CN102834899A - Laser processing apparatus - Google Patents
Laser processing apparatus Download PDFInfo
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- CN102834899A CN102834899A CN2011800182470A CN201180018247A CN102834899A CN 102834899 A CN102834899 A CN 102834899A CN 2011800182470 A CN2011800182470 A CN 2011800182470A CN 201180018247 A CN201180018247 A CN 201180018247A CN 102834899 A CN102834899 A CN 102834899A
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- 238000012545 processing Methods 0.000 title abstract description 37
- 238000005192 partition Methods 0.000 claims abstract description 190
- 238000011068 loading method Methods 0.000 claims abstract description 109
- 230000003287 optical effect Effects 0.000 claims abstract description 16
- 230000005855 radiation Effects 0.000 claims description 120
- 238000000034 method Methods 0.000 claims description 94
- 230000008569 process Effects 0.000 claims description 89
- 238000012856 packing Methods 0.000 claims description 83
- 238000003754 machining Methods 0.000 claims description 44
- 238000012546 transfer Methods 0.000 claims description 24
- 238000011282 treatment Methods 0.000 claims description 15
- 230000001678 irradiating effect Effects 0.000 claims description 9
- 230000001105 regulatory effect Effects 0.000 claims description 8
- 238000000638 solvent extraction Methods 0.000 abstract 2
- 239000007789 gas Substances 0.000 description 34
- 230000000694 effects Effects 0.000 description 18
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 16
- 238000005224 laser annealing Methods 0.000 description 12
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 230000008676 import Effects 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000012797 qualification Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 241000278713 Theora Species 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013532 laser treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
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- Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Recrystallisation Techniques (AREA)
- Laser Beam Processing (AREA)
Abstract
Disclosed is a laser processing apparatus wherein a subject to be processed can be quickly carried in/out without disposing a load lock chamber or the like in the laser processing apparatus, and, furthermore, the atmosphere in the processing chamber can be stabilized in a short time. The laser processing apparatus is provided with: the processing chamber (2), which contains the subject to be processed (100), and which radiates laser light to the subject (100) under adjusted atmosphere; and an optical system, which guides the laser light into the processing chamber (2) from the outside. The processing chamber (2) has an openable/closable loading entrance (7), through which the subject (100) is loaded in the processing chamber (2) from the outside of the processing chamber (2), and in the processing chamber (2), a load area (A) continuous from the loading entrance (7), and a laser light irradiation area (B) continuous from the load area (A) are provided. The processing chamber also has a partitioning section that partitions the load area (A) into a space (A1) on the loading entrance side, and a space (A2) on the laser light irradiation area side. The partitioning section permits the subject (100) to move between the space (A1) on the loading entrance side, and the space (A2) on the laser light irradiation area side.
Description
Technical field
The present invention relates to the handled object irradiating laser is carried out the laser machining device of processing such as laser annealing.
Background technology
In the semiconductive thin film of the substrate that is used for flat-panel monitor etc., known have a situation of using amorphous film, in addition, uses the situation of crystal film in addition.Proposition has a kind ofly anneals to amorphous film so that its crystallization is made the method for this crystal film through laser.In addition, handle as laser annealing, also known have pair crystalloid film irradiating laser to remove defective and improve crystallinity etc. and handle to be modified as purpose.
In above-mentioned laser annealing etc. is handled, adopt and remove atmospheric effect, be controlled to the method for the atmosphere of the most suitable crystallization etc.For this atmosphere, except inert gases such as nitrogen, vacuum etc., also known have a spot of oxygen etc. is carried out method of mixing with these atmosphere on one's own initiative.In order to regulate above-mentioned atmosphere, handled object is accommodated in the process chamber, regulate the atmosphere in this receiving room, shine handled object from the outside laser that imports of process chamber then.But, with handled object when the process chamber outside is packed inner treatment chamber into, because of loading port of opening process chamber etc. is sneaked in the process chamber atmosphere.Therefore, the atmosphere that need carry out in the process chamber is regulated (low oxygen concentration etc.), but existence need make stable time of atmosphere, the low such problem of production efficiency.Therefore, propose to have outside process chamber, to be provided for moving into, taking out of the scheme (for example, with reference to patent documentation 1) of semiconductor in addition with the laser machining device of the load-lock chambers (load lock chamber) of substrate.
According to Figure 13 this device is described.
In process chamber 45, dispose the platform 46 that is used to pack into and puts handled object 100, on the top board of process chamber 45, be provided with the importing window 47 that imports laser from the outside.Transfer robot chamber 43 is connected with process chamber 45 via gate valve 44, and load-lock chambers 41 is connected with transfer robot chamber 43 via gate valve 42.Be useful in the exterior arrangement of load-lock chambers 41 handled object 100 is transported to the transfer robot 40 in the load-lock chambers 41.
Above-mentioned load-lock chambers 41, transfer robot chamber 43, process chamber 45 are communicated with via gate valve 42,44 under the gas atmosphere of vacuum or regulation.
In service at said apparatus; When moving into substrate, under the state of closing gate valve 42,44, open the gate valve (not shown) of load-lock chambers 41; Utilize transfer robot 40 that handled object 100 is moved in the load-lock chambers 41, close the gate valve of load-lock chambers 41 then.Under gate valve 42,44 closing state, load-lock chambers 41 is vacuumized, then, keep vacuum or import the gas of stipulating.Next, open gate valve 42, handled object 100 is transported in the transfer robot chamber 43 from load-lock chambers 41, further, open gate valve 44, handled object 100 is encased in the process chamber 45, close load-lock chambers 44, to carry out processing such as laser annealing.Thus, can under the situation of the atmosphere of keeping process chamber 45, carry out desirable processing.
The prior art document
Patent documentation
Patent documentation 1: Japanese Patent Laid is opened the 2002-164407 communique
Summary of the invention
Invent problem to be solved
Such as stated being provided with in the processing unit of load-lock chambers; Process chamber is maintained the atmosphere (for example blanket of nitrogen of low oxygen concentration etc.) of regulation; Handled object is taken out of, when moving into; As long as load-lock chambers is carried out the atmosphere displacement, therefore, needn't carry out the atmosphere adjusting to process chamber and just can handle.
But, in this processing unit, cost is risen because of being provided with transfer robot chamber and load-lock chambers, and, also need guarantee the space that is provided with beyond the process chamber significantly.In addition, also there is following problem: promptly, need be used for taking out of at every turn, when moving into handled object the atmosphere in the load-lock chambers is replaced into the time and the operating cost of nitrogen or inert gas etc., and also increase the time that is used to carry handled object.
The present invention implements in order to solve aforesaid technical problem in the past, and its purpose is to provide a kind of and load-lock chambers needn't be set and can makes the stable laser machining device of atmosphere in the processing unit at short notice.
The technical scheme that the technical solution problem is adopted
That is, in the laser machining device of the present invention, the 1st the invention is characterized in, comprising: process chamber, and this process chamber is taken in handled object, and is carrying out under the atmosphere of regulating this handled object irradiating laser; And optical system, this optical system with laser in this process chamber of external orientation,
Said process chamber has and is used for the said handled object loading port said inner treatment chamber, that can open and close of packing into from said process chamber outside; And said inner treatment chamber comprise the loading zone that links to each other with said loading port, and and the laser radiation that links to each other of this loadings zone regional
Has separating part in said loading zone; The space of space that this partitioned portion is separated out the said oral-lateral of packing into that links to each other with said loading port and the laser radiation zone side that comprises said laser radiation zone, this separating part can make said handled object mobile between the space of the space of the said oral-lateral of packing into and said laser radiation zone side.
