect to described motherboard, described electronic circuit module is characterised in that, a plurality of described installation sheets comprise: pass near the first the first elasticity installation sheet that passes the hole the end, one side that is formed on described circuit substrate, pass be formed on described circuit substrate pass the second elasticity installation sheet in hole with second of opposed another side end, end, one side, make described the first elasticity installation sheet and the second elasticity installation sheet in the rear side of described circuit substrate and each self-corresponding described edge part Elastic Contact of passing the hole, by the side in described the first elasticity installation sheet and described the second elasticity installation sheet to described circuit substrate to distolateral elastic force-applying on one side and by the opposing party in described the first elasticity installation sheet and described the second elasticity installation sheet to described circuit substrate to the distolateral elastic force-applying of another side, thereby described radome is temporarily fixed on the described circuit substrate.
For the electronic circuit module of such formation, when being installed in radome on the circuit substrate, if the first elasticity installation sheet and the second elasticity installation sheet pass respectively first and pass hole and second and pass the hole, then described the first elasticity installation sheet and the second elasticity installation sheet towards each other away from direction or the corresponding edge part Elastic Contact of passing the hole of approximating direction and circuit substrate, thereby radome becomes the state on the assigned position that is temporarily fixed at circuit substrate.Thus, radome easily can be installed on the circuit substrate with the high position precision, thereby the relative position relation of the installation leg of external connection terminals group and radome is stablized.Consequently, when installing to motherboard, with described external connection terminals with install that leg passes respectively the through hole of motherboard and installing hole and operation that electronic circuit module is erected can be carried out all the time without barrier.
On the basis of said structure, preferably, possesses the connector members that keeps the mode of described external connection terminals group to consist of with the holder by insulating properties, and be provided with the terminal hole that the described the first terminal of confession section is passed in the end, one side of described circuit substrate, and, at the outstanding pressing tablet that is provided with end, one side crimping that makes described holder and described circuit substrate of described radome, thus, can easily the external connection terminals assembly be located on the assigned position of circuit substrate.Namely, make with each the first terminal section of the integrated external connection terminals group of holder and easily pass corresponding terminal hole, if directly make pressing tablet and holder Elastic Contact under passing the state of terminal hole in the first terminal section like this and prevent the perk of connector members, then can limit the external connection terminals group to the installation site of circuit substrate with high accuracy.
On the basis of said structure, preferably, by a plurality of described installation sheet except described the first elasticity installation sheet and the second elasticity installation sheet being passed respectively the corresponding described hole of passing, thereby limit the installation site of (face) direction in the face of described circuit substrate of described radome, and, sidewall by making described radome and the parts mount surface butt of described circuit substrate, thereby limit the installation site along the thickness of slab direction of described circuit substrate of described radome, thus, can radome easily be temporarily fixed at high positional precision the assigned position of circuit substrate.
[invention effect]
For the electronic circuit module that mount type vertically is set of the present invention, when being installed to radome on the circuit substrate, the first elasticity installation sheet by making radome and the second elasticity installation sheet pass respectively first of circuit substrate and pass hole and second and pass the hole, thereby radome can be temporarily fixed on the assigned position of circuit substrate, therefore this radome easily can be installed on the circuit substrate with the high position precision, and the relative position relation of the installation leg of external connection terminals group and radome is stablized.Thus, when installing to motherboard, with described external connection terminals with install that leg passes respectively the through hole of motherboard and installing hole and operation that electronic circuit module is erected can be carried out all the time without barrier.Therefore, according to the present invention, can access installation property and well and easily avoid installing the bad electronic circuit module that mount type vertically is set.
Description of drawings
Fig. 1 is the exploded perspective view of the related electronic circuit module of embodiments of the present invention example.
Fig. 2 is the front view of this electronic circuit module of observing from the radome side.
Fig. 3 is the rearview of this electronic circuit module.
Fig. 4 is the cutaway view along the A-A line of Fig. 2.
Fig. 5 is the B section enlarged drawing of Fig. 2.
Fig. 6 is the cutaway view along the D-D line of Fig. 5.
Fig. 7 is the C section enlarged drawing of Fig. 2.
