CN102832148B - Joint apparatus and joint method - Google Patents
Joint apparatus and joint method Download PDFInfo
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- CN102832148B CN102832148B CN201210147489.6A CN201210147489A CN102832148B CN 102832148 B CN102832148 B CN 102832148B CN 201210147489 A CN201210147489 A CN 201210147489A CN 102832148 B CN102832148 B CN 102832148B
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- framework
- cooling water
- hot plate
- edge
- plate portion
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/34—Heating or cooling presses or parts thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/06—Platens or press rams
- B30B15/062—Press plates
- B30B15/064—Press plates with heating or cooling means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/16—Control arrangements for fluid-driven presses
- B30B15/166—Electrical control arrangements
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S100/00—Presses
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Press Drives And Press Lines (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
A joint apparatus and a joint method can prevent a service life of a sealing part from reducing through a simple structure, thereby preventing a running rate of the apparatus from reducing. The joint apparatus (10) comprises a pressurization mechanism (14), a plurality of hot plate parts (26) disposed in a direction where the pressurization part (14) applies pressure and provided with heat sources inside, a frame body (30) disposed at the side of the hot plate parts (26), and a vacuum chamber (C) formed among the hot plate parts by laminating the hot plate parts which are close to one another in the pressure direction, wherein bonding base materials are joined through thermo-compression bonding by using the hot plate parts (26) in the vacuum chamber (C), and is characterized by comprising a sealing part (34) disposed between the hot plate parts (26) and the frame body (30) and sealing the vacuum chamber (C) in an air tight manner, and a frame body cooling part (38) disposed on the frame body (30) and used for cooling the frame body (30) and the sealing part (34).
Description
Technical field
The present invention relates to a kind of such as the bonding base material of tabular or foil-like is engaged by thermo-compressed coupling device and joint method.
Background technology
At present, propose a kind of decompressor, the cylinder being used for upper and lower fixture is combined and the cylinder that carries out regulation punch process in compartment are set to different components, utilize docking to be close to i.e. horizontal plane and engage the combination carrying out upper and lower fixture, vacuumize by the compartment that formed in the combination by upper and lower fixture, and make fixture under a high vacuum and decline together with its lower clamp be close to, thus the punch process of carrying out specifying (with reference to patent documentation 1).
According to above-mentioned decompressor, high vacuum is set in the compartment that can easily the combination by upper and lower fixture be formed, even if by the washer sealing slot part constriction of sliding surface to accurate high compression size, also sealing lubricating grease can not be made to overflow or produce the loss, distortion etc. of seal washer, and can be completely degassed to make in product by being promptly promoted to condition of high vacuum degree in compartment, such as also can carry out low pressure punch process under a high vacuum.
Prior art document
Patent documentation
Patent documentation 1: Japanese Patent Laid-Open 2002-96199 publication
But, because seal washer exposes at high temperature, therefore, make the life of product of seal washer reduce because of design temperature.Therefore, exist and need frequently change seal washer and make the problem that the running rate of decompressor reduces.In addition, also exist along with the frequent replacing of seal washer and make the problem that the operating cost of decompressor raises.
Summary of the invention
Therefore, the object of the present invention is to provide a kind of service life reduction that can prevent sealing with simple structure, and then the coupling device preventing unit service factor from reducing and joint method.
The coupling device of the first invention comprises: pressing mechanism; Hot plate portion, this hot plate portion applies stressed action direction is configured with multiple at above-mentioned pressing mechanism, and has thermal source in inside; Framework, this framework is located at the side in above-mentioned hot plate portion; And vacuum chamber, this vacuum chamber is because of by stacked each other for above-mentioned hot plate portion adjacent on above-mentioned stressed action direction and be formed between above-mentioned hot plate portion, in above-mentioned vacuum chamber, utilize above-mentioned hot plate portion thermally to be crimped by bonding base material to engage, it is characterized in that, comprise: sealing, sealing portion is located between above-mentioned hot plate portion and above-mentioned framework, and is closed airtightly by above-mentioned vacuum chamber; And framework cooling end, this framework cooling end is located at above-mentioned framework, and for cooling above-mentioned framework and above-mentioned sealing.
In this case, it is preferable that, above-mentioned framework is configured to frame-shaped by the first edge, the second edge, the 3rd edge and the 4th edge, wherein, above-mentioned second edge is relative with the first edge, first edge end is connected with an end of the second edge by above-mentioned 3rd edge, another end of first edge is connected with another end of the second edge by above-mentioned 4th edge, above-mentioned framework cooling end comprises: multiple cooling water inflow part, and these cooling water inflow part are located at the central portion place of above-mentioned first edge; Multiplely cooling water flow out of portion, these portions of cooling water flow out of are located at the central portion place of above-mentioned second edge; First cooling water channel, this first cooling water channel from above-mentioned first edge via above-mentioned 3rd edge until above-mentioned second edge, so that an above-mentioned cooling water inflow part is connected with an above-mentioned portion of cooling water flow out of; And second cooling water channel, this second cooling water channel from above-mentioned first edge via above-mentioned 4th edge until above-mentioned second edge, so that another above-mentioned cooling water inflow part is connected with another above-mentioned portion of cooling water flow out of.