According to the present invention; In process chamber, has the zone of loading and laser radiation zone; The separating part that has through loading in the zone; The space of space that is separated out the said oral-lateral of packing into that links to each other with said loading port and the laser radiation zone side that comprises said laser radiation zone, thus handled object is being moved in the process chamber or when process chamber is taken out of, reduced the atmosphere of sneaking into from loading port influence as much as possible the laser radiation zone.
Preferably will load the zone with the mode that links to each other with loading port and loading port in abutting connection with setting, loading is regional between loading port and laser radiation zone.Loading the zone and be the zone that makes the handled object of packing into from loading port move and be maintained, is the space that comprises the holding position that handled object is kept for processing.Handled object is loaded into the holding position that loads the zone, moves to the laser radiation zone so that it is carried out predetermined process from this loading zone.
Separating part can make handled object move to the laser radiation zone from loading the zone.At separating part the opening portion is set in advance, passes this opening portion and move so that be processed physical efficiency.
Through the opening portion that handled object is moved being set in advance, handled object is moved smoothly to the laser radiation zone from loading the zone at separating part.As the opening portion, both can be open all the time opening portion, also can be the opening portion of following on-off action.In addition, also can become open state along with moving of handled object as gas curtain.
In addition; The processing that handled object is carried out; As preferred exemplary, for example can enumerate the laser annealing that makes non-crystal handled object crystallization or make the handled object modification of crystal, but as the present invention; Processed content is not limited to this, as long as laser radiation is carried out predetermined process to handled object.
In addition; As handled object, the semiconductor (for example Si semiconductor) that can will become the object of above-mentioned laser annealing processing illustrates as typical handled object, but as the present invention; Its classification does not have special qualification, as long as confirm object according to the purpose of handling.
In addition, above-mentioned processing is under the atmosphere of having carried out adjusting, in process chamber, to carry out.This atmosphere is got rid of air atmosphere, typically can enumerate inert gas atmosphere, vacuum atmosphere etc.In addition, also can be the atmosphere of having regulated humidity, temperature etc.That is,, the classification of the atmosphere of regulating there is not special qualification, so long as atmosphere beyond under atmosphere, that be adjusted to rated condition gets final product as the present invention.
Next, the 2nd laser machining device of the present invention is characterised in that, in said the 1st the present invention, said separating part has the partition wall in the space of the space that is separated out the said oral-lateral of packing into and said laser radiation zone side.
The 3rd laser machining device of the present invention is characterised in that, in said the 1st the present invention, said separating part has the atmosphere gas curtain in the space of the space that is separated out the said oral-lateral of packing into and said laser radiation zone side.
As separating part, can use the space that is separated out the said oral-lateral of packing into and said laser radiation zone side the space partition wall or use the gas curtain etc. of atmosphere gas.Partition wall, gas curtain can spread all over whole separating part, in addition, also can use partition wall or gas curtain to constitute the part of separating part, also can partition wall be used with gas curtain.
The 4th laser machining device of the present invention is characterised in that, in said the 1st～the 3rd the present invention, said partitioned portion be separated out as the said oral-lateral space of packing into said load the zone, and as the said laser radiation zone in side space, said laser radiation zone.
The 5th laser machining device of the present invention is characterised in that; In said the 1st～the 3rd the present invention, said partitioned portion is separated out and is in said pack into the oral-lateral space and comprise the said side space, said laser radiation zone that loads the part in zone of said in the zone that loads.
The 6th laser machining device of the present invention is characterised in that; The said the 1st～the 3rd of the present invention in each, said separating part can be separated out and be in said pack into the oral-lateral space and comprising being encased in the side space, said laser radiation zone in the side space, holding position that the said handled object that loads the zone keeps of said in the zone that loads.
The position that separating part is separated can be the optional position that loads the zone, in the position, forefront, is separated out loading zone that becomes the oral-lateral space of packing into and the laser radiation zone that becomes side space, laser radiation zone.Thus, load the zone and can carry out the atmosphere adjusting as loading the interlocking zone.
In addition, can the position that separating part is separated be located at and load in the zone,, can enumerate the space that is separated out the oral-lateral of packing into and as the position in the space of the holding position side in the regional side of laser radiation space as an one of which mode.Usually, in the platform upper surface, keep the position of handled object to become the holding position.Therefore, as this spaced-apart locations, typical example is in loading the zone, to be separated out space that comprises platform and the spaced-apart locations that does not comprise the space of platform.
The 7th laser machining device of the present invention is characterised in that, the said the 1st～the 6th of the present invention in each, can be connected with in the said oral-lateral space of packing into with ventilating pack into the oral-lateral feeder with pack the oral-lateral exhaust apparatus into.
The oral-lateral space can connect the confession exhaust apparatus packing into.Thus, can easily regulate atmosphere in the oral-lateral space of packing into.Packing the oral-lateral feeder into can be with importings such as nitrogen, the inert gas oral-lateral space of packing into, and the oral-lateral exhaust apparatus of packing into can carry out exhaust or vacuumizes etc. the oral-lateral space of packing into.
Under following these situation, that is, 1) handled object is moved into, when taking out of process chamber, 2) in processing procedure, and 3) when handled object is carried in process chamber, can utilize above-mentioned confession exhaust apparatus to regulate the atmosphere in the oral-lateral space of packing into.
Through guarantee to pack into oral-lateral space and gas supply-discharge system is set in inner treatment chamber, can obtain following effect.That is, 1. suppress the atm number of sneaking into, and can reduce sneaking into of the space of atmosphere outside the oral-lateral space of packing into of inner treatment chamber from the loading port outside through the oral-lateral space of packing into being carried out shielding construction that air feed obtains.2. through supplying exhaust, can at short notice the air atmosphere of sneaking into the oral-lateral space of packing into be replaced as the difficult atmosphere that influences laser treatment beyond nitrogen or other atmosphere.
Thus, sneak into influence, can make the atmosphere of irradiating part stable at short notice laser irradiating part atmosphere through reducing atmosphere.
The 8th laser machining device of the present invention is characterised in that, the said the 1st～the 7th of the present invention in each, can be connected with irradiation area feeder and irradiation area exhaust apparatus in said laser radiation zone with ventilating.
Can connect the confession exhaust apparatus in the laser radiation zone.Thus, can as much as possible that laser radiation is regional atmosphere maintain constant.Can with the oral-lateral spatial of packing into that loads the zone confession exhaust apparatus be set in the laser radiation zone yet.
The 9th laser machining device of the present invention is characterised in that, the said the 1st～the 8th of the present invention in each, said inner treatment chamber comprises makes said handled object load mobile workpiece transfer device between zone and the said laser radiation zone said.
Can utilize the included workpiece transfer device of inner treatment chamber will be encased in loading zone handled object afterwards and move to the laser radiation zone.In addition, as required, also can handled object be moved to from the laser radiation zone and load the zone.Thus, needn't be as existing apparatus be used for handled object is moved to from load-lock chambers the transfer robot chamber of process chamber in the process chamber outer setting.
The 10th laser machining device of the present invention is characterised in that in said the 9th the present invention, said workpiece transfer device has the platform that keeps said handled object and this handled object is moved between said loading zone and said laser radiation zone.
Through in said handled object mobile device, comprising the platform that is used to keep handled object, can remain at the handled object in the loading zone of will packing into and directly move to the laser radiation zone under the situation on the platform.In addition, platform also can move between two zones under the state that does not keep handled object.
