CN102830136B - Survey the vortex induction circuit of soil moisture - Google Patents
Survey the vortex induction circuit of soil moisture Download PDFInfo
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- CN102830136B CN102830136B CN201210273252.2A CN201210273252A CN102830136B CN 102830136 B CN102830136 B CN 102830136B CN 201210273252 A CN201210273252 A CN 201210273252A CN 102830136 B CN102830136 B CN 102830136B
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Abstract
Surveying the vortex induction circuit of soil moisture, it relates to soil moisture technical field of measurement and test.It comprises inducer (L1), first electric capacity the 14th electric capacity (C1 C14), first resistance the 26th resistance (R1 R26), transformator (T), first comparator the second comparator (IC1 IC2), adjustable resistor (W1), integrated chip (U1), single-chip microcomputer (U2), display apparatus module (DS1), first isolated gate FET the 4th isolated gate FET (Q1 Q4), audion (Q5), one end of inducer (L1) respectively with one end of the 5th electric capacity (C5), one end of tenth resistance (R10), one end of 11st resistance (R11), the base stage of audion (Q5) connects.It surveys soil moisture with face generation point, uses vortex-like fashion non-contact measurement, and circuit design is reasonable, convenient to use.
Description
Technical field:
The present invention relates to soil moisture technical field of measurement and test, be specifically related to a kind of vortex induction circuit surveying soil moisture.
Background technology:
Requiring and water source water supply condition according to crop water, controlling, regulate soil moisture and need water requirement to meet crop, be the centre point filling general management work, the most basic is the mensuration of the water content of soil.The assay method of soil moisture content, from traditional oven drying method, to electrical measuring method, until the nuclear technology means etc. in modern times, having tens kinds, wherein with the oven drying method after Field sampling as standard method of measurement, but these methods are mostly DYNAMIC DISTRIBUTION the stockpiles of ocean weather station observation soil moisture year in year out, for the instant measurement of soil moisture, never one is the most effective and accurate method.
Traditional soil moisture method is all plug-in type: common for inserting two electrodes, resistance or capacitance size by two interpolars determine humidity size.But it is relevant that this inserts the depth with electrode, and localized measurement error is the biggest.
Summary of the invention:
It is an object of the invention to provide a kind of vortex induction circuit surveying soil moisture, it surveys soil moisture with face generation point, uses vortex-like fashion non-contact measurement, and circuit design is reasonable, convenient to use.
In order to solve the problem existing for background technology, the present invention is by the following technical solutions: it comprises inducer L1, first electric capacity-the 14 electric capacity C1-C14, first resistance-the 26 resistance R1-R26, transformator T, first comparator the-the second comparator IC1-IC2, adjustable resistor W1, integrated chip U1, single-chip microcomputer U2, display apparatus module DS1, first isolated gate FET the-the four isolated gate FET Q1-Q4, audion Q5, one end of inducer L1 respectively with one end of the 5th electric capacity C5, one end of tenth resistance R10, one end of 11st resistance R11, the base stage of audion Q5 connects, tenth resistance