In this case, it is preferable that, above-mentioned hot plate portion has: the first limit; Second Edge, this Second Edge is relative with above-mentioned first limit; And hot plate cooling end, this hot plate cooling end is used for cooling above-mentioned hot plate portion, and above-mentioned hot plate cooling end comprises: multiple cooling water inflow part, and these cooling water inflow part are located at the central portion place on above-mentioned first limit; Multiplely cooling water flow out of portion, these portions of cooling water flow out of are located at the both ends place on above-mentioned first limit; First cooling water channel, this first cooling water channel above-mentioned first limit with turn back between above-mentioned Second Edge while an above-mentioned cooling water inflow part is connected with an above-mentioned portion of cooling water flow out of; And second cooling water channel, this second cooling water channel above-mentioned first limit with turn back between above-mentioned Second Edge while another above-mentioned cooling water inflow part is connected with another above-mentioned portion of cooling water flow out of.
In this case, it is preferable that, comprising: temperature detecting part, this temperature detecting part is located at above-mentioned framework, and for detecting the temperature of above-mentioned framework; Open and close valve, this open and close valve makes cooling water flow into above-mentioned framework cooling end or makes cooling water stop flowing into above-mentioned framework cooling end; And control part, when the temperature that said temperature test section detects above-mentioned framework is more than first temperature, above-mentioned control part is opened above-mentioned open and close valve and is flowed into above-mentioned framework cooling end to make cooling water, and when said temperature test section detects that the temperature of above-mentioned framework is below the second temperature lower than above-mentioned first temperature, above-mentioned control part is closed above-mentioned open and close valve and is stopped flowing into above-mentioned framework cooling end to make cooling water.
Bonding base material heats each other by the joint method of the second invention in vacuum chamber, pressurize to engage, it is characterized in that, comprise: by the hot plate portion with thermal source being configured in two interareas in above-mentioned bonding base material outside each other, framework is configured in the mode of the side surrounding above-mentioned bonding base material and above-mentioned hot plate portion, and sealing is set between above-mentioned hot plate portion and above-mentioned framework, thus form the step of enclosure space around above-mentioned bonding base material; By vacuumizing the step forming vacuum chamber to above-mentioned enclosure space; And cool above-mentioned framework and above-mentioned sealing, and by step that above-mentioned hot plate portion heats above-mentioned bonding base material, pressurizes.
In this case, it is preferable that, comprise the following steps: after in above-mentioned vacuum chamber, above-mentioned bonding base material being heated each other, pressurizeing, above-mentioned hot plate portion is cooled, and above-mentioned framework is cooled.
In this case, it is preferable that, in the process in above-mentioned vacuum chamber, bonding base material thermally crimped, the temperature of above-mentioned framework is detected, when the temperature detecting above-mentioned framework is more than first temperature, start to cool above-mentioned framework and above-mentioned sealing, when the temperature detecting above-mentioned framework is below the second temperature, stop cooling above-mentioned framework and above-mentioned sealing.
According to the present invention, the service life reduction of sealing can be prevented with simple structure, and then prevent unit service factor from reducing.
Accompanying drawing explanation
Fig. 1 is the structure chart of hot plate portion (the Japanese: Hot Disk portion) state before reclosing of the coupling device representing first embodiment of the invention.
Fig. 2 is the structure chart of the state of hot plate portion after overlapping of the coupling device representing first embodiment of the invention.
Fig. 3 is the structure chart in the hot plate portion of the coupling device of first embodiment of the invention.
Fig. 4 is the structure chart to the framework that the hot plate portion of the coupling device of first embodiment of the invention keeps.
Fig. 5 is the Y1-Y2 direction view of Fig. 4.
Fig. 6 is the key diagram of the thermal contraction in the hot plate portion of the formation vacuum chamber of the coupling device representing second embodiment of the invention.
Fig. 7 is the structure chart to the framework that the hot plate portion of the coupling device of third embodiment of the invention keeps.
Fig. 8 is the structure chart in the hot plate portion of the coupling device of third embodiment of the invention.