The 11st laser machining device of the present invention is characterised in that in said the 10th the present invention, said workpiece transfer device makes said platform relatively move with respect to said laser in said laser radiation zone, thereby carries out the scanning of said laser.
When utilizing laser that handled object is handled, generally speaking, handle on one side can make laser handled object carried out relative scanning on one side.Among the present invention, also can make the included platform of said workpiece transfer device move to the laser radiation zone, then, the scanning when carrying out laser radiation through moving this platform.Thus, can be also used as scanning means and the device of transferring handled object, can the simplification device structure.In addition, if make with handled object from load the zone move to the direction in laser radiation zone identical with above-mentioned scanning direction, be a direction of principal axis, then can simplify and be used for the apparatus structure that moves and scan, and, can effectively utilize the space of process chamber.In addition, when platform being moved,, then has the effect of further raising space efficiency if make the part of platform be positioned at the space that loads area side for the relative scanning of laser.
The 12nd laser machining device of the present invention is characterised in that, in the said the 10th or the 11st the present invention, said platform constitutes the part of said separating part when being positioned at said loading area side.
Through with the part of platform, can simplify the structure division of separating part as separating part.
The 13rd laser machining device of the present invention is characterised in that; Of the present invention in each the said the 10th～the 12nd; In said process chamber; Part as said separating part comprises the below partition wall, and this below partition wall is elongated in the loading port side end position of the said platform of said loading area side standby from the lower side of said loading port, is separated out the below in the said oral-lateral space of packing into or the below in said pack into oral-lateral space and side space, said laser radiation zone with said platform.
Through configuration below partition wall, the oral-lateral space of packing into that can avoid loading the zone is communicated with via following side space with laser radiation side space.
The 14th laser machining device of the present invention is characterised in that; Of the present invention in each the said the 1st～the 13rd; Said separating part has the place ahead partition wall, and this place ahead partition wall is separated out the space of the said oral-lateral of packing into and the space of said laser radiation zone side on the direction fore-and-aft direction of packing into of said handled object.
Separating part can have the place ahead partition wall, and this place ahead partition wall is separated out the space of the oral-lateral of packing into and the space of laser radiation zone side on the direction fore-and-aft direction of packing into of said handled object.Thus, on the direction of packing into of handled object, space before and after spatial being divided into.This place ahead partition wall under the situation that is positioned at the loading zone territory, preferably be configured in can be separated out that handled object is loaded into and the position in the space of the holding position side that is maintained and the oral-lateral space of packing on.Thus, can avoid as much as possible because of handled object pack into the space of holding position side, further pack into the space of laser radiation zone side is affected atmosphere.
In addition, if the place ahead partition wall is configured on the position that is separated out loading zone and laser radiation zone, then can be applied as loading interlocking zone loading the zone.
The 15th laser machining device of the present invention is characterised in that; Of the present invention in each the said the 1st～the 14th; In said process chamber; Part as said separating part comprises the side partition wall, and this side partition wall is elongated to said laser radiation zone side from the both sides of said loading port, thereby is separated out the side in the said oral-lateral space of packing into or the side in said pack into oral-lateral space and side space, said laser radiation zone.
Through configuration side partition wall, the oral-lateral space of packing into that can avoid loading the zone is communicated with via the space, side with laser radiation side space.
The 16th laser machining device of the present invention is characterised in that; Of the present invention in each the said the 1st～the 15th; Comprise as first separating part loading the said separating part in space that the zone is separated into space and the said laser radiation zone side of the said oral-lateral of packing into that links to each other with loading port, comprise as second separating part being separated out said zone and the regional said separating part of said laser radiation of loading said.
Through second separating part, can be separated out the space and the laser radiation zone of the oral-lateral of packing into more reliably.
The 17th laser machining device of the present invention is characterised in that, comprising: process chamber, and this process chamber is taken in handled object, and is carrying out under the atmosphere of regulating this handled object irradiating laser; And optical system, this optical system with laser in this process chamber of external orientation,
Said process chamber has and is used for the said handled object loading port said inner treatment chamber, that can open and close of packing into from said process chamber outside; And said inner treatment chamber comprise the loading interlocking zone that links to each other with said loading port, and and the laser radiation that links to each other of this loadings interlocking zone regional
The said physical efficiency that is processed moves between said loading interlocking zone and laser radiation zone.
The effect of invention
As stated; According to the present invention; Can reduce influence, can the atmosphere that laser radiation is regional be controlled to stable status in the short time, help to cut down the processing time of handled object the atmosphere outside the oral-lateral space of packing into; And can make non-crystalline semiconductor film crystallization etc. equably, have the effect that improves treatment effect.
In addition, load-lock chambers and transfer robot chamber etc. need be set, and space efficiency is improved.And, have the effect of the use amount that reduces required time of the atmosphere be used to regulate load-lock chambers, atmosphere gas.
Description of drawings
Fig. 1 is the longitudinal section of face side of brief configuration of the laser annealing processing unit of an expression execution mode of the present invention.
Fig. 2 is the cutaway view of overlooking side of the structure of Fig. 1.
Fig. 3 is the cutaway view of left surface of the structure of Fig. 1.
Fig. 4 is the cutaway view of right flank of the structure of Fig. 1.
Fig. 5 is the longitudinal section of face side of the brief configuration of the laser annealing processing unit of expression in another embodiment of the present invention.
Fig. 6 is the cutaway view of overlooking side of the structure of Fig. 5.
Fig. 7 is the longitudinal section of face side of the brief configuration of the laser annealing processing unit of expression in the another embodiment of the invention.
Fig. 8 is the cutaway view of overlooking side of the structure of Fig. 7.
Fig. 9 (a) is the cutaway view of left surface of the structure of Fig. 7, and Fig. 9 (b) is the cutaway view of its right flank.
Figure 10 is the longitudinal section of face side of the brief configuration of the laser annealing processing unit of expression in the another embodiment of the invention.
Figure 11 is the cutaway view of left surface of the structure of Figure 10.
Figure 12 is the longitudinal section of face side of brief configuration of the laser annealing processing unit of expression another embodiment of the invention.
Figure 13 is the sketch map of the existing laser annealing processing unit of expression.
Embodiment
Below, according to accompanying drawing laser machining device 1 of the present invention is described.
Fig. 1 is the figure in the positive cross section of expression laser machining device 1, and Fig. 2 is a vertical view cutaway drawing, and Fig. 3 is the left surface cutaway view, and Fig. 4 is the right flank cutaway view.
Laser machining device 1 comprises: process chamber 2; Be in the laser oscillator 3 outside this process chamber 2; And the laser 3a that this laser oscillator 3 is exported carried out shaping and the optical system 4 of the above-mentioned process chamber 2 that leads.
In addition; At process chamber 2; As the part of optical system 4, have the importing window 5 in the process chamber 2 external orientation process chambers 2 with laser 3a, pass the laser 3a that imports window 5 and be imported into and pass and setly on the shielding box 6 that is arranged in the process chamber 2 see through hole 6a and shine on the handled object 100.Shielding box 6 is used for the illuminated portion of handled object 100 is brushed shroud gas.
In process chamber 2, be provided with the platform 10 that can move at fore-and-aft direction and left and right directions with respect to the direction of packing into of handled object 100, this platform 10 is moved by mobile device 11.This mobile device 11 has the effect as workpiece transfer device of the present invention.Platform 10 has the rectangular shape of overlooking, and more leaning on loading port 7 sides than shielding box 6, has position of readiness, and has the gap between platform 10 and the loading port 7.Do not need bigger gap between shielding box 6 and the position of readiness.