Fig. 8 is the cutaway view along the E-E line of Fig. 7.
[symbol description]
1 electronic circuit module
2 circuit substrates
The 2a parts mount surface
2b is the end on one side
2c another side end
3 high frequency circuit components
4 connector members
5 external connection terminals
5a the first terminal section
5b the second portion of terminal
6 holders
7 radomes
The 7a sidewall
8 install leg
9 pressing tablets
10 connection sheets (installation sheet)
11 first elasticity installation sheets (installation sheet)
12 second elasticity installation sheets (installation sheet)
13 terminal holes
14 through holes (passing the hole)
15 stop holes (first passes the hole)
16 stop holes (second passes the hole)
20 motherboards
21 through holes
22 installing holes
Embodiment
Below, with reference to accompanying drawing the embodiments of the present invention example is described.As shown in Figure 1, the related electronic circuit module 1 of present embodiment example is for vertically arranging the mount type module with respect to motherboard 20 with the attitude configuration that erects.
Such as Fig. 1～shown in Figure 4, this electronic circuit module 1 mainly comprises: be equipped with that the circuit substrate 2 of high frequency circuit components 3 (with reference to Fig. 2), the holder 6 of utilizing insulating properties keep external connection terminals groups 5 and the connector members 4 that consists of, be installed in the radome 7 that is made of metallic plate on the circuit substrate 2 in the mode that covers high frequency circuit components 3 at parts mount surface 2a.Connector members 4 is installed in end, one side 2b (being the bottom among Fig. 2～Fig. 4) of circuit substrate 2, and many external connection terminals groups 5 arrangement mode according to the rules that is bent into L word shape is fixed on the holder 6.In addition, be provided with at radome 7: a plurality of installation legs 8 that hang down from the Width two ends, be used for a pair of pressing tablet 9 of holder 6 Elastic Contact of connector members 4, in order to be installed on the circuit substrate 2 and from the outstanding a plurality of installation sheets (connection sheet 10 and elasticity installation sheet 11,12) of sidewall 7a.Need to prove that Fig. 4 is along the cutaway view of the A-A line of Fig. 2, has omitted high frequency circuit components 3 etc. in this Fig. 4, Fig. 1.
Be provided with the terminal hole 13 that connects external connection terminals group 5 for inserting at the end, one side of circuit substrate 2 2b with becoming the row shape.Be formed with the conductive part same with through hole at described terminal hole 13, this conductive part is connected with the not shown Wiring pattern of the electric circuit that comprises high frequency circuit components 3.In addition, on circuit substrate 2, be provided with a plurality of holes (through hole 14 and stop hole 15,16) of passing in the mode of surrounding high frequency circuit components 3.
Through hole 14 disperses to be formed with a plurality of near the peripheral part of circuit substrate 2 or its.Pass the connection sheet 10 of the correspondence of radome 7 in each through hole 14, both are 14,10 by soldering.Need to prove that described through hole 14 is connected with the not shown earthing conductor pattern that earthing member as described electric circuit plays a role.
Stop hole 15 forms slotted hole near the 2b of the end, one side of circuit substrate 2, its long axis direction is consistent with end, one side 2b of circuit substrate 2.As shown in Figure 6, in this stop hole 15, pass the first elasticity installation sheet 11 of radome 7, in the rear side of circuit substrate 2, the diagram lower edge Elastic Contact of the edge part of the infolding of the first elasticity installation sheet 11 (paddy folding, valley fold) leading section 11a and stop hole 15 and locking.Need to prove that Fig. 6 is the cutaway view along the D-D line of Fig. 5, Fig. 5 is the B section enlarged drawing of Fig. 2.
On the other hand, in the external connection terminals group 5 of connector members 4, be provided with: insert many 5a of the first terminal section being connected in terminal hole 13, extend and pass many second portion of terminal 5b of the through hole 21 of motherboard 20 to the direction that becomes approximate right angle with respect to the 5a of the first terminal section at the end, one side of circuit substrate 2 2b.The 5a of the first terminal section is passing the conductive part of corresponding terminal hole 13 rear solderings at this terminal hole 13.In addition, keep the holder of growing crosswise 6 of external connection terminals group 5 pass at each 5a of the first terminal section under the state of corresponding terminal hole 13 pressing tablet 9 elastic force-applyings of radome 7 and with end, one side 2b crimping of circuit substrate 2.Need to prove that the second portion of terminal 5b of external connection terminals group 5 is electrically connected with the external circuit of motherboard 20 sides with corresponding through hole 21 solderings.