Symbol description
10 coupling devices
14 pressing mechanisms
26 hot plate portions
27a first limit
27b Second Edge
27c the 3rd limit
27d the 4th limit
28 hot plate cooling ends
28a1 cooling water inflow part
28a2 cooling water inflow part
28b1 cooling water flow out of portion
28b2 cooling water flow out of portion
28c1 first cooling water channel
28c2 second cooling water channel
30 frameworks
31a first edge
31b second edge
31c the 3rd edge
31d the 4th edge
32 control parts
34 sealings
38 framework cooling ends
38a1 cooling water inflow part
38a2 cooling water inflow part
38b1 cooling water flow out of portion
38b2 cooling water flow out of portion
38c1 first cooling water channel
38c2 second cooling water channel
39 open and close valves
40 Temperature Detectors (temperature detecting part)
X bonding base material
Y bonding base material
C vacuum chamber
Embodiment
With reference to accompanying drawing, the coupling device of first embodiment of the invention and joint method are described.
(coupling device)
Coupling device is described.Coupling device is device bonding base material being engaged with each other by thermo-compressed.Bonding base material is then the substrate before bonding, except wafer and assembly substrate, also comprises by the submounts of singualtion.In the coupling device of present embodiment, multiple bonding base plate bonding is produced composite base plate.Bonding base material for the manufacture of composite base plate both can be different types of base material, also can be the base material of identical type.Manufactured composite base plate can be used as the part of electronic equipment.
As shown in Figure 1, coupling device 10 comprises basket 12.In the inside of basket 12, be arranged multiple hot plate portion 26 along the vertical direction.The multiple bonding base materials as coalesced object thing are configured with between each hot plate portion 26.Pressing mechanism 14 is configured with in the bottom of basket 12.Pressing mechanism 14 can adopt the fluid pressure type piston rod 16 that can stretch in the vertical direction to be used as an example.Pressing mechanism 14 is subject to the control of not shown control part and is driven.
Downside base portion 18 is connected with at the leading section of the piston rod 16 of pressing mechanism 14.
Therefore, when pressing mechanism 14 i.e. piston rod 16 is flexible in the vertical direction, downside base portion 18 can move in the vertical direction.
Downside base portion 18 is provided with stressed multiple pillar component 20 is applied to hot plate portion 26A, 26B, 26C, 26D, 26E (being called rightly in " hot plate portion 26 ").
In addition, upside base portion 22 is fixed with on the top of basket 12.Upside base portion 22 is provided with stressed multiple pillar component 24 is applied to hot plate portion 26.Thus between the pillar component 20 being formed in downside base portion 18 and the pillar component 24 of upside base portion 22, the structure multiple hot plate portions 26 stacked along the vertical direction clamped with the plus-pressure specified.
As shown in Figure 3, hot plate portion 26 has: the first limit 27a; The Second Edge 27b relative with the first limit 27a; By the 3rd limit 27c that an end of the first limit 27a is connected with an end of Second Edge 27b; And by the 4th limit 27d that another end of the first limit 27a is connected with another end of Second Edge 27b.
Hot plate cooling end 28 is provided with in hot plate portion 26.Hot plate cooling end 28 is by cooling water inflow part 28a, cooling water flow out of portion 28b and cooling water channel 28c to form, wherein, above-mentioned cooling water inflow part 28a is located at an end of the first limit 27a in hot plate portion 26, and for cooling water being guided to the inside in hot plate portion 26, above-mentionedly cooling water flow out of another end that portion 28b is located at the first limit 27a in hot plate portion 26, and for cooling water being expelled to the outside in hot plate portion 26, above-mentioned cooling water channel 28c is located at the inside in hot plate portion 26, to be square wavy extension in reciprocal for several times mode between the first limit 27a and Second Edge 27b, and cooling water inflow part 28a is connected with the portion 28b of cooling water flow out of.By this, by making the cooling water flowed into from cooling water inflow part 28a flow among cooling water channel 28c, and flow out to outside from the portion 28b of cooling water flow out of, thus hot plate portion 26 is cooled.
Cooling water flows into or flows out hot plate portion 26 and controls by control part 32 (with reference to Fig. 4).That is, control part 32 being opened by controlling open and close valve, being closed the inflow of controlled cooling model water or flowing out hot plate portion 26.
Framework 30 is provided with in the side in hot plate portion 26.As shown in Figure 4, framework 30 is surrounded by the first edge 31a, the second edge 31b, the 3rd edge 31c and the 4th edge 31d, wherein, above-mentioned second edge 31b is relative with the first edge 31a, first edge 31a end is connected with an end of the second edge 31b by above-mentioned 3rd edge 31c, and another end of the first edge 31a is connected with another end of the second edge 31b by above-mentioned 4th edge 31d.Each edge 31a, 31b, 31c, 31d of framework 30 are adjacent with the side in slidable mode and hot plate portion 26.
Hot plate portion 26 is made up of identical materials such as carbon steels with framework 30.