nullThe other end of R10 respectively with one end of the 12nd resistance R12、One end of 3rd resistance R3、8 feet of the first comparator IC1、Power supply VCC、One end of first resistance R1、One end of second resistance R2、One end of 4th resistance R4、8 feet of integrated chip U1、One end of 6th resistance R6、8 feet of the second comparator IC2 connect，The other end of the 12nd resistance R12 respectively with one end of the 6th electric capacity C6、One end of transformator T armature winding、The colelctor electrode of audion Q5 connects，The emitter stage of audion Q5 respectively with one end of the 13rd resistance R13、One end of 8th electric capacity C8 connects，The other end of the 6th electric capacity C6 and one end of the 7th electric capacity C7 connect，The other end of the 7th electric capacity C7 is connected with the other end of transformator T armature winding，And the 6th electric capacity C6 and the junction of the 7th electric capacity C7、The other end of inducer L1、The other end of the 5th electric capacity C5、The other end of the 11st resistance R11、The other end of the 13rd resistance R13、The equal ground connection of the other end of the 8th electric capacity C8；The other end of the 3rd resistance R3 is connected with one end, 3 feet of the first comparator IC1 of the second electric capacity C2 respectively, the other end of the second electric capacity C2 is connected with one end of transformator T secondary windings, the other end of transformator T secondary windings, 2 feet of the first comparator IC1, the 4 equal ground connection of foot；1 foot of the first comparator IC1 is connected with the other end, one end of the first electric capacity C1 of the first resistance R1 respectively, the other end of the first electric capacity C1 6 feet with the other end of the second resistance R2, integrated chip U1 respectively are connected, the other end of the 4th resistance R4 is connected with 7 feet, one end of the 5th resistance R5 of integrated chip U1 respectively, 2 feet of integrated chip U1 are connected with one end of adjustable resistor W1, the other end of the 5th resistance R5, the other end of adjustable resistor W1,3 feet of integrated chip U1, the 4 equal ground connection of foot；5 feet of integrated chip U1 are connected with the other end, one end of the 4th electric capacity C4 of the 6th resistance R6 respectively, 1 foot of integrated chip U1 is connected with one end, one end of the 7th resistance R7 of the 3rd electric capacity C3 respectively, the other end of the 7th resistance R7 is connected with one end, 3 feet of the second comparator IC2 of the 8th resistance R8 respectively, 2 feet of the second comparator IC2 and one end of the 9th resistance R9 connect, the 4 equal ground connection of foot of the other end of the 4th electric capacity C4, the other end of the 3rd electric capacity C3, the other end of the 9th resistance R9 and the second comparator IC2；The other end of the 8th resistance R8 is connected with 1 foot of the second comparator IC2,19 feet of single-chip microcomputer U2, one end of the 14th electric capacity C14 respectively, the other end ground connection of the 14th electric capacity C14；2 feet of single-chip microcomputer U2,3 feet are connected with 2 feet, 3 feet of connector J1 respectively, and 1 foot of connector J1 is connected with power supply VCC, the 4 foot ground connection of connector J1；null6 feet of single-chip microcomputer U2、7 feet、8 feet、9 feet respectively with one end of the 22nd resistance R22、One end of 23rd resistance R23、One end of 24th resistance R24、One end of 25th resistance R25 connects，The other end of the 22nd resistance R22、The other end of the 23rd resistance R23、The other end of the 24th resistance R24、The other end of the 25th resistance R25 respectively with the G pole of the 4th isolated gate FET Q4、The G pole of the 3rd isolated gate FET Q3、The G pole of the second isolated gate FET Q2、The G pole of the first isolated gate FET Q1 connects，4th isolated gate FET Q4、3rd isolated gate FET Q3、Second isolated gate FET Q2、The D pole of the first isolated gate FET Q1 is connected with each other and is connected to power supply VCC，The S pole of the first isolated gate FET Q1 is connected with 6 feet of display apparatus module DS1，The S pole of the second isolated gate FET Q2 is connected with 8 feet of display apparatus module DS1，The S pole of the 3rd isolated gate FET Q3 is connected with 9 feet of display apparatus module DS1，The S pole of the 4th isolated gate FET Q4 is connected with 12 feet of display apparatus module DS1，11 feet of display apparatus module DS1 and one end of the 14th