As the present invention, the platform 10 of position of readiness and the gap value between the loading port are not had special qualification, but can enumerate 100～300mm.Space till the front end from loading port 7 to the platform that is in position of readiness 10 becomes and loads regional A, becomes laser radiation zone B in the space of side more on the front than the front end of platform 10.
In addition, the upper surface that is in the platform 10 of position of readiness becomes the holding position of handled object 100.
Both side ends position rear side, this platform 10 at the platform that is in position of readiness 10 disposes the side partition wall 12,12 along fore-and-aft direction with the plate face with vertically being provided with.The top board 2b of the upper surface of side partition wall 12 and rear end face and process chamber 2 and the sidewall 2a of process chamber seamlessly are close to.In addition, loading port 7 all is being between the side partition wall 12 of both sides on the direction in length and breadth.In addition, the residing position of front end of side partition wall 12,12 and the rear end face of platform 10 have small gap.The lower end of side partition wall 12 is elongated to the top position slightly of the bottom of platform 10. Side partition wall 12,12 constitutes the part of separating part of the present invention.
In addition; Between side partition wall 12 and 12; With the plate face dispose with being horizontally disposed with upper surface be positioned at the basic identical height of the upper level of platform 10 on lower horizontal partition wall 13; Lower horizontal partition wall 13 extends on left and right directions, and the inner surface of two end faces of its left and right directions and side partition wall 12,12 seamlessly is close to.Lower horizontal partition wall 13 is equivalent to below of the present invention partition wall.
The front end of lower horizontal partition wall 13 is elongated to the front end of side partition wall 12.Therefore, the rear end face of the front end of lower horizontal partition wall 13 and platform 10 has small gap.
The rear end of lower horizontal partition wall 13 arrives the opening portion of loading port 7 near sidewall 2a.And; Rear end at lower horizontal partition wall 13; The vertical partition wall 14 in the rear that the plate face vertically is provided with is arranged towards the below agley continuously, and the vertical partition wall 14 in rear extends on left and right directions, and the inner surface of two end faces of its left and right directions and side partition wall 12,12 seamlessly is close to.
In addition, the rear surface of the vertical partition wall 14 in rear is blocked the lower side of the opening of loading port 7, and around it, is close to sidewall 2a, and is elongated to the position identical with the lower end of side partition wall 12 towards the below.The lower side of loading port 7 is blocked by the vertical partition wall 14 in this rear.Do not blocked and open loading port 7, guaranteeing to have the required opening of handled object 100 of packing into by the vertical partition wall 14 in rear.
The vertical partition wall 14 in lower horizontal partition wall 13 and rear constitutes the part of separating part of the present invention.
And, the upper front end side of side partition wall 12, between the side partition wall 12 and 12, the plate face is disposed the vertical partition wall 15 in the place ahead with vertically being provided with, the upper surface of the vertical partition wall 15 in front and the top board 2b of process chamber 2 seamlessly are close to.In addition, the vertical partition wall 15 in the place ahead towards about elongation, two end faces of its left and right directions and the inner surface of side partition wall 12,12 seamlessly are close to.In addition, the lower end of the vertical partition wall 15 in the place ahead does not arrive the upper surface of lower horizontal partition wall 13, and guarantees gapped G1 between this upper surface.The vertical partition wall 15 in the place ahead is equivalent to the place ahead of the present invention partition wall, constitutes the part of separating part.
Handled object 100 can pass said clearance G 1 and move, and clearance G 1 constitutes the opening portion of separating part.
By the vertical partition wall 14 of above-mentioned side partition wall 12,12, lower horizontal partition wall 13, rear, and the vertical partition wall 15 in the place ahead constitute the partition wall that becomes separating part of the present invention.This partition wall is preferably the material that is not subject to pollutions such as oxygen, for example, can use and carry out the aluminium sheet that alumite is handled.
By the vertical partition wall 14 of above-mentioned side partition wall 12,12, lower horizontal partition wall 13, rear, and the space that impales of the vertical partition wall 15 in the place ahead become the oral-lateral space A1 that packs into that loads regional A, the space of platform 10 tops of standby becomes the laser radiation side space A2 that loads regional A.Therefore, the upper surface of platform 10 constitutes the part of separating part.In addition, in this execution mode, laser radiation side space A2 becomes the side space, holding position of handled object 100.
In addition, in this mode, platform 10 moves on left and right directions, but because the front end of separating part is positioned at the rear side of platform 10, therefore, the platform 10 that moves can not disturb with separating part.
In addition, more than separating part is illustrated as fixture, but separating part also can be made up of the member of movable member or shape-variable.
And; Be connected with pack into the oral-lateral air supply line road 16 and the oral-lateral exhaust lay out 17 of packing at the oral-lateral space A1 that packs into; This oral-lateral air supply line road 16 of packing into can provide atmosphere gas such as nitrogen, argon to the oral-lateral space A1 that packs into, and the atmosphere gas that this oral-lateral exhaust lay out 17 of packing into will be packed in the A1 of oral-lateral space carries out exhaust.On each circuit, be provided with open and close valve 16a, flowmeter 16b, open and close valve 17a, flowmeter 17b.By the oral-lateral air supply line road 16 of packing into, open and close valve 16a, and flowmeter 16b constitute the part of the oral-lateral feeder of packing into of the present invention, constitute the part of the oral-lateral exhaust apparatus of packing into of the present invention by the oral-lateral exhaust lay out 17 of packing into, open and close valve 17a, flowmeter 17b.
Through supplying with atmosphere gas to the oral-lateral space A1 that packs into, can be from the small gap between above-mentioned partition wall and the platform 10 blow gas laterally, thereby obtain function, the raising shielding as gas curtain.Therefore; Preferably the gap with partition wall and platform 10 is reduced to the degree that platform moves of not damaging as much as possible; And, preferably the gap of partition wall and platform 10 is reduced to the degree that can fully obtain by the effect of the gas curtain that air feed produced of atmosphere gas as much as possible.
In addition; B is connected with irradiation area air feed circuit 18 and irradiation area exhaust lay out 19 in the laser radiation zone; This irradiation area air feed circuit 18 can provide atmosphere gas such as nitrogen, argon in the B of laser radiation zone, this irradiation area exhaust lay out 19 carries out exhaust with the atmosphere gas in the B of laser radiation zone.On each circuit, be provided with open and close valve 18a, flowmeter 18b, open and close valve 19a, flowmeter 19b.By irradiation area air feed circuit 18, open and close valve 18a, and flowmeter 18b constitute the part of irradiation area feeder of the present invention, constitute the part of irradiation area exhaust apparatus of the present invention by irradiation area exhaust lay out 19, open and close valve 19a, flowmeter 19b.In addition, the confession exhaust apparatus of the oral-lateral of packing into can only be arranged also, not have the confession exhaust apparatus of irradiation area.
Next the action to above-mentioned laser machining device 1 describes.
At first; Before handling; In advance platform 10 is moved to position of readiness, closing gate valve 8 is opened open and close valve 16a, 17a, 18a, 19a to carry out exhaust and to supply with atmosphere gas and regulate the atmosphere in the process chamber 2 while utilize flowmeter 16b, 17b, 18b, 19b to regulate flow.
In addition, preferably make the irradiation area air feed circuit 18 that is arranged on laser radiation zone B and irradiation area exhaust lay out 19 till the taking out of of the moving into of handled object 100, processing, handled object, continue air feed and exhaust.