As shown in Figure 5, hot plate portion 26 is configured in two interarea sides of bonding base material.Framework 30 is provided with in the mode surrounding hot plate portion 26 in the side in hot plate portion 26.The side of framework 30 and lower surface are formed with seal groove 34A.Sealing 34 has been imbedded in seal groove 34A.Sealing 34 is such as made up of fluorubber etc.Framework 30 is exerted a force downward by Compress Spring 35.Framework cooling end 38 is provided with in framework 30.Later the details of framework cooling end 38 is described.
When hot plate portion 26 adjacent be along the vertical direction subject to plus-pressure bonding base material X, Y are crimped time, in the region that the hot plate portion 26B by the framework 30 of the hot plate portion 26C of upside, the hot plate portion 26C of upside, sealing 34, downside surrounds, be formed with vacuum chamber C.
Like this, in the coupling device 10 comprising multiple hot plate portion 26, because multiple hot plate portion 26 is all in stacked state, therefore, multiple vacuum chamber C can be formed with, in each vacuum chamber C, utilize hot plate portion 26 to carry out the mutual joining process of bonding base material X, Y.Bonding base material X, Y are engaged under the state of clamping at bonded fixture S, T.
Each hot plate portion 26 is formed with access 29.Therefore, the multiple vacuum chamber C being divided formation respectively by each hot plate portion 26 are the structures be communicated with via access 29.By this, all vacuum chamber C form a vacuum space on the whole.
In access 29, be connected with vacuum pump (not shown), under the work of vacuum pump, make each vacuum chamber C be in vacuum state.Vacuum pump is controlled portion 32 and controls and driven.
As shown in Figure 4, framework cooling end 38 is provided with in the inside of framework 30.Framework cooling end 38 is by cooling water inflow part 38a, cooling water flow out of portion 38b and cooling water channel 38c to form, wherein, above-mentioned cooling water inflow part 38a is located at the substantial middle place of the first edge 31a of framework 30, and for cooling water being guided to the inside of framework 30, above-mentionedly cooling water flow out of the substantial middle place that portion 38b is located at the first edge 31a of framework 30, and for cooling water being expelled to the outside of framework 30, above-mentioned cooling water channel 38c is located at each edge 31a, 31b, 31c, the inside of 31d, flow for cooling water inflow part 38a to be connected also Cooling Water with the portion 38b of cooling water flow out of.By this, flow among cooling water channel 38c by each edge 31a of framework 30, the order of 31b, 31c, 31d by making the cooling water flowing into the inside of framework 30 from cooling water inflow part 38a, and a circulation is carried out in the inside of framework 30, flow out to the outside of framework 30 from the portion 38b of cooling water flow out of, thus framework 30 is cooled.
The Temperature Detector 40 for detecting the temperature of framework 30 is provided with in framework 30.The temperature of the framework 30 detected by Temperature Detector 40 is output to control part 32 as detection signal.
Control part 32, after receiving the detection signal from Temperature Detector 40, just determines the Current Temperatures of framework 30.
As Temperature Detector 40, such as, use thermocouple.
Control part 32 controls open and close valve 39, and is controlled cooling water inflow, each edge 31a flowing out framework 30,31b, 31c, 31d by open and close valve 39.By this, control part 32 can make cooling water flow into each edge 31a of framework 30, the inside of 31b, 31c, 31d or make cooling water stop flowing into each edge 31a of framework 30, the inside of 31b, 31c, 31d.
Control part 32 comprises ROM (not shown).The data of the relation between temperature and the inflow of cooling water representing framework 30 are stored in ROM.According to these data, when the temperature of such as framework 30 reaches more than 200 DEG C, control part 32 opens open and close valve flows into framework 30 each edge 31a, 31b, 31c, 31d to make cooling water start, when the temperature of framework 30 reaches below 150 DEG C, control part 32 closes open and close valve to each edge 31a, 31b, 31c, 31d of making cooling water stop flowing into framework 30.
Above-mentioned 200 DEG C and 150 DEG C are only an example, are not limited to said temperature.Can come to regulate arbitrarily according to the material of sealing 34, kind.
Then, general description is carried out to the joining process utilizing coupling device 10 to make bonding base material be engaged with each other.Joining process has following process.
(coincidence in hot plate portion)
As shown in Figure 2, overlapping after utilizing pressing mechanism 14 to make each hot plate portion 26 in basket 12 increase.By multiple hot plate portion 26 is all overlapping, multiple vacuum chamber C just can be formed.
(vacuumizing)
Control to drive vacuum pump by control part 32, utilize and vacuumize to make each vacuum chamber C be in vacuum state.Because each vacuum chamber C is in the state of connection, therefore, a vacuum space is formed on the whole.