resistance R14 connect，The other end of the 14th resistance R14 is connected with 12 feet of single-chip microcomputer U2，7 feet of display apparatus module DS1 and one end of the 15th resistance R15 connect，The other end of the 15th resistance R15 is connected with 13 feet of single-chip microcomputer U2，4 feet of display apparatus module DS1 and one end of the 16th resistance R16 connect，The other end of the 16th resistance R16 is connected with 14 feet of single-chip microcomputer U2，2 feet of display apparatus module DS1 and one end of the 17th resistance R17 connect，The other end of the 17th resistance R17 is connected with 15 feet of single-chip microcomputer U2，1 foot of display apparatus module DS1 and one end of the 18th resistance R18 connect，The other end of the 18th resistance R18 is connected with 16 feet of single-chip microcomputer U2，10 feet of display apparatus module DS1 and one end of the 19th resistance R19 connect，The other end of the 19th resistance R19 is connected with 17 feet of single-chip microcomputer U2，5 feet of display apparatus module DS1 and one end of the 20th resistance R20 connect，The other end of the 20th resistance R20 is connected with 18 feet of single-chip microcomputer U2，3 feet of display apparatus module DS1 and one end of the 21st resistance R21 connect，The other end of the 21st resistance R21 is connected with 11 feet of single-chip microcomputer U2；1 foot of single-chip microcomputer U2 is connected with one end, the negative pole of the 9th electric capacity C9 of the 26th resistance R26 respectively, the other end ground connection of the 26th resistance R26, the positive pole of the 9th electric capacity C9 is connected with power supply VCC, one end of the 11st electric capacity C11, the positive pole of the tenth electric capacity C10,20 feet of single-chip microcomputer U2 respectively, the other end of the 11st electric capacity C11, the minus earth of the tenth electric capacity C10；4 feet of single-chip microcomputer U2 and one end of the 12nd electric capacity C12 connect, and 5 feet of single-chip microcomputer U2 and one end of the 13rd electric capacity C13 connect, the other end of the 12nd electric capacity C12, the other end of the 13rd electric capacity C13, the 10 equal ground connection of foot of single-chip microcomputer U2.
The measuring method of the present invention is: 1, when soil moisture is the biggest, and facing conductive ability is the strongest, according to this principle, makees LC oscillating circuit: doing induction coil with the enamel-covered wire of Φ 1.0 around round base body 20 circle of a Φ 30cm, parallel connection obtains one group of LC frequency of oscillation；2, with a same people little 5th electric capacity C5 inducer L1 in parallel, the size of this inducer L1 is identical with the inductance size of the induction coil of coiling, and a LC frequency of oscillation value of so getting back, as reference value；3, meeting measured object as inducer L1, its coil inductance changes due to eddy current effect so that its LC frequency of oscillation changes, then compares to obtain one group of data with former benchmark LC frequency of oscillation；4, the data calibration after two groups of data are subtracted each other is soil moisture.
The present invention surveys soil moisture with face generation point, uses vortex-like fashion non-contact measurement, and circuit design is reasonable, convenient to use.
Accompanying drawing illustrates:
Fig. 1 is the circuit theory diagrams of the present invention.
Detailed description of the invention:
With reference to Fig. 1, this detailed description of the invention by the following technical solutions: it comprises inducer L1, the first electric capacity-the