If the atmosphere through air feed and exhaust have been accomplished in each zone is regulated; Then open gate valve 8; Utilize transfer robot 9 to be encased in handled object 100 in the oral-lateral space A1 that packs into that loads in the regional A from loading port 7; Further handled object 100 is passed clearance G 1 from the oral-lateral space A1 that packs into and be encased in the side space A2 of laser radiation zone, put then, remain on the holding position on the platform 10.When opening gate valve 8, preferred 16 pairs on the oral-lateral air supply line road of packing into the oral-lateral space A1 that packs into that utilizes only carries out air feed, thereby prevents that atmosphere outside from sneaking in the oral-lateral space A1 that packs into.At this moment, the oral-lateral space A1 that packs into realizes shielding, and therefore, even atmosphere is blended in the oral-lateral space A1 that packs into, atmosphere also can't easily get into laser radiation zone side space A2 and then get into laser radiation zone B.
Handled object 100 is encased on the holding position of laser radiation zone side space A2; Then; Closing gate valve 8; Air feed is carried out on pack into oral-lateral air supply line road 16, irradiation area air feed circuit 18 of utilization, utilizes loading port exhaust lay out 17, irradiation area exhaust lay out 19 to carry out exhaust, thereby makes the atmosphere in the process chamber 2 stable.At this moment, atmosphere can not be blended in the B of laser radiation zone basically, only need be used for making pack into the stable time degree of atmosphere of oral-lateral space A1 to get final product, and can shorten to be used for the atmosphere stable treated time.
After atmosphere is stable, utilize mobile device 11 that platform 10 is moved towards the left among Fig. 1.Move in the way at this, the part of handled object 100 arrives irradiation position, therefore, can before handled object 100 moves to laser radiation zone B fully, begin laser radiation.By laser oscillator 3 output laser 3a, make laser 3a pass the importing window 5 in optical system 4 and the optical system 4, further pass the shielding box 6 in the process chamber 2, shine on the handled object 100 that is positioned at laser radiation zone B from seeing through hole 6a.
Utilize mobile device 11 that platform 10 is moved up in front and back, thereby carry out laser 3a scanning.When scanning, platform 10 can utilize the space that loads regional A side to loading regional A side shifting.
In addition, change scanning position, can on whole of handled object 100, carry out the processing of irradiating laser through platform 10 is moved at left and right directions.In this was handled, partition wall can not hinder moving of platform 10 and handled object 100.
Through said method, can handle handled object 100 efficiently.The handled object 100 that utilizes mobile device 11 will accomplish processing moves to platform 10 and loads regional A side; Only carry out opening gate valve 8 under the state of air feed in utilization 16 pairs in the oral-lateral space air feed circuit oral-lateral space A1 side of packing into of packing into, utilize transfer robot 9 to take out of outside the process chamber 2.Then, can with the description of front likewise, another is handled body 100 moves into and carry out same processing.
(execution mode 2)
In the above-described embodiment; Side partition wall 12 to following is illustrated; That is, the front end of this side partition wall 12 is positioned near the rear end of the platform 10 that is in position of readiness, and; This side partition wall 12 will load the zone and be separated into the oral-lateral space of packing into, reaches the laser radiation side space identical with side space, holding position, but also can the front position of separating part be arranged in the side space, holding position.According to Fig. 5, Fig. 6 this example is described.Fig. 5 is with the figure behind process chamber 2 longitudinally cuttings, and Fig. 6 is the vertical view that has omitted top board.
In addition, for the identical label of the structure identical mark, omit or simplify its explanation with above-mentioned execution mode.
In this example,, the plate face is disposed the side partition wall 20,20 along fore-and-aft direction with vertically being provided with in the both side ends position of platform 10. Side partition wall 20,20 side in the wings has the shape identical with above-mentioned side partition wall 12,12, and makes front side be elongated to side space, holding position, and the lower end is positioned at directly over the upper surface of platform 10.The upper surface of side partition wall 20,20 and the top board 2b of process chamber 2 seamlessly are close to.
The rear side of partition wall 20 in the side, make lower horizontal partition wall 13 and above-mentioned execution mode mutually coequality near the rear of the platform 10 of standby, have the vertical partition wall 14 in rear in loading port 7 sides.When platform 10 moves, when platform 10 is positioned at the forefront, the front end of side demarcation strip 20 be in nonoverlapping position, the rear end of platform 10 on.Thus,, can not disturb on platform 10 when keeping handled object 100 and move left and right with side partition wall 20.
The leading section of partition wall 20 in the side, partition wall 20 is put on the shelf and is provided with the vertical partition wall 21 in the place ahead that the plate face vertically is provided with in the side of both sides.The upper surface of the vertical partition wall 21 in the place ahead seamlessly is close to the top board 2b of process chamber 2, and, the vertical partition wall 21 in the place ahead towards about extend, the inner surface of two end faces about it and the side partition wall 20 of both sides seamlessly is close to.The vertical partition wall 21 in the place ahead is equivalent to the place ahead of the present invention partition wall.
In addition, guarantee gapped G2 between the upper surface of the lower end of vertical partition wall 21 and platform 10 forwardly.The vertical partition wall 21 in front constitutes the part of separating part of the present invention.
Handled object 100 can pass above-mentioned clearance G 2 and move, and clearance G 2 constitutes the opening portion of separating part.
By the vertical partition wall 14 of above-mentioned side demarcation strip 20,20, lower horizontal demarcation strip 13, rear, and the vertical partition wall 21 in the place ahead constitute the partition wall that becomes separating part of the present invention.
In this execution mode, the range assignment of front that also will be from loading port 7 to the platform that is in position of readiness 10 is given and is loaded regional A, and shielding box 6 sides are distributed to laser radiation zone B.
By the vertical partition wall 14 of side partition wall 20,20, lower horizontal partition wall 13, rear, and the partition wall that constitutes of the vertical partition wall 21 in the place ahead cover loading port 7 side spaces around; And will load regional A and be separated into oral-lateral space A3 and the laser radiation zone side space A4 that packs into, thereby obtain shielding.
At the oral-lateral space A3 that packs into; Be connected with pack into the oral-lateral air supply line road 16 and the oral-lateral exhaust lay out 17 of packing into above-mentioned execution mode identically; Air feed through from the oral-lateral air supply line road 16 of packing into obtains the gas curtain effect; Thereby the raising shielding, and, can utilize the oral-lateral exhaust lay out 17 of packing into to get rid of the atmosphere of sneaking into as soon as possible.In addition, the B in the laser radiation zone is connected with laser radiation side air feed circuit 18 and laser radiation side exhaust lay out 19 with above-mentioned execution mode identically.
Also identical in this execution mode with above-mentioned execution mode, can handled object 100 be moved in the process chamber 2, utilize the processing of laser radiation, and handled object 100 is taken out of outside process chamber 2.At this moment, keep the atmosphere of laser radiation zone B as much as possible, and the moving into of handled object 100, when taking out of, can realize the stable of atmosphere at short notice.
(execution mode 3)
In above-mentioned each execution mode; Be illustrated loading the separating part that regional A is separated into the side space, oral-lateral space and laser radiation zone of packing into, but also can comprise and being separated out as the loading zone A in the oral-lateral space of packing into as the separating part of the laser radiation zone B in side space, laser radiation zone.
Below, describe according to Fig. 7～Fig. 9.In addition, for the identical label of the structure identical mark, omit or simplify its explanation with above-mentioned execution mode.
