CN102832177B - 用于从基部基底受控地移除半导体器件层的方法 - Google Patents
用于从基部基底受控地移除半导体器件层的方法 Download PDFInfo
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- CN102832177B CN102832177B CN201210199986.0A CN201210199986A CN102832177B CN 102832177 B CN102832177 B CN 102832177B CN 201210199986 A CN201210199986 A CN 201210199986A CN 102832177 B CN102832177 B CN 102832177B
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- layer
- crack propagation
- semiconductor device
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
- H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
- H01L21/7813—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate leaving a reusable substrate, e.g. epitaxial lift off
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1892—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof methods involving the use of temporary, removable substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1892—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof methods involving the use of temporary, removable substrates
- H01L31/1896—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof methods involving the use of temporary, removable substrates for thin-film semiconductors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Recrystallisation Techniques (AREA)
- Drying Of Semiconductors (AREA)
- Weting (AREA)
Abstract
Description
Claims (22)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/161,260 | 2011-06-15 | ||
US13/161,260 US9040392B2 (en) | 2011-06-15 | 2011-06-15 | Method for controlled removal of a semiconductor device layer from a base substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102832177A CN102832177A (zh) | 2012-12-19 |
CN102832177B true CN102832177B (zh) | 2015-02-25 |
Family
ID=46208941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210199986.0A Expired - Fee Related CN102832177B (zh) | 2011-06-15 | 2012-06-14 | 用于从基部基底受控地移除半导体器件层的方法 |
Country Status (4)
Country | Link |
---|---|
US (2) | US9040392B2 (zh) |
CN (1) | CN102832177B (zh) |
DE (1) | DE102012209891B4 (zh) |
GB (1) | GB2491930B (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8518807B1 (en) * | 2012-06-22 | 2013-08-27 | International Business Machines Corporation | Radiation hardened SOI structure and method of making same |
US9040432B2 (en) * | 2013-02-22 | 2015-05-26 | International Business Machines Corporation | Method for facilitating crack initiation during controlled substrate spalling |
WO2015073089A1 (en) * | 2013-08-26 | 2015-05-21 | The Regents Of The University Of Michigan | Thin film lift-off via combination of epitaxial lift-off and spalling |
DE102013020693A1 (de) * | 2013-12-04 | 2015-06-11 | Siltectra Gmbh | Verfahren zum Erzeugen großflächiger Festkörperschichten |
US9058990B1 (en) * | 2013-12-19 | 2015-06-16 | International Business Machines Corporation | Controlled spalling of group III nitrides containing an embedded spall releasing plane |
US9245747B2 (en) * | 2014-05-01 | 2016-01-26 | International Business Machines Corporation | Engineered base substrates for releasing III-V epitaxy through spalling |
US9799792B2 (en) * | 2015-01-14 | 2017-10-24 | International Business Machines Corporation | Substrate-free thin-film flexible photovoltaic device and fabrication method |
US9865769B2 (en) * | 2015-03-23 | 2018-01-09 | International Business Machines Corporation | Back contact LED through spalling |
US10460948B2 (en) * | 2015-09-04 | 2019-10-29 | International Business Machines Corporation | Stress assisted wet and dry epitaxial lift off |
US9570295B1 (en) | 2016-01-29 | 2017-02-14 | International Business Machines Corporation | Protective capping layer for spalled gallium nitride |