(heating, pressurized treatments)
Then, utilize each hot plate portion 26 to carry out heat treated.Owing to being built-in with heater in each hot plate portion 26, therefore, by driving heater with control part 32, just heat treated can be carried out.By thermoregulator, the temperature in hot plate portion 26 is set as 280 DEG C ~ 300 DEG C.
Meanwhile, because hot plate portion 26 adjacent is in the vertical direction subject to plus-pressure, therefore, with the plus-pressure of regulation, the bonding base material be configured between hot plate portion 26 can be crimped each other.In addition, the crimping process due to bonding base material carries out in the inside of vacuum chamber C, therefore, can carry out in the cleaning ambient not having rubbish or dust to enter.Consequently, the electrical characteristic of the composite base plate produced by bonding base material can be maintained in high-quality.
Herein, in the process crimped each other bonding base material in heating, pressurized treatments, the temperature of framework 30 controls as follows.Such as, the temperature of framework 30 is subject to the detection of Temperature Detector 40 all the time, and its testing result is exported to control part 32 (with reference to Fig. 4).By this, control part 32 just can determine the Current Temperatures of framework 30.
In addition, when the temperature of framework 30 reaches more than 200 DEG C, control part 32 (with reference to Fig. 4) opens open and close valve.By this, cooling water is made to flow into each edge 31a, 31b, 31c, 31d of framework 30.Consequently, framework 30 is cooled, and temperature is declined.
And when the temperature of framework 30 reaches below 150 DEG C, control part 32 closes open and close valve 39.By this, cooling water is made to stop flowing into each edge 31a, 31b, 31c, 31d of framework 30.Consequently, make to weaken the cooling effect of framework 30, and transmit from hot plate portion 26 heat and make the temperature of framework 30 increase.
As mentioned above, in the process crimped each other bonding base material in heating, pressurized treatments, the temperature of framework 30 is controlled as more than 150 DEG C, less than 200 DEG C.
In addition, in each vacuum chamber C, carry out the crimping process of bonding base material simultaneously.
(cooling processing of vacuum chamber)
After finishing the crimping each other of bonding base material, the inside of vacuum chamber C is cooled.Now, cool under the state that the vacuum degree of vacuum chamber C is maintained setting.Flow in the cooling water channel 28c of inside, hot plate portion 26 by making cooling water and hot plate portion 26 is cooled, thus carry out the cooling to vacuum chamber C.
(releasing vacuum)
Then, drop to the temperature of regulation in the temperature of vacuum chamber C after, in order to remove the vacuum state of vacuum chamber C, air is entered, thus make all vacuum chambers all towards atmosphere opening.
Then, the effect of the coupling device of first embodiment of the invention and joint method, effect are described.
As shown in Figure 5, by arranging cooling water channel 38c in framework 30, just can cool framework 30.By cooling framework 30, just can cool the sealing 34 of the seal groove 34A (with reference to Fig. 5) being installed on framework 30.Therefore, even if when hot plate portion 26 is heated, also the temperature of sealing 34 can be controlled as reaching certain above temperature, thus can Yin Gaowen be prevented and cause the service life reduction of sealing 34.Consequently, reduce the replacing number of times of sealing 34, thus the running rate of coupling device 10 can be improved.
In addition, due to the temperature reducing sealing 34 can be controlled to, therefore, do not need the sealing of the high price of high-temperature durable, thus the operating cost of coupling device 10 can be reduced.
Especially, in the process crimped each other bonding base material in heating, pressurized treatments, the temperature of framework 30 is controlled to be more than 150 DEG C, less than 200 DEG C.By this, due to press temperature condition can be set in the mode of the heat resisting temperature not depending on sealing 34, therefore, the scope of punching press condition can be expanded.By this, the scope of application of the bonding base material as object can be expanded.
Then, the coupling device of second embodiment of the invention and joint method are described.The structure identical to the structure of the coupling device with the first execution mode marks identical symbol, and suitably the description thereof will be omitted.
In the coupling device and joint method of the second execution mode, in the cooling processing of vacuum chamber, after finishing the heating each other of bonding base material, pressurization, while hot plate portion 26 is cooled, also can cool framework 30.On chilling temperature, framework 30 can be cooled to and there is the temperature identical with hot plate portion 26.
(technical problem and solution)
As shown in Figure 6, when utilizing cooling water that the hot plate portion 26 being heated to 280 DEG C ~ 300 DEG C is chilled to the normal temperature of about 30 DEG C, the hot plate portion 26 of expanding because of heating can shrink rapidly towards the direction of arrow in figure.On the other hand, if do not cool framework 30, then do not shrink under framework 30 will maintain high temperature (200 DEG C ~ 260 DEG C).Therefore, the gap enlargement of hot plate portion 26 and framework 30 can be made, thus impact is brought on the air-tightness of sealing 34.By this, there is the vacuum degree such as maintaining the vacuum chamber C of 100Pa ~ 500Pa can be deteriorated to the technical problem of about 10000Pa.