In this execution mode, laser machining device 1 also comprises: process chamber 2; Be in the laser oscillator 3 outside this process chamber 2; And the laser 3a that this laser oscillator 3 is exported carried out shaping and the optical system 4 of the above-mentioned process chamber 2 that leads.In addition; At process chamber 2; As the part of optical system 4, have the importing window 5 in the process chamber 2 external orientation process chambers 2 with laser 3a, pass the laser 3a that imports window 5 and be imported into and pass and setly on the shielding box 6 that is arranged in the process chamber 2 see through hole 6a and shine on the handled object 100.Shielding box 6 is used for the illuminated portion of handled object 100 is brushed shroud gas.Be provided with loading port 7 and comprise the gate valve 8 that this loading port 7 is opened and closed at the sidewall 2a of process chamber 2.In the outside of process chamber 2, transfer robot 9 is positioned at loading port 7 residing sides.
In process chamber 2, be provided with platform 10, this platform 10 is moved by mobile device 11.This mobile device has the effect as workpiece transfer device of the present invention.Platform 10 has the rectangular shape of overlooking, and more leaning on loading port 7 sides than shielding box 6, has position of readiness.
On the ora terminalis of the both sides of the platform that is in position of readiness 10; Side partition wall 30,30 seamlessly is close to the top board 2b of process chamber 2 along the upper surface lateral margin of platform 10, upper end and is fixing, and the lower surface of side partition wall 30,30 and the upper surface of platform 10 only have less clearance.
In addition, in this mode, because platform 10 moves on Width, therefore, the gap between the lower surface of side partition wall 30,30 and the upper surface of platform 10 forms the size that the handled object 100 that puts on platform 10 is passed through.In addition,, set this gap narrower, thereby improve air-tightness not making platform 10 under the situation that Width moves.
In addition, for not with remain on handled object 100 on the platform 10 part disturbed take place, the part, gap of platform 10 upper surfaces and side partition wall 30 is reduced.
In addition; In loading port 7 sides; Side, the rear partition wall 30a, the 30a that on side partition wall 30,30, in succession mutually and extend along the rear end faced downwards of platform 10 from the rear end side of platform 10; This side, rear partition wall 30a, 30a seamlessly are close in loading port 7 sides and sidewall 2a, and the front end face of side, rear partition wall 30a, 30a has small gap with the rear end face that is in the platform 10 of position of readiness.
In addition; Two bottoms of side, rear partition wall 30a, 30a are elongated to the lower side of loading port 7; Has set up the horizontally disposed lower horizontal partition wall 31 of plate face between two of side partition wall 30a, 30a bottoms in the wings position below more leaning on than loading port 7.The rear end face of lower horizontal partition wall 31 and sidewall 2a seamlessly are close to, lower horizontal partition wall 31 about elongation, inner surface of two end faces and side, rear partition wall 30a, 30a seamlessly is close to about it.In addition, the front end face of lower horizontal partition wall 31 is elongated to the front end face of side, rear partition wall 30a.That is, the front end face of lower horizontal partition wall 31 has small gap with the rear end face that is in the platform 10 of position of readiness.
The front side end of side partition wall 30,30 is elongated to the front end of the platform 10 that is in position of readiness, between the leading section top of side partition wall 30,30, sets up the vertical partition wall 32 in the place ahead of stringer board shape.The upper surface and the top board 2b of the vertical partition wall 32 in the place ahead seamlessly are close to; Align with the lower end of side partition wall 30 in the lower end of the vertical partition wall 32 in the place ahead; Guarantee clearance G 3 between the upper surface of itself and platform 10, pass through can make the handled object 100 that puts on platform 10.The opening portion that this clearance G 3 constitutes in the separating part.
By above-mentioned side partition wall 30,30, side, rear partition wall 30a, 30a, lower horizontal partition wall 31, and the vertical partition wall 32 in the place ahead constitute the partition wall that becomes separating part of the present invention.Through this separating part, be separated out as the loading zone A in the oral-lateral space of packing into as the laser radiation zone B in side space, laser radiation zone.This partition wall is preferably the material that is not subject to pollutions such as oxygen, for example, can use and carry out the aluminium sheet that alumite is handled.
Regional A is connected with air feed circuit 16 and exhaust lay out 17 in loading, and this air feed circuit 16 can provide atmosphere gas such as nitrogen, argon, and the atmosphere gas that this exhaust lay out 17 will load in the regional A carries out exhaust.On each circuit, be provided with open and close valve 16a, flowmeter 16b, open and close valve 17a, flowmeter 17b.
By above-mentioned air feed circuit 16, open and close valve 16a, flowmeter 16b, and not shown air supply source etc. constitute the oral-lateral feeder of packing into of the present invention, by above-mentioned exhaust lay out 17, open and close valve 17a, flowmeter 17b, and not shown exhaust pump etc. constitute the oral-lateral exhaust apparatus of packing into of the present invention.
Through atmosphere gas being provided to loading regional A, can be from the small gap between above-mentioned partition wall and the platform 10 blow gas laterally, thereby obtain function, the raising shielding as gas curtain.Therefore, preferably the gap with partition wall and platform 10 is reduced to the degree that platform moves of not damaging as much as possible, and preferably the gap with partition wall and platform 10 is reduced to the effect by the gas curtain that air feed produced of atmosphere gas that can fully obtain as much as possible.
In this execution mode, also loading port 7 is loaded regional A to the range assignment of the front of the platform that is in position of readiness 10, shielding box 6 sides are distributed to laser radiation zone B.In addition, in this execution mode, be separated out and load regional A and laser radiation zone B, load regional A and play the effect that loads the interlocking zone.
The separating part that constitutes by the vertical partition wall 32 of side partition wall 30,30, lower horizontal partition wall 31, the place ahead cover loading port 7 side spaces around; And be separated out that to load regional A immediate shipment entrance side space be side space, laser radiation zone with laser radiation zone B, thereby acquisition shielding.
Load regional A and obtain the gas curtain effect, thereby improve shielding, and oral-lateral exhaust lay out 17 can be got rid of the atmosphere of sneaking into as soon as possible through packing into through air feed from the oral-lateral air supply line road 16 of packing into.
(execution mode 4)
In addition; In the above-mentioned execution mode, on the left and right sides ora terminalis of the upper surface of the platform 10 that side partition wall 12 is positioned at be in position of readiness, and platform 10 is moved on left and right directions; But also can change the shape of side partition wall, and platform 10 can be moved.According to Figure 10, Figure 11 this example is described.In addition, for the identical label of the structure identical mark, omit or simplify its explanation with above-mentioned execution mode.
In the scope that platform 10 moves to left and right direction; The left and right sides wall with platform does not take place on the position of interference; This routine side partition wall 35,35 is fixed on the top board 2b floppily, and side partition wall 35,35 has near the length the lower face side that arrives platform 10.In addition, the rear side of side partition wall 35,35 seamlessly is fixed on the sidewall 2a, in shielding box 6 sides, has the length of the front-end edge that arrives platform 10.In addition; Rear side at the platform that is in position of readiness 10; Between side partition wall 35 and 35, link the lower horizontal partition wall 36 that the transverse slat shape is arranged; The back square end of lower horizontal partition wall 36 seamlessly is fixed on the sidewall 2a, and front end is elongated to the position that has minim gap with the rear end face of platform 10.
In addition, the front end of side partition wall 35,35 is elongated to the front-end edge of the upper surface of platform 10, the vertical partition wall 37 in the place ahead of putting on the shelf and being provided with the stringer board shape at this front end.The upper surface of the vertical partition wall 37 in the place ahead seamlessly is close to and is fixed on the top board 2b, and the lower surface has the gap that can make the degree that the handled object 100 that puts on platform 10 passes through.This gap is equivalent to the opening portion in the separating element.By above-mentioned side partition wall 35,35, lower horizontal partition wall 36, and the vertical partition wall 37 in the place ahead constitute the partition wall that becomes separating part of the present invention.