null14 electric capacity C1-C14、First resistance-the 26 resistance R1-R26、Transformator T、First comparator the-the second comparator IC1-IC2、Adjustable resistor W1、Integrated chip U1、Single-chip microcomputer U2、Display apparatus module DS1、First isolated gate FET the-the four isolated gate FET Q1-Q4、Audion Q5，One end of inducer L1 respectively with one end of the 5th electric capacity C5、One end of tenth resistance R10、One end of 11st resistance R11、The base stage of audion Q5 connects，The other end of the tenth resistance R10 respectively with one end of the 12nd resistance R12、One end of 3rd resistance R3、8 feet of the first comparator IC1、Power supply VCC、One end of first resistance R1、One end of second resistance R2、One end of 4th resistance R4、8 feet of integrated chip U1、One end of 6th resistance R6、8 feet of the second comparator IC2 connect，The other end of the 12nd resistance R12 respectively with one end of the 6th electric capacity C6、One end of transformator T armature winding、The colelctor electrode of audion Q5 connects，The emitter stage of audion Q5 respectively with one end of the 13rd resistance R13、One end of 8th electric capacity C8 connects，The other end of the 6th electric capacity C6 and one end of the 7th electric capacity C7 connect，The other end of the 7th electric capacity C7 is connected with the other end of transformator T armature winding，And the 6th electric capacity C6 and the junction of the 7th electric capacity C7、The other end of inducer L1、The other end of the 5th electric capacity C5、The other end of the 11st resistance R11、The other end of the 13rd resistance R13、The equal ground connection of the other end of the 8th electric capacity C8；The other end of the 3rd resistance R3 is connected with one end, 3 feet of the first comparator IC1 of the second electric capacity C2 respectively, the other end of the second electric capacity C2 is connected with one end of transformator T secondary windings, the other end of transformator T secondary windings, 2 feet of the first comparator IC1, the 4 equal ground connection of foot；1 foot of the first comparator IC1 is connected with the other end, one end of the first electric capacity C1 of the first resistance R1 respectively, the other end of the first electric capacity C1 6 feet with the other end of the second resistance R2, integrated chip U1 respectively are connected, the other end of the 4th resistance R4 is connected with 7 feet, one end of the 5th resistance R5 of integrated chip U1 respectively, 2 feet of integrated chip U1 are connected with one end of adjustable resistor W1, the other end of the 5th resistance R5, the other end of adjustable resistor W1,3 feet of integrated chip U1, the 4 equal ground connection of foot；5 feet of integrated chip U1 are connected with the other end, one end of the 4th electric capacity C4 of the 6th resistance R6 respectively, 1 foot of integrated chip U1 is connected with one end, one end of the 7th resistance R7 of the 3rd electric capacity C3 respectively, the other end of the 7th resistance R7 is connected with one end, 3 feet of the second comparator IC2 of the 8th resistance R8 respectively, 2 feet of the second comparator IC2 and one end of the 9th resistance R9 connect, the 4 equal ground connection of foot of the other end of the 4th electric capacity C4, the other end of the 3rd electric capacity C3, the other end of the 9th resistance R9 and the second comparator IC2；The other end of the 8th resistance R8 is connected with 1 foot of the second comparator IC2,19 feet of single-chip microcomputer U2, one end of the 14th electric capacity C14 respectively, the other end ground connection of the 14th electric capacity C14；2 feet of single-chip microcomputer U2,3 feet are connected with 2 feet, 3 feet of connector J1 respectively, and 1 foot of connector J1 is connected with power supply VCC, the 4 foot ground connection of connector J1；null6 feet of single-chip microcomputer U2、7 feet、8 feet、9 feet respectively with one end of the 22nd resistance R22、One end of 23rd resistance R23、One end of 24th resistance R24、One end of 25th resistance R25 connects，The other end of the 22nd resistance R22、The other end of the 23rd resistance R23、The other end of the 24th resistance R24、The other end of the 25th resistance R25 respectively with the G pole of the 4th isolated gate FET Q4、The G pole of the 3rd isolated gate FET Q3、The G pole of the second isolated gate FET Q2、The G pole of the first isolated gate FET Q1 connects，4th