For solving the problems of the technologies described above, by cooling framework 30 while cooling hot plate portion 26, just can suppressing the gap enlargement between hot plate portion 26 and framework 30, therefore, the vacuum degree of the vacuum chamber C when cooling can being stoped to be deteriorated.
Due to hot plate portion 26 and the cooling means of framework 30 identical with the cooling means in the coupling device 10 of the first execution mode and joint method, therefore, omit the description.
Keeping the object of vacuum degree till normal temperature to be due to the difference according to bonding base material when cooling, also having the base material that oxidation occurs at 50 DEG C ~ more than 60 DEG C, therefore, vacuum degree must be maintained till the temperature of bonding base material declines.
According to coupling device and the joint method of the second execution mode, when cooling hot plate portion 26, the vacuum degree of vacuum chamber C can be prevented to be deteriorated, even if in case the objects such as oxidation and must maintain higher vacuum degree in time having cooled till bonding base material, the coupling device 10 of present embodiment also can be used to process.
Below, the coupling device of the 3rd execution mode of the present invention is described.Identical symbol is marked for the structure that the structure of the coupling device with the first execution mode is identical, and suitably the description thereof will be omitted.
In the coupling device of the 3rd execution mode, the structure of the framework cooling end 38 being located at framework 30 and the hot plate cooling end 28 of being located at hot plate portion 26 is designed.
As shown in Figure 7, framework cooling end 38 is by two cooling water inflow part 38a1, 38a2, two cooling water flow out of portion 38b1, 38b2, first cooling water channel 38c1, second cooling water channel 38c2 is formed, wherein, above-mentioned two cooling water inflow part 38a1, 38a2 is located at the central portion place of the first edge 31a of framework 30, above-mentioned two cooling water flow out of portion 38b1, 38b2 is located at the central portion place of the second edge 31b relative with the first edge 31a, above-mentioned first cooling water channel 38c1 from the first edge 31a via the 3rd edge 31c until the second edge 31b, so that a cooling water inflow part 38a1 be cooling water flow out of portion 38b1 be connected with one, above-mentioned second cooling water channel 38c2 from the first edge 31a via the 4th edge 31d until the second edge 31b, another cooling water inflow part 38a2 is connected be cooling water flow out of portion 38b2 with another.
By this, when cooling framework 30, the cooling water flowing into framework 30 inside from a cooling water inflow part 38a1 flow to the second edge 31b from the first edge 31a via the 3rd edge 31c, and cooling water flow out of from one the outside that portion 38b1 flows out to framework 30.In addition, the cooling water flowing into framework 30 inside from another cooling water inflow part 38a2 flow to the second edge 31b from the first edge 31a via the 4th edge 31d, and cooling water flow out of from another outside that portion 38b2 flows out to framework 30.
Compared with the structure of the framework side cooling end of the first execution mode (with reference to Fig. 4), in the third embodiment, only flowed roughly one half-distance of cooling water channel of framework 30 inside of cooling water is just discharged to outside.
As shown in Figure 8, hot plate cooling end 28 is by two cooling water inflow part 28a1, 28a2, two cooling water flow out of portion 28b1, 28b2, first cooling water channel 28c1, second cooling water channel 28c2 is formed, wherein, above-mentioned two cooling water inflow part 28a1, 28a2 is located at the central portion place of the first limit 27a in hot plate portion 26, above-mentioned two cooling water flow out of portion 28b1, 28b2 is located at the both ends of the first limit 27a, above-mentioned first cooling water channel 28c1 the first limit 27a with turn back between Second Edge 27b while a cooling water inflow part 28a1 be cooling water flow out of portion 28b1 be connected with one, above-mentioned second cooling water channel 28c2 the first limit 27a with turn back between Second Edge 27b while another cooling water inflow part 28a2 be cooling water flow out of portion 28b2 with another be connected.
By this, when cooling hot plate portion 26, the cooling water flowing into inside, hot plate portion 26 from cooling water inflow part 28a1 flows to an end side of the first limit 27a while can turning back back and forth between the first limit 27a and Second Edge 27b, and cooling water flow out of from one the outside that portion 28b1 flows out to hot plate portion 26.In addition, flow into another end side flowing to the first limit 27a while the cooling water of inside, hot plate portion 26 can be turned back back and forth between the first limit 27a and Second Edge 27b from another cooling water inflow part 28a2, and cooling water flow out of from another outside that portion 28b2 flows out to hot plate portion 26.
