CN102830179A - Ultrasonic probe - Google Patents

Ultrasonic probe Download PDF

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Publication number
CN102830179A
CN102830179A CN2012102806352A CN201210280635A CN102830179A CN 102830179 A CN102830179 A CN 102830179A CN 2012102806352 A CN2012102806352 A CN 2012102806352A CN 201210280635 A CN201210280635 A CN 201210280635A CN 102830179 A CN102830179 A CN 102830179A
Authority
CN
China
Prior art keywords
shell
ultrasonic probe
probe
wafer
ultrasonic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012102806352A
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Chinese (zh)
Inventor
赵勤俭
王振
杨昺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JIANGSU SANHE SOUND SOURCE ULTRASONIC TECHNOLOGY CO LTD
Original Assignee
JIANGSU SANHE SOUND SOURCE ULTRASONIC TECHNOLOGY CO LTD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JIANGSU SANHE SOUND SOURCE ULTRASONIC TECHNOLOGY CO LTD filed Critical JIANGSU SANHE SOUND SOURCE ULTRASONIC TECHNOLOGY CO LTD
Priority to CN2012102806352A priority Critical patent/CN102830179A/en
Publication of CN102830179A publication Critical patent/CN102830179A/en
Pending legal-status Critical Current

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Abstract

The invention discloses an ultrasonic probe which comprises a shell. A buffer block is arranged on the shell and is provided with a probe wafer; a protection layer is arranged on the probe wafer; a heat radiation pedestal is connected with the bottom of the shell; a data terminal is fixedly installed in the shell and is in electrical connection with the probe wafer; and a heat transfer layer is arranged between the heat radiation pedestal and the shell. With such a structure, the ultrasonic probe provided by the invention can improve reliability of detection by the ultrasonic probe and has the advantages of a simple structure and a long service life.

Description

Ultrasonic probe
Technical field
The present invention relates to the UT (Ultrasonic Testing) field, particularly relate to a kind of ultrasonic probe.
Background technology
Ultrasound examination is one of big conventional sense method in five in the Non-Destructive Testing field, and it possesses advantages such as environmental pollution is little, therefore in the work efficiency Non-Destructive Testing, has obtained using widely.
Being used for giving birth to the ultrasonic exciting signal in the ultrasound examination is ultrasonic probe with the parts that receive the ultrasound wave return signal.Ultrasonic probe is of a great variety in the prior art, and purposes is different, but their basic system generally includes by wafer, diaphragm (or entrant sound piece) and the high frequency cable that is connected with instrument and takes out part, support, shell etc.
Wherein, the ultrasonic probe based on piezoelectric effect that uses both at home and abroad at present all is to adopt organic glass or polysulfones material to do voussoir; Form the detection faces of probe; When such ultrasonic probe detected the metal worker, if when the detection faces of seized metal works is more coarse, this organic glass or the probe that gathers type of soughing material detected the surface with regard to easy abrasion; The detection effect of influence probe shortens the life-span of popping one's head in.The automatic ultrasonic contact method that especially ought run into the seized workpiece of metal detects; If it is bigger to detect task amount, ultrasonic probe weares and teares just sooner, sometimes closes effect in order to reach good misfortune; When the snap-in force of probe was big, probe also may be damaged in the coarse surface of seized workpiece.
Summary of the invention
The technical matters that the present invention mainly solves provides a kind of ultrasonic probe, can improve the reliability that ultrasonic probe detects, and is simple in structure, long service life.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of ultrasonic probe is provided, comprises: shell; Said shell is provided with buffer stopper, and said buffer stopper is provided with the probe wafer, and said probe wafer is provided with protective seam; Said outer casing bottom is connected with cooling base; Said housing internal fixation is provided with data terminal, and said data terminal electrically connects with the probe wafer, is provided with heat transfer layer between said cooling base and the shell.
In preferred embodiment of the present invention, the curved shape of the xsect of said probe wafer.
In preferred embodiment of the present invention, said protective seam is stainless steel or aluminium.
In preferred embodiment of the present invention, said heat transfer layer is a sheet metal, is coated with insulating heat-conduction material on the said sheet metal.
In preferred embodiment of the present invention, also be equipped with sensor on the said shell.
The invention has the beneficial effects as follows: ultrasonic probe of the present invention can improve the reliability that ultrasonic probe detects, and is simple in structure, long service life.
Description of drawings
Fig. 1 is the structural representation of ultrasonic probe one preferred embodiment of the present invention;
The mark of each parts is following in the accompanying drawing: 1, shell, 2, buffer stopper, 3, the probe crystal block, 4, protective seam, 5, cooling base, 6, data terminal, 7, heat transfer layer, 8, sensor.
Embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present invention is set forth in detail, thereby protection scope of the present invention is made more explicit defining so that advantage of the present invention and characteristic can be easier to it will be appreciated by those skilled in the art that.
See also Fig. 1, a kind of ultrasonic probe comprises: shell 1; Said shell 1 is provided with buffer stopper 2, and said buffer stopper 2 is provided with probe wafer 3, and said probe wafer 3 is provided with protective seam 4; Said shell 1 bottom is connected with cooling base 5; Said housing 1 internal fixation is provided with data terminal 6, and said data terminal 6 electrically connects with probe wafer 3, is provided with heat transfer layer 7 between said cooling base 5 and the shell 1.
In addition, the curved shape of the xsect of said probe wafer 3.
In addition, said protective seam 4 is stainless steel or aluminium.
In addition, said heat transfer layer 8 is a sheet metal, is coated with insulating heat-conduction material on the said sheet metal, and heat transfer layer 8 sends the heat of shell 1 to cooling base 5.
In addition, also be equipped with sensor 8 on the said shell 1.
Be different from prior art, ultrasonic probe of the present invention enough improves the reliability that ultrasonic probe detects, and is simple in structure, long service life.
The above is merely embodiments of the invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes instructions of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.