isolated gate FET Q4、3rd isolated gate FET Q3、Second isolated gate FET Q2、The D pole of the first isolated gate FET Q1 is connected with each other and is connected to power supply VCC，The S pole of the first isolated gate FET Q1 is connected with 6 feet of display apparatus module DS1，The S pole of the second isolated gate FET Q2 is connected with 8 feet of display apparatus module DS1，The S pole of the 3rd isolated gate FET Q3 is connected with 9 feet of display apparatus module DS1，The S pole of the 4th isolated gate FET Q4 is connected with 12 feet of display apparatus module DS1，11 feet of display apparatus module DS1 and one end of the 14th resistance R14 connect，The other end of the 14th resistance R14 is connected with 12 feet of single-chip microcomputer U2，7 feet of display apparatus module DS1 and one end of the 15th resistance R15 connect，The other end of the 15th resistance R15 is connected with 13 feet of single-chip microcomputer U2，4 feet of display apparatus module DS1 and one end of the 16th resistance R16 connect，The other end of the 16th resistance R16 is connected with 14 feet of single-chip microcomputer U2，2 feet of display apparatus module DS1 and one end of the 17th resistance R17 connect，The other end of the 17th resistance R17 is connected with 15 feet of single-chip microcomputer U2，1 foot of display apparatus module DS1 and one end of the 18th resistance R18 connect，The other end of the 18th resistance R18 is connected with 16 feet of single-chip microcomputer U2，10 feet of display apparatus module DS1 and one end of the 19th resistance R19 connect，The other end of the 19th resistance R19 is connected with 17 feet of single-chip microcomputer U2，5 feet of display apparatus module DS1 and one end of the 20th resistance R20 connect，The other end of the 20th resistance R20 is connected with 18 feet of single-chip microcomputer U2，3 feet of display apparatus module DS1 and one end of the 21st resistance R21 connect，The other end of the 21st resistance R21 is connected with 11 feet of single-chip microcomputer U2；1 foot of single-chip microcomputer U2 is connected with one end, the negative pole of the 9th electric capacity C9 of the 26th resistance R26 respectively, the other end ground connection of the 26th resistance R26, the positive pole of the 9th electric capacity C9 is connected with power supply VCC, one end of the 11st electric capacity C11, the positive pole of the tenth electric capacity C10,20 feet of single-chip microcomputer U2 respectively, the other end of the 11st electric capacity C11, the minus earth of the tenth electric capacity C10；4 feet of single-chip microcomputer U2 and one end of the 12nd electric capacity C12 connect, and 5 feet of single-chip microcomputer U2 and one end of the 13rd electric capacity C13 connect, the other end of the 12nd electric capacity C12, the other end of the 13rd electric capacity C13, the 10 equal ground connection of foot of single-chip microcomputer U2.
The measuring method of this detailed description of the invention is: 1, when soil moisture is the biggest, facing conductive ability is the strongest, according to this principle, make LC oscillating circuit: doing induction coil with the enamel-covered wire of Φ 1.0 around round base body 20 circle of a Φ 30cm, parallel connection obtains one group of LC frequency of oscillation；2, with same size a 5th electric capacity C5 inducer L1 in parallel, the size of this inducer L1 is identical with the inductance size of the induction coil of coiling, and a LC frequency of oscillation value of so getting back, as reference value；3, meeting measured object as inducer L1, its coil inductance changes due to eddy current effect so that its LC frequency of oscillation changes, then compares to obtain one group of data with former benchmark LC frequency of oscillation；4, the data calibration after two groups of data are subtracted each other is soil moisture.
This detailed description of the invention surveys soil moisture with face generation point, uses vortex-like fashion non-contact measurement, and circuit design is reasonable, convenient to use.