Compared with the structure of the hot panel part side cooling end of the first execution mode (with reference to Fig. 3), in the third embodiment, only flowed roughly one half-distance of cooling water channel of inside, hot plate portion 26 of cooling water is just discharged to outside.
(technical problem and solution)
When cooling hot plate portion 26, if use the cooling means shown in Fig. 3, then the temperature difference on the left and right directions in the hot plate portion 26 in cooling will become large.Like this, relatively produce skew because the shrinkage on the left and right directions in hot plate portion 26 is different, thus expand the gap between hot plate portion 26 and framework 30.
According to the reason identical with hot plate portion 26, when cooling framework 30, if the cooling means shown in use Fig. 4, then can produce temperature difference on the left and right directions of framework 30 when cooling framework 30, and because of the difference of the shrinkage on the left and right directions of framework 30, the vacuum degree of vacuum chamber C is deteriorated.
Therefore, as shown in Figure 7, when cooling framework 30, because cooling water is from the inside of the centre inflow framework 30 of the first edge 31a of framework 30, and the outside of framework 30 is flowed out to from the centre of the second edge 31b being positioned at opposition side, therefore, the uniformity of temperature profile on the left and right directions (Fig. 7 arrow X-direction) of framework 30 can be made.
In addition, as shown in Figure 8, when cooling hot plate portion 26, because cooling water is from the inside in the center side inflow hot plate portion 26 of the first limit 27a in hot plate portion 26, and the outside in hot plate portion 26 is flowed out to from the side, both ends of the first limit 27a, therefore, the uniformity of temperature profile on the left and right directions (Fig. 8 arrow X-direction) in hot plate portion 26 can be made.By this cooling means, when cooling hot plate portion 26, the skew that can prevent the left and right temperature difference in reason framework 30 and hot plate portion 26 from causing and vacuum degree is deteriorated.By this, reduce the replacing number of times of sealing 34, thus the running rate of coupling device 10 can be improved.
The reason will studied the homogenizing of the Temperature Distribution on the left and right directions (Fig. 7 and Fig. 8 arrow X-direction) in framework 30 and hot plate portion 26 is because framework 30 and hot plate portion 26 size is in the lateral direction longer than the size on fore-and-aft direction (Fig. 7 and Fig. 8 arrow Y-direction), and the harmful effect caused because of temperature difference thus can be made to manifest more significantly.
Claims (9)
1. a coupling device, comprising:
Pressing mechanism;
Hot plate portion, this hot plate portion applies stressed action direction is configured with multiple at described pressing mechanism, and has thermal source in inside;
Framework, this framework is configured with multiple in the mode of the side surrounding hot plate portion described in each and is set as and can slides relative to this hot plate portion; And
Vacuum chamber, this vacuum chamber because of by stacked each other for described hot plate portion adjacent on described stressed action direction and be formed between described hot plate portion,
In described vacuum chamber, utilize described hot plate portion thermally to be crimped by bonding base material and engage,
It is characterized in that, comprising:
Sealing, sealing portion is located at hot plate portion described in each and described in each between framework, and is closed airtightly by described vacuum chamber; And
Framework cooling end, this framework cooling end is located at the inside of described framework, and for cooling described framework and described sealing.
2. coupling device as claimed in claim 1, is characterized in that,
Described framework is configured to frame-shaped by the first edge, the second edge, the 3rd edge and the 4th edge, wherein, described second edge is relative with the first edge, first edge end is connected with an end of the second edge by described 3rd edge, another end of first edge is connected with another end of the second edge by described 4th edge
Described framework cooling end comprises:
Multiple cooling water inflow part, these cooling water inflow part are located at the central portion place of described first edge;
Multiplely cooling water flow out of portion, these portions of cooling water flow out of are located at the central portion place of described second edge;
First cooling water channel, this first cooling water channel from described first edge via described 3rd edge until described second edge, so that a described cooling water inflow part is connected with the portion of cooling water flow out of described in; And
Second cooling water channel, this second cooling water channel from described first edge via described 4th edge until described second edge, so that cooling water inflow part described in another is connected with the portion of cooling water flow out of described in another.
3. coupling device as claimed in claim 1 or 2, is characterized in that,
Described hot plate portion has:
First limit;
Second Edge, this Second Edge is relative with described first limit; And
Hot plate cooling end, this hot plate cooling end is used for cooling described hot plate portion,
Described hot plate cooling end comprises:
Multiple cooling water inflow part, these cooling water inflow part are located at the central portion place on described first limit;
Multiplely cooling water flow out of portion, these portions of cooling water flow out of are located at the both ends place on described first limit;
First cooling water channel, this first cooling water channel described first limit with turn back between described Second Edge while a described cooling water inflow part is connected with the portion of cooling water flow out of described in; And
Second cooling water channel, this second cooling water channel described first limit with turn back between described Second Edge while cooling water inflow part described in another is connected with the portion of cooling water flow out of described in another.