The hole (through hole 14 and stop hole 15,16) of passing of the correspondence of radome 7 by a plurality of installation sheets (connection sheet 10 and elasticity installation sheet 11,12) being passed circuit substrate 2 is temporarily fixed on the assigned position of this circuit substrate 2.Namely, when being installed in radome 7 on the circuit substrate 2, if the first elasticity installation sheet 11 and the second elasticity installation sheet 12 are passed respectively stop hole 15 and stop hole 16, then as shown in Figure 3, described the first elasticity installation sheet and the second elasticity installation sheet 11,12 towards each other away from direction and circuit substrate 2 ( corresponding stop hole 15,16 edge part) Elastic Contact, so radome 7 becomes the state that is temporarily fixed on the circuit substrate 2.
When described radome 7 is installed, if the first elasticity installation sheet and the second elasticity installation sheet 11,12 are inserted corresponding stop hole 15,16, the a plurality of connection sheets 10 that then are dispersed in the peripheral part of radome 7 also side by side insert corresponding through hole 14, therefore can under the state of described a plurality of connection sheets 10 location radome 7 be temporarily fixed on the circuit substrate 2.Therefore, when each installation sheet 10～12 passes correspondingly when passing hole 14～16, radome 7 is temporarily fixed with the limited state in installation site of direction in the face of circuit substrate 2.
In addition, if when described radome 7 is installed, make the parts mount surface 2a butt of sidewall 7a and circuit substrate 2, then such as Fig. 6 and shown in Figure 8, therefore the first elasticity installation sheet and the second elasticity installation sheet 11,12 leading section 11a, 12a and the rear side Elastic Contact of circuit substrate 2 produce the power that sidewall 7a is pressed to parts mount surface 2a.Consequently, as shown in Figure 4, become limiting wall by the sidewall 7a that makes radome 7, radome 7 is temporarily fixed with the limited state in installation site along the thickness of slab direction of circuit substrate 2.
When being installed in radome 7 on the circuit substrate 2, make the 5a of the first terminal section of the external connection terminals group 5 of connector members 4 pass corresponding terminal hole 13 at the end, one side of circuit substrate 2 2b in advance.Then, such as Fig. 2 and shown in Figure 4, under the temporary fixed state that radome 7 is installed on the circuit substrate 2, make holder 6 Elastic Contact of a pair of pressing tablet 9 and connector members 4.Thus, holder 6 is forced to do one's bidding with the sheet 9 that is pressed of the state with end, one side 2b crimping of circuit substrate 2, therefore can prevent that the 5a of the first terminal section from causing the perk of connector members 4 to the insertion quantity not sufficient of terminal hole 13.That is, embed on the circuit substrate 2 that connector members 4 is arranged and it is temporary fixed if as described above radome 7 is assembled at end, one side 2b, then can prevent by the pressing tablet 9 of radome 7 perk of connector members 4.And, then, with each connection sheet 10 and corresponding through hole 14 solderings, and with the 5a of the first terminal section of the external connection terminals group 5 conductive part soldering with corresponding terminal hole 13, radome 7 and connector members 4 are fixed on respectively the assigned position of circuit substrate 2 with higher positional precision thus.
In addition, be formed with the stage portion 7b continuous with the cardinal extremity that leg 8 is installed at radome 7.Therefore, when each being installed leg 8 and inserts corresponding installing hole 22, the surperficial butt of stage portion 7b and motherboard 20 and limit the insertion amount that leg 8 respectively is installed, and prevent the inclination of radome 7 by stage portion 7b.