In this execution mode, be separated into and give loading regional A0 to the allocation of space of the upper side of the platform that is in position of readiness 10 loading port 7, shielding box 6 sides are distributed to laser radiation zone B.Therefore, load regional A0 and play the effect that loads the interlocking zone.By side partition wall 35,35, lower horizontal partition wall 36, and the partition wall that constitutes of the vertical partition wall 37 in the place ahead cover loading port 7 around, mark off and load regional A0 and laser radiation zone B, thus the acquisition shielding.This loads regional A0 and obtains the gas curtain effect through the air feed from the air feed circuit, thereby improves shielding, and, can utilize exhaust lay out to get rid of the atmosphere of sneaking into as soon as possible.
Also identical with above-mentioned execution mode in this execution mode, it is indoor handled object to be moved into processing, utilizes the processing of laser radiation, and handled object is taken out of outside process chamber.At this moment, keep the atmosphere in laser radiation zone as much as possible, and the moving into of handled object, when taking out of, can realize the stable of atmosphere at short notice.
(execution mode 5)
In above-mentioned each execution mode; Be illustrated loading the regional separating part that is separated into pack into oral-lateral space and side space, laser radiation zone, but also can be to comprise respectively being separated out the separating part that loads regional A and laser radiation zone B and will loading the separating part that the zone is separated into pack into oral-lateral space and the regional side of laser radiation space.
In this execution mode 5,, have Fig. 7～separating part shown in Figure 9, also comprise being separated into pack into oral-lateral space and first separating part that comprises the space of holding position, this structure is described according to Figure 12 with loading the zone as second separating part.In addition, for the identical label of the structure identical mark, omit or simplify its explanation with above-mentioned each execution mode.
In this mode, have side separating part 30, this side separating part 30 is elongated to the front of platform 10.Guarantee minimal gap between the upper surface of side partition wall 30 and platform 10, handled object 100 is being remained on the platform 10 and during mobile platform 10, handled object 100 does not disturb with side partition wall 30 each other.In addition, shown in the imaginary line shown in figure 12, for not with remain on handled object 100 on the platform 10 part disturbed take place, the platform 10 and the part, gap of side partition wall 30 are reduced.
The rear side of partition wall 30 has side, rear partition wall 30a in the side, in the lower end side of this side, rear partition wall 30a, has set up lower horizontal demarcation strip 31 with above-mentioned execution mode 3 identically.In addition, the upper front end side of partition wall 30a is provided with the vertical partition wall 15 in the place ahead in the side, rear of the rear end side that is positioned at platform 10.The upper surface and the top board 2b of the vertical partition wall 15 in the place ahead seamlessly are close to.Guarantee gapped G1 between the upper surface of vertical forwardly partition wall 15 and platform 10.Handled object 100 can pass clearance G 1 and move.
Constitute first separating part by side, rear partition wall 30a, lower horizontal partition wall 31, the vertical partition wall 15 in the place ahead, will load regional A through first separating part and be separated into the space A1 of the oral-lateral of packing into and the space A2 of laser radiation zone side.
In addition, the leading section of partition wall 30 has the vertical partition wall 32 in the place ahead in the side.The upper surface of the vertical partition wall 32 in the place ahead and about two end faces seamlessly be close to the top board 2b of process chamber 2 and side partition wall 30 inner surfaces of both sides.In addition, guarantee between the upper surface of the lower end of vertical forwardly partition wall 32 and platform 10 gapped.Handled object 100 can pass above-mentioned gap and move.
Upper surface by side partition wall 30, the vertical partition wall 31 in the place ahead and platform 10 constitutes second separating part of the present invention.Distribute to be separated out through second separating part and load regional A and the regional B of laser radiation.Therefore, load regional A and play the effect that loads the interlocking zone.
First separating part cover loading port 7 side spaces around, and will load regional A and be separated into pack into oral-lateral space A1 and the regional side space A2 of laser radiation, thus the acquisition shielding.And second separating part further obtains shielding with being separated into regional A of loading and laser radiation zone B in the process chamber 2.
The oral-lateral space A1 that packs into obtains the gas curtain effect through the air feed from the oral-lateral air supply line road of packing into, thereby improves shielding, and the oral-lateral exhaust lay out can be got rid of the atmosphere of sneaking into as soon as possible through packing into.
More than, describe the present invention according to above-mentioned execution mode, but the present invention is not limited to the content of above-mentioned execution mode, can suitably change.
Label declaration
1 laser machining device
2 process chambers
3 laser oscillators
4 optical systems
6 shielding boxs
7 loading ports
8 gate valves
9 transfer robots
10 platforms
11 mobile devices
12 side partition walls
13 lower horizontal partition walls
Partition wall is indulged at 14 rears
Partition wall is indulged in 15 the place aheads
The 16 oral-lateral air supply line roads of packing into
The 17 oral-lateral exhaust lay outs of packing into
18 laser radiation side air feed circuits
19 laser radiation side exhaust lay outs
20 side partition walls
Partition wall is indulged in 21 the place aheads
30 side partition walls
31 lower horizontal partition walls
Partition wall is indulged in 32 the place aheads
35 side partition walls
36 lower horizontal partition walls
Partition wall is indulged in 37 the place aheads
A loads the zone
The A1 oral-lateral space of packing into
A2 laser radiation side space
The A3 oral-lateral space of packing into
A4 laser radiation side space
B laser radiation zone
100 handled objects
Claims (17)
1. a laser machining device is characterized in that, comprising:
Process chamber, this process chamber is taken in handled object, and is carrying out under the atmosphere of regulating this handled object irradiating laser; And optical system, this optical system with laser in this process chamber of external orientation,
Said process chamber has and is used for the said handled object loading port said inner treatment chamber, that can open and close of packing into from said process chamber outside; And said inner treatment chamber comprise the loading zone that links to each other with said loading port, and and the laser radiation that links to each other of this loadings zone regional
Has separating part in said loading zone; The space of space that this partitioned portion is separated out the said oral-lateral of packing into and the laser radiation zone side that comprises said laser radiation zone, this separating part can make said handled object mobile between the space of the space of the said oral-lateral of packing into and said laser radiation zone side.
2. laser machining device as claimed in claim 1 is characterized in that, said separating part has the partition wall in the space of the space that is separated out the said oral-lateral of packing into and said laser radiation zone side.
3. laser machining device as claimed in claim 1 is characterized in that, said separating part has the atmosphere gas curtain in the space of the space that is separated out the said oral-lateral of packing into and said laser radiation zone side.
4. like each described laser machining device of claim 1 to 3, it is characterized in that, said partitioned portion be separated out as the said oral-lateral space of packing into said load the zone, and as the said laser radiation zone in side space, said laser radiation zone.
5. like each described laser machining device of claim 1 to 3; It is characterized in that said partitioned portion is separated out and is in said pack into the oral-lateral space and comprise the said side space, said laser radiation zone that loads the part in zone of said in the zone that loads.
6. like each described laser machining device of claim 1 to 3; It is characterized in that said partitioned portion is separated out and is in said pack into the oral-lateral space and comprise the side space, said laser radiation zone in the side space, holding position that the said handled object that loads the zone of packing into is kept of said in the zone that loads.
7. like each described laser machining device of claim 1 to 6, it is characterized in that, can be connected with pack into the oral-lateral feeder and the oral-lateral exhaust apparatus of packing in the said oral-lateral space of packing into with ventilating.