Claims (5)

1. a ultrasonic probe is characterized in that, comprising: shell; Said shell is provided with buffer stopper, and said buffer stopper is provided with the probe wafer, and said probe wafer is provided with protective seam; Said outer casing bottom is connected with cooling base; Said housing internal fixation is provided with data terminal, and said data terminal electrically connects with the probe wafer, is provided with heat transfer layer between said cooling base and the shell.
2. ultrasonic probe according to claim 1 is characterized in that, the curved shape of the xsect of said probe wafer.
3. ultrasonic probe according to claim 1 is characterized in that, said protective seam is stainless steel or aluminium.
4. ultrasonic probe according to claim 1 is characterized in that, said heat transfer layer is a sheet metal, is coated with insulating heat-conduction material on the said sheet metal.
5. ultrasonic probe according to claim 1 is characterized in that, also is equipped with sensor on the said shell.
CN2012102806352A 2012-08-09 2012-08-09 Ultrasonic probe Pending CN102830179A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012102806352A CN102830179A (en) 2012-08-09 2012-08-09 Ultrasonic probe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012102806352A CN102830179A (en) 2012-08-09 2012-08-09 Ultrasonic probe

Publications (1)

Publication Number Publication Date
CN102830179A true CN102830179A (en) 2012-12-19

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012102806352A Pending CN102830179A (en) 2012-08-09 2012-08-09 Ultrasonic probe

Country Status (1)

Country Link
CN (1) CN102830179A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104942685A (en) * 2015-07-15 2015-09-30 国家电网公司 Device for grinding ultrasonic wave guide probe
CN104977362A (en) * 2015-07-16 2015-10-14 常州市常超电子研究所有限公司 High-temperature-resistant ultrasonic probe
CN105181814A (en) * 2015-09-25 2015-12-23 无锡市博阳超声电器有限公司 Ultrasonic probe capable of achieving rapid heat dissipation
CN109725063A (en) * 2017-10-27 2019-05-07 深圳开立生物医疗科技股份有限公司 Ultrasonic probe
CN110623706A (en) * 2019-11-05 2019-12-31 孙延玲 Urological extracorporeal lithotripter ultrasonic probe rod adjusting structure and using method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101103929A (en) * 2006-07-10 2008-01-16 日本电波工业株式会社 Ultrasonic probe
CN201034982Y (en) * 2007-04-27 2008-03-12 北京工业大学 Double-layer PVDF piezoelectric thin film line focusing ultrasound probe
CN101513352A (en) * 2008-02-18 2009-08-26 株式会社东芝 Two-dimensional array ultrasonic probe
CN201594087U (en) * 2009-12-21 2010-09-29 钢铁研究总院 Parallel ultrasonic detecting probe
CN102226784A (en) * 2011-04-11 2011-10-26 中国铁道科学研究院金属及化学研究所 Ultrasonic probe
CN202693531U (en) * 2012-08-09 2013-01-23 江苏三合声源超声波科技有限公司 Ultrasonic probe

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101103929A (en) * 2006-07-10 2008-01-16 日本电波工业株式会社 Ultrasonic probe
CN201034982Y (en) * 2007-04-27 2008-03-12 北京工业大学 Double-layer PVDF piezoelectric thin film line focusing ultrasound probe
CN101513352A (en) * 2008-02-18 2009-08-26 株式会社东芝 Two-dimensional array ultrasonic probe
CN201594087U (en) * 2009-12-21 2010-09-29 钢铁研究总院 Parallel ultrasonic detecting probe
CN102226784A (en) * 2011-04-11 2011-10-26 中国铁道科学研究院金属及化学研究所 Ultrasonic probe
CN202693531U (en) * 2012-08-09 2013-01-23 江苏三合声源超声波科技有限公司 Ultrasonic probe

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104942685A (en) * 2015-07-15 2015-09-30 国家电网公司 Device for grinding ultrasonic wave guide probe
CN104977362A (en) * 2015-07-16 2015-10-14 常州市常超电子研究所有限公司 High-temperature-resistant ultrasonic probe
CN105181814A (en) * 2015-09-25 2015-12-23 无锡市博阳超声电器有限公司 Ultrasonic probe capable of achieving rapid heat dissipation
CN109725063A (en) * 2017-10-27 2019-05-07 深圳开立生物医疗科技股份有限公司 Ultrasonic probe
CN110623706A (en) * 2019-11-05 2019-12-31 孙延玲 Urological extracorporeal lithotripter ultrasonic probe rod adjusting structure and using method thereof
CN110623706B (en) * 2019-11-05 2022-04-22 孙延玲 Urological extracorporeal lithotripter ultrasonic probe rod adjusting structure and using method thereof

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20121219