More than explanation like that, for the routine related electronic circuit module that mount type vertically is set 1 of present embodiment, when being installed in radome 7 on the circuit substrate 2, stop hole 15 and stop hole 16 that the first elasticity installation sheet 11 by making radome 7 and the second elasticity installation sheet 12 pass respectively circuit substrate 2, thus this radome 7 can be temporarily fixed at the assigned position of circuit substrate 2.Therefore, radome 7 easily can be installed on the circuit substrate 2 with higher positional precision, and can form the relative position relation stable structure of the installation leg 8 of external connection terminals group 5 and radome 7.Thus, when installing to motherboard 20, the operation that the through hole 21 that makes described external connection terminals group 5 and installation leg 8 pass respectively motherboard 20 erects electronic circuit module 1 with installing hole 22 can be carried out all the time without barrier.That is, this electronic circuit module 1 can avoid reliably because of the installation site of 7 pairs of circuit substrates 2 of radome to depart from the installation that causes bad.Need to prove, in this electronic circuit module 1, because the installation leg 8 of external connection terminals group 5 and radome 7 is installed on the motherboard 20 with the fixing state of machinery, therefore even under the indoor environment that is applied in like that vibration and impacts of car, the electronic circuit module 1 that erects at motherboard 20 is rocked or topple over.
In addition, in this electronic circuit module 1, if radome 7 is installed on the circuit substrate 2, then thereby pressing tablet 9 can prevent connector members 4 with respect to the perk (5a of the first terminal section is with respect to the insertion quantity not sufficient of terminal hole 13) of circuit substrate 2 with holder 6 Elastic Contact, therefore can easily external connection terminals group 5 be provided on the assigned position of circuit substrate 2.Namely, make easily with each 5a of the first terminal section of holder 6 integrated external connection terminals groups 5 and insert in the corresponding terminal hole 13, so, if directly make pressing tablet 9 prevent the perk of connector members 4 with holder 6 Elastic Contact, then can limit accurately external connection terminals group 5 with respect to the installation site of circuit substrate 2 keeping the first terminal 5a of section to pass under the state of terminal hole 13.
In addition, in this electronic circuit module 1, when being installed in radome 7 on the circuit substrate 2, by a plurality of connection sheets 10 being inserted respectively in the corresponding through hole 14, thereby can limit the installation site of direction in the face of circuit substrate 2 of radome 7, and the sidewall 7a by making radome 7 and the parts mount surface 2a butt of circuit substrate 2, thereby can limit the installation site along the thickness of slab direction of circuit substrate 2 of radome 7.Therefore, radome 7 easily can be installed on the assigned position of circuit substrate 2 with high positional precision.
Need to prove, in above-mentioned execution mode example, thereby although be the first elasticity installation sheet 11 by making radome 7 and the second elasticity installation sheet 12 stop hole 15 that passes respectively circuit substrate 2 and stop hole 16 first elasticity installation sheets and the second elasticity installation sheet 11,12 towards each other away from direction and circuit substrate 2 Elastic Contact and temporary fixed radome 7, but, in the situation that constitutes direction that the first elasticity installation sheet and the second elasticity installation sheet 11,12 approach towards each other and circuit substrate 2 Elastic Contact, also can make radome 7 become temporary fixed state.
Claims (3)
1. electronic circuit module, possess: be equipped with high frequency circuit components and have a plurality of circuit substrates that pass the hole, the external connection terminals group that derives from the end, one side of this circuit substrate, be installed on the described circuit substrate and cover the radome of the sheet-metal of described high frequency circuit components, in described external connection terminals group, be provided with: the first terminal section that inserts the end, one side that is connected in described circuit substrate, second portion of terminal of passing the through hole of motherboard to the direction extension that is approximately perpendicular to this first terminal section, and, be provided with in that described radome is outstanding: the described a plurality of installation sheets that pass the hole that pass described circuit substrate, pass the installation leg of the installing hole of described motherboard with the extension of described the second portion of terminal almost parallel ground, described electronic circuit module is the electronic circuit module that mount type vertically is set that disposes with the attitude that erects with respect to described motherboard, described electronic circuit module is characterised in that
A plurality of described installation sheets comprise: pass near the first the first elasticity installation sheet that passes the hole the end, one side that is formed on described circuit substrate, pass be formed on described circuit substrate pass the second elasticity installation sheet in hole with second of opposed another side end, end, one side, described the first elasticity installation sheet and the second elasticity installation sheet are in rear side and each self-corresponding described edge part Elastic Contact of passing the hole of described circuit substrate, by the side in described the first elasticity installation sheet and described the second elasticity installation sheet to described circuit substrate to distolateral elastic force-applying on one side and by the opposing party in described the first elasticity installation sheet and described the second elasticity installation sheet to described circuit substrate to the distolateral elastic force-applying of another side, thereby described radome is temporarily fixed on the described circuit substrate.