Claims (2)
1. survey the vortex induction circuit of soil moisture, it is characterised in that it comprises inducer (L1), the first electric capacity-the 14 electricity
Hold (C1-C14), the first resistance-the 26 resistance (R1-R26), transformator (T), first comparator the-the second comparator
(IC1-IC2), adjustable resistor (W1), integrated chip (U1), single-chip microcomputer (U2), display apparatus module (DS1), the first insulated gate field
Effect pipe the-the four isolated gate FET (Q1-Q4), audion (Q5), one end of inducer (L1) respectively with the 5th electric capacity (C5)
One end, one end of the tenth resistance (R10), one end of the 11st resistance (R11), audion (Q5) base stage connect, the tenth resistance
(R10) the other end respectively with one end of the 12nd resistance (R12), one end of the 3rd resistance (R3), the 8 of the first comparator (IC1)
Foot, power supply VCC, one end of the first resistance (R1), one end of the second resistance (R2), one end of the 4th resistance (R4), integrated chip
(U1) 8 feet, one end of the 6th resistance (R6), 8 feet of the second comparator (IC2) connect, the 12nd resistance (R12) another
One end is connected with one end of the 6th electric capacity (C6), one end of transformator (T) armature winding, the colelctor electrode of audion (Q5) respectively,
The emitter stage of audion (Q5) is connected with one end, one end of the 8th electric capacity (C8) of the 13rd resistance (R13) respectively, the 6th electric capacity
(C6) the other end and one end of the 7th electric capacity (C7) connect, the other end of the 7th electric capacity (C7) and transformator (T) armature winding
The other end connects, and the 6th electric capacity (C6) and the junction of the 7th electric capacity (C7), the other end of inducer (L1), the 5th electric capacity
(C5) the other end, the other end of the 11st resistance (R11), the other end of the 13rd resistance (R13), the 8th electric capacity (C8) another
The equal ground connection in one end；The other end of the 3rd resistance (R3) respectively with one end, 3 feet of the first comparator (IC1) of the second electric capacity (C2)
Connecting, the other end of the second electric capacity (C2) is connected with one end of transformator (T) secondary windings, another of transformator (T) secondary windings
End, 2 feet of the first comparator (IC1), the 4 equal ground connection of foot；1 foot of the first comparator (IC1) respectively with the first resistance (R1)
The other end, one end of the first electric capacity (C1) connect, the other end of the first electric capacity (C1) respectively with the other end of the second resistance (R2),
6 feet of integrated chip (U1) connect, the other end of the 4th resistance (R4) respectively with 7 feet, the 5th resistance of integrated chip (U1)
(R5) one end connects, and 2 feet of integrated chip (U1) are connected with one end of adjustable resistor (W1), the 5th resistance (R5) another
One end, the other end of adjustable resistor (W1), 3 feet of integrated chip (U1), the 4 equal ground connection of foot；5 feet of integrated chip (U1) divide
Not being connected with the other end, one end of the 4th electric capacity (C4) of the 6th resistance (R6), 1 foot of integrated chip (U1) is electric with the 3rd respectively
Hold the one end of (C3), the 7th resistance (R7) one end connect, the other end of the 7th resistance (R7) respectively with the one of the 8th resistance (R8)
End, 3 feet of the second comparator (IC2) connect, and 2 feet of the second comparator (IC2) and one end of the 9th resistance (R9) connect, the
The other end of four electric capacity (C4), the other end of the 3rd electric capacity (C3), the other end of the 9th resistance (R9) and the second comparator (IC2)
The 4 equal ground connection of foot；The other end of the 8th resistance (R8) respectively with 1 foot of the second comparator (IC2), 19 feet of single-chip microcomputer (U2),
One end of 14th electric capacity (C14) connects, the other end ground connection of the 14th electric capacity (C14)；2 feet of single-chip microcomputer (U2), 3 feet divide
Not being connected with 2 feet, 3 feet of connector (J1), 1 foot of connector (J1) is connected with power supply VCC, 4 feet of connector (J1)
Ground connection；6 feet of single-chip microcomputer (U2), 7 feet, 8 feet, 9 feet respectively with one end, the 23rd resistance of the 22nd resistance (R22)
(R23) one end, one end of the 24th resistance (R24), one end of the 25th resistance (R25) connect, the 22nd resistance
(R22) the other end, the other end of the 23rd resistance (R23), the other end of the 24th resistance (R24), the 25th resistance