8. like each described laser machining device of claim 1 to 7, it is characterized in that, can be connected with irradiation area feeder and irradiation area exhaust apparatus with ventilating in said laser radiation zone.
9. like each described laser machining device of claim 1 to 8, it is characterized in that said inner treatment chamber comprises makes said handled object at the said workpiece transfer device that moves between zone and the said laser radiation zone that loads.
10. laser machining device as claimed in claim 9 is characterized in that, said workpiece transfer device has the platform that keeps said handled object and said handled object is moved between said loading zone and said laser radiation zone.
11. laser machining device as claimed in claim 10 is characterized in that, said workpiece transfer device makes said platform relatively move with respect to said laser in said laser radiation zone, thereby carries out the scanning of said laser.
12., it is characterized in that said platform constitutes the part of said separating part when being positioned at said loading area side like claim 10 or 11 described laser machining devices.
13. each described laser machining device like claim 10 to 12; It is characterized in that; In said process chamber; Part as said separating part comprises the below partition wall, and this below partition wall is elongated in the loading port side end position of the said platform of said loading area side standby from the lower side of said loading port, and is separated out the below in the said oral-lateral space of packing into or the below in said pack into oral-lateral space and side space, said laser radiation zone with said platform.
14. each described laser machining device like claim 1 to 13; It is characterized in that; Said separating part has the place ahead partition wall, and this place ahead partition wall is separated out the space of the said oral-lateral of packing into and the space of said laser radiation zone side on the direction fore-and-aft direction of packing into of said handled object.
15. each described laser machining device like claim 1 to 14; It is characterized in that; In said process chamber; Part as said separating part comprises the side partition wall, and this side partition wall is elongated to said laser radiation zone side from the both sides of said loading port, thereby is separated out the side in the said oral-lateral space of packing into or the side in said pack into oral-lateral space and side space, said laser radiation zone.
16. each the described laser machining device like claim 1 to 15 is characterized in that, said separating part as first separating part, and is comprised and is separated out said zone and the second regional separating part of said laser radiation of loading.
17. a laser machining device is characterized in that, comprising:
Process chamber, this process chamber is taken in handled object, and is carrying out under the atmosphere of regulating this handled object irradiating laser; And optical system, this optical system with laser in this process chamber of external orientation,
Said process chamber has and is used for the said handled object loading port said inner treatment chamber, that can open and close of packing into from said process chamber outside; And said inner treatment chamber comprise the loading interlocking zone that links to each other with said loading port, and and the laser radiation that links to each other of this loadings interlocking zone regional
The said physical efficiency that is processed moves between said loading interlocking zone and laser radiation zone.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010091802A JP5467578B2 (en) | 2010-04-12 | 2010-04-12 | Laser processing equipment |
| JP2010-091802 | 2010-04-12 | ||
| JP2011086145A JP5447991B2 (en) | 2011-04-08 | 2011-04-08 | Laser processing equipment |
| PCT/JP2011/058929 WO2011129282A1 (en) | 2010-04-12 | 2011-04-08 | Laser processing apparatus |
| JP2011-086145 | 2011-04-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102834899A true CN102834899A (en) | 2012-12-19 |
| CN102834899B CN102834899B (en) | 2015-08-05 |
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ID=44798658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180018247.0A Active CN102834899B (en) | 2010-04-12 | 2011-04-08 | Laser machining device |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR101896949B1 (en) |
| CN (1) | CN102834899B (en) |
| TW (1) | TWI471914B (en) |
| WO (1) | WO2011129282A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113013073A (en) * | 2015-02-27 | 2021-06-22 | 株式会社日本制钢所 | Atmosphere forming device and floating conveying method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1197382A (en) * | 1997-09-19 | 1999-04-09 | Japan Steel Works Ltd:The | Laser annealer |
| CN1713344A (en) * | 2004-06-16 | 2005-12-28 | 株式会社半导体能源研究所 | Laser treating apparatus, laser irradiation method and manufacture of semiconductor device |
| JP2006147859A (en) * | 2004-11-19 | 2006-06-08 | Sumitomo Heavy Ind Ltd | Method and device for processing |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04356917A (en) * | 1991-06-03 | 1992-12-10 | Matsushita Electric Ind Co Ltd | Laser anneal apparatus |
| JP4001647B2 (en) * | 1995-12-04 | 2007-10-31 | 株式会社半導体エネルギー研究所 | Method for manufacturing crystalline semiconductor film |
| JP4593548B2 (en) * | 1996-05-15 | 2010-12-08 | 株式会社半導体エネルギー研究所 | Doping processing equipment |
| JP3175002B2 (en) * | 1997-05-07 | 2001-06-11 | 住友重機械工業株式会社 | Laser annealing equipment |
| TW444275B (en) * | 1998-01-13 | 2001-07-01 | Toshiba Corp | Processing device, laser annealing device, laser annealing method, manufacturing device and substrate manufacturing device for panel display |
| JP4014729B2 (en) * | 1998-06-05 | 2007-11-28 | クリーン・テクノロジー株式会社 | UV cleaning equipment |
| JP2000021891A (en) * | 1998-06-26 | 2000-01-21 | Toshiba Corp | Substrate processor and substrate processing method |
| JP2002164407A (en) | 2000-11-27 | 2002-06-07 | Japan Steel Works Ltd:The | Laser annealing equipment and its method |
| JP4589606B2 (en) * | 2003-06-02 | 2010-12-01 | 住友重機械工業株式会社 | Manufacturing method of semiconductor device |
| JP4170360B2 (en) * | 2006-12-01 | 2008-10-22 | 株式会社半導体エネルギー研究所 | Method for manufacturing thin film transistor |
| US7923660B2 (en) * | 2007-08-15 | 2011-04-12 | Applied Materials, Inc. | Pulsed laser anneal system architecture |
-
2011
- 2011-04-08 KR KR1020127024497A patent/KR101896949B1/en active IP Right Grant
- 2011-04-08 WO PCT/JP2011/058929 patent/WO2011129282A1/en active Application Filing
- 2011-04-08 CN CN201180018247.0A patent/CN102834899B/en active Active
- 2011-04-12 TW TW100112641A patent/TWI471914B/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1197382A (en) * | 1997-09-19 | 1999-04-09 | Japan Steel Works Ltd:The | Laser annealer |
| CN1713344A (en) * | 2004-06-16 | 2005-12-28 | 株式会社半导体能源研究所 | Laser treating apparatus, laser irradiation method and manufacture of semiconductor device |
| JP2006147859A (en) * | 2004-11-19 | 2006-06-08 | Sumitomo Heavy Ind Ltd | Method and device for processing |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113013073A (en) * | 2015-02-27 | 2021-06-22 | 株式会社日本制钢所 | Atmosphere forming device and floating conveying method |
| CN113013073B (en) * | 2015-02-27 | 2023-07-25 | Jsw阿克迪纳系统有限公司 | Atmosphere forming device and floating conveying method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011129282A1 (en) | 2011-10-20 |
| TWI471914B (en) | 2015-02-01 |
| TW201142924A (en) | 2011-12-01 |
| CN102834899B (en) | 2015-08-05 |
| KR20130069549A (en) | 2013-06-26 |
| KR101896949B1 (en) | 2018-09-11 |
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Effective date of registration: 20220407 Address after: Kanagawa Patentee after: JSW acdina System Co.,Ltd. Address before: Tokyo Patentee before: THE JAPAN STEEL WORKS, Ltd. |