2. electronic circuit module according to claim 1 is characterized in that,
Possesses the connector members that keeps the mode of described external connection terminals group to consist of with the holder by insulating properties, and be provided with the terminal hole that the described the first terminal of confession section is passed in the end, one side of described circuit substrate, and, at the outstanding pressing tablet that is provided with end, one side crimping that makes described holder and described circuit substrate of described radome.
3. electronic circuit module according to claim 1 and 2 is characterized in that,
By a plurality of described installation sheet except described the first elasticity installation sheet and the second elasticity installation sheet being passed respectively the corresponding described hole of passing, thereby limit the installation site along the face direction of described circuit substrate of described radome, and, sidewall by making described radome and the parts mount surface butt of described circuit substrate, thus the installation site along the thickness of slab direction of described circuit substrate of described radome limited.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011146366A JP5663419B2 (en) | 2011-06-30 | 2011-06-30 | Electronic circuit module |
| JP2011-146366 | 2011-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102856686A true CN102856686A (en) | 2013-01-02 |
Family
ID=47403027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100457037A Pending CN102856686A (en) | 2011-06-30 | 2012-02-24 | Electronic circuit module |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5663419B2 (en) |
| CN (1) | CN102856686A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102257211B1 (en) | 2020-04-14 | 2021-05-26 | 가부시키가이샤 메이유우 | Interdental brush |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1842258A (en) * | 2005-03-30 | 2006-10-04 | 阿尔卑斯电气株式会社 | Electronic circuit unit |
| JP2007019426A (en) * | 2005-07-11 | 2007-01-25 | Maspro Denkoh Corp | Electronic apparatus |
| US20080115967A1 (en) * | 2006-11-22 | 2008-05-22 | Giboney Kirk S | Shield For A Microwave Circuit Module |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3000A (en) * | 1843-03-10 | Improvement in sugar-boilers | ||
| JPS6291499U (en) * | 1985-11-28 | 1987-06-11 | ||
| JPH0197588U (en) * | 1987-12-22 | 1989-06-29 | ||
| JPH0638479Y2 (en) * | 1989-05-01 | 1994-10-05 | 富士通テン株式会社 | Shield case for electronic components |
| JPH0529784A (en) * | 1991-07-22 | 1993-02-05 | Murata Mfg Co Ltd | Pack type high frequency device |
| JPH08293687A (en) * | 1995-04-24 | 1996-11-05 | Sony Corp | Method of manufacturing shielded electric product with connector for external connection and the product |
| JPH11163573A (en) * | 1997-11-26 | 1999-06-18 | Sony Corp | Circuit device |
| JP3901501B2 (en) * | 2001-12-12 | 2007-04-04 | アルプス電気株式会社 | Electronic circuit unit mounting structure |
| JP2003078278A (en) * | 2002-08-27 | 2003-03-14 | Murata Mfg Co Ltd | Electronic component with shield case |
-
2011
- 2011-06-30 JP JP2011146366A patent/JP5663419B2/en active Active
-
2012
- 2012-02-24 CN CN2012100457037A patent/CN102856686A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1842258A (en) * | 2005-03-30 | 2006-10-04 | 阿尔卑斯电气株式会社 | Electronic circuit unit |
| JP2007019426A (en) * | 2005-07-11 | 2007-01-25 | Maspro Denkoh Corp | Electronic apparatus |
| US20080115967A1 (en) * | 2006-11-22 | 2008-05-22 | Giboney Kirk S | Shield For A Microwave Circuit Module |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013016544A (en) | 2013-01-24 |
| JP5663419B2 (en) | 2015-02-04 |
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Application publication date: 20130102 |