(R25) the other end respectively with the G pole of the 4th isolated gate FET (Q4), the G pole of the 3rd isolated gate FET (Q3),
The G pole of the second isolated gate FET (Q2), the G pole of the first isolated gate FET (Q1) connect, the 4th insulated-gate field-effect
Pipe (Q4), the 3rd isolated gate FET (Q3), the second isolated gate FET (Q2), the first isolated gate FET (Q1)
D pole is connected with each other and is connected to power supply VCC, the S pole of the first isolated gate FET (Q1) and the 6 of display apparatus module (DS1)
Foot connects, and the S pole of the second isolated gate FET (Q2) is connected with 8 feet of display apparatus module (DS1), the 3rd insulated gate field effect
9 feet of the S pole and display apparatus module (DS1) that should manage (Q3) are connected, the S pole of the 4th isolated gate FET (Q4) and display
12 feet of device module (DS1) connect, and 11 feet of display apparatus module (DS1) and one end of the 14th resistance (R14) connect, and the tenth
The other end of four resistance (R14) is connected with 12 feet of single-chip microcomputer (U2), 7 feet of display apparatus module (DS1) and
One end of 15 resistance (R15) connects, and the other end of the 15th resistance (R15) is connected with 13 feet of single-chip microcomputer (U2), display
4 feet of device module (DS1) and one end of the 16th resistance (R16) connect, the other end of the 16th resistance (R16) and monolithic
14 feet of machine (U2) connect, and 2 feet of display apparatus module (DS1) and one end of the 17th resistance (R17) connect, and the 17th
The other end of resistance (R17) is connected with 15 feet of single-chip microcomputer (U2), 1 foot of display apparatus module (DS1) and the 18th resistance
(R18) one end connects, and the other end of the 18th resistance (R18) is connected with 16 feet of single-chip microcomputer (U2), display apparatus module
(DS1) 10 feet and one end of the 19th resistance (R19) connect, the other end of the 19th resistance (R19) and single-chip microcomputer (U2)
17 feet connect, one end connection of 5 feet of display apparatus module (DS1) and the 20th resistance (R20), the 20th resistance
(R20) the other end is connected with 18 feet of single-chip microcomputer (U2), 3 feet of display apparatus module (DS1) and the 21st resistance
(R21) one end connects, and the other end of the 21st resistance (R21) is connected with 11 feet of single-chip microcomputer (U2)；Single-chip microcomputer (U2)
1 foot be connected with one end, the negative pole of the 9th electric capacity (C9) of the 26th resistance (R26) respectively, the 26th resistance
(R26) other end ground connection, the positive pole of the 9th electric capacity (C9) respectively with power supply VCC, one end of the 11st electric capacity (C11),
The positive pole of the tenth electric capacity (C10), 20 feet of single-chip microcomputer (U2) connect, the other end of the 11st electric capacity (C11), the tenth electric capacity
(C10) minus earth；4 feet of single-chip microcomputer (U2) and one end of the 12nd electric capacity (C12) connect, the 5 of single-chip microcomputer (U2)
One end of foot and the 13rd electric capacity (C13) connects, the other end of the 12nd electric capacity (C12), the 13rd electric capacity (C13) another
One end, the 10 equal ground connection of foot of single-chip microcomputer (U2).
The vortex induction circuit of survey soil moisture the most according to claim 1, it is characterised in that described vortex induction electricity
The measuring method on road is: (1), when soil moisture is the biggest, and facing conductive ability is the strongest, according to this principle, does LC vibration electricity
Road: doing induction coil with the enamel-covered wire of Φ 1.0 around round base body 20 circle of a Φ 30cm, parallel connection obtains one group of LC oscillation frequency
Rate；(2), with same size the 5th electric capacity (C5) inducer in parallel (L1), the size of this inducer (L1) and the sense of coiling
The inductance size answering coil is identical, and a LC frequency of oscillation value of so getting back, as reference value；(3), meet when inducer (L1)
Measured object, its coil inductance changes due to eddy current effect so that its LC frequency of oscillation changes, then shakes with former benchmark LC
Swing frequency ratio and relatively obtain one group of data；(4) data calibration after, two groups of data are subtracted each other is soil moisture.
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| CN102830136A (en) | 2012-12-19 |
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