4. coupling device as claimed in claim 1 or 2, is characterized in that, comprising:
Temperature detecting part, this temperature detecting part is located at described framework, and for detecting the temperature of described framework;
Open and close valve, this open and close valve makes cooling water flow into described framework cooling end or makes cooling water stop flowing into described framework cooling end; And
Control part, when the temperature that described temperature detecting part detects described framework is more than first temperature, described control part is opened described open and close valve and is flowed into described framework cooling end to make cooling water, when described temperature detecting part detects that the temperature of described framework is below the second temperature lower than described first temperature, described control part is closed described open and close valve and is stopped flowing into described framework cooling end to make cooling water.
5. coupling device as claimed in claim 3, is characterized in that, comprising:
Temperature detecting part, this temperature detecting part is located at described framework, and for detecting the temperature of described framework;
Open and close valve, this open and close valve makes cooling water flow into described framework cooling end or makes cooling water stop flowing into described framework cooling end; And
Control part, when the temperature that described temperature detecting part detects described framework is more than first temperature, described control part is opened described open and close valve and is flowed into described framework cooling end to make cooling water, when described temperature detecting part detects that the temperature of described framework is below the second temperature lower than described first temperature, described control part is closed described open and close valve and is stopped flowing into described framework cooling end to make cooling water.
6. coupling device as claimed in claim 1, is characterized in that,
Described framework has seal groove, and described sealing is installed on described seal groove.
7. a joint method, heats bonding base material each other, pressurizes to engage, it is characterized in that, comprising in vacuum chamber:
By multiple hot plate portions with thermal source are configured in described bonding base material separately outside two interareas, configuration framework, this framework is to surround described bonding base material and the mode of the side in hot plate portion described in each is configured with multiple and is set as and can slides relative to this hot plate portion, and described in each hot plate portion and described in each, between framework, sealing is set, thus form the step of enclosure space around described bonding base material;
By vacuumizing the step forming vacuum chamber to described enclosure space; And
The framework cooling end being located at the inside of described framework is utilized to cool described framework and described sealing, and by step that described hot plate portion heats described bonding base material, pressurizes.
8. joint method as claimed in claim 7, is characterized in that, comprise the following steps:
After in described vacuum chamber, described bonding base material being heated each other, pressurizeing, described hot plate portion is cooled, and described framework is cooled.
9. joint method as claimed in claim 7 or 8, is characterized in that,
In the process in described vacuum chamber, bonding base material thermally crimped, the temperature of described framework is detected,
When the temperature detecting described framework is more than first temperature, start to cool described framework and described sealing,
When the temperature detecting described framework is below the second temperature, stop cooling described framework and described sealing.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-130881 | 2011-06-13 | ||
| JP2011130881A JP5423997B2 (en) | 2011-06-13 | 2011-06-13 | Joining apparatus and joining method |
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| CN102832148A CN102832148A (en) | 2012-12-19 |
| CN102832148B true CN102832148B (en) | 2015-04-01 |
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| JP (1) | JP5423997B2 (en) |
| KR (1) | KR101363273B1 (en) |
| CN (1) | CN102832148B (en) |
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| KR100722682B1 (en) * | 2001-05-18 | 2007-05-29 | 아르재 가부시키가이샤 | Multi-Participant Game Method Using Network, Game Server Executing The Game Method, and Storage Medium Storing Game Program Executing The Game Method |
| CN113458578A (en) * | 2020-03-30 | 2021-10-01 | 超众科技股份有限公司 | Joining device |
| CN113458580A (en) * | 2020-03-30 | 2021-10-01 | 超众科技股份有限公司 | Joining device |
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| JPS61148499A (en) * | 1984-12-21 | 1986-07-07 | 日本電気株式会社 | Voice signal band compression system |
| JPS61148499U (en) * | 1985-02-28 | 1986-09-12 | ||
| JPH0526758Y2 (en) * | 1987-10-16 | 1993-07-07 | ||
| JP2516262B2 (en) * | 1989-10-11 | 1996-07-24 | 株式会社日立製作所 | hot press |
| JP2000256727A (en) * | 1999-03-05 | 2000-09-19 | Kawasaki Steel Corp | Water-cooling flange in metallurgical furnace |
| JP5237151B2 (en) * | 2009-02-23 | 2013-07-17 | 三菱重工業株式会社 | Substrate support for plasma processing equipment |
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| CN102832148A (en) | 2012-12-19 |
| KR101363273B1 (en) | 2014-02-13 |
| JP2013000749A (en) | 2013-01-07 |
| JP5423997B2 (en) | 2014-02-19 |
| KR20120138631A (en) | 2012-12-26 |
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