FI129855B (en) * | 2019-10-08 | 2022-09-30 | Jani Oksanen | METHOD AND STRUCTURE FOR MANUFACTURING THIN FILMS |
US11695089B2 (en) | 2019-12-31 | 2023-07-04 | Industrial Technology Research Institute | Solar cell modules |
Citations (5)
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US4445965A (en) * | 1980-12-01 | 1984-05-01 | Carnegie-Mellon University | Method for making thin film cadmium telluride and related semiconductors for solar cells |
CN1190248A (zh) * | 1996-12-18 | 1998-08-12 | 佳能株式会社 | 半导体产品的制造工艺 |
US5811348A (en) * | 1995-02-02 | 1998-09-22 | Sony Corporation | Method for separating a device-forming layer from a base body |
CN1225500A (zh) * | 1997-12-26 | 1999-08-11 | 佳能株式会社 | 半导体产品及其制造方法 |
CN1230302A (zh) * | 1996-07-16 | 1999-09-29 | 雷伊化学公司 | 电路保护装置 |
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EP0509560A3 (en) * | 1986-05-20 | 1992-12-30 | Showa Denko Kabushiki Kaisha | Roll type solid electrolytic capacitor |
JP3360919B2 (ja) | 1993-06-11 | 2003-01-07 | 三菱電機株式会社 | 薄膜太陽電池の製造方法,及び薄膜太陽電池 |
JP3619058B2 (ja) * | 1998-06-18 | 2005-02-09 | キヤノン株式会社 | 半導体薄膜の製造方法 |
JP4771510B2 (ja) | 2004-06-23 | 2011-09-14 | キヤノン株式会社 | 半導体層の製造方法及び基板の製造方法 |
EP1863100A1 (en) * | 2006-05-30 | 2007-12-05 | INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM vzw (IMEC) | Method for the production of thin substrates |
US20100047959A1 (en) | 2006-08-07 | 2010-02-25 | Emcore Solar Power, Inc. | Epitaxial Lift Off on Film Mounted Inverted Metamorphic Multijunction Solar Cells |
EP2168172B1 (en) | 2007-07-03 | 2019-05-22 | Microlink Devices, Inc. | Methods for fabricating thin film iii-v compound solar cell |
AU2008325223A1 (en) | 2007-11-02 | 2009-05-14 | President And Fellows Of Harvard College | Production of free-standing solid state layers by thermal processing of substrates with a polymer |
US8802477B2 (en) * | 2009-06-09 | 2014-08-12 | International Business Machines Corporation | Heterojunction III-V photovoltaic cell fabrication |
EP2462631B1 (en) | 2009-09-10 | 2021-06-30 | The Regents of the University of Michigan | Methods of preparing flexible photovoltaic devices using epitaxial liftoff, and preserving the integrity of growth substrates used in epitaxial growth |
-
2011
- 2011-06-15 US US13/161,260 patent/US9040392B2/en not_active Expired - Fee Related
-
2012
- 2012-04-12 GB GB1206430.9A patent/GB2491930B/en not_active Expired - Fee Related
- 2012-06-13 DE DE102012209891.7A patent/DE102012209891B4/de not_active Expired - Fee Related
- 2012-06-14 CN CN201210199986.0A patent/CN102832177B/zh not_active Expired - Fee Related
- 2012-09-05 US US13/603,944 patent/US9059073B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4445965A (en) * | 1980-12-01 | 1984-05-01 | Carnegie-Mellon University | Method for making thin film cadmium telluride and related semiconductors for solar cells |
US5811348A (en) * | 1995-02-02 | 1998-09-22 | Sony Corporation | Method for separating a device-forming layer from a base body |
CN1230302A (zh) * | 1996-07-16 | 1999-09-29 | 雷伊化学公司 | 电路保护装置 |
CN1190248A (zh) * | 1996-12-18 | 1998-08-12 | 佳能株式会社 | 半导体产品的制造工艺 |
CN1225500A (zh) * | 1997-12-26 | 1999-08-11 | 佳能株式会社 | 半导体产品及其制造方法 |
Also Published As
Publication number | Publication date |
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DE102012209891A1 (de) | 2012-12-20 |
GB201206430D0 (en) | 2012-05-30 |
US20120322244A1 (en) | 2012-12-20 |
US9059073B2 (en) | 2015-06-16 |
DE102012209891B4 (de) | 2018-12-13 |
US9040392B2 (en) | 2015-05-26 |
GB2491930B (en) | 2013-10-02 |
US20130005119A1 (en) | 2013-01-03 |
CN102832177A (zh) | 2012-12-19 |
GB2491930A (en) | 2012-